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Electronic Component Apparatus

Abstract: An electronic component apparatus includes a case having a housing portion (5), clamp portions (13,14) each made of a conductor and provided to the case in a shape of a capital V or U, a capacitor element (4) attached inside the housing portion (5) of the case, and lead wires (8,9) drawn out from the capacitor element (4) and connected to the clamp portions (13,14) at tip ends (8a, 9a), respectively. The tip ends (8a, 9a) of the lead wires (8,9) connected, respectively, to the clamp portions (13,14) are formed to have a non-circular cross section so as to conform to a shape of the clamp portions (13,14).

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
12 June 2012
Publication Number
09/2014
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
Parent Application
Patent Number
Legal Status
Grant Date
2018-08-07
Renewal Date

Applicants

MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310

Inventors

1. KURODA, MOTOKAZU
C/O MITSUBISHI ELECTRIC ENGINEERING CO., LTD., 13-5, KUDANKITA 1-CHOME, CHIYODA-KU, TOKYO 102-0073
2. IWAMOTO, SHINJI
C/O MITSUBISHI ELECTRIC CORPORATION, 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310

Specification

Description

ELECTRONIC COMPONENT APPARATUS

Field of the Invention

[0001]

The present invention relates to an electronic component apparatus attached to a brush holder of a vehicle AC generator or the like.

Background Art

[0002]

An electronic component apparatus in the related art, for example, a capacitor apparatus is attached to a plate of a brush holder of a vehicle AC generator.

The plate is made of resin by integral molding and serves also as a case forming a housing portion. Clamp portions provided integrally by insert molding are formed inside the case. A capacitor element is housed in the housing portion inside the case and lead wires from the capacitor element are connected to the respective clamp portions by soldering (for example, see Patent Document 1).

[0003]
A specific configuration of a capacitor apparatus in the related art will now be described. A clamp portion is of substantially V shape before soldering and a tip end of a lead wire having a circular cross section is attached to a joint surface of the V shape.

Then, the tip end of the lead wire is caulked at the clamp portion. The tip end of the lead wire is caulked until the tip end is press-fit to the clamp portion and also until the clamp portion is shaped like a capital U. Thereafter, the tip end of the lead wire and the clamp portion are connected by soldering. Finally, resin is filled in the case for fixation.

Related Art Document Patent Document

[0004]
Patent Document 1: WO2008/142778

Summary of the Invention

Problems that the Invention is to Solve

[0005]
In the capacitor apparatus in the related art, however, the lead wire of the capacitor element is a round wire having a circular cross section and the tip end, which is a portion joined to the clamp portion, is also a round wire having a circular cross section. Accordingly, an area jointed to solder is small and consequently joint strength to the clamp portion becomes weak.

Also, a caulking process is required when the tip end of the lead wire of the capacitor element and the clamp portion are joined. Hence, a connection process is complex and workability is poor.

[0006]
The invention is devised to solve the problem described above and has an object to obtain an electronic component apparatus not only capable of enhancing joint strength between a lead wire of an element in an electronic component and a clamp portion but also capable of improving connection workability.

Means for Solving the Problems

[0007]
An electronic component apparatus according to the invention includes clamp portions each of which is made of a conductor shaped like a capital V or U and an electronic component that has lead wires drawn out from an element in the electronic component and connected to the clamp portions at tip ends. The electronic component apparatus is characterized in that the tip ends of the lead wires connected to the clamp portions are formed to have a non-circular cross section so as to conform to a shape of the clamp portions.

Advantage of the Invention

[0008]

According to the invention, the tip ends of the lead vires of the element in the electronic component connected to the clamp portions are formed to have a non-circular cross section so as to conform to a shape of the clamp portions. Hence, because it becomes possible to increase a joint area between the lead wires and the clamp portions, joint strength can be enhanced. Also, by forming the tip ends of the lead wires to have a non-circular cross section, it becomes possible to form the tip ends in a shape suitable to a shape of the clamp portions . Accordingly, a range of application of the clamp portions and the lead wires can be widened, and not only can convenience be enhanced, but also the cost can be reduced. In addition, it becomes possible to omit a caulking process that is otherwise necessary to join the lead wires to the clamp portions. Hence, connection workability can be improved.

Brief Description of the Drawings

[0009]

Fig. 1 is an exploded perspective view of a major portion of a brush holder according to a first embodiment of the invention.

Fig. 2 is a front view of a capacitor apparatus according to the first embodiment of the invention.

