BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] This invention relates to an electronic control device in which an electronic circuit board is housed in a case.
2. Description of the Related Art
[0002] In a conventional waterproof electronic control device, a plurality of connectors are provided on a substrate, the substrate is inserted into a case such that the connectors are exposed from the case, and then the case is filled with resin (see Japanese Patent Publication No. 4471993, for example). [0003] Further, in a case having a circuit board proposed in the prior art, a substrate is prevented from being inserted into the case upside down by providing a projecting portion on a front surface but not a rear surface of the substrate and providing a stopper in an insertion port of the case so that when the substrate is inserted into the case upside down, the projecting portion impinges on the stopper. The projecting portion is provided on both left and right sides of the substrate, and the stopper is provided on both left and right sides of the insertion port of the case (see Japanese Patent Application Publication No. 2010-171195, for example).

SUMMARY OF THE INVENTION
[0004] In the conventional case having a circuit board disclosed in Japanese Patent Application Publication No. 2010-171195, however, when the substrate is inserted into the case correctly, the stoppers oppose the rear surface of the substrate, and therefore regions opposed by the stoppers on the rear surface of the substrate form component disposal prohibited regions in which electronic components cannot be disposed. Further, the substrate is inserted into the case while being moved relative to the stoppers provided on the left and right sides, and therefore the component disposal prohibited region extends over entire substrate insertion direction region on the left and right sides of the rear surface of the substrate. As a result, the component disposal prohibited regions increase in size, leading to a reduction in a proportion of an effective surface area of the substrate, i.e. the surface area of a region in which electric wires and electronic components can be disposed.
[0005] This invention has been designed to solve the problem described above, and an object thereof is to obtain an electronic control device with which an electronic circuit board can be prevented from being housed in a case upside down, and a proportion of an effective surface area of a substrate

main body can be increased.
[000 6] An electronic control device according to this invention includes an electronic circuit board that includes a substrate main body having a first surface and a second surface and an electronic component provided on at least one of the first surface and the second surface, and a case housing the electronic circuit board, wherein an opening portion is provided in a depth direction front end portion of the case, a holding portion that projects into the case is provided in a depth direction rear end portion of the case, a rear end portion of the substrate main body is fitted to a holding groove provided in the holding portion, a projecting portion is provided in the rear end portion of the substrate main body on at least one of the first surface and the second surface, the projecting portion, when seen in the depth direction of the case, is disposed in an interference avoidance position removed from the holding portion, and when the electronic circuit board is turned over from a condition in which the projecting portion is positioned in the interference avoidance position such that respective positions of the first surface and the second surface are reversed, the projecting portion, when seen in the depth direction of the case, is positioned in an interference position overlapping at least a part of the holding portion. [0007] The electronic control device according to this

invention is configured such that when the electronic circuit board is mistakenly inserted into the case upside down, the projecting portion interferes with the holding portion. As a result, the electric circuit board can be prevented from being housed in the case upside down. Further, component disposal prohibited regions are not formed over an entire region of the substrate main body in the direction in which the substrate main body is inserted into the case, and therefore the proportion of the effective surface area of the substrate main body can be increased.
BRIEF DESCRIPTION OF THE DRAWINGS [0008] FIG. 1 is a perspective view showing an electronic control device for an internal combustion engine according to a first embodiment of this invention;
FIG. 2 is a front view showing a case when seen from an opening portion in FIG. 1;
FIG. 3 is a top view showing the electronic control device of FIG. 1;
FIG. 4 is a sectional view taken along an IV-IV line in FIG. 3;
FIG. 5 is a perspective view showing a condition in which an electronic circuit board of FIG. 1 is inserted into the case upside down;

