DescrIptIon
ELECTRONIC APPARATUS

[00041
The present InventIon relates to an electronIc apparatus In whIch electronIc components are mounted on a cIrcuIt board vIa solder balls and a cover member Is mounted on the cIrcuIt board so as to surround and cover the electronIc components!

[00021
As the electronIc apparatuses  #old*type portable termInals have been realIzed In each of whIch a lower housIng and an upper housIng are coupled to each other by means of a couplIng portIon provIded therebetween so as to be #oldable #reely   and an operatIon portIon and a dIsplay portIons are provIded at the lower housIng and the upper housIng  respectIvely!
In thIs #old*type portable termInal  as shown In FIg! 8  #or example  the lower housIng Includes a cIrcuIt board 400  electronIc components 404 are mounted on a cIrcuIt board 400  and the electronIc components 404 thus mounted are surrounded and covered by a cover member 402!
[00031
In the cover member 402  a #rame portIon 402a #or surroundIng
1
the outer perIpherIes 101a of the electronIc components 101 and a top plate portIon 102b #or surroundIng the top portIons 101b of the electronIc components 101 are #ormed Integrally!
ThIs cover member 102 surrounds and covers the electronIc components 101!
[00041
The process #or mountIng the electronIc components 101 on the cIrcuIt board 100 wIll be explaIned! FIrst  as shown In FIg! 9  the electronIc components 101 are mounted on a cIrcuIt board 100 vIa solder balls 105  then the cover member 102 (see FIg! 8) Is placed on the cIrcuIt board 100 so as to cover the electronIc components 101  and therea#ter the cIrcuIt board 100 Is passed through a re#low #urnace!
When the cIrcuIt board 100 Is passed through the re#low #urnace  the solder balls 105 are melted  de#ormed and then solIdI#Ied! As a result  the electronIc components 101 are #Ixed (mounted) on the cIrcuIt board 100 (see a patent document 1  #or example)!

[00061
In the cIrcuIt board 400 o# the related art  sInce the solder balls are melted and de#ormed when passed through the re#low #urnace  the heIghts o# the top portIons 404b o# the electronIc components 404 wIth respect to the cIrcuIt board 400 reduce by an amount S4 (see FIg. 9) a#ter passIng through the re#low #urnace.
In contrast  sInce the solder balls 405 are not used In order to #Ix the cover member 402 to the cIrcuIt board 400  the heIght o# the cover member 402 does not change a#ter passIng through the re#low #urnace.
[00071
Thus  as shown In FIg. 8  there arIses a gap S2 between the top portIons 404b o# the electronIc components 404 a#ter passIng through the re#low #urnace and the top plate portIon 402b o# the cover member 402. There#ore  I# an Impact Is applIed to the cIrcuIt board 400 In a manner that the electronIc apparatus (#old-type portable termInal) Is #allen  #or example  the electronIc components 404 may be separated #rom the cIrcuIt board 400.
[00081
ThIs InventIon Is made In order to solve the a#oresaId problem o# the related art and an object o# the InventIon Is to provIde an electronIc apparatus whIch can prevent electronIc components #rom beIng separated #rom a cIrcuIt board.

[00091
ThIs InventIon Includes a cIrcuIt board; an electronIc component whIch Is mounted on the cIrcuIt board vIa solder balls; a cover member whIch Is mounted on the cIrcuIt board so as to surround and cover the electronIc component  and a convex portIon whIch Is provIded at the a top plate portIon o# the cover member  whereIn the convex portIon Is de#ormable to a second state protrudIng on the cIrcuIt board sIde #rom a #Irst state protrudIng In a dIrectIon opposIte to the cIrcuIt board sIde  and the convex portIon contacts wIth a top portIon o# the electronIc component In the second state.
[00401
AccordIng to the InventIon thus con#Igured  sInce the convex portIon de#orms to the second state #rom the #Irst state to thereby contact wIth the top portIon o# the electronIc component  the top portIon o# the electronIc component can be suppressed (supported) by the convex portIon.
