FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
[See section 10, Rule 13]
ELECTRONIC DEVICE;
MITSUBISHI ELECTRIC CORPORATION, A CORPORATION
ORGANISED AND EXISTING UNDER THE LAWS OF JAPAN, WHOSE
ADDRESS IS 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 1008310,
JAPAN
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE
INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED
2
DESCRIPTION
Technical Field
[0001] The present disclosure relates to an electronic device.
5 Background Art
[0002] An electronic device, such as a propulsion controller or a power supply
device installed on a railway vehicle, includes a housing accommodating multiple
electronic components. Patent Literature 1 describes an example of such an electronic
device. A vehicle driving controller described in Patent Literature 1 as an example of an
10 electronic device includes multiple semiconductor elements accommodated in a housing
and attached to a cooling block, and an insulator located between the semiconductor
devices to prevent pieces of any broken semiconductor device from scattering and
damaging other semiconductor devices.
Citation List
15 Patent Literature
[0003] Patent Literature 1: Unexamined Japanese Patent Application Publication
No. 2013-163503
Summary of Invention
Technical Problem
20 [0004] When, for example, an electronic device has an overcurrent, the electronic
device stops, but the overcurrent may break semiconductor devices, causing scattering of
broken pieces of the semiconductor devices. An insulator included in a vehicle driving
controller described in Patent Literature 1 is attached to a cooling block between the
semiconductor devices, and leaves a gap between the insulator and a housing. This gap
25 may allow scattering pieces of one semiconductor device to pass through between the
insulator and the housing and come in contact with another semiconductor device, and
may break the other semiconductor device. This issue is common to the semiconductor
3
device as well as to electronic components included in an electronic device.
[0005] In response to the above circumstances, an objective of the present
disclosure is to provide an electronic device that suppresses pieces of any electronic
component included in the electronic device scattering and coming in contact with other
5 electronic components.
Solution to Problem
[0006] To achieve the above objective, an electronic device according to an aspect
of the present disclosure includes a housing, a base, and a partition assembly. The
housing accommodates a plurality of electronic components. The base is removably
10 attached to the housing and at least two of the plurality of electronic components are
attached to the base. The partition assembly separates at least one electronic component
of the at least two electronic components attached to the base from another electronic
component of the at least two electronic components attached to the base. The partition
assembly includes a first partition and a second partition. The first partition is located to
15 separate the at least one electronic component of the at least two electronic components
from the another electronic component of the at least two electronic components. The
second partition is located adjacent to the first partition and closes at least a part of a gap
between the first partition and the housing.
Advantageous Effects of Invention
20 [0007] The partition assembly included in the electronic device according to the
above aspect of the present disclosure includes the first partition that separates at least one
electronic component of at least two electronic components attached to the base from
another electronic component,of the at least two electronic components attached to the
base and the second partition located adjacent to the first partition and closing at least the
25 part of the gap between the first partition and the housing. This structure can reduce the
likelihood that pieces of any electronic component scatter and come in contact with other
electronic components.
4
Brief Description of Drawings
[0008] FIG. 1 is a circuit diagram of an electronic device according to Embodiment
1;
FIG. 2 is a cross-sectional view of the electronic device according to Embodiment
5 1;
FIG. 3 is a perspective view of the electronic device according to Embodiment 1;
FIG. 4 is a cross-sectional view of the electronic device according to Embodiment
1 taken along line IV-IV as viewed in the direction indicated by the arrows in FIG. 2;
FIG. 5 is a cross-sectional view of the electronic device according to Embodiment
10 1 taken along line V-V as viewed in the direction indicated by the arrows in FIG. 2;
FIG. 6 is a perspective view of electronic components in Embodiment 1;
FIG. 7 is a perspective view of a housing and a partition assembly in Embodiment
1;
FIG. 8 is a cross-sectional view of an electronic device according to Embodiment
15 2;
FIG. 9 is a cross-sectional view of the electronic device according to Embodiment
2 taken along line IX-IX as viewed in the direction indicated by the arrows in FIG. 8;
FIG. 10 is a cross-sectional view of the electronic device according to Embodiment
2 taken along line X-X as viewed in the direction indicated by the arrows in FIG. 8;
20 FIG. 11 is a cross-sectional view of an electronic device according to Embodiment
3;
FIG. 12 is a cross-sectional view of the electronic device according to Embodiment
3 taken along line XII-XII as viewed in the direction indicated by the arrows in FIG. 11;
FIG. 13 is a cross-sectional view of the electronic device according to Embodiment
25 3 taken along line XIII-XIII as viewed in the direction indicated by the arrows in FIG. 11;
FIG. 14 is a perspective view of a housing and a partition assembly in Embodiment
3;
5
FIG. 15 is a cross-sectional view of an electronic device according to a first
modification of an embodiment;
FIG. 16 is a cross-sectional view of an electronic device according to a second
modification of an embodiment;
5 FIG. 17 is a cross-sectional view of an electronic device according to a third
modification of an embodiment;
FIG. 18 is a cross-sectional view of the electronic device according to the third
modification of the embodiment taken along line XVIII-XVIII as viewed in the direction
indicated by the arrows in FIG. 17;
10 FIG. 19 is a cross-sectional view of an electronic device according to a fourth
modification of an embodiment;
FIG. 20 is a cross-sectional view of the electronic device according to the fourth
modification of the embodiment taken along line XX-XX as viewed in the direction
indicated by the arrows in FIG. 19;
15 FIG. 21 is a cross-sectional view of an electronic device according to a fifth
modification of an embodiment;
FIG. 22 is a cross-sectional view of an electronic device according to a sixth
modification of an embodiment; and
FIG. 23 is a cross-sectional view of the electronic device according to the sixth
20 modification of the embodiment taken along line XXIII-XXIII as viewed in the direction
indicated by the arrows in FIG. 22.
