Description:FIELD OF THE INVENTION
[001] The present invention relates to an electronic component enclosure. More particularly, relates to the electronic component enclosure for enclosing a Printed Circuit Board (PCB) and a method of assembling the electronic component enclosure.

BACKGROUND OF THE INVENTION
[002] In conventional electronic component enclosures, in order to protect Printed Circuit Board (PCB) components, a potting material is used. The potting material is poured within a casing adapted to enclose the PCB components and is then cured. The potting material protects the PCB components from abrasion and environmental hazards. However, potting material is incapable of providing ingress protection to the PCB components. Hence, sealants or gaskets are required to be mounted onto the casing, for preventing dust and/or water intrusion into the casing, thereby providing ingress protection to the PCB components. Additional components such as sealants and gaskets, increases cost and time of assembly of the electronic component, which is undesirable. Moreover, filling the casing completely with the potting material increases weight and also makes the process of assembly of the electronic component cumbersome and expensive. Additionally, potting when done in the whole casing requires replacement of the entire PCB unit, in the event of damage to the substrate of the PCB. That is, only replacement of PCB is feasible due to filling of the casing with potting material and no reworking or repairing of the PCB is possible, which is undesirable. Also, in existing electronic components, say a Vehicle Control Unit (VCU), the ports providing external interface to the VCU are fastened to the casing and an end cover using multiple fasteners. The casing has an end cover with gaskets for sealing the enclosure and the end cover has provisions for accommodating the external interface ports, thereby exposing the ports outside of the casing and the end cover for connecting the VCU to various components. However multiple fasteners are used to hold the ports in place and also the end cover, again increasing the number of components and cost in assembly and servicing.
[003] In order to overcome some of the aforesaid limitations, conformal coating of PCBs is carried out, wherein aerosol is sprayed on surface of the PCB or electronic components. However, such a process is again cumbersome and expensive.
[004] In view of the above, there is a need for an electronic component enclosure and a method of assembling the electronic component enclosure, which addresses one or more limitations stated above.

SUMMARY OF THE INVENTION
[005] In one aspect, an electronic component enclosure is provided. The electronic component enclosure comprises a casing for accommodating a Printed Circuit Board (PCB) having a plurality of electronic components and a plurality of heat dissipating components. A partition wall assembly is mounted onto the PCB and is adapted to be disposed in a front portion of the casing for partitioning the casing into the front portion and a rear portion. The partition wall assembly is adapted to receive and support one or more ports configured for providing communication interface to the plurality of electronic components in the PCB, the partition wall assembly is defined with a potting filling cavity for receiving and retaining a potting material in the front portion of the casing.
[006] In an embodiment, the partition wall assembly comprises a plurality of mounting elements for mounting the partition wall assembly onto the PCB.
[007] In an embodiment, the partition wall assembly comprises a top partition wall unit and a bottom partition wall unit. The top partition wall unit comprises a top portion, and a seat portion extending downwardly from the top portion. The seat portion is defined with one or more mounting elements for mounting the top partition wall unit to a top surface of the PCB. A bottom partition wall unit comprises a bottom portion and an engaging face extending upwardly from the bottom portion. The engaging face is defined with one or more mounting elements for mounting the bottom partition unit to a bottom surface of the PCB.
[008] In an embodiment, the top partition wall unit and the bottom partition wall unit are provided with one or more guide members. The one or more guide members extend downwardly from the top portion of the top partition wall unit and upwardly from the bottom portion of the bottom partition wall unit for engaging with support grooves in the one or more ports.
[009] In an embodiment, the top partition wall unit and the bottom partition wall unit comprises ribs provided on an inner surface of the top portion and on an inner surface of the bottom portion respectively. The ribs are adapted to enhance structural rigidity of the top partition wall unit and the bottom partition wall unit.
[010] In an embodiment, the top partition wall unit and the bottom partition wall unit comprises a plurality of cutouts on the top portion and on the bottom portion respectively. The plurality of cutouts is adapted to adhere the top partition wall unit and the bottom partition wall unit to the inner surface of the casing.
[011] In an embodiment, the casing comprises a stopper for restricting position of the partition wall assembly in the front portion of the casing.
[012] In an embodiment, guiding grooves are provided on inner side surfaces of the casing. The guiding grooves are adapted to guide and maintain orientation of the PCB within the casing.
[013] In another aspect, a method of assembling the electronic component enclosure is disclosed. The method comprises a top partition wall unit mounted onto the top surface of the Printed Circuit Board (PCB) through one or more mounting elements. A bottom partition wall unit is then mounted onto a bottom surface of the PCB through one or more mounting elements to form a PCB sub assembly. The top partition wall unit and the bottom partition wall unit upon mounting on the PCB define the potting filling cavity for receiving and retaining a potting material. One or more guide members of the top partition wall unit and the bottom partition wall unit engage with support grooves provided to one or more ports of the PCB, upon mounting of the top partition wall unit and the bottom partition wall unit onto the PCB, for supporting the one or more ports. The PCB sub assembly is thereafter inserted into a casing via a front portion such that, the top partition wall unit, the bottom partition wall unit and the one or more ports are disposed in a front portion of the casing. Subsequently, the potting material is potted in the potting filling cavity through the front portion of the casing. The potting material is thereafter cured for fixing the PCB sub assembly to the casing.