FIG. 6 is a top view showing the electronic circuit board and the case when a projecting portion and a holding portion shown in FIG. 5 interfere with each other;
FIG. 7 is a sectional view taken along a VII-VII line in FIG. 6;
FIG. 8 is an enlarged top view showing a part of an electronic control device according to a second embodiment of this invention in which the projecting portion is provided; and
FIG. 9 is an enlarged top view showing a part of an electronic control device according to a third embodiment of this invention in which the projecting portion is provided.
DESCRIPTION OF THE PREFERRED EMBODIMENTS [0009] Embodiments of this invention will be described below with reference to the drawings.
First Embodiment
FIG. 1 is a perspective view showing an electronic control device for an internal combustion engine according to a first embodiment of this invention. In the drawing, an electronic control device 1 includes an electronic circuit board 2 and a resin case 3 in which the electronic circuit board 2 is housed. In this example, the electronic control device 1 is an electronic control device for an internal combustion engine, which is used to control an internal combustion engine. The

internal combustion engine may be an engine provided in a four-wheeled or two-wheeled vehicle, for example. [0010] The case 3 includes a flattened tubular portion 3a, and a case end wall portion 3b that blocks a lengthwise direction end portion of the tubular portion 3a. A depth direction of the case 3 matches the lengthwise direction of the tubular portion 3a, and a width direction of the case 3 matches a width direction of the tubular portion 3a. Accordingly, an opening portion 4 is provided in a depth direction front end portion of the case 3. Here, as shown in FIG. 1, the depth direction of the case 3 and the width direction of the case 3 are set as an X direction and a Y direction, respectively, [0011] The electronic circuit board 2 is disposed in the case 3 such that a width direction of the electronic circuit board 2 is aligned with the width direction Y of the case 3 and a depth direction of the electronic circuit board 2 is aligned with the depth direction X of the case 3. Further, the electronic circuit board 2 is inserted into the case 3 from the opening portion 4 along the depth direction X of the case 3 in a direction indicated by an arrow A. A front end portion of the electronic circuit board 2 is disposed in the opening portion 4. The case 3 is filled with a filling material such as resin while the front end portion of the electronic circuit board 2 remains exposed.

[0012] The electronic circuit board 2 includes a resin substrate main body 5, and a plurality of electronic components, not shown in the drawing, provided on the substrate main body 5.
[0013] The substrate main body 5 has a first surface 6 and a second surface 7. The first surface 6 and the second surface 7 are parallel surfaces that oppose each other in a thickness direction of the substrate main body 5. The plurality of electronic components are provided on at least one of the first surface 6 and the second surface 7 . In this example, electronic components are mounted on both the first surface 6 and the second surface 7. Semiconductor chips, for example, are used as the electronic components.
[0014] A plurality of contact terminals 8 are provided on a front end portion of the substrate main body 5. Wiring patterns, not shown in the drawing, are provided on both the first surface 6 and the second surface 7 of the substrate main body 5 as electric wires for electrically connecting the plurality of electronic components to the plurality of contact terminals 8. The wiring patterns are formed from a metal such as copper. Thus, a control board of an electronic control system formed by electrically connecting a plurality of electronic components to each other is provided on the substrate main body 5.

[0015] A vehicle body side connector, not shown in the drawing, is provided in a vehicle body in which the internal combustion engine is disposed. A wire harness formed by bundling a plurality of vehicle body wires is connected to the vehicle body side connector. The vehicle body side connector includes a connector housing and a plurality of connector terminals disposed in the connector housing. The plurality of vehicle body wires forming the wire harness are connected individually to the plurality of connector terminals.
[0016] The vehicle body side connector is connected to the electronic control device 1 by being fitted to the opening portion 4 of the case 3. When the vehicle body side connector is connected to the electronic control device 1, the front end portion of the substrate main body 5 is inserted into the connector housing of the vehicle body side connector. When the front end portion of the substrate main body 5 is inserted into the connector housing of the vehicle body side connector, the plurality of contact terminals 8 respectively contact the plurality of connector terminals such that the contact terminals 8 are electrically connected to the respective vehicle body wires . The control board of the electronic circuit board 2 is electrically connected to the plurality of vehicle body wires via the plurality of contact terminals 8. [0017] A projecting portion 9 is provided in a rear end