Description of Embodiments
[0009] An electronic device according to one or more embodiments of the present
disclosure is described below in detail with reference to the drawings. In the figures, the
25 same reference signs denote the same or equivalent components.
[0010] Embodiment 1
As an example of an electronic device, a direct current (DC)-three-phase converter
6
is installed on a railway vehicle to convert DC power supplied from a DC power source
to three-phase alternating current (AC) power and to supply the AC power to a motor.
An electronic device 1 according to Embodiment 1 is described using, in an example, a
standby redundant DC-three-phase converter that includes two power converters. One
5 power converter serves as an operation system, and the other power converter serves as a
standby system.
[0011] The electronic device 1 illustrated in FIG. 1 includes a positive input
terminal 1a connected to a power source, a negative input terminal 1b grounded, and
output terminals 1c, 1d, and 1e connected to a load 61. The output terminals 1c, 1d, and
10 1e correspond to a U phase, a V phase, and a W phase of three-phase AC power.
[0012] The electronic device 1 receives DC power supply from the power source
connected to the positive input terminal 1a, or more specifically, a current collector that
acquires power from an electrical substation through a power supply line. The
electronic device 1 converts the supplied DC power to three-phase AC power, and
15 supplies the three-phase AC power to the load 61. For example, the power supply line
is an overhead power line or a third rail, and the current collector is a pantograph or a
contact shoe. The load 61 includes, for example, a three-phase induction motor.
[0013] The components of the electronic device 1 are described below. The
electronic device 1 includes a first power converter 11, a capacitor CU1, and a contactor
20 MC1. The first power converter 11 converts DC power supplied from the power source
to three-phase AC power and supplies the three-phase AC power to the load 61. The
capacitor CU1 is connected between a pair of primary terminals of the first power
converter 11 that are located near the power source. The contactor MC1 has one end
connected to the positive input terminal 1a and the other end connected to a point of
25 connection between a positive terminal of the capacitor CU1 and the primary terminal of
the first power converter 11.
[0014] The first power converter 11 includes three pairs of switching elements 12
7
each connected in series. The three pairs of switching elements 12 correspond to the U
phase, the V phase, and the W phase of three-phase AC power. The switching elements
12 corresponding to the U phase, the switching elements 12 corresponding to the V phase,
and the switching elements 12 corresponding to the W phase are connected in parallel to
5 one another. Each switching element 12 includes an insulated-gate bipolar transistor
(IGBT) 13 and a freewheeling diode 14 including an anode connected to an emitter
terminal of the IGBT 13 and a cathode connected to a collector terminal of the IGBT 13.
A controller (not illustrated) provides a gate signal to a gate terminal of the IGBT 13
included in each switching element 12 included in the first power converter 11 to turn on
10 or off the switching element 12. Each switching element 12 performs switching to
cause the first power converter 11 to convert DC power to three-phase AC power.
[0015] The capacitor CU1 is charged with DC power supplied from the power
source.
The contactor MC1 includes, for example, a DC electromagnetic contactor to
15 electrically connect or disconnect the first power converter 11 and the capacitor CU1 to
or from the power source.
[0016] The electronic device 1 further includes a second power converter 21, a
capacitor CU2, and a contactor MC2. The second power converter 21 converts DC
power supplied from the power source to three-phase AC power, and supplies the
20 three-phase AC power to the load 61. The capacitor CU2 is connected between a pair
of primary terminals of the second power converter 21 that are located near the power
source. The contactor MC2 has one end connected to the positive input terminal 1a and
the other end connected to a point of connection between a positive terminal of the
capacitor CU2 and the primary terminal of the second power converter 21.