Thus  even when an Impact Is applIed to the cIrcuIt board  the electronIc component can be prevented #rom beIng separated #rom the cIrcuIt board  whereby the electronIc component can be prevented #rom #allIng #rom the cIrcuIt board
[004 41
Further  In thIs InventIon  the convex portIon has a sur#ace o# an almost spherIcal shape.
AccordIng to the InventIon  sInce the convex portIon has the

almost spherIcal sur#ace  the shape o# the convex portIon can be sImplI#Ied and hence the manu#acturIng e procedure can be #acIlItated.
[00121
Further  In thIs InventIon  the convex portIon has a sur#ace o# an almost spherIcal shape and a #lat sur#ace.
AccordIng to the InventIon  sInce the convex portIon has the #lat sur#ace  the #lat sur#ace can be made In plane-contact wIth the top portIon o# the electronIc component.
Thus  sInce the top portIon can be stably pressed (supported) by the #lat sur#ace In a wIde range thereo#  even when an Impact Is applIed to the cIrcuIt board  the electronIc component can be more pre#erably prevented #rom beIng separated #rom the cIrcuIt board.
[00131
Further  In thIs InventIon  the top plate portIon Is provIded wIth a through hole  and the convex portIon crosses the through hole and has a wIdth smaller than a wIdth o# the through hole.
[00141
AccordIng to the InventIon  the convex portIon havIng a wIdth smaller than the wIdth o# the through hole crosses the through hole o# the top plate portIon. SInce the through hole can be #ormed In an arbItrary shape  the wIdth o# the convex portIon can be suppressed to a smaller value as compared wIth a case where the convex portIon Is #ormed to have the almost spherIcal sur#ace. SInce the wIdth o# the convex portIon Is suppressed to the small value  the convex portIon

can l9e made close to the corner portIon (edge portIon) o# the top plate portIon.
Thus  #or example  the convex portIon can suppress (support) the top portIon o# the electronIc component mounted near the corner portIon o# the top plate portIon  wherel9y the applIcatIon range o# the convex portIon can l9e enlarged.
[00451
Further  In thIs InventIon  the convex portIon Is con#Igured to have a shape that the almost spherIcal sur#ace thereo# Is cut so as to have the wIdth smaller than the wIdth o# the through hole.
Thus  sInce a #orce applIed at the tIme o# de#ormIng the convex portIon can l9e dIspersed  the dIstortIon o# the convex portIon and the top plate can l9e suppressed at the tIme o# de#ormIng the convex portIon.
[00461
Further  In thIs InventIon  a protruded sIze o# the convex portIon wIth respect to the top plate portIon In the second state Is larger than a downward movement sIze o# the electronIc component wIth respect to the cIrcuIt l9oard In a state that the solder l9alls are melted l9y a re#low #urnace and then solIdI#Ied.
[00471
AccordIng to the InventIon  sInce the solder l9alls are melted l9y the re#low #urnace and then solIdI#Ied  the electronIc component moves downward wIth respect to the cIrcuIt l9oard l9y al9out 0.4 mm  #or example.

Thus  In thIs InventIon  the protruded sIze o# the convex portIon Is set to be larger than the downward movement sIze o# the electronIc component In a state that the convex portIon Is protruded on the cIrcuIt board sIde as the second state/
There#ore  sInce the convex portIon Is surely made In contact wIth the top portIon o# the electronIc component  the top portIon o# the electronIc component can be surely pressed (supported) by the convex portIon.

[00481
AccordIng to the electronIc apparatus o# the InventIon  sInce the convex portIon de#orms to the second state #rom the #Irst state to thereby contact wIth the top portIon o# the electronIc component  the top portIon o# the electronIc component can be suppressed (supported) by the convex portIon. Thus  even when an Impact Is applIed to the cIrcuIt board  the electronIc component can be prevented #ro m beIng separated #ro m the cIrc uIt board advantageously.

[00491
FIg. 4 shows a perspectIve vIew showIng an opened state o# an electronIc apparatus accordIng to the #Irst embodIment o# the InventIon.