Fig. 3 is a cross section taken on line A-A of Fig. 2.

Fig. 4 is a side view of the capacitor element according to the first embodiment of the invention.

Fig. 5is a partial cross section glowing a configuration of clamp portions according to the first embodiment of the invention.

Fig. 6 is a partial cross section showing a connection state of a lead wire of the capacitor element and the clamp portion according to the first embodiment of the invention.

Fig. 7 is a cross section of a tip end of the lead wire of the capacitor element according to the first embodiment of the invention.

Fig. 8 is a partial cross section showing a connection process of a lead wire of a capacitor element and a clamp portion according to a second embodiment of the invention.

Fig. 9 is a partial cross section showing the connection process of the lead wire of the capacitor element and the clamp portion according to the second embodiment of the invention.

Mode for Carrying Out the Invention

[0010]
Hereinafter, preferred embodiments of an electronic component apparatus of the invention will be described using the drawings.

[0011] First Embodiment
Fig. 1 is an exploded perspective view of a major portion of a brush holder according to a first embodiment of the invention. Fig. 2 is a front view of a capacitor apparatus according to the first embodiment of the invention. Fig. 3 is a cross section taken on line A-A of Fig. 2. Fig. 4 is a side view of a capacitor element according to the first embodiment of the invention. Fig. 5 is a partial cross section showing a configuration of clamp portions according to the first embodiment of the invention. Fig. 6 is a partial cross section showing a connection state of a lead wire of the capacitor element and the clamp portion according to the first embodiment of the invention. Fig. 7 is a cross section of a tip end of the lead wire of the capacitor element according to the first embodiment of the invention.

[0012]
Referring to Fig. 1, numeral 1 denotes a brush holder attached to a vehicle AC generator. The brush holder 1 has a brush 2and a lesin plate 3 is attached thereto in a detachable manner. The resin plate 3 serves also as a case for a capacitor element 4, which is an element in an electronic component. A housing portion 5 in which to house the capacitor element 4 is made of resin and formed integrally with the resin plate 3. Numeral 6 denotes a plus terminal and a minus terminal is embedded in the resin plate 3. The capacitor element 4 is attached inside the housing portion 5 and lead wires 8 and 9 each having a circular cross section are drawn out, respectively, from both sides of the capacitor element 4. The lead wires 8 and 9 are formed by coating an outer periphery of a steel wire 10 with copper 11 and by applying tin coating 12 on an outer periphery of the copper 11. Moreover, respective tip ends 8a and 9a of the. lead wires 8 and 9 are formed to have an oval cross section as is shown in Fig. 7.

[0013]
Inside the housing portion 5, two (plus and minus) clamp portions 13 and 14 are formed integrally by insert molding and fixed firmly. The clamp portions 13 and 14 are made of a conductor and formed to have a V-shaped tip end. The respective tip ends 8a and 9a of the lead wires 8 and 9 are connected to these V-shaped portions . Numeral 15 denotes solder connecting the respective tip ends 8a and 9a of the lead wires 8 and 9 to the clamp portions 13 and 14, respectively. The solder 15 is melted and firmly fixed in a state as is shown in Fig. 6. The respective tip ends 8a and 9a of the lead wires 8 and 9 of the capacitor element 4 are soldered to the clamp portions 13 and 14, respectively, inside the housing portion 5 first, and then mold resin 16 is filled in a space in the housing portion 5 for fixation.

[0014]
The respective tip ends 8a and 9a of the lead wires 8 and 9 of the capacitor element 4 are formed to have an oval cross section by a round wire crushing process. As is shown in Fig. 5, the respective tip ends 8a and 9a of the lead wires 8 and 9 are attached to the V-shaped portions of the clamp portions 13 and 14, respectively. Then, as is shown in Fig. 6, the tip ends 8a and 9a are connected to the clamp portions 13 and 14, respectively, by soldering with the solder 15.

[0015]
As is shown in Fig. 6, according to the first embodiment, a capacitor is used as the electronic component and it is possible to increase joint areas between the solder 15 and the respective tip ends 8a and 9a of the lead wires 8 and 9 of the capacitor element 4 as well as the clamp portions 13 and 14 . Accordingly, joint strength can be enhanced. It thus becomes possible to ensure sufficient joint strength even when the invention is applied to lead-free soldering.