25 [0017] The second power converter 21 includes three pairs of switching elements
22 each connected in series. The three pairs of switching elements 22 connected in
series correspond to the U phase, the V phase, and the W phase of three-phase AC power
8
and are connected in parallel to one another. Each switching element 22 includes an
IGBT 23 and a freewheeling diode 24 including an anode connected to an emitter
terminal of the IGBT 23 and a cathode connected to a collector terminal of the IGBT 23.
A controller (not illustrated) provides a gate signal to a gate terminal of each switching
5 element 22 included in the second power converter 21 to turn on or off the switching
element 22. Each switching element 22 performs switching to cause the second power
converter 21 to convert DC power to three-phase AC power.
[0018] The capacitor CU2 is charged with DC power supplied from the power
source.
10 The contactor MC2 includes, for example, a DC electromagnetic contactor to
electrically connect or disconnect the second power converter 21 and the capacitor CU2
to or from the power source.
[0019] One of the primary terminals of the first power converter 11 is connected to
the positive input terminal 1a with the contactor MC1. One of the primary terminals of
15 the second power converter 21 is connected to the positive input terminal 1a with the
contactor MC2. In other words, the first power converter 11 and the second power
converter 21 are connected commonly to the power source. Secondary terminals of the
first power converter 11 and secondary terminals of the second power converter 21 are
connected to the output terminals 1c, 1d, and 1e. In other words, the first power
20 converter 11 and the second power converter 21 are connected commonly to the load 61.
[0020] One of the first power converter 11 and the second power converter 21
serves as an operation system, and the other serves as a standby system. In the example
described below, the first power converter 11 serves as an operation system, and the
second power converter 21 serves as a standby system. In other words, during the
25 operation of the first power converter 11, the second power converter 21 is stopped.
More specifically, during the contactor MC1 being turned on, the contactor MC2 remains
open, and the second power converter 21 receives no power.
9
[0021] For example, when the first power converter 11 has an overcurrent to stop
the first power converter 11 and the contactor MC1 is open, the contactor MC2 is turned
on to supply power to the second power converter 21, and the second power converter 21
starts operating. An overcurrent may break an electronic component included in the
5 electronic device 1, for example, one switching element 12, causing scattering of broken
pieces of the switching element 12. When the scattering pieces of the switching element
12 come in contact with another electronic component such as a switching element 22,
the switching element 22 is broken, and the second power converter 21 fails to start
operating. The electronic device 1 thus has the structure to reduce the likelihood of
10 scattering of broken pieces of any electronic component.
[0022] The structure of the electronic device 1 is described in detail below. To
simplify the drawings, FIGS. 2, 3, and FIG. 4 that is a cross-sectional view taken along
line IV-IV as viewed in the direction indicated by the arrows in FIG. 2 simply illustrate
the capacitors CU1 and CU2 and the switching elements 12 and 22 among the
15 components of the electronic device 1 illustrated in FIG. 1. The same applies to the
subsequent figures. Parts of a housing 40 and a fixing frame 41 are not illustrated in
FIG. 3.
[0023] With reference to FIGS. 2 to 4, X-axis extends in the longitudinal direction
of the housing 40, and Y-axis extends in the lateral direction of the housing 40. X-axis
20 corresponds to a direction in which a railway vehicle on which the electronic device 1 is
installed travels, and Y-axis corresponds to the width direction of the railway vehicle.
X-axis, Y-axis, and Z-axis are perpendicular to one another. When the railway vehicle
on which the electronic device 1 is installed is located horizontally, Z-axis extends in the
vertical direction. The same applies to the subsequent figures.
25 [0024] The electronic device 1 includes the housing 40 accommodating multiple
electronic components, a base 10 removably attached to the housing 40, and a partition
assembly 30 that separates the electronic components from one another. The electronic
10
device 1 further includes a busbar 15 that connects the capacitor CU1 to the multiple
switching elements 12, a busbar 25 that connects the capacitor CU2 to the multiple
switching elements 22, a pair of first attachments 16 that attach the capacitor CU1 to the
base 10, and a pair of second attachments 26 that attach the capacitor CU2 to the base 10.
5 The electronic device 1 preferably further includes a cooler 50 attached to the base 10 to
cool the electronic components.
[0025] The housing 40 is attached under the floor of the railway vehicle. The
housing 40 has rigidity and strength enough to resist deformation under the maximum
expected vibration from the railway vehicle. For example, the housing 40 is formed
10 from metal such as iron or aluminum. The housing 40 has an opening 40a in the surface
intersecting with Y-axis. The housing 40 accommodates the fixing frame 41 to which
the pair of first attachments 16 and the pair of second attachments 26 are fixed.
[0026] The fixing frame 41 is a plate fixed to the housing 40. The fixing frame 41
has rigidity and strength enough to resist deformation under the maximum expected
15 vibration from the railway vehicle, and is attached to the housing 40 with strength enough
not to change the positional relationship between the housing 40 and the fixing frame 41.