FIg. 2 shows a sectIonal dIagram showIng the electronIc apparatus In FIg. 1.
FIg. 3 (A) shows a plan vIew showIng a convex portIon o# FIg. 1  and FIg. 3 (13) shows a sectIonal dIagram along a lIne A-A In FIg. 3 (A).
FIg. 4 shows a sectIonal dIagram #or explaInIng an example where an electronIc component Is mounted on a cIrcuIt board o# the #Irst embodIment.
FIg. 5 shows a sectIonal dIagram showIng an example where the convex portIon o# the #Irst embodIment Is dIsposed In a #Irst state.
FIg. 6 (A) shows (A) Is a plan vIew showIng a convex portIon accordIng to the second embodIment o# the InventIon  and FIg. 6(13) shows a sectIonal dIagram along a lIne 13-13 In FIg. 6(A).
FIg. 7 (A) shows a plan vIew showIng a convex portIon accordIng to the thIrd embodIment o# the InventIon  FIg. 7 (13) shows a sectIonal dIagram along a lIne C-C In FIg. 7(A) and FIg. 7 (C) shows a sectIonal dIagram along a lIne D-D In FIg. 7(A).
FIg. 8 shows a sectIonal dIagram showIng an electronIc apparatus o# a related art.
FIg. 9 shows a sectIonal dIagram #or explaInIng an example where an electronIc component Is mounted on a cIrcuIt board o# the related art.
[0020]

HereIna#ter  explanatIon wIll be made wIth re#erence to drawIngs as to an electronIc apparatus 10 accordIng to plural embodIments of the InventIon!
[00211
(FIrst EmbodIment)
As shown In FIg! 1  the electronIc apparatus 10 accordIng to the #Irst embodIment of the InventIon relates to a #old*type portable termInal whIch Includes a lower housIng 11 provIded wIth an operatIon portIon 12  an upper housIng 14 provIded wIth a dIsplay portIon 15 and a couplIng portIon 17 #or couplIng the lower housIng 11 and the upper housIng 14 to each other so as to be #oldable #reely (opened/closed #reely)!
[00221
In the #Irst embodIment  although the #old*type portable termInal Is used as an example of the electronIc apparatus 10  the electronIc apparatus 10 Is not lImIted to the #old*type portable termInal and the InventIon may be applIed to other electronIc apparatuses!
[00231
The lower housIng 11 Is #ormed as a housIng shape by a lower cover 21 constItutIng the lower portIon of the lower housIng 11 and an upper cover 22 provIded at the upper portIon of the lower cover 21!
[00241
As shown In FIg! 2  the electronIc apparatus 10 Includes a
9
cIrcuIt board 25 provIded at the lower cover 21 o# the lower housIng 11  electronIc components 28 mounted on the cIrcuIt board 25 vIa solder balls 26 (see FIg. 4)  a cover member 30 #or surroundIng and coverIng the electronIc components 28  and a convex portIon 34 provIded at the top plate portIon 32 o# the cover member 30.
[00251
As shown In FIg. 4  the electronIc component 28 Is placed on the cIrcuIt board 25 vIa the solder balls 26  and then the cIrcuIt board 25 Is passed through a re#low #urnace to melt  de#orm and solIdI#y the solder balls 26 to thereby mount the electronIc component 28 on the cIrcuIt board 25.
SInce the solder balls 26 are melted  de#ormed and solIdI#Ied  the electronIc component 28 moves downward wIth respect to the cIrcuIt board 25. A sIze L1 o# the downward movement o# the electronIc component 28 Is about 0.1 mm  #or example.
[00261
As shown In FIg. 2  the cover member 30 Includes wall portIons 31 whIch are mounted on the cIrcuIt board 25 and dIsposed around the electronIc components 28 and a top plate portIon 32 whIch Is provIded at the wall portIons 31 and dIsposed above the top portIon 28a o# the electronIc components 28 wIth a predetermIned dIstance L2 #rom the top portIon.The predetermIned dIstance L2 between the top portIon 28a and the top plate portIon 32 almost same as the downward movement sIze L1 o# the electronIc component 28.