BRIEF DESCRIPTION OF THE DRAWINGS
[014] Reference will be made to embodiments of the invention, examples of which may be illustrated in accompanying figures. These figures are intended to be illustrative, not limiting. Although the invention is generally described in context of these embodiments, it should be understood that it is not intended to limit the scope of the invention to these particular embodiments.
Figure 1 is a perspective view of an electronic component enclosure, in accordance with an exemplary embodiment of the present invention.
Figure 2 is an exploded view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.
Figure 3 is a sectional view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.
Figure 4 is a perspective view of a top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 5 is a perspective view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 6a is a top view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 6b is a right-side view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 6c is a right-side view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 7 is a perspective view of a bottom partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 8 is a perspective view of the bottom partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 9a is a top view of the bottom partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 9b is a left-side view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 9c is a right-side view of the top partition wall unit, in accordance with an exemplary embodiment of the present invention.
Figure 10 is a flow diagram depicting a method of assembling the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.
Figure 11 is an exploded view of a PCB sub-assembly, in accordance with an exemplary embodiment of the present invention.
Figure 12 is an exploded view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.
Figure 13 is a perspective view of the electronic component enclosure, in accordance with an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION
[015] Various features and embodiments of the present invention here will be discernible from the following further description thereof, set out hereunder.
[016] Figure 1 is a perspective view of an electronic component enclosure 100 (hereinafter referred to as ‘enclosure 100’), in accordance with an exemplary embodiment of the present disclosure. The enclosure 100 is adapted to accommodate and protect a Printed Circuit Board (PCB) 104 (for e.g. as shown in Figure 2) having a plurality of electronic components (not shown) such as capacitors, resistors etc., and a plurality of heat dissipating elements (not shown), while being inexpensive and easy to manufacture and assemble.
[017] The enclosure 100 comprises a casing 102 adapted to accommodate the PCB 104 and/or any other electronic components. In the present embodiment, the casing 102 is a shell structure, adapted to accommodate the PCB 104 and/or the electronic components. The casing 102 is defined with a front portion 102a and a rear portion 102b. The front portion 102a acts as a mouth portion of the casing 102 and is adapted to receive the PCB 104 and/or the electronic components. In the present embodiment, the front portion 102a is provided with a larger area of cross-section than the rear portion 102b, for ease of entry of PCB 104 and/or electronic components into the casing 102. In an embodiment, the casing 102 is provided with an upper casing 102c and a lower casing 102d. The upper casing 102c and the lower casing 102d are attached to one another via conventional attaching mechanisms known in the art, to form the casing 102. In another embodiment, the upper casing 102c and the lower casing 102d may be integrally formed in the casing 102. In an embodiment, the casing 102 is defined with a stepped profile at the interface of the front portion 102a and the rear portion 102b, due to the larger area of cross-section of the front portion 102a compared to the rear portion 102b.
[018] In an embodiment, the casing 102 is provided with guiding grooves 134 (shown in Figures 2 and 12) on inner side surfaces 136 (shown in Figures 2 and 12) for guiding the PCB 104 to the rear portion 102b, thereby maintaining orientation and/or alignment of the PCB 104 within the rear portion 102b. During assembly of the PCB 104 into the casing 102, side portions (not shown) of the PCB 104 engage with the guiding grooves 134 and thereby, enable the guiding grooves 134 to guide and maintain orientation and/or alignment of the PCB 104 within the casing 102. In an embodiment, the guiding groove 134 may be etched onto the inner side surfaces 136 of the casing 102. In another embodiment, the upper casing 102c and the lower casing 102d may be defined with a cutout (not shown) at the adjoining side surfaces (not shown), so that the guiding grooves 134 are formed on the inner side surfaces 136 upon assembly of the upper casing 102c and the lower casing 102d.
