Title of invention: Electronic control device
Technical field
[0001]
　The present invention relates to an electronic control device in which two circuit boards are sealed with a resin.
Background technology
[0002]
　Among the electronic control devices having a resin-sealed structure, there is a so-called card edge connector type electronic control device provided with a card edge connector that can be inserted into an edge connector socket. The card edge connector is configured by providing a terminal portion, which is an external connection terminal, at an end portion of a circuit board. Regarding such a card edge connector type electronic control device, there is a technique disclosed in Patent Document 1.
[0003]
　In the electronic control device disclosed in Patent Document 1, a circuit board is arranged in a cavity of a transfer mold mold composed of a lower mold and an upper mold, and a card edge terminal portion of the circuit board is sandwiched between the lower mold and the upper mold. The circuit board is sealed with the resin by pushing the molten resin material into the cavity.
Prior art literature
Patent documents
[0004]
Patent Document 1: Japanese Unexamined Patent Publication No. 2006-173402
Outline of the invention
Problems to be solved by the invention
[0005]
　By the way, with respect to such an electronic control device, there is a case where it is desired to increase the signal transmission system with the outside. In this case, the number of terminals constituting the card edge terminal portion may be increased. However, if the number of terminals is increased, the width of the card edge terminal portion becomes wider. This is disadvantageous from the viewpoint of miniaturization of the electronic control device. Therefore, there is a limit to increasing the number of card edge terminals.
[0006]
　Therefore, the substrate surfaces of the two circuit boards are arranged so as to face each other while being separated from each other, and the entire two circuit boards are sealed with a resin sealing member in a state where the respective card edge terminals are exposed. Is possible.
[0007]
　In order to expose each card edge terminal portion, it is necessary to seal between the card edge terminal portions when the molten resin material is poured into the cavity of the mold. As an example of the sealing method, it is conceivable to move and fit the slide type between each card edge terminal portion.
[0008]
　In order to prevent the molten resin from leaking from the cavity, it is necessary to bring each card edge terminal portion into close contact with the slide type. Therefore, when the slide type moves, the slide type and each card edge terminal portion rub against each other. Ensuring the quality of each card edge terminal against this rubbing phenomenon is important for improving the quality of the electronic control device.
[0009]
　An object of the present invention is to provide a technique capable of ensuring the quality of a card edge terminal portion.
Means to solve problems
[0010]
　According to the invention according to claim 1, two circuit boards in which each card edge terminal portion faces in the same direction and the respective substrate surfaces face each other, and a
　plurality of circuit boards mounted on the two circuit boards, respectively. and electronic components,
　to expose only the card edge terminal portion of said each comprise a sealing member made of resin which seals the whole of the plurality of electronic components and the two circuit boards,
　wherein each The card edge terminal portion of the above has a plurality of terminals provided on the substrate surface and an electrically insulating printed layer surrounding each of the terminals, and
　the surface of the printed layer is the thickness of the circuit board. Provided is an electronic control device characterized in that the direction is set higher than the contact surface of each of the terminals.
[0011]
　As described in claim 2, preferably, the two circuit boards have an electrically insulating plate-shaped base material, a wiring layer provided on the surface of the base material, and a surface of the base material, respectively. The
　printing layer is a silk printing layer printed on the surface of the solder resist layer by silk printing, including an electrically insulating solder resist layer covering the above.
[0012]
　As described in claim 3, preferably, the two circuit boards are arranged in a tapered shape so that the distance between the two circuit boards increases toward each of the card edge terminals.
Effect of the invention
[0013]
　According to claim 1, each card edge terminal portion has a plurality of terminals provided on the substrate surface and an electrically insulating printing layer surrounding the periphery of each terminal. The surface of this printed layer is set higher than the contact surface of each terminal in the thickness direction of the circuit board. Therefore, when the slide mold is fitted between the card edge terminals, the slide mold comes into contact with the print layer without contacting each terminal. Since the slide type and each terminal do not rub against each other, the quality of the card edge terminal portion is ensured.
[0014]
　In claim 2, the printing layer is printed on the surface of the solder resist layer by silk printing. Therefore, when printing a component number or the like on the surface of the solder resist layer by silk printing, a printing layer can be provided at the same time. A print layer can be provided around the card edge terminal portion without increasing the number of new steps.