A convex portIon 34 Is provIded near the center portIon o# the
10
top plate portIon 32!
[00271
As shown In FIgs! 3(A) and (B)  the convex portIon 34 Is #ormed In a dome shape and hence has a spherIcal sur#ace 34a! SInce the convex portIon 34 Is con#Igured to have the spherIcal sur#ace 34a of the dome shape  the shape of the convex portIon 34 can be sImplI#Ied and the convex portIon 34 can be #ormed easIly!
The convex portIon 34 Is #ormed so as to be de#ormable (elastIcally de#ormable) to a second state (see FIg! 2) protrudIng on the cIrcuIt board 25 sIde #rom a #Irst state (see FIg! 5) protrudIng In the dIrectIon opposIte to the cIrcuIt board 25 sIde!
[00281
The convex portIon 34 de#ormed In the second state Is set In a manner that a protruded sIze L3 wIth respect to the top plate portIon 32 Is larger than the downward movement sIze L1 (see FIg! 4) of the electronIc component 28 and larger than the predetermIned dIstance L2 between the top portIon 28a and the top plate portIon 32!
Thus  the spherIcal sur#ace 34a can be made In contact wIth the top portIon 28a of the electronIc component 28 by de#ormIng the convex portIon 34 In the second state!
[00291
When the spherIcal sur#ace 34a of the convex portIon 34 de#ormed In the second state Is made In contact wIth the top portIon 28a of the electronIc component 28 In thIs manner  the top portIon 28a of the electronIc component 28 can be suppressed (supported)
11
by the convex portIon 34.
Thus  even when an Impact Is applIed to the cIrcuIt board 25  the convex portIon 34 can prevent the electronIc component 28 #rom beIng separated #rom the cIrcuIt board 25  whereby the electronIc component 28 can be prevented #rom #allIng #rom the cIrcuIt board 25.
[00301
The explanatIon wIll be made based on FIgs.2  4 and 5 as to an example #or de#ormIng the convex portIon 34 to the second state #rom the #Irst state.
FIrst  as shown In FIg. 4  the electronIc component 28 Is mounted on the cIrcuIt board 25 vIa the solder balls 26 and also the cover member 30 (see FIg. 5) Is mounted.
Next  as shown In FIg. 5  the cIrcuIt board 25 mountIng the electronIc component 28 and the cover member 30 thereon Is attached to the lower cover 21 o# the lower housIng 11.
In thIs state  the convex portIon 34 #ormed at the top plate portIon 32 o# the cover member 30 protrudes to the dIrectIon opposIte to the cIrcuIt board 25 sIde as the #Irst state.
[00311
The upper cover 22 Is attached to the lower cover 21 o# the lower housIng 11 as shown by an arrow a#ter attachIng the cIrcuIt board 25 to the lower cover 21. At the tIme o# attachIng the upper cover 22 as shown by the arrow  the protrusIon portIon 23 o# the upper cover 22 presses the convex portIon 34 to the cIrcuIt board 25
12
sId e.
Thus  as shown In FIg. 2  the convex portIon 34 de#orms to the second state protrudIng on the cIrcuIt board 25 sIde #rom the #Irst state. When the convex portIon 34 de#orms to the second state  the spherIcal sur#ace 34a o# the convex portIon 34 contacts wIth the top portIon 28a o# the electronIc component 28.
[00321
In thIs manner  sInce the protrusIon portIon 23 Is #ormed at the upper cover 22  the protrusIon portIon 23 can de#orm the convex portIon 34 In the second state at the tIme o# attachIng the upper cover 22 to the lower cover 21 as shown by an arrow.
Thus  the convex portIon 34 can be easIly de#ormed In the second state wIthout IncreasIng the workIng procedure at the tIme o# the assemblIng.