portion of the substrate main body 5. The projecting portion 9 is provided on at least one of the first surface 6 and the second surface 7. In this example, the projecting portion 9 is provided on both the first surface 6 and the second surface 7. Further, in this example, the projecting portion 9 is electrically cut off from the plurality of electronic components so as to be electrically independent of the control board. The projecting portion 9 provided on the first surface
6 and the projecting portion 9 provided on the second surface
7 may be shaped identically or differently.
[0018] The projecting portion 9 provided on the substrate main body 5 may be a mounted component such as a different semiconductor chip from the plurality of electronic components forming the control board, or a projecting portion formed from solder material, for example.
[0019] When a mounted component is used as the projecting portion 9, the mounted component is mounted on the substrate main body 5 by means of solder flow or reflow, for example. As a result, the mounted component serving as the projecting portion 9 can be mounted on the substrate main body 5 at the same time as the plurality of electronic components forming the control board, thereby preventing an increase in the number of processes required to manufacture the electronic control device 1.

[0020] When the projecting portion 9 is formed from solder material, a metal pattern is formed on the substrate main body 5, whereupon the projecting portion 9 is formed by coating the metal pattern on the substrate main body 5 with the solder material. Further, when the projecting portion 9 is formed from solder material, similarly to a case in which a mounted component is mounted on the substrate main body 5, formation of the projecting portion 9 from the solder material and mounting of the plurality of electronic components on the substrate main body 5 are implemented at the same time by means of solder flow or reflow, for example. As a result, the projecting portion 9 can be formed without using a separate component, thereby preventing an increase in cost, and the projecting portion 9 can be formed on the substrate main body 5 at the same time as the plurality of electronic components are mounted, thereby preventing an increase in the number of processes required to manufacture the electronic control device 1. The projecting portion 9 may be provided on only one of the first surface 6 and the second surface 7, but when the projecting portion 9 is formed from solder material, the thickness of the
solder material is normally set at several tens of urn to several hundreds of \xm, and therefore the projecting portion 9 is formed on both the first surface 6 and the second surface 7 as required. [0021] FIG. 2 is a front view showing the case 3 when seen

from the opening portion 4 in FIG. 1. Further, FIG. 3 is a top view showing the electronic control device 1 of FIG. 1, and FIG. 4 is a sectional view taken along an IV-IV line in FIG. 3. As shown in FIG. 2, a holding portion 11 and a pair of guide rails 12 are provided in the case 3.
[0022] As shown in FIGS. 3 and 4, the holding portion 11 is provided in a depth direction rear end portion of the case 3, or in other words on the case end wall portion 3b. Further, the holding portion 11 projects into the case 3 from the case end wall portion 3b toward the opening portion 4 . The holding portion 11 is provided with a holding groove 13 to which the rear end portion of the substrate main body 5 is fitted. The holding groove 13 is provided to extend in the width direction Y of the case 3. A depth direction of the holding groove 13 matches the depth direction X of the case 3. [0023] The pair of guide rails 12 are grooves provided parallel to an inner surface of the case 3 so as to extend in the depth direction X of the case 3. Further, the pair of guide rails 12 oppose each other in the width direction Y of the case 3. A pair of side portions of the substrate main body 5 are fitted individually to the pair of guide rails 12. As a result, displacement of the electronic circuit board 2 relative to the case 3 is restricted in the width direction Y of the case 3 by the pair of guide rails 12. When the electronic circuit board

2 is inserted into the case 3 from the opening portion 4, the
substrate main body 5 is guided in the depth direction X of the
case 3 by the pair of guide rails 12.
[0024] When the interior of the case 3 is seen in the depth direction X of the case 3 from the opening portion 4, an orthogonal center line that passes through the center of a straight line connecting the pair of guide rails 12 is set as a partition line P, and when two interior regions of the case
3 partitioned by the partition line P are set as a first region
Q and a second region R, the holding portion 11 is disposed in
only one of the first region Q and the second region R, as shown
in FIG. 2. In this example, the holding portion 11 is disposed
in the first region Q when the case 3 is seen in the depth
direction X of the case 3.
[0025] When the electronic circuit board 2 is fitted to the pair of guide rails 12 correctly so that the first surface 6 and the second surface 7 are oriented correctly relative to the case 3, the projecting portion 9, when seen in the depth direction X of the case 3, is positioned in a different region, among the first region Q and the second region R, to the holding portion 11. In other words, the projecting portion 9 is positioned in an interference avoidance position removed from the holding portion 11. [0026] When, on the other hand, the electronic circuit