Also, each of the lead wires 8 and 9 having a circular cross section is crushed only at the tip ends and deformed to have an oval cross section suitable for the shape of the clamp portions 13 and 14. Hence, by adequately adjusting a degree of crushing of the lead wires 8 and 9, the lead wires 8 and can conform to the clamp portions 13 and 14 of various shapes .

Accordingly, a range of application is widened and convenience is enhanced.

Further, joint areas between the respective tip ends 8a and 9a of the lead wires 8 and 9 and the clamp portions 13 and 14, respectively, are increased. Hence, in a case where these portions are joined by electrical resistance welding or the like, a temperature rise can be suppressed.

Moreover, it becomes possible to omit a caulking process that is otherwise necessary to join the respective tip ends 8a and 9a of the lead wires 8 and 9 to the clamp portions 13 and 14, respectively. Hence, connection workability can be improved.

[0016] Second Embodiment

Fig. 8 and Fig. 9 are partial cross sections of a major portion of a capacitor apparatus according to a second embodiment of the invention.

Referring to Fig. 8 and Fig. 9, a concavo-convex portion 8 0 is formed to the respective tip ends 8a and 9a of the lead wires 8 and 9 of the capacitor element 4.

Concavo-convex potions 13a and 14a are formed on V-shaped joint surfaces of the clamp portions 13 and 14, respectively, in a corresponding manner to the concavo-convex portions 8 0 of the lead wires 8 and 9, respectively.

[0017]
According to the second embodiment as above, a joint area between the solder 15 and the respective tip ends 8a and 9a of the lead wires 8 and 9 and the clamp portions 13 and 14 is large. Hence, joint strength can be enhanced further.

[0018]

The above has described a case where joint portions of the clamp portions 13 and 14 are of a V shape (including substantially a V shape) by way of example. It should be appreciated, however, that the same advantages can be achieved even when the joint portions are formed in a U shape (including substantially a U shape).

[0019]
Also, the respective embodiments above have described a case where the invention is applied to the vehicle AC generator by way of example . It should be appreciated, however, that applications of the invention are not limited to the vehicle AC generator and the invention is also applicable to those using a capacitor apparatus of this type.

[0020]
Further, the respective embodiments above have described a case where a capacitor is used as an electronic component by way of example. It should be appreciated, however, that the electronic component is not limited to capacitors and the same advantages as those of the respective embodiments above can be achieved even in a case where diodes, transistors, thyristors, ICs (integrated circuits) , and the like are used as the electronic component.

[0021]
Furthermore, the respective embodiments above have described a case where the clamp portions are provided integrally with the case by way of example. It should be appreciated, however, that the invention is also applicable to a case where the clamp portions are not provided to the case.

Industrial Applicability

[0022]
The invention is applied to an electronic component apparatus.

Description of Reference Numerals and Signs

[0023]
1: brush holder 3 s resin plate 4: capacitor element 5: housing portion 6: terminal 8 and 9: lead wire 8a and 9a: tip end 10: steel wire 11: copper 12: tin coating 13 and 14: clamp portion 13a and 14a: concavo-convex portion 15: solder 16: mold resin 80: concave-convex portion of the lead wire

IN, Amendments to (all) Claims and Abstract Claims:

1. An electronic component apparatus comprising:

clamp portions each of which is made of a conductor shaped like a capital V or U; and

an electronic component that has lead wires drawn out from an element in the electronic component and connected to the clamp portions at tip ends, characterized in that:

the tip ends of the lead wires connected to the clamp portions are formed to have a non-circular cross section so as to conform to a shape of the clamp portions.

2. The electronic component apparatus according to claim 1, characterized in that:

the tip ends of the lead wires are soldered to the clamp portions.

3. The electronic component apparatus according to claim 1, characterized in that:

the tip ends of the lead wires are connected to the clamp portions by resistance welding.

4. The electronic component apparatus according to claim 2, characterized in that:

the tip ends of the lead wires are formed to have an oval cross section.

5. The electronic component apparatus according to claim 4, characterized in that:

the lead wires are formed to have the oval cross section at the tip ends alone and a rest is formed to have a circular cross section.

6. The electronic component apparatus according to claim 2, characterized in that:

the lead wires are formed by attaching copper on an outer periphery of a steel wire.

7. The electronic component apparatus according to claim 6, characterized in that:

the lead wires are formed by coating a steel wire with copper and applying tin coating on an outer periphery of the copper.

8. The electronic component apparatus according to claim 2, characterized in that:

the tip ends of the lead wires are formed to have an oval cross section by crushing a round wire.