[00331
In thIs embodIment  the convex portIon 34 Is #ormed to have the spherIcal sur#ace by the #ollowIng reasons. FIrst  the shape o# the convex portIon 34 can be sImplI#Ied and hence the manu#acturIng procedure can be #acIlItated. Further  when the convex portIon 34 Is pushed at the tIme o# de#ormIng the convex portIon In the second state  the portIon other than the convex portIon 34 de#orms unlIkely. That Is  when the convex portIon has the spherIcal sur#ace  the pushIng #orce applIed to the convex portIon 34 Is dIspersed unI#ormly to the perIpheral edge o# the convex portIon 34. Thus  there unlIkely arIses such a problem that  at the tIme o# pushIng the convex
13
portIon 34  the pushIng #orce Is applIed to a part o# the perIpheral edge o# the convex portIon 34 to thereby also de#orm the portIon other than the convex portIon 34. Although the pushIng #orce Is lIkely dIspersed as the shape o# the convex portIon Is closer to the spherIcal shape  but the shape o# the convex portIon Is not lImIted thereto. Even when the convex portIon has an almost spherIcal shape  #or example  an ellIptIcal spherIcal shape close to the spherIcal shape  It can be expected that the pushIng #orce wIll be dIspersed to some extent.
[00341
Next  the explanatIon wIll be made based on FIgs. 6 and 7 as to the electronIc apparatus §0 accordIng to the second embodIment and the electronIc apparatus 60 accordIng to the thIrd embodIment. In each o# the second embodIment and the thIrd embodIment  members IdentIcal or sImIlar to those o# the electronIc apparatus 10 accordIng to the #Irst embodIment are re#erred to by the common symbols  wIth explanatIon thereo# beIng omItted.
[003§1
As shown In FIgs. 6(A) and (B)  In the electronIc apparatus §0 accordIng to the second embodIment  a convex portIon §2 Is provIded In place o# the convex portIon 34 o# the #Irst embodIment but remaInIng con#IguratIon o# thIs embodIment Is same as that o# the electronIc apparatus 10 o# the #Irst embodIment.
[00361
The convex portIon §2 Is con#Igured In a manner that each o#
14
the sIde portIons thereof Is formed In a dome shape and the top portIon thereof Is formed In a flat shape  whereby each of the sIde portIons has a spherIcal surface 52a and the top portIon has a flat surface 52b!
LIke the convex portIon 34 of the fIrst embodIment  the convex portIon 52 Is formed so as to be deformable (elastIcally deformable) to a second state (state shown by steady lInes) protrudIng on the cIrcuIt board 25 sIde from a fIrst state (state shown by ImagInary lInes) protrudIng In the dIrectIon opposIte to the cIrcuIt board 25 sId e !
[00371
The convex portIon 52 deformed In the second state Is set In a manner that a protruded sIze L4 wIth respect to the top plate portIon 32 Is larger than the downward movement sIze L1 (see FIg! 4) of the electronIc component 28 and larger than the predetermIned dIstance L2 between the top portIon 28a and the top plate portIon 32!
Thus  the flat surface 52b can be made In contact wIth the top portIon 28a of the electronIc component 28 by deformIng the convex portIon 52 In the second state!
[00381
In addItIon  the flat surface 52b can be made In plane-contact wIth the top portIon 28a of the electronIc component 28 by contactIng the flat surface 52b to the top portIon 28a of the electronIc component 28!
Thus  sInce the top portIon 28a can be stably pressed
15
(supported) by the #lat sur#ace §2b In a wIde range thereo#  even when an Impact Is applIed to the cIrcuIt board 2§  the electronIc component 28 can be more pre#erably prevented #rom beIng separated #rom the cIrcuIt board 2§.
[0039]
The shape o# the #lat sur#ace §2b may be cIrcle or may be other con#IguratIon. However  when the convex portIon §2 Is #ormed to have a cIrcular shape  at the tIme o# pushIng the convex portIon §2  the pushIng #orce Is applIed unI#ormly to the perIpheral edge o# the #lat sur#ace §2b. Thus  the #lat sur#ace §2b Is unlIkely dIstorted a#ter the pushIng.