[019] In an embodiment, the casing 102 is a flat oval cylindrical shell structure with a rectangular cross-section. In another embodiment, the casing 102 is made of a plastic material. Alternatively, the casing 102 may be made by a metallic material or a composite material as per design feasibility and requirement. In another embodiment, the dimensions of the casing 102 are selected as per the size of the PCB 104 and/or electronic components that is to be accommodated.
[020] Referring to Figure 2 in conjunction with Figure 1, a partition wall assembly 106 is mounted onto the PCB 104 via a plurality of mounting elements 112a, 112b. The partition wall assembly 106 is disposed on the front portion 102a. In an embodiment, the casing 102 comprises a stopper 128 for restricting position of the partition wall assembly 106 in the front portion 102a. The partition wall assembly 106 ensures partition of the casing 102 as the front portion 102a and the rear portion 102b. Such a construction, ensures that a potting material (not shown) is only required to be filled either at the front portion 102a or at the rear portion 102b, thereby mitigating the need for filling the potting material throughout the casing 102. In the present embodiment, the potting material is filled in the front portion 102a of the casing 102. Also, the partition wall assembly 106 prevents flow of the potting material from the front portion 102a to the rear portion 102b, and vice versa. In the present embodiment, the partition wall assembly 106 prevents flow of the potting material from the front portion 102a to the rear portion 102b. Further, the partition wall assembly 106 is adapted to receive and support one or more ports 108 provided to the PCB 104, in order to provide communication interface to the electronic components of the PCB 104. The communication interface enables transfer of electric current and electrical signals to the PCB 104 for operation of the electronic component and different components in a powered device, such as a vehicle (not shown) being controlled by the electronic component. In an embodiment, the electronic component may be a motor control unit (not shown) controlling the operation of a motor (not shown) of the vehicle. The motor may drive the vehicle and the motor control unit may be connected between one or more power sources (not shown) in the vehicle and the motor. The ports 108 may be the means for transfer of power and control signals to both the energy source and the motor. In another embodiment, the electronic component may be a vehicle control unit controlling different subsystems of the vehicle, such as, ignition system (not shown), transmission system (not shown), etc.
[021] The partition wall assembly 106 is also provided with a potting filling cavity 110 (for e.g. as shown in Figure 3) for receiving and retaining the potting material of the enclosure 100 in the front portion 102a. The potting filling cavity 110 ensures filling of the potting material within the front portion 102a itself, thereby mitigating requirement of filling the entire casing 102 with the potting material. Consequently, the enclosure 100 becomes inexpensive due to reduced usage of the potting material. Also, the potting material in the front portion 102a ensures that the PCB 104 is resistant to shocks and vibrations and prevents ingress of water, moisture or any corrosive agent from the front portion 102a toward the rear portion 102b. It is in the rear portion 102b of the casing 102 that the electronic components of PCB 104 are located and the potting material in the potting filling cavity 110 is in the front portion 102a of the casing 102. In an embodiment, the partition wall assembly 106 may be a monolithic structure. In the present embodiment, the partition wall assembly 106 is an assembly of a top partition wall unit 118 and a bottom partition wall unit 120, which will be described in description pertaining to Figures 4-9c.
[022] Referring to Figures 4-6c, the top partition wall unit 118 of the partition wall assembly 106 is depicted. The top partition wall unit 118 comprises a top portion 118a and a seat portion 118b that extends downwardly from the top portion 118a. In an embodiment, the downward extension of the seat portion 118b can be inclined to the top portion 118a, as per requirement. In an embodiment, the top portion 118a and the seat portion 118b conform to an inverted L-shaped structure (for e.g. as shown in Figure 6c), for feasibility of mounting onto the front portion 102a of the casing 102. The top portion 118a is adapted to engage on a top inner surface (not shown) of the front portion 102a of the casing 102, while the seat portion 118b engages with a top surface 104a of the PCB 104.