[0015]
　In claim 3, the circuit boards are arranged in a tapered shape so that the distance between them increases toward each card edge terminal portion. Therefore, when the slide mold is fitted or pulled out between the card edge terminals, the slide mold moves only slightly and becomes non-contact with the print layer. Therefore, the distance between the slide type and the contact surface of the terminal can be further increased. The quality of the electronic control device can be easily improved.
A brief description of the drawing
[0016]
FIG. 1A is a cross-sectional view of an electronic control device according to an embodiment. FIG. 1B is an enlarged view of a portion 1b of FIG. 1A. ..
FIG. 2A is a plan view of the periphery of the card edge terminal portion of the electronic control device shown in FIG. FIG. 2B is a sectional view taken along line 2b-2b of FIG. 2A.
FIG. 3A is a diagram illustrating a preparatory step of a manufacturing method of the electronic control device shown in FIG. 1A. FIG. 3B is a diagram illustrating a substrate arranging process to a pushing process.
FIG. 4A is a diagram illustrating a resin molding process. FIG. 4B is a perspective view of the electronic control device.
Mode for carrying out the invention
[0017]
　Embodiments of the present invention will be described below with reference to the accompanying drawings. In the explanation, the term "upper and lower" refers to the upper and lower parts with reference to the drawing.

[0018]
　See FIG. 1 (a). The electronic control device 10 is mounted on a motorcycle, for example, and is used by being inserted into an edge connector socket Co.
[0019]
　The electronic control device 10 electrically connects the power supply board 20 (circuit board 20), the control board 30 (circuit board 30) provided opposite to the power supply board 20, and these circuit boards 20 and 30. It has a connecting portion 11 and a resin-made sealing resin portion 12 (sealing member 12) that seals a part of these circuit boards 20 and 30 and the connecting portion 11.
[0020]
　The surface of the power supply board 20 facing the control board 30 is referred to as the first facing surface 21 (board surface 21). The surface opposite to the first facing surface 21 is referred to as the first outer surface 22. The surface of the control board 30 facing the power supply board 20 is referred to as a second facing surface 31 (board surface 31). The surface opposite to the second facing surface 31 is referred to as the second outer surface 32.
[0021]
　A plurality of electronic components 23 to 26 are mounted on the power supply board 20, and a first card edge terminal portion 27 (card edge terminal) that can supply power to these electronic components 23 to 26 and can be inserted into the edge connector socket Co. Part 27) is formed.
[0022]
　The first card edge terminal portion 27 is exposed to the outside from the sealing resin portion 12. The first card edge terminal portion 25 needs to be formed on at least the first facing surface 21.
[0023]
　A plurality of electronic components 33 to 35 are mounted on the control board 30, and a second card edge terminal portion 36 (card edge terminal) that can supply power to these electronic components 33 to 35 and can be inserted into the edge connector socket Co. Part 35) is formed.
[0024]
　The second card edge terminal portion 35 is exposed to the outside from the sealing resin portion 12. The second card edge terminal portion 35 needs to be formed at least on the second facing surface 31.
[0025]
　The electronic components 23 to 26 and the electronic components 33 to 35 are, for example, transistors, ICs, diodes and the like. The first card edge terminal portion 27 and the second card edge terminal portion 36 face in the same direction.
[0026]
　See FIG. 1 (b). The power supply board 20 and the control board 30 are arranged at an angle with respect to the parallel lines PL and PL extending in parallel with each other. The tilt angle of the power supply board 20 with respect to the parallel line PL is θ1, and the tilt angle of the control board 30 with respect to the parallel line PL is θ2. θ1 and θ2 may have the same angle or may be different. It is desirable that θ1 and θ2 are 0.5 ° to 2.0 °.
[0027]
　The distance from the power supply board 20 to the control board 30 is L1 at the tip portions 28 and 37, respectively. The distance from the power supply board 20 to the control board 30 is L2 in the vicinity of the sealing resin portion 14. Here, L1> L2. The two circuit boards 20 and 30 are arranged so that the card edge terminal portions 27 and 36 face each other while being separated from each other, and the connecting portion 11 is provided so that the portions exposed from the sealing resin portion 14 are spaced apart from each other. They are arranged so as to be tilted from each other so as to spread from the bent portion toward the tip portions 28 and 37. That is, the two circuit boards 20 and 30 are arranged in a tapered shape so that the distance between the two circuit boards 20 and 30 increases toward the card edge terminal portions 27 and 36, respectively.
[0028]
　See FIG. 1 (a). Arbitrary parts such as wires, bus bars, and flexible wiring can be used for the connecting portion 11.