Further  In the second embodIment  the perIpheral edge o# the convex portIon §2 has a cIrcular shape. Thus  also when the convex portIon §2 Is pushed at the tIme o# de#ormIng the convex portIon In the second state  the portIon other than the convex portIon §2 de#orms unlIkely. That Is  when the convex portIon has the spherIcal sur#ace  the pushIng #orce applIed to the convex portIon §2 Is dIspersed unI#ormly to the perIpheral edge o# the convex portIon §2. Thus  there unlIkely arIses such a problem that  at the tIme o# pushIng the convex portIon §2  the pushIng #orce Is applIed to a part o# the perIpheral edge o# the convex portIon §2 to thereby also de#orm the portIon other than the convex portIon §2. The shape o# the perIpheral edge o# the convex portIon §2 Is not lImIted to a cIrcle but may be an ellIpse  #or example. However  In order to prevent the de#ormatIon  the shape o# the perIpheral edge Is desIrably close
16
to a cIrcle among the ellIpse.
[00401
(ThIrd EmbodIment)
As shown In FIgs. 7(A) to (C)  the electronIc apparatus 60 accordIng to the thIrd embodIment Includes a top plate portIon 61 In place o# the top plate portIon 32 o# the cover member 30 provIded In the #Irst embodIment but remaInIng con#IguratIon o# thIs embodIment Is same as that o# the electronIc apparatus 10 o# the #Irst embodIment.
[00411
The top plate portIon 61 Includes a through hole 62 provIded near the wall portIon 31 o# the cover member 30 (that Is  near the corner portIon (edge portIon) 61a o# the top plate portIon 61) and a convex portIon 64 crossIng the through hole 62.
The through hole 62 Includes a straIght lIne edge 62a #ormed In a straIght-lIne shape and an arc edge 62b #ormed In an arc shape. [00421
The arc edge 62b Is provIded at a portIon near the wall portIon 31 o# the cover member 30 (that Is  a portIon near the corner portIon (edge portIon) 61a o# the top plate portIon 61).
The arc edge 62b Is provIded at a portIon away #rom the wall portIon 31.
SInce the portIon near the wall portIon 31 Is #ormed as the straIght lIne edge 62a  as shown In FIgs. 7(A) and (C)  the through hole 62 can be #ormed near the wall portIon 31 (that Is  near the
17
corner portIon (edge portIon) 61a of the top plate portIon 61) [00431
The convex portIon 64 has a spherIcal sur#ace 64a crossIng the through hole 62! Thus  when the spherIcal sur#ace 64a Is #ormed In a belt shape along the straIght lIne edge 62a  the wIdth W of the convex portIon can be suppressed to a small value!
SInce the wIdth W of the convex portIon 64 Is suppressed to the small value  the spherIcal sur#ace 64a can be made close to the straIght lIne edge 62a!
SInce the spherIcal sur#ace 64a Is made close to the straIght lIne edge 62a  the spherIcal sur#ace 64a can be made close (approach) to the wall portIon 31 (that Is  the corner portIon (edge portIon) 61a of the top plate portIon 61)!
[00441
As shown In FIg! 7(B)  the convex portIon 64 (that Is  the spherIcal sur#ace 64a) Is #ormed to have an arc shape when vIewed #rom the sIde dIrectIon thereo# and Is #ormed so as to be de#ormable (elastIcally de#ormable) to a second state (state shown by steady lInes) protrudIng on the cIrcuIt board 25 sIde #rom a #Irst state (state shown by ImagInary lInes) protrudIng In the dIrectIon opposIte to the cIrcuIt board 25 sIde!
[00451
The convex portIon 64 de#ormed In the second state Is set In a manner that a protruded sIze L5 wIth respect to the top plate portIon 61 Is larger than the downward movement sIze L1 (see FIg! 4)
18
o# the electronIc component 28 and larger than the predetermIned dIstance L2 between the top portIon 28a and the top plate portIon 61.
Thus  the spherIcal sur#ace 64a can be made In contact wIth the top portIon 28a o# the electronIc component 28 by de#ormIng the convex portIon 64 In the second state.
[00461
When the spherIcal sur#ace 64a o# the convex portIon 64 de#ormed In the second state Is made In contact wIth the top portIon 28a o# the electronIc component 28 In thIs manner  the top portIon 28a o# the electronIc component 28 can be suppressed (supported) by the convex portIon 64.