9. The electronic component apparatus according to claim 2, characterized in that:

the clamp portions are provided to a case having a housing portion, and the element in the electronic component is attached inside the housing portion.

10. The electronic component apparatus according to claim 9, characterized in that:

the housing portion of the case is filled with resin that electrically isolates and firmly fixes the element in the electronic component.

11. The electronic component apparatus according to claim 9, characterized in that:

the case is made of resin.

12. The electronic component apparatus according to claim 9, characterized in that:

the case is attached to a brush holder of a vehicle AC generator.

13. The electronic component apparatus according to claim 2, characterized in that:

the lead wires are drawn out, respectively, from both sides of the element in the electronic component, and the two lead wires are connected to the two clamp portions, respectively.

14. The electronic component apparatus according to any one of claims 1 through 13, characterized in that:

the lead wires are provided with a concavity and a convexity on surfaces to be joined to the clamp portions, and the clamp portions are provided with a concavity and a convexity on surfaces to be joined to the lead wires in a manner corresponding to the concavity and the convexity provided on the lead wires.

15. The electronic component apparatus according to claim 14, characterized in that:

the clamp portions are formed integrally with the case by insert molding.

16. The electronic component apparatus according to claim 14, characterized in that:

the electronic component is a capacitor.

Documents

Application Documents

# Name Date
1 5121-CHENP-2012 POWER OF ATTORNEY 12-06-2012.pdf 2012-06-12
1 5121-CHENP-2012-RELEVANT DOCUMENTS [09-03-2020(online)].pdf 2020-03-09
2 5121-CHENP-2012 PCT 12-06-2012..pdf 2012-06-12
2 5121-CHENP-2012-RELEVANT DOCUMENTS [28-02-2019(online)].pdf 2019-02-28
3 5121-CHENP-2012-IntimationOfGrant07-08-2018.pdf 2018-08-07
3 5121-CHENP-2012 FORM-5 12-06-2012.pdf 2012-06-12
4 5121-CHENP-2012-PatentCertificate07-08-2018.pdf 2018-08-07
4 5121-CHENP-2012 FORM-3 12-06-2012.pdf 2012-06-12
5 Abstract_Granted 299775_07-08-2018.pdf 2018-08-07
5 5121-CHENP-2012 FORM-2 12-06-2012.pdf 2012-06-12
6 Claims_Granted 299775_07-08-2018.pdf 2018-08-07
6 5121-CHENP-2012 FORM-18 12-06-2012.pdf 2012-06-12
7 Description_Granted 299775_07-08-2018.pdf 2018-08-07
7 5121-CHENP-2012 FORM-13 12-06-2012.pdf 2012-06-12
8 Drawings_Granted 299775_07-08-2018.pdf 2018-08-07
8 5121-CHENP-2012 FORM-1 12-06-2012.pdf 2012-06-12
9 5121-CHENP-2012 ENGLISH TRANSLATION 12-06-2012..pdf 2012-06-12
9 Marked up Claims_Granted 299775_07-08-2018.pdf 2018-08-07
10 5121-CHENP-2012 DRAWINGS 12-06-2012.pdf 2012-06-12
10 5121-CHENP-2012-Written submissions and relevant documents (MANDATORY) [24-07-2018(online)].pdf 2018-07-24
11 5121-CHENP-2012 DESCRIPTION (COMPLETE) 12-06-2012.pdf 2012-06-12
11 5121-CHENP-2012-HearingNoticeLetter.pdf 2018-06-14
12 5121-CHENP-2012 CORRESPONDENCE OTHERS 12-06-2012.pdf 2012-06-12
12 5121-CHENP-2012-ABSTRACT [06-02-2018(online)].pdf 2018-02-06