For example, the fixing frame 41 is formed from metal such as iron or aluminum, and
fastened to the housing 40 with a metal fastener.
[0027] The base 10 is removably attached to the housing 40 with a first main
20 surface 10a closing the opening 40a in the housing 40. In Embodiment 1, the base 10 is
a thermally conductive plate attached to the outer surface of the housing 40 to close the
opening 40a. At least two electronic components are attached to the first main surface
10a of the base 10. In Embodiment 1, as illustrated in FIG. 5 that is a cross-sectional
view taken along line V-V as viewed in the direction indicated by the arrows in FIG. 2,
25 six switching elements 12 and six switching elements 22 are attached to the first main
surface 10a. In addition, the capacitors CU1 and CU2 are attached to the first main
surface 10a.
11
[0028] More specifically, as illustrated in FIG. 6, the capacitor CU1 is attached to
the first main surface 10a with the pair of first attachments 16, with the switching
elements 12 held between the capacitor CU1 and the base 10. Similarly, the capacitor
CU2 is attached to the first main surface 10a with the pair of second attachments 26 with
5 the switching elements 22 held between the capacitor CU2 and the base 10.
[0029] The cooler 50 for dissipating heat transferred from at least two electronic
components attached to the first main surface 10a is attached to a second main surface
10b opposite to the first main surface 10a.
[0030] The base 10 is attached to the outer surface of the housing 40 illustrated in
10 FIG. 7, with the switching elements 12 and 22 and the capacitors CU1 and CU2 attached
to the first main surface 10a, and the cooler 50 attached to the second main surface 10b.
Thus, as illustrated in FIG. 3, the switching elements 12 and 22, the capacitors CU1 and
CU2, the busbars 15 and 25, the first attachments 16, and the second attachments 26 are
accommodated in the housing 40.
15 [0031] The base 10 is preferably formed from a highly thermally-conductive
material, for example, metal such as copper or aluminum, whose thermal conductivity is
high enough to transfer heat from the electronic components attached to the first main
surface 10a to the cooler 50.
[0032] The busbar 15 electrically connects the output terminals of the capacitor
20 CU1 to the switching elements 12. The busbar 15 is, for example, a laminate busbar
including a laminate of multiple conductors and multiple insulating layers. In
Embodiment 1, the busbar 15 is bent in an L shape, and electrically connects the output
terminals of the capacitor CU1 in an upper portion of the capacitor CU1 in Z-direction to
the switching elements 12 attached to the base 10.
25 [0033] The busbar 25 electrically connects the output terminals of the capacitor
CU2 to the switching elements 22. The busbar 25 is, for example, a laminate busbar
including a laminate of multiple conductors and multiple insulating layers. In
12
Embodiment 1, the busbar 25 is bent in an L shape, and electrically connects the output
terminals of the capacitor CU2 in an upper portion of the capacitor CU2 in Z-direction to
the switching elements 22 attached to the base 10.
[0034] As illustrated in FIGS. 2 to 4, each first attachment 16 is a plate with a main
5 surface parallel to a YZ plane. The pair of first attachments 16 are attached to the
capacitor CU1 with the capacitor CU1 held therebetween in X-direction. The pair of
first attachments 16 attached to the capacitor CU1 are then attached to the base 10.
[0035] Each first attachment 16 has rigidity and strength enough to resist
deformation under the maximum expected vibration from the railway vehicle, and is
10 attached to the base 10 with strength enough not to change the positional relationship
between the capacitor CU1 and each first attachment 16 and the positional relationship
between the base 10 and each first attachment 16. For example, each first attachment 16
is formed from a plate of metal such as iron or aluminum with a thickness greater than or
equal to 10 mm, and is fastened by a fastener with a side surface in contact with the first
15 main surface 10a and thus is attached to the base 10.
[0036] Each second attachment 26 is a plate having a main surface parallel to the
YZ plane. The pair of second attachments 26 are attached to the capacitor CU2 with the
capacitor CU2 held therebetween in X-direction. The pair of second attachments 26
attached to the capacitor CU2 are then attached to the base 10.
20 [0037] Each second attachment 26 has rigidity and strength enough to resist
deformation under the maximum expected vibration from the railway vehicle, and is
attached to the base 10 with strength not to change the positional relationship between the
capacitor CU2 and each second attachment 26 and the positional relationship between the
base 10 and each second attachment 26. For example, each second attachment 26 is
25 formed from a plate of metal such as iron or aluminum with a thickness greater than or
equal to 10 mm, and is fastened by a fastener with a side surface in contact with the first
main surface 10a and thus is attached to the base 10.
13
[0038] The cooler 50 includes heat pipes 51 attached to the base 10 and multiple
fins 52 attached to the heat pipes 51 with the heat pipes 51 extending through the fins 52.