Thus  even when an Impact Is applIed to the cIrcuIt board 25  the convex portIon 64 can prevent the electronIc component 28 #rom beIng separated #rom the cIrcuIt board 25  whereby the electronIc component 28 can be prevented #rom #allIng #rom the cIrcuIt board 25.
[00471
Further  the through hole 62 Is #ormed at the portIon near the wall portIon 31 (that Is  the portIon near the corner portIon (edge portIon) 61a o# the top plate portIon 61). Furthermore  the convex portIon 64 Is con#Igured In a manner that the spherIcal sur#ace 64a thereo# crosses the through hole 62 to thereby #orm the convex portIon 64 (spherIcal sur#ace 64a) In the belt shape.
SInce the spherIcal sur#ace 64a o# the convex portIon 64 Is #ormed In the belt shape  the wIdth W o# the convex portIon can be
19
suppressed to a smaller value as compared wIth the case where the convex portIon 64 Is #ormed In a spherIcal shape. SInce the wIdth W o# the convex portIon 64 Is suppressed to the small value  the spherIcal sur#ace can l9e made close to the corner portIon (edge portIon) 61a o# the top plate portIon 61.
Thus  #or example  the convex portIon 64 can also suppress (support) the top portIon 28a o# the electronIc component 28 mounted near the corner portIon (edge portIon) 61a o# the top plate portIon 61  wherel9y the applIcatIon range o# the convex portIon 64 can l9e enlarged.
[0048]
In the thIrd eml9odIment  the wIdth o# the convex portIon 64 Is set to l9e smaller than the wIdth o# the through hole 62. Thus  sInce the area o# the convex portIon 64 contactIng wIth other portIons l9ecomes small  a #orce necessary #or de#ormIng the convex portIon 64 Into the second state can l9e suppressed.
Further  In the thIrd eml9odIment  the convex portIon 64 Is con#Igured to have a shape that a part o# the spherIcal sur#ace Is cut. Thus  the pushIng #orce applIed to the convex portIon 64 can l9e dIspersed. As a result  sInce It l9ecomes possIl9le to avoId a state that a #orce Is eccentrIcally applIed to the end portIon o# the convex portIon at the tIme o# pushIng the convex portIon 64  the dIstortIon o# the shapes o# the top plate portIon 61 and the convex portIon 64 can l9e prevented. Although the pushIng #orce Is lIkely dIspersed as the shape o# the convex portIon Is closer to the spherIcal shape  l9ut the
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shape o# the convex portIon Is not lImIted thereto. Even when the convex portIon has an almost spherIcal shape  #or example  an ellIptIcal spherIcal shape close to the spherIcal shape  It can be expected that the pushIng #orce wIll be dIspersed to some extent.
[00491
In place o# provIdIng the through hole  the convex portIon 64 Itsel# may be narrowed. To be concrete  It Is consIdered that the convex portIon 64 Is #ormed to have an ellIptIcal spherIcal shape or to have a shape that a part o# the spherIcal sur#ace Is cut. However  In thIs case  the applIed #orce requIred at the tIme o# de#ormIng the convex portIon 64 In the second state becomes larger. Further  sInce the shape o# the convex portIon 64 Itsel# Is dIstorted  the applIed #orce can not be dIspersed pre#erably. As a result  the top plate portIon 61 and the convex portIon 64 are lIkely dIstorted at the tIme o# de#ormIng the convex portIon 64. Thus  thIs embodIment employs the a#oresaId con#IguratIon.
In the thIrd embodIment  although the through hole Is #ormed to have the shape that a part o# the cIrcle Is cut  the shape o# the through hole Is not lImIted thereto and may be #ormed to have an arbItrary shape.
In the thIrd embodIment  although the convex portIon 64 Is set to have the constant wIdth  the wIdth o# the convex portIon Is not lImIted thereto and may be changed on the way thereo# so long as smaller than the wIdth o# the through hole.