[0029]
　The sealing resin portion 12 is molded by a transfer mold. As the material of the sealing resin portion 12, any resin material such as epoxy resin, phenol resin, melamine resin, unsaturated polyester, silicon resin, polyurethane, polypropylene and the like can be adopted.
[0030]
　See FIG. 2 (a). On the first outer surface 22, the first card edge terminal portion 27 has a plurality of terminals 41, for example, seven terminals 41.
[0031]
　See FIG. 2 (b). The power supply board 20 has electrical insulation, for example, electrical insulation covering both sides of a glass plate base material 51, copper wiring layers 52 and 53 provided on both sides of the base material 51, and both sides of the base material 51. Includes sex solder resist layers 54, 55 and print layers 60, 70 printed on both sides of the solder resist layers 54, 55. The terminal 41 is a part of the wiring layer 52 and is exposed from the solder resist layer 52.
[0032]
　See FIG. 2 (a). The printed layer 60 is a product number of the power supply board 20, characters, figures, symbols, etc. for assisting in the mounting work of the electronic components 23 to 26, and is formed by silk printing. In this embodiment, the printing layer 60 includes a symbol 61 indicating the electronic component 21 and a first surrounding portion 62 surrounding each terminal 41.
[0033]
　In a plan view, the first surrounding portion 62 has a first region 63 extending from the edge of the sealing resin portion 12 to the lateral edge of the terminal 41, and the terminal 41 adjacent to the first region 63. It can be divided into a second region 64 extending to the edge in the lateral direction opposite to the second region 64 and a third region 65 adjacent to the second region 64 and extending to the tip portion 28. The first region 63 and the third region 65 have a band shape. The second region 64 has a rectangular shape and is intermittently located between the seven terminals 41 and to the side thereof.
[0034]
　See FIG. 2 (b). Also on the first facing surface 21, a second surrounding portion 72 surrounding the terminal 42 is formed on the surface of the solder resist layer 55. Further, the second card edge terminal portion 36 of the control board 30 has the same configuration. The description is omitted.
[0035]
　The thickness of the wiring layer 52 on the first outer surface 22 side and the thickness of the wiring layer 53 on the first facing surface 21 side are the same. Similarly, the thicknesses of the solder resist layers 54 and 55 are the same, and the thicknesses of the print layers 60 and 70 are also the same.
[0036]
　The surface 72a of the second surrounding portion 72 (printing layer 70) is set higher than each terminal 42 in the thickness direction of the power supply board 20. That is, the height H1 to the surface 72a of the second surrounding portion 72 is higher than the height H2 to the contact surface 42a of the terminal 42 with reference to the center C in the thickness direction of the power supply board 20 (H1> H2). ).
[0037]
　The second card edge terminal portion 36 (FIG. 1 (b)) has the same configuration as the first card edge terminal portion 27. That is, the second facing surface 31 is provided with a third surrounding portion 67 around the terminal 43. The second outer surface 32 is provided with a fourth surrounding portion 77 around the terminal 44.
[0038]
　Next, a method of manufacturing the electronic control device will be described.
[0039]
　See FIG. 3 (a). First, it is composed of a power supply board 20 having a first card edge terminal portion 27, a control board 30 having a second card edge terminal portion 36, and a connection portion 11 connecting the power supply board 20 and the control board 30. The main body 13 is prepared.
[0040]
　See FIG. 3 (b). A molding die 80 for molding the sealing resin portion 12 (see FIG. 1A) will be described. The molding die 80 slides in the left-right direction between the fixed lower die 81, the upper die 82 which is stacked on the upper part of the lower die 81 and can be moved up and down, and the lower die 81 and the upper die 82. A slide type 84 whose tip can penetrate into the cavity 83, a first support member 85 extending upward from the lower mold 81 to support the power supply board 20, and a control type 85 extending upward from the lower mold 81. A second support member 86 that supports the substrate 30, a first urging portion 87 that urges the power supply substrate 20 toward the slide type 53, and a second urging portion 87 that urges the control board 30 toward the slide type 53. It has an urging portion 88 and a plunger 89 that heats the resin material 12M and fills the cavity 83.
[0041]
　The length of the end 84a on the cavity 83 side of the slide type 84 is L3, and the length of the end 84b on the opposite side is L4. The length L4 of the end 84b is longer than the length L3 of the end 84a. That is, L3