Each heat pipe 51 includes a header attached to the base 10 and extending in X-direction,
and a branch pipe continuous with the header and extending vertically upward away from
5 the base 10. The header is received in a groove on the base 10, and fixed to the base 10
by, for example, bonding with an adhesive or soldering. The branch pipe is attached to
the header by welding or soldering to be continuous with the header.
[0039] The header and the branch pipe included in each heat pipe 51 are formed
from a highly thermally conductive material, for example, metal such as copper or
10 aluminum. Each heat pipe 51 contains a coolant. The coolant is an object, such as
water, that evaporates with heat transferred from the electronic components, and liquefies
by dissipating heat into air around the cooler 50 through the heat pipes 51 and the fins 52.
[0040] When heat is transferred to the coolant from the switching elements 12 and
22 attached to the first main surface 10a through the base 10 and the headers in the heat
15 pipes 51, the coolant evaporates. The evaporated coolant moves upward in Z-direction
in the heat pipe 51. The coolant transfers heat to the air around the cooler 50 through
the branch pipes in the heat pipes 51 and the fins 52 while moving upward in Z-direction,
and is cooled and liquefies. The liquefied coolant moves downward in Z-direction
along inner walls of the heat pipes 51. As described above, the coolant circulates while
20 repeatedly evaporating and liquefying to transfer heat generated in the switching elements
12 and 22 to air around the cooler 50, and to cool the switching elements 12 and 22.
[0041] The partition assembly 30 to prevent scattering of broken pieces of any
electronic component includes a first partition 30a and second partitions 30b. The first
partition 30a is located to separate at least one electronic component of at least two
25 electronic components attached to the base 10 from another electronic component of the
at least two electronic components attached to the base 10. The second partitions 30b
are located adjacent to the first partition 30a and close at least parts of gaps between the
14
first partition 30a and the housing 40.
[0042] In Embodiment 1, the partition assembly 30 includes the first partition 30a
and two second partitions 30b. The first partition 30a is a plate attached to the base 10.
The two second partitions 30b are plates holding the first partition 30a therebetween in
5 the direction along the main surface of the first partition 30a.
[0043] The first partition 30a is attached to the first main surface 10a of the base 10,
and extends away from the base 10. One main surface of the first partition 30a, or more
specifically, the surface of the first partition 30a facing in the negative X-direction faces
the switching elements 12. Facing the switching elements 12 includes facing the
10 switching elements 12 directly without other components between the first partition 30a
and the switching elements 12, and indirectly with other components between the first
partition 30a and the switching elements 12.
[0044] The other main surface of the first partition 30a, or more specifically, the
surface of the first partition 30a facing in the positive X-direction faces the switching
15 elements 22. Facing the switching elements 22 includes facing the switching elements
22 directly without other components between the first partition 30a and the switching
elements 22, and indirectly with other components between the first partition 30a and the
switching elements 22. The first partition 30a located in the above manner separates the
switching elements 12 from the switching elements 22.
20 [0045] The first partition 30a attached to the base 10 passes through the opening
40a, and thus has a dimension in Z-direction less than or equal to the dimension of the
opening 40a in Z-direction. To prevent scattering of pieces of any electronic component,
the first partition 30a preferably has a maximum dimension in Z-direction that allows the
first partition 30a to pass through the opening 40a. The first partition 30a preferably has
25 strength enough to prevent scattering pieces of any electronic component from breaking
through the first partition 30a. For example, the first partition 30a may be a metal plate
with a thickness or a dimension in X-direction of 1 to 5 mm inclusive.
15
[0046] More specifically, the first partition 30a is a thin metal plate with a bent end.
The bent end is in contact with the base 10 and attached to the base 10 with a fastener.
The main surface of the metal plate excluding the end faces the main surface of each
second partition 30b. The first partition 30a formed from highly thermally conductive
5 metal dissipates heat of air in the housing 40 into air around the cooler 50 from the cooler
50 through the first partition 30a and the base 10, and thus can cool the air in the housing
40.
[0047] As illustrated in FIGS. 3 to 5 and 7, the two second partitions 30b are
attached to the housing 40, and close at least parts of the gaps between the first partition
10 30a and the housing 40. More specifically, one of the second partitions 30b closes a gap
42 between the housing 40 and the vertically upper end of the first partition 30a. The
other of the second partitions 30b closes a gap 42 between the housing 40 and the
vertically lower end of the first partition 30a. Closing the gaps 42 refers to making the
gaps 42 narrow enough to prevent the broken pieces of any electronic component from
15 passing through and coming in contact with the other electronic components. In other
words, the second partitions 30b may not completely close the gaps 42. In Embodiment
1, the second partitions 30b suppress broken pieces of the switching elements 12 or 22
passing through the gaps 42 in X-direction.