board 2 is turned over from the correct condition in which the projecting portion 9 is positioned in the interference avoidance position so that respective positions of the first surface 6 and the second surface 7 are reversed, the projecting portion 9, when seen in the depth direction X of the case 3, is positioned in the same region, among the first region Q and the second region R, as the holding portion 11. In other words, the projecting portion 9 is located in an interference position overlapping at least a part of the holding portion 11. [0027] When the electronic circuit board 2 is disposed in the case 3 correctly, the rear end portion of the substrate main body 5 is fitted to the holding groove 13. The holding portion 11 holds the electronic circuit board 2 in a condition where the rear end portion of the substrate main body 5 is fitted to the holding groove 13.
[0028] As shown in FIGS. 2 and 3, when the case 3 is seen in the depth direction X of the case 3, the projecting portion 9 is disposed in a different region, among the first region Q and the second region R, to the holding portion 11. In this example, when the case 3 is seen in the depth direction X of the case 3, the holding portion 11 is disposed in the first region Q and the projecting portion 9 is disposed in the second region R. As a result, the projecting portion 9 is positioned in the interference avoidance position such that interference between

the holding portion 11 and the projecting portion 9 in the depth direction of the case 3 is avoided.
[0029] Further, the projecting portion 9 and the holding portion 11 are disposed in symmetrical positions about the partition line P when seen in the depth direction X of the case 3. Therefore, when the electronic circuit board 2 is turned over from a condition in which the projecting portion 9 is positioned in the interference avoidance position so that the respective positions of the first surface 6 and the second surface 7 are reversed, the projecting portion 9, when seen in the depth direction X of the case 3, is positioned in the interference position overlapping at least a part of the holding portion 11. In other words, when the electronic circuit board 2 is turned upside down from the correct condition, the projecting portion 9 interferes with the holding portion 11 in the depth direction X of the case 3.
[0030] Furthermore, as shown in FIG. 3, a total dimension (Ll + L2) of a distance LI from a width direction side face of the case 3 to the holding portion 11 and a width direction dimension L2 of the holding portion 11 is smaller than a distance from the width direction side face of the case 3 to the partition line P. Moreover, a depth dimension L3 of the holding groove 13 is larger than a distance L4 from a rear end surface of the substrate main body 5 to the projecting portion 9. In other

words, L3 > L4 . Therefore, in a condition where the electronic circuit board 2 is housed in the case 3, the projecting portion 9 overlaps at least a part of the holding portion 11 when seen in the width direction of the case 3.
[0031] As long as the projecting portion 9 interferes with the holding portion 11 when the electronic circuit board 2 is inserted into the case 3 upside down, or in other words when the electronic circuit board 2 is inserted into the case 3 incorrectly, the shape and position of the projecting portion 9 may be set as desired.
[0032] Next, a method of manufacturing the electronic control device 1 will be described. To manufacture the electronic control device 1, first, the pair of side portions of the substrate main body 5 are fitted respectively to the pair of guide rails 12, whereupon the electronic circuit board 2 is inserted into the case 3 from the opening portion 4 in the depth direction X of the case 3 while being guided by the pair of guide rails 12. As long as the electronic circuit board 2 is in the correct condition at this time, the holding portion 11 and the projecting portion 9 are located in the first region Q and the second region R, respectively, when seen from the depth direction X of the case 3, and therefore the projecting portion 9 is positioned in the interference avoidance position removed from the holding portion 11. As a result, interference between