[023] Further, the seat portion 118b is defined with the mounting provisions 112a that engage with slots 104c (for e.g. as shown in Figures 2 and 10) provided in the PCB 104, and thus, enabling mounting of the top partition wall unit 118 onto the top surface 104a of the PCB 104. In an embodiment, the mounting provisions 112a engage with the slots 104c via a snap-fit mechanism. In an embodiment, the mounting provisions 112a are provided at the ends and at a central portion of the seat portion 118b. Corresponding to the location of the mounting provisions 112a, the slots 104c are provided for enabling engagement with the top surface 104a of the PCB 104.
[024] Further, one or more guide members 122 (for e.g. as shown in Figure 6b) are provided on the top partition wall unit 118. The guide members 122 extend downwardly from the top portion 118a towards the PCB 104. The guide members 122 are configured to engage with support grooves 132 provided on the one or more ports 108. The guide members 122 are configured to stably support the ports 108 within the enclosure 100. Thus, the guide members 122 act as a securing mechanism for the ports 108, thereby mitigating need for use of fasteners in the enclosure 100. In an embodiment, the guide members 122 extend upto a required length based on the depth of the support grooves 132 for seamless engagement. In another embodiment, the guide members 122 are a plurality of rectangular members with dimensions corresponding to the construction of the support grooves 132. In the present embodiment, each of the plurality of rectangular members are spaced apart between each other in order to conform to the construction of the support grooves 132.
[025] The top partition wall unit 118 further comprises ribs 114 provided on an inner surface 124 (for e.g. as shown in Figure 5) of the top portion 118a. The ribs 114 are adapted to enhance structural rigidity of the top partition wall unit 118. In the present embodiment, the ribs 114 are hexagonal in construction for enhancing the structural rigidity.
[026] In the present embodiment, a plurality of cutouts 116 (for e.g. as shown in Figure 6a) are provided on the top portion 118a. The plurality of cutouts 116 are adapted to adhere the top partition wall unit 118 to the inner surface of the casing 102 via the potting material added into the potting filling cavity 110. In an embodiment, the plurality of cutouts 116 are triangular in shape, as the vertex pointing towards the ports 108 ensures that the shear stress is directed away from the PCB 104 during disengagement of cables (not shown) from the ports 108.
[027] Referring to Figures 7-9c, the bottom partition wall unit 120 of the partition wall assembly 106 is depicted. The bottom partition wall unit 120 comprises a bottom portion 120a and an engaging portion 120b that extends upwardly from the bottom portion 120a. In an embodiment, the upward extension of the engaging portion 120b can be inclined to the bottom portion 120a, as per requirement. In an embodiment, the bottom portion 120a and the engaging portion 120b conform to an L-shaped structure (for e.g. as shown in Figure 9c), for feasibility of mounting onto the front portion 102a of the casing 102. The bottom portion 120a is adapted to engage on a bottom inner surface (not shown) of the front portion 102a of the casing 102, while the engaging portion 120b engages with a bottom surface 104b of the PCB 104. Upon engagement, the engaging portion 120b partitions the front portion 102a from the rear portion 102b of the casing 102, towards the bottom surface 104b of the PCB 104.
[028] Further, the engaging portion 120b is defined with the mounting provisions 112b that engage with the slot 104c (for e.g. as shown in Figures 2 and 10) provided on the PCB 104 and thus, enabling mounting of the bottom partition wall unit 120 onto the bottom surface 104b of the PCB 104. In an embodiment, the mounting provisions 112b extend upwardly from the bottom portion 120a. In an embodiment, the mounting provisions 112b engage with the slots 104c via a snap-fit mechanism. In an embodiment, the mounting provisions 112b are provided at the ends and a central portion of the engaging portion 120b for engagement with the slots 104c of the PCB 104.