[0048] Each second partition 30b is attached to the housing 40 by, for example,
20 welding, bonding, or fastening with a fastener. In Embodiment 1, one of the second
partitions 30b is attached to a vertically upper portion of the housing 40 and the surface
having the opening 40a. The other of the second partitions 30b is attached to a
vertically lower portion of the housing 40 and the surface having the opening 40a. The
second partitions 30b preferably have strength enough to prevent scattering pieces of any
25 electronic component from breaking through the second partitions 30b. For example,
the second partitions 30b may each be a metal plate with a thickness or a dimension in
X-direction of 1 to 5 mm inclusive.
16
[0049] More specifically, each second partition 30b is a thin metal plate with a bent
end. The bent end is in contact with the housing 40 and attached to the housing 40 with
a fastener. The main surface of the metal plate excluding the end faces the main surface
of the first partition 30a.
5 [0050] The second partitions 30b are displaced from the first partition 30a in
X-direction and attached to the housing 40. Each second partition 30b preferably
extends from the position attached to the housing 40 to a position at which a part of the
main surface faces a part of the first partition 30a. Thus, as illustrated in FIGS. 4 and 5,
the main surface of the first partition 30a faces the main surfaces of the two second
10 partitions 30b. More specifically, parts of the main surface of the first partition 30a are
in contact with parts of the main surfaces of the two second partitions 30b. This
structure suppresses broken pieces of one of the switching elements 12 and 22 coming in
contact with the other switching elements 12 and 22.
[0051] As described above, the electronic device 1 according to Embodiment 1
15 includes the partition assembly 30 separating the switching elements 12 from the
switching elements 22, and suppresses broken pieces of one of the switching elements 12
and 22 scattering and coming in contact with the other switching elements 12 and 22.
This structure allows one of the first power converter 11 and the second power converter
21 to continue operating when the other one of the power converters 11 and 21 stops
20 operating.
[0052] Embodiment 2
The partition assembly 30 may have any shape other than in the above example,
and may have any shape that can suppress the electronic component scattering and
coming in contact with the other electronic components. In an example, Embodiment 2
25 describes an electronic device 2 including two second partitions with different shapes.
The electronic device 2 illustrated in FIG. 8, FIG. 9 that is a cross-sectional view taken
along line IX-IX as viewed in the direction indicated by the arrows in FIG. 8, and FIG. 10
17
that is a cross-sectional view taken along line X-X as viewed in the direction indicated by
the arrows in FIG. 9 differs from the electronic device 1 according to Embodiment 1 in
including a partition assembly 31. The electronic device 2 is described below focusing
on the differences between the electronic devices 1 and 2.
5 [0053] As illustrated in FIGS. 8 to 10, the partition assembly 31 includes a first
partition 31a and second partitions 31b and 31c. The first partition 31a has the same
shape as the first partition 30a included in the partition assembly 30 in the electronic
device 1. The second partitions 31b and 31c are located adjacent to the first partition
31a and close at least parts of gaps between the first partition 31a and the housing 40.
10 [0054] In Embodiment 2, the second partitions 31b and 31c are plates holding the
first partition 31a therebetween in Z-direction. Of the second partitions 31b and 31c, the
second partition 31b located vertically downward has the same shape as one of the paired
second partitions 30b included in the partition assembly 30 in the electronic device 1
located vertically downward, and closes the gap 42 between the housing 40 and the
15 vertically lower end of the first partition 31a.
[0055] Of the second partitions 31b and 31c, the second partition 31c located
vertically upward separates the electronic components attached to the base 10 from the
other electronic components, or more specifically, the electronic components not attached
to the base 10. More specifically, the main surface of the second partition 31c faces the
20 surface of the housing 40 having the opening 40a. The longitudinal direction of the
second partition 31c is aligned with X-direction. As illustrated in FIG. 10, in
Embodiment 2, the second partition 31c has a dimension in X-direction greater than the
dimension of the opening 40a in X-direction. As illustrated in FIG. 9, the side surface
of the second partition 31c, or more specifically, the surface of the second partition 31c
25 facing in the negative Z-direction faces the side surface of the first partition 31a, or more
specifically, the surface of the first partition 31a facing in the positive Z-direction. In
Embodiment 2, the surface of the second partition 31c facing in the negative Z-direction
18
is in contact with the surface of the first partition 31a facing in the positive Z-direction.
[0056] The second partition 31c closes the gap 42 between the vertically upper end
of the first partition 31a and the housing 40. More specifically, the second partition 31c
suppresses broken pieces of the switching elements 12 or 22 passing through the gap 42
5 between the vertically upper end of the first partition 31a and the housing 40 in
Y-direction. This structure suppresses broken pieces of the switching elements 12 or 22
coming in contact with, for example, a substrate on the surfaces of the capacitors CU1
and CU2 facing in the negative Y-direction, or more specifically, a substrate receiving a
voltage sensor circuit, and damaging the substrate.