the projecting portion 9 and the holding portion 11 in the depth direction of the case 3 is avoided.
[0033] The electronic circuit board 2 is then inserted into the case 3 until the rear end portion of the substrate main body 5 is pushed into the holding groove 13 of the holding portion 11 existing in the depth direction rear end portion of the case 3. As a result, as shown in FIGS. 3 and 4, the rear end portion of the substrate main body 5 is fitted to the holding groove 13 such that the electronic circuit board 2 is held in the holding portion 11. The electronic circuit board 2 is thus housed in the case 3.
[0034] Next, the case 3 is filled with a filling material such as resin, whereupon the filling material filled into the case 3 is hardened. As a result, the electronic circuit board 2 is fixed within the case 3, whereby the electronic control device 1 is completed.
[0035] In the electronic circuit board 2, electronic components are provided on both the first surface 6 and the second surface 7 of the substrate main body 5, and it may therefore be difficult to distinguish between the front and rear surfaces of the electronic circuit board 2. In this case, the electronic circuit board 2 may be inserted into the case 3 in a condition where the front and rear surfaces of the electronic circuit board 2 are turned upside down from the correct

condition.
[0036] Next, a case in which the electronic circuit board 2 is inserted into the case 3 upside down, or in other words a case in which the electronic circuit board 2 is inserted into the case 3 incorrectly, will be described. FIG. 5 is a perspective view showing a condition in which the electronic circuit board 2 of FIG. 1 is inserted into the case 3 upside down. When the electronic circuit board 2 is turned over from the correct condition, in which the front and rear surfaces of the electronic circuit board 2 are oriented correctly, so that the front and rear surfaces of the electronic circuit board 2 are reversed, the position of the projecting portion 9 when seen in the depth direction X of the case 3 shifts from the interference avoidance position, in which the front and rear surfaces of the electronic circuit board 2 are oriented correctly, to the interference position, which is symmetrical thereto about the partition line P. In this example, when the electronic circuit board 2 is turned over from the correct condition, in which the front and rear surfaces of the electronic circuit board 2 are oriented correctly, so that the front and rear surfaces of the electronic circuit board 2 are reversed, the position of the projecting portion 9 shifts from the second region R to the first region Q, i.e. the same region as the holding portion 11. As a result, the projecting portion

9 overlaps at least a part of the holding portion 11 when seen in the depth direction X of the case 3.
[0037] Hence, when the electronic circuit board 2 is inserted into the case 3 incorrectly, the projecting portion 9 interferes with at least a part of the holding portion 11 in the depth direction of the case 3 such that the rear end portion of the substrate main body 5 cannot be fitted all the way into the holding groove 13. As a result, it becomes physically impossible to house the electronic circuit board 2 in the case 3.
[0038] FIG. 6 is a top view showing the electronic circuit board 2 and the case 3 when the projecting portion 9 and the holding portion 11 of FIG. 5 interfere with each other. Further, FIG. 7 is a sectional view taken along a VII-VII line in FIG. 6. When the projecting portions 9 interferes with the holding portion 11, the rear end portion of the substrate main body 5 cannot be inserted all the way into the holding groove 13, and therefore the front end portion of the electronic circuit board 2 projects from the opening portion 4 of the case 3. In other words, as shown in FIG. 6, in comparison with a case where the front and rear surfaces of the electronic circuit board 2 are oriented correctly, the position of the electronic circuit board 2 deviates to the opening portion 4 side of the case 3 by a difference (L3 - L4) between the depth dimension L3 of the

holding groove 13 and the distance L4, with the result that the front end portion of the electronic circuit board 2 projects from the opening portion 4 of the case 3. It is therefore possible to determine at a glance that the electronic circuit board 2 is upside down.
[0039] By withdrawing the electronic circuit board 2 from the case 3 and orienting the front and rear surfaces of the electronic circuit board 2 correctly, the electronic circuit board 2 can then be housed in the case 3. [0040] The completed electronic control device 1 is attached to the vehicle body by inserting the front end portion of the electronic circuit board 2 into the vehicle body side connector.
[0041] In the electronic control device 1 thus configured, the projecting portion 9 is provided on both the first surface 6 and the second surface 7 of the substrate main body 5, and is disposed in the interference avoidance position removed from the holding portion 11 when seen in the depth direction of the case 3. Hence, in a condition where the electronic circuit board 2 is upside down, the projecting portion 9 is positioned in the interference position overlapping at least a part of the holding portion 11 when seen in the depth direction of the case 3 . Therefore, when the electronic circuit board 2 is mistakenly inserted into the case 3 upside down, the projecting portion