[029] Furthermore, one or more guide members 122 may also be provided to the bottom partition wall unit 120, with construction identical to the one or more guide members 122 mounted onto the top partition wall unit 118. The bottom partition wall unit 120 also comprises ribs 114 provided on an inner surface 126 (for e.g. as shown in Figure 8) of the bottom portion 120a. The ribs 114 are adapted to enhance structural rigidity of the bottom partition wall unit 120. In the present embodiment, the ribs 114 are hexagonal in shape for enhancing the structural rigidity. In another embodiment, the construction and dimensions of the ribs 114 are provided as per design feasibility and requirement. In the present embodiment, a plurality of cutouts 116 (for e.g. as shown in Figure 9a) are provided on the bottom portion 120a. The plurality of cutouts 116 are adapted to adhere the bottom partition wall unit 120 to the inner surface of the casing 102 via the potting material that is added into the potting filling cavity 110.
[030] Figure 10 illustrates a flow diagram of a method 1000 for assembling the electronic component enclosure 100, in accordance with an exemplary embodiment of the present disclosure.
[031] At step 1002, the top partition wall unit 118 is mounted onto the top surface 104a of the PCB 104 through the one or more mounting elements 112a (for e.g. as shown in Figure 11). In an embodiment, the top partition wall unit 118 is mounted onto the top surface 104a via snap-fitting of the mounting elements 112a onto the slots 104c of the PCB 104.
[032] At step 1004, the bottom partition wall unit 120 is mounted onto the bottom surface 104b of the PCB 104 through one or more mounting elements 112b (for e.g. as shown in Figure 11) to form a PCB sub assembly 130 (for e.g. as shown in Figure 12). The PCB sub assembly 130 may be combination of the PCB 104, the top partition wall unit 118, and the bottom partition wall unit 120. The top partition wall unit 118 and the bottom partition wall unit 120 upon mounting on the PCB 104 define the potting filling cavity 110 for receiving and retaining the potting material. At this stage, the one or more guide members 122 of the top partition wall unit 118 and the bottom partition wall unit 120 engage with support grooves 132 in the ports 108 of the PCB 104 for supporting the ports 108.
[033] At step 1006. the PCB sub assembly 130 is inserted into the casing 102 (for e.g. as shown in Figure 12) such that, the top partition wall unit 118, the bottom partition wall unit 120 and the ports 108 are disposed in the front portion 102a of the casing 102. Upon inserting the PCB sub assembly 130 into the casing 102, the method 1000 proceeds to step 1008.
[034] At step 1008, the potting material is added or potted in the potting filling cavity 110. In an embodiment, the potting material is added or potted in the potting filling cavity 110 from the front portion 102a of the casing 102. Thereafter, the method 1000 proceeds to step 1010 where the potting material is cured thereby fixing the PCB sub assembly 130 to the casing 102.
[035] The claimed invention as discussed above is not routine, conventional, or well understood in the art, as the claimed aspects enable the following solutions to the existing problems in conventional technologies. Specifically, the claimed aspect of the partition wall assembly 106 comprising the top partition wall unit 118 and the bottom partition wall unit 120, facilitates local potting, improves manufacturability, serviceability and assembly of the enclosure 100. Also, the aspect of the top partition wall unit 118 and the bottom partition wall unit 120 mitigates the requirement of filling the potting material onto whole of the casing 102, thereby reducing weight and size of the enclosure 100. Additionally, the aspect of providing the one or more guide members 122 provides adequate support to the one or more ports 108, thereby facilitating a screwless design of the enclosure 100. Furthermore, due to the one or more guide members 122 and ribs 114 the need for a lid member which is typically used in conventional enclosures is mitigated, while achieving required sealing or ingress protection to the PCB 104. Moreover, due to the top partition wall unit 118 and the bottom partition wall unit 120 with the potting material, the PCB 104 can be removed and repaired with ease, thereby ensuring reusability of the PCB 104 and/or the enclosure 100. , Claims:WE CLAIM:
1. An electronic component enclosure (100), comprising:
a casing (102) for accommodating a Printed Circuit Board (PCB) (104) having a plurality of electronic components and a plurality of heat dissipating components; and
a partition wall assembly (106) mounted onto the PCB (104) and adapted to be disposed in a front portion (102a) of the casing (102) for partitioning the casing (102) into the front portion (120a) and a rear portion (102b), the partition wall assembly (106) adapted to receive and support one or more ports (108) configured for providing communication interface to the plurality of electronic components in the PCB (104),
wherein the partition wall assembly (106) is defined with a potting filling cavity (110) for receiving and retaining a potting material (100) in the front portion (102a) of the casing (102).