[00501
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The con#IguratIons o# the electronIc apparatuses 10  50 and 60 are not lImIted to those o# the #Irst embodIment  second embodIment and thIrd embodIment  respectIvely  and may be suItably changed or modI#Ied.
For example  although the #old*type portable termInal Is employed as an example o# the electronIc apparatus 10 In each o# the #Irst to thIrd embodIments  the electronIc apparatus 10 Is not lImIted to the #old*type portable termInal but may be applIed to other types o# electronIc apparatuses.
[00511
Further  the shapes and con#IguratIons o# the electronIc apparatuses 10  50  60  the cIrcuIt board 25  the solder balls 26  the electronIc component 28  the top portIon 28a o# the electronIc component 28  the cover member 30  the top plate portIons 32  61  the convex portIons 34  52  the spherIcal sur#aces 34a  52a  64a  the #lat sur#ace 52b  the through hole 62 and the convex portIon 64 etc. employed In the #Irst to thIrd embodIments are not lImIted thereto and may be changed suItably.
[00521
ThIs applIcatIon Is based on Japanese Patent ApplIcatIon (Japanese Patent ApplIcatIon No. 2010*054641) #Iled on March 11  2010 and the content thereo# Is Incorporated hereIn by re#erence. ExplanatIon o# SIgns
[00531
10  50  60 electronIc apparatus
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25 cIrcuIt board
26 solder ball
28 electronIc component
28a top portIon
30 cover member
32  61 top plate portIon
34  52 convex portIon
34a  52a  64a spherIcal surface
52b flat surface
62 through hole
64 convex portIon
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ClaIms
1! An electronIc apparatus comprIsIng:
a cIrcuIt board;
an electronIc component mounted on the cIrcuIt board vIa solder balls;
a cover member mounted on the cIrcuIt board so as to surround and cover the electronIc component; and
a convex portIon provIded at a top plate portIon of the cover member  whereIn the convex portIon Is deformable to a second state protrudIng on the cIrcuIt board sIde from a fIrst state protrudIng In a dIrectIon opposIte to the cIrcuIt board sIde  and the convex portIon contacts wIth a top portIon of the electronIc component In the second state!
2! The electronIc apparatus accordIng to claIm 1  whereIn the
convex portIon has a surface of an almost spherIcal shape!
3! The electronIc apparatus accordIng to claIm 1  whereIn the
convex portIon has a surface of an almost spherIcal shape and a flat surface!
4! The electronIc apparatus accordIng to claIm 1  whereIn the top
plate portIon Is provIded wIth a through hole and the convex portIon crosses the through hole and has a wIdth smaller than a wIdth of the
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through hole.
S. The electronIc apparatus accordIng to claIm 4  whereIn the
convex portIon Is con#Igured to have a shape that the almost spherIcal sur#ace thereo# Is cut so as to have the wIdth smaller than the wIdth o# the through hole.
6. The electronIc apparatus accordIng to claIm 1  whereIn a
protruded sIze o# the convex portIon wIth respect to the top plate portIon In the second state Is larger than a downward movement sIze o# the electronIc component wIth respect to the cIrcuIt l9oard In a state that the solder l9alls are melted l9y a re#low #urnace and then solIdI#Ied.

Abstract
To provIde an electronIc apparatus that can prevent electronIc components #rom beIng separated #rom a cIrcuIt board.
The electronIc apparatus 10 Includes a cIrcuIt board 25  an electronIc component 28 mounted on the cIrcuIt board 25 vIa solder balls 26  a cover member 30 mounted on the cIrcuIt board 25 so as to surround and cover the electronIc component 28 and a convex portIon 34 provIded at the top plate portIon 32 o# the cover member 30. The convex portIon 34 Is de#ormable to a second state protrudIng on the cIrcuIt board 25 sIde #rom a #Irst state protrudIng In the dIrectIon opposIte to the cIrcuIt board 25 sIde. When the convex portIon 34 Is de#ormed In the second state  the convex portIon 34 thus de#ormed can be made In contact wIth the top portIon 28a o# the electronIc component 28.
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