9 interferes with the holding portion 11. Accordingly, the rear end portion of the substrate main body 5 cannot be fitted to the holding groove 13, making it easy to determine that the electronic circuit board 2 is upside down. As a result, the electronic circuit board 2 can be prevented from being mistakenly housed in the case 3 upside down. Moreover, a component disposal prohibited region in which electronic components cannot be disposed can be limited to a partial region in the rear end portion of the substrate main body 5, or more specifically regions of the projecting portions 9 and a region in which the substrate main body 5 is fitted into the holding groove 13, and therefore a situation in which the component disposal prohibited region is formed over an entire region of the substrate main body 5 in the direction in which the substrate main body 5 is inserted into the case 3 can be avoided. Hence, a proportion of an effective surface area of the substrate main body 5, i.e. a surface area of a region in which electric wires and electronic components can be disposed, can be increased. As a result, the electronic circuit board 2 can be reduced in size and increased in density, enabling either a reduction in size or an increase in functionality in the electronic control device 1.
[0042] Assuming, for example, in the conventional case having a circuit board disclosed in Japanese Patent Application

Publication No. 2010-171195, described in the background art, that the widths of the parts of the substrate opposed by the left and right side stoppers are respectively 3 mm, and assuming that leeway of approximately 2 mm is provided in consideration of backlash when the substrate is inserted, the component disposal prohibited region in which electronic components cannot be disposed must be set at 5 mm in each of the left and right side end portions of the substrate. Further, in the conventional case having a circuit board disclosed in Japanese Patent Application Publication No. 2010-171195, the component disposal prohibited region extends over the entire substrate insertion direction region on both the left and right sides of the substrate, and therefore, assuming that a depth direction length of the substrate is 60 mm, a region of 60 x 5 x 2 = 600 mm2 is required as the component disposal prohibited region. [0043] According to this embodiment, on the other hand, assuming that the width direction dimension L2 of the holding portion 11 and the depth dimension L3 of the holding groove 13 are respectively set at 5 mm, the surface area of the region of the substrate main body 5 that is fitted to the holding groove 13, taking into account both the first surface 6 and the second surface 7, is 5x5x2 = 50 mm2. Moreover, when a semiconductor component having a width direction dimension of 1. 6 mm x a depth direction dimension of 0.8 mm is employed as the projecting

portion 9, the surface area of the region of the projecting portion 9, taking into account both the first surface 6 and the second surface 7, is 1.6 x 0.8 x 2 = 2.56 mm2. As a result, the component disposal prohibited region is formed in a total region of 50 + 2.56 = 52.56 mm2. According to this embodiment, therefore, the component disposal prohibited region can be greatly reduced in comparison with Japanese Patent Application Publication No. 2010-171195. In other words, limitations on substrate design are suppressed such that the control circuit can be configured at a higher density without varying the surface area of the substrate main body 5, enabling either a reduction in size or an increase in functionality in the electronic control device 1. Furthermore, the electronic circuit board 2 is prevented from being inserted incorrectly into the case 3, and therefore a rate at which defective electronic control devices 1 are generated can be suppressed. As a result, the electronic control device 1 can be assembled more efficiently and improved in quality.
[0044] Further, the projecting portion 9 is electrically cut off from the plurality of electronic components forming the circuit of the electronic control system, and therefore, even when the electronic circuit board 2 is mistakenly inserted into the case 3 upside down such that the projecting portion 9 comes into contact with the holding portion 11 so as to deform or fall

off, the abnormality in the projecting portion 9 can be prevented from having an adverse effect on the control circuit. As a result, the functions of the electronic control device 1 can be preserved.
[0045] Note that in the example described above, the projecting portion 9 is provided on both the first surface 6 and the second surface 7, but the projecting portion 9 may be provided on only one of the first surface 6 and the second surface 7. In this case, the region of the projecting portion 9 can be reduced even further, enabling a further reduction in the component disposal prohibited region of the substrate main body 5. As a result, the proportion of the effective surface area of the substrate main body 5 can be increased even further. [0046] Second Embodiment
FIG. 8 is an enlarged top view showing a part of the electronic control device 1 according to a second embodiment of this invention in which the projecting portion 9 is provided. A first wiring pattern 21 and a second wiring pattern 22 are provided on the substrate main body 5 as electric wires for electrically connecting the plurality of electronic components to the plurality of contact terminals 8, The first wiring pattern 21 is provided on the first surface 6, and the second wiring pattern 22 is provided on the second surface 7 . The first wiring pattern 21 and the second wiring pattern 22 are formed