10 [0057] The second partition 31c is attached to the housing 40 by, for example,
welding, bonding, or fastening with a fastener. In Embodiment 2, the second partition
31c is attached to a vertically upper portion of the housing 40. The second partition 31c
preferably has strength enough to prevent scattering pieces of any electronic component
from breaking through the second partition 31c. For example, the second partition 31c
15 may be a metal plate with a thickness or a dimension in Y-direction of 1 to 5 mm
inclusive.
[0058] More specifically, the second partition 31c is a thin metal plate with a bent
end. The bent end is in contact with the housing 40 and attached to the housing 40 with
a fastener. The main surface of the metal plate excluding the end faces the surface of
20 the housing 40 having the opening 40a. The second partition 31c preferably extends
from a position attached to the housing 40 to the vertically upper end of the first partition
31a. Thus, as illustrated in FIGS. 9 and 10, the vertically lower end of the second
partition 31c is in contact with the vertically upper end of the first partition 31a. This
structure suppresses broken pieces of one of the switching elements 12 and 22 coming in
25 contact with other electronic components not attached to the base 10.
[0059] As described above, the electronic device 2 according to Embodiment 2
includes the partition assembly 31 that separates the switching elements 12 from the
19
switching elements 22, and separates the switching elements 12 and 22 from other
electronic components. This structure can suppress broken pieces of one of the
switching elements 12 and 22 scattering and coming in contact with the other switching
elements 12 and 22, and can suppress broken pieces of at least one of the switching
5 elements 12 and 22 scattering and coming in contact with the other electronic
components.
[0060] Embodiment 3
The partition assemblies 30 and 31 may have any shapes other than in the above
examples, and the first partition and the second partitions may be formed integrally. An
10 electronic device 3 including a partition assembly 32 with a first partition and second
partitions integrated with one another is described in Embodiment 3. The electronic
device 3 illustrated in FIG. 11, FIG. 12 that is a cross-sectional view taken along line
XII-XII as viewed in the direction indicated by the arrows in FIG. 11, FIG. 13 that is a
cross-sectional view taken along line XIII-XIII as viewed in the direction indicated by the
15 arrows in FIG. 11, and FIG. 14 differs from the electronic device 1 according to
Embodiment 1 in including the partition assembly 32. The electronic device 3 is
described below focusing on the differences between the electronic devices 1 and 3.
[0061] The partition assembly 32 to prevent scattering of electronic components
separates at least one electronic component of at least two electronic components
20 attached to the base 10 from another electronic component of at least two electronic
components attached to the base 10. As illustrated in FIGS. 12 to 14, the partition
assembly 32 is attached to a vertically upper portion and a vertically lower portion of the
housing 40. One main surface of the partition assembly 32, or more specifically, the
surface of the partition assembly 32 facing in the negative X-direction faces the switching
25 elements 12. The other main surface of the partition assembly 32, or more specifically,
the surface of the first partition 30a facing in the positive X-direction faces the switching
elements 22. As described above, the partition assembly 32 extends from the vertically
20
upper portion to the vertically lower portion of the housing 40 to separate the switching
elements 12 from the switching elements 22.
[0062] As illustrated in FIGS. 12 and 14, preferably, the partition assembly 32
partially protrudes toward the opening 40a. More specifically, as illustrated in FIG. 12,
5 the surface of the partition assembly 32 facing in the positive Y-direction is preferably in
contact with the base 10 with the base 10 attached to the housing 40.
[0063] The partition assembly 32 preferably has strength enough to prevent
scattering pieces of any electronic component from breaking through the partition
assembly 32. For example, the partition assembly 32 may be a metal plate with a
10 thickness or a dimension in X-direction of 1 to 5 mm inclusive.
[0064] More specifically, the partition assembly 32 is a thin metal plate with bent
ends. As illustrated in FIG. 13, both the bent ends are in contact with the vertically
upper portion and the vertically lower portion of the housing 40 and attached to the
housing 40 by, for example, welding, bonding, or fastening with fasteners. One main
15 surface of the metal plate excluding both the ends faces the switching elements 12, and
the other main surface of the metal plate excluding both the ends faces the switching
elements 22. The partition assembly 32 formed from highly thermally conductive metal
dissipates heat of air in the housing 40 into air around the cooler 50 from the cooler 50
through the partition assembly 32 and the base 10, and thus can cool the air in the housing
20 40.
[0065] As described above, the electronic device 3 according to Embodiment 3
includes the partition assembly 32 that separates the switching elements 12 from the
switching elements 22, and thus can suppress broken pieces of one of the switching
elements 12 and 22 scattering and coming in contact with the other switching elements 12
25 and 22.