13 5121-CHENP-2012 CLAIMS 12-06-2012.pdf 2012-06-12
13 5121-CHENP-2012-Annexure [06-02-2018(online)].pdf 2018-02-06
14 5121-CHENP-2012 ABSTRACT 12-06-2012.pdf 2012-06-12
14 5121-CHENP-2012-CLAIMS [06-02-2018(online)].pdf 2018-02-06
15 5121-CHENP-2012 FORM-3 5-12-2012.pdf 2012-12-18
15 5121-CHENP-2012-COMPLETE SPECIFICATION [06-02-2018(online)].pdf 2018-02-06
16 5121-CHENP-2012 FORM-1 5-12-2012.pdf 2012-12-18
16 5121-CHENP-2012-DRAWING [06-02-2018(online)].pdf 2018-02-06
17 5121-CHENP-2012-FER_SER_REPLY [06-02-2018(online)].pdf 2018-02-06
17 5121-CHENP-2012 CORRESPONDENCE OTHERS 5-12-2012.pdf 2012-12-18
18 5121-CHENP-2012-FORM 3 [06-02-2018(online)].pdf 2018-02-06
18 5121-CHENP-2012-Form-13-120612.pdf 2016-11-21
19 5121-CHENP-2012-FER.pdf 2017-08-07
19 5121-CHENP-2012-FORM-26 [06-02-2018(online)].pdf 2018-02-06
20 5121-CHENP-2012-OTHERS [06-02-2018(online)].pdf 2018-02-06
21 5121-CHENP-2012-FER.pdf 2017-08-07
21 5121-CHENP-2012-FORM-26 [06-02-2018(online)].pdf 2018-02-06
22 5121-CHENP-2012-FORM 3 [06-02-2018(online)].pdf 2018-02-06
22 5121-CHENP-2012-Form-13-120612.pdf 2016-11-21
23 5121-CHENP-2012 CORRESPONDENCE OTHERS 5-12-2012.pdf 2012-12-18
23 5121-CHENP-2012-FER_SER_REPLY [06-02-2018(online)].pdf 2018-02-06
24 5121-CHENP-2012-DRAWING [06-02-2018(online)].pdf 2018-02-06
24 5121-CHENP-2012 FORM-1 5-12-2012.pdf 2012-12-18
25 5121-CHENP-2012-COMPLETE SPECIFICATION [06-02-2018(online)].pdf 2018-02-06
25 5121-CHENP-2012 FORM-3 5-12-2012.pdf 2012-12-18
26 5121-CHENP-2012 ABSTRACT 12-06-2012.pdf 2012-06-12
26 5121-CHENP-2012-CLAIMS [06-02-2018(online)].pdf 2018-02-06
27 5121-CHENP-2012 CLAIMS 12-06-2012.pdf 2012-06-12
27 5121-CHENP-2012-Annexure [06-02-2018(online)].pdf 2018-02-06
28 5121-CHENP-2012 CORRESPONDENCE OTHERS 12-06-2012.pdf 2012-06-12
28 5121-CHENP-2012-ABSTRACT [06-02-2018(online)].pdf 2018-02-06
29 5121-CHENP-2012 DESCRIPTION (COMPLETE) 12-06-2012.pdf 2012-06-12
29 5121-CHENP-2012-HearingNoticeLetter.pdf 2018-06-14
30 5121-CHENP-2012 DRAWINGS 12-06-2012.pdf 2012-06-12
30 5121-CHENP-2012-Written submissions and relevant documents (MANDATORY) [24-07-2018(online)].pdf 2018-07-24
31 5121-CHENP-2012 ENGLISH TRANSLATION 12-06-2012..pdf 2012-06-12
31 Marked up Claims_Granted 299775_07-08-2018.pdf 2018-08-07
32 5121-CHENP-2012 FORM-1 12-06-2012.pdf 2012-06-12
32 Drawings_Granted 299775_07-08-2018.pdf 2018-08-07
33 5121-CHENP-2012 FORM-13 12-06-2012.pdf 2012-06-12
33 Description_Granted 299775_07-08-2018.pdf 2018-08-07
34 5121-CHENP-2012 FORM-18 12-06-2012.pdf 2012-06-12
34 Claims_Granted 299775_07-08-2018.pdf 2018-08-07
35 5121-CHENP-2012 FORM-2 12-06-2012.pdf 2012-06-12
35 Abstract_Granted 299775_07-08-2018.pdf 2018-08-07
36 5121-CHENP-2012 FORM-3 12-06-2012.pdf 2012-06-12
36 5121-CHENP-2012-PatentCertificate07-08-2018.pdf 2018-08-07
37 5121-CHENP-2012-IntimationOfGrant07-08-2018.pdf 2018-08-07
37 5121-CHENP-2012 FORM-5 12-06-2012.pdf 2012-06-12
38 5121-CHENP-2012-RELEVANT DOCUMENTS [28-02-2019(online)].pdf 2019-02-28
38 5121-CHENP-2012 PCT 12-06-2012..pdf 2012-06-12
39 5121-CHENP-2012-RELEVANT DOCUMENTS [09-03-2020(online)].pdf 2020-03-09
39 5121-CHENP-2012 POWER OF ATTORNEY 12-06-2012.pdf 2012-06-12

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