2. The electronic component enclosure (100) as claimed in claim 1, wherein the partition wall assembly (106) comprises a plurality of mounting elements (112a, 112b) for mounting the partition wall assembly (106) onto the PCB (104).

3. The electronic component enclosure (100) as claimed in claim 1, wherein the partition wall assembly (106) comprises:
a top partition wall unit (118) comprising a top portion (118a), and a seat portion (118b) extending downwardly from the top portion (118a), the seat portion (118b) defined with one or more mounting elements (112a) for mounting the top partition wall unit (118) to a top surface (104a) of the PCB (104); and
a bottom partition wall unit (120) comprising a bottom portion (120a) and an engaging face (120b) extending upwardly from the bottom portion (120a), the engaging face (120b) defined with one or more mounting elements (112b) for mounting the bottom partition unit (120) to a bottom surface (104b) of the PCB (104).

4. The electronic component enclosure (100) as claimed in claim 3, wherein the top partition wall unit (118) and the bottom partition wall unit (120) are provided with one or more guide members (122), the one or more guide members (122) extending downwardly from the top portion (118a) of the top partition wall unit (118) and upwardly from the bottom portion (120a) of the bottom partition wall unit (120) for engaging with support grooves (132) in the one or more ports (108).

5. The electronic component enclosure (100) as claimed in claim 3, wherein the top partition wall unit (118) and the bottom partition wall unit (120) comprises ribs (114) provided on an inner surface (124) of the top portion (118a) and on an inner surface (126) of the bottom portion (120a) respectively, the ribs (114) being adapted to enhance structural rigidity of the top partition wall unit (118) and the bottom partition wall unit (120).

6. The electronic component enclosure (100) as claimed in claim 3, wherein the top partition wall unit (118) and the bottom partition wall unit (120) comprises a plurality of cutouts (116) on the top portion (118a) and on the bottom portion (120a) respectively, the plurality of cutouts (116) being adapted to adhere the top partition wall unit (118) and the bottom partition wall unit (120) to the inner surface of the front portion (102a) of the casing (102).

7. The electronic component enclosure (100) as claimed in claim 1, wherein the casing (102) comprises a stopper (128) for restricting position of the partition wall assembly (106) in the front portion (102a) of the casing (102).

8. The electronic component enclosure (100) as claimed in claim 1, comprises guiding grooves (134) provided on inner side surfaces (136) of the casing (102), the guiding grooves (134) being adapted to guide and maintain orientation of the PCB (104) within the casing (102).

9. A method (1000) of assembling an electronic component enclosure (100), the method (1000) comprising:
mounting a top partition wall unit (118) onto a top surface (104a) of a Printed Circuit Board (PCB) (104) through one or more mounting elements (112a);
mounting a bottom partition wall unit (120) onto a bottom surface (104b) of the PCB (104) through one or more mounting elements (112b) to form a PCB sub assembly (130), the top partition wall unit (118) and the bottom partition wall unit (120) upon mounting on the PCB (104) define a potting filling cavity (110) for receiving and retaining a potting material;
wherein, one or more guide members (122) of the top partition wall unit (118) and the bottom partition wall unit (120) engage with support grooves (132) in one or more ports (108) of the PCB (104) upon mounting of the top partition wall unit (118) and the bottom partition wall unit (120) onto the PCB (104), for supporting the one or more ports (108);
inserting the PCB sub assembly (130) into a casing (102) through a front portion (102a) such that, the top partition wall unit (118), the bottom partition wall unit (120) and the one or more ports (108) are disposed in a front portion (102a) of the casing (102);
potting, the potting material in the potting filling cavity (110) through the front portion (102a) of the casing (102); and
curing, the potting material, for fixing the PCB sub assembly (130) to the casing (102).

Dated this 18th day of May 2022
TVS MOTOR COMPANY LIMITED
By their Agent & Attorney

(Nikhil Ranjan)
of Khaitan & Co
Reg No IN/PA-1471