from a metal such as copper.
[0047] The projecting portion 9 is formed on both the first wiring pattern 21 and the second wiring pattern 22. In this example, the projecting portion 9 is formed from solder material. Respective front surfaces of the substrate main body 5, the first wiring pattern 21, and the second wiring pattern 22 are covered by an insulator known as solder resist. The solder resist is removed from respective locations of the first wiring pattern 21 and the second wiring pattern 22 in which the projecting portions 9 are formed.
[0048] A plurality of vias 23 are provided in the substrate main body 5 so as to penetrate the substrate main body 5 in the thickness direction. The first wiring pattern 21 and the second wiring pattern 22 are electrically connected to each other via the respective vias 23. In this example, as shown in FIG. 8, some of the vias 23 are provided in the regions of the projecting portions 9 when seen in the thickness direction of the substrate main body 5. All other configurations are identical to the first embodiment.
[0049] Next, a method of providing the projecting portions 9 on the substrate main body 5 will be described. First, the solder resist is removed from the locations of the first wiring pattern 21 and the second wiring pattern 22 in which the projecting portions 9 are to be formed such that respective

parts of the first wiring pattern 21 and the second wiring pattern 22 are exposed. Next, solder material is applied to the exposed parts of the first wiring pattern 21 and the second wiring pattern 22 so as to bulge out therefrom, whereupon the projecting portions 9 are formed by hardening the applied solder material.
[0050] In the electronic control device 1 thus configured, the projecting portions 9 are provided respectively on the first wiring pattern 21 and the second wiring pattern 22, and therefore respective parts of the first wiring pattern 21 and the second wiring pattern 22 can be disposed in the regions of the projecting portions 9. As a result, the surface area of the substrate main body 5 can be used effectively. More specifically, when electric wires are not disposed in the regions of the projecting portions 9, the effective surface area of the substrate main body 5, i.e. the surface area of the region thereof in which electric wires and electronic components can be disposed, decreases, whereas in this embodiment, the regions in which the projecting portions 9 are provided double as regions in which respective parts of the first wiring pattern 21 and the second wiring pattern 22 are disposed. Hence, the projecting portions 9 can be provided on the substrate main body 5 without reducing the effective surface area of the substrate main body 5.

[0051] Note that in the example described above, the projecting portion 9 is formed on both the first wiring pattern 21 and the second wiring pattern 22, but the projecting portion 9 may be formed on only one of the first wiring pattern 21 and the second wiring pattern 22.
[0052] Further, in the example described above, the vias 23 are provided in the regions of the projecting portions 9, but the vias 23 may be omitted from the regions of the projecting portions 9. [0053] Third Embodiment
FIG. 9 is an enlarged top view showing a part of the electronic control device 1 according to a third embodiment of this invention in which the projecting portion 9 is provided. A wiring pattern 31 constituting an electric wire for electrically connecting the plurality of electronic components to the plurality of contact terminals 8 and a heat dissipating pattern, not shown in the drawing, disposed at a remove from the wiring pattern 31 are provided on the substrate main body 5.
[0054] The wiring pattern 31 and the heat dissipating pattern are formed from a metal such as copper. Further, the wiring pattern 31 and the heat dissipating pattern are respectively provided on both the first surface 6 and the second surface 7.

[0055] The projecting portion 9 is provided on the heat dissipating pattern so as to be removed from the wiring pattern
31. In this example, the projecting portion 9 is provided on
both the first surface 6 and the second surface 7. The
projecting portions 9 are formed from solder material.
[0056] The plurality of electronic components mounted on
the substrate main body 5 include a heat generating component
32. The heat generating component 32 includes a component main
body 32a, a plurality of electric terminals 32b projecting from
the component main body 32a so as to be connected to the wiring
pattern 31, and a heat dissipating terminal 32c projecting from
the component main body 32a so as to be connected to the
projecting portion 9. The electric terminals 32b are connected
to the wiring pattern 31 by soldering. Further, the heat
dissipating terminal 32c is connected to the projecting portion
9 by soldering.
[0057] Heat from the heat generating component 32 is transmitted to the heat dissipating pattern from the heat dissipating terminal 32c via the projecting portion 9 . The heat dissipating pattern and the projecting portion 9 discharge heat from the heat generating component 32 to the outside. All other configurations are identical to the first embodiment. [0058] Next, a method of providing the projecting portion 9 on the substrate main body 5 will be described. Solder

material is provided on the part of the heat dissipating pattern, the heat dissipating pattern being formed on the substrate main body 5, in which the projecting portion 9 is to be formed, and the heat generating component 32 is mounted on the substrate main body 5 by reflow or the like. Hence, the projecting portion 9 is provided on the substrate main body 5 at the same time as the heat generating component 32 is mounted on the substrate main body 5.
[0059] In the electronic control device 1 thus configured, the heat dissipating pattern for discharging heat from the heat generating component 32 to the outside is provided on the substrate main body 5, and the projecting portion 9 is provided on the heat dissipating pattern. Therefore, a part of the heat dissipating pattern can be disposed in the region of the projecting portion 9, whereby the surface area of the substrate main body 5 can be used effectively. More specifically, the heat dissipating pattern is preferably formed over a wide area in order to reduce thermal resistance so as to obtain an improved heat dissipation performance, but when the disposal area of the heat dissipating pattern is widened, the effective surface area of the substrate main body 5 decreases. In this embodiment, a part of the heat dissipating pattern is disposed in the region where the projecting portion 9 is provided. As a result, the heat dissipation performance can be improved and the electronic

circuit board 2 can be prevented from being inserted into the case 3 incorrectly while suppressing the amount by which the effective surface area of the substrate main body 5 is reduced. [0060] Note that in the example described above, the projecting portion 9 is provided on both the first surface 6 and the second surface 7, but the projecting portion 9 may be provided on only one of the first surface 6 and the second surface 7.
[0061] Note that in the example described above, the projecting portion 9 is formed from solder material, but instead, a different mounted component from the electronic components forming the control circuit may be provided on the substrate main body 5 as the projecting portion 9.
[0062] Further, in the embodiments described above, electronic components are provided on both the first surface 6 and the second surface 7, but electronic components may be provided on only one of the first surface 6 and the second surface 7.

What Is Claimed Is:
1. An electronic control device comprising:
an electronic circuit board that includes a substrate main body having a first surface and a second surface, and an electronic component provided on at least one of the first surface and the second surface; and
a case housing the electronic circuit board,
wherein an opening portion is provided in a depth direction front end portion of the case,
a holding portion that projects into the case is provided in a depth direction rear end portion of the case,
a rear end portion of the substrate main body is fitted to a holding groove provided in the holding portion,
a projecting portion is provided in the rear end portion of the substrate main body on at least one of the first surface and the second surface,
the projecting portion, when seen in the depth direction of the case, is disposed in an interference avoidance position removed from the holding portion, and
when the electronic circuit board is turned over from a condition in which the projecting portion is positioned in the interference avoidance position such that respective positions of the first surface and the second surface are reversed, the projecting portion, when seen in the depth direction of the case,

is positioned in an interference position overlapping at least a part of the holding portion.
2. The electronic control device according to claim 1, wherein a different mounted component from the electronic component is provided on the substrate main body as the projecting portion.
3. The electronic control device according to claim 1, wherein the projecting portion is formed from solder material.
4. The electronic control device according to claim 3, wherein a heat dissipating pattern for discharging heat from the electronic component to the outside is provided on the substrate main body, and
the projecting portion is provided on the heat dissipating pattern.
5. The electronic control device according to claim 3,
wherein an electric wire to which the electronic component is
electrically connected is provided on the substrate main body,
and
the projecting portion is provided on the electric wire.

6. The electronic control device according to any one of claims 1 to 3, wherein the projecting portion is electrically cut off from the electronic component.