[0066] The present disclosure is not limited to the above embodiments. The
partition assemblies 30 to 32 may have any shape other than in the above examples, and
21
may have any shape that can suppress an electronic component scattering and coming in
contact with another electronic component. In an example, as illustrated in FIG. 15, the
two second partitions 30b included in the partition assembly 30 in the electronic device 1
may be located across the first partition 30a in X-direction. In this case, the first
5 partition 30a has one main surface facing the main surface of the second partition 30b
located vertically upward, and the other main surface facing the main surface of the
second partition 30b located vertically downward. In the example illustrated in FIG. 15,
a part of one main surface of the first partition 30a is in contact with a part of the main
surface of the second partition 30b located vertically upward, and a part of the other main
10 surface of the first partition 30a is in contact with a part of the main surface of the second
partition 30b located vertically downward.
[0067] In Embodiment 1, parts of the main surface of the first partition 30a are in
contact with parts of the main surfaces of the two second partitions 30b. In some
embodiments, as illustrated in FIG. 16, the first partition 30a and the second partitions
15 30b may be separate from one another in X-direction. In this case, the first partition 30a
and the second partitions 30b is preferably located adjacent to one another enough to
block broken pieces of the switching elements 12 or 22 that are to pass through between
the first partition 30a and the second partitions 30b.
[0068] To suppress broken pieces of any electronic component scattering and
20 coming in contact with another electronic component, the partition assemblies 30 to 32
may be larger than partition assemblies in the above embodiments. In an example, as
illustrated in FIG. 17 and FIG. 18 that is a cross-sectional view taken along line
XVIII-XVIII as viewed in the direction indicated by the arrows in FIG. 17, a partition
assembly 33 included in the electronic device 1 includes a first partition 33a and two
25 second partitions 33b extending to the fixing frame 41.
[0069] The first partition 33a has a shape corresponding to the shape of the first
partition 30a extended to the fixing frame 41. One main surface of the first partition 33a,
22
or more specifically, the surface of the first partition 33a facing in the negative
X-direction faces the switching elements 12. The other main surface of the first
partition 33a, or more specifically, the surface of the first partition 33a facing in the
positive X-direction faces the switching elements 22.
5 [0070] More specifically, the first partition 33a is a thin metal plate with bent ends.
The bent ends are in contact with the base 10 and the fixing frame 41 and attached to the
base 10 and the fixing frame 41 by, for example, welding, bonding, or fastening with
fasteners. More specifically, when the base 10 receiving the first partition 33a is
attached to the outer surface of the housing 40, the first partition 33a comes in contact
10 with the fixing frame 41. Thus, the first partition 33a is attached to the fixing frame 41.
[0071] The main surface of the metal plate excluding both the ends faces the main
surface of each second partition 33b. The first partition 33a formed from highly
thermally conductive metal dissipates heat of air in the housing 40 into air around the
cooler 50 from the cooler 50 through the first partition 33a and the base 10, and thus can
15 cool the air in the housing 40.
[0072] Each second partition 33b has a shape corresponding to the shape of the
second partition 30b extended to the fixing frame 41. Each second partition 33b is
attached to the housing 40 and closes at least a part of the corresponding gap between the
first partition 33a and the housing 40. In the example of FIGS. 17 and 18, the gaps
20 between the first partition 33a and the housing 40 correspond to the gap 42 between the
vertically upper end of the first partition 33a and the housing 40 and the gap 42 between
the vertically lower end of the first partition 33a and the housing 40. One of the second
partitions 33b closes the gap 42 between the vertically upper end of the first partition 33a
and the housing 40. The other of the second partitions 33b closes the gap 42 between
25 the vertically lower end of the first partition 33a and the housing 40.
[0073] Each second partition 33b is attached to the housing 40 and the fixing frame
41 by, for example, welding, bonding, or fastening with a fastener. One of the second
23
partitions 33b is attached to a vertically upper portion of the housing 40, the surface
having the opening 40a, and the fixing frame 41. The other of the second partitions 33b
is attached to a vertically lower portion of the housing 40, the surface having the opening
40a, and the fixing frame 41. The second partitions 33b preferably have strength
5 enough to prevent scattering pieces of any electronic component from breaking through
the second partitions 33b. For example, the second partition 33b may be a metal plate
with a thickness or a dimension in X-direction of 1 to 5 mm inclusive.
[0074] More specifically, each second partition 33b is a thin metal plate with a bent
end. The bent end is in contact with the housing 40 and the fixing frame 41 and
10 attached to the housing 40 and the fixing frame 41 with a fastener. The main surface of
the metal plate excluding the end faces the main surface of the first partition 33a.
[0075] As described above, the first partition 33a extends from the base 10 to the
fixing frame 41, and the second partitions 33b extend from the surface of the housing 40
having the opening 40a to the fixing frame 41. Thus, the gaps between the first partition
15 33a and the housing 40 are smaller than the gaps in the electronic device 1. This
structure more reliably suppresses broken pieces of one of the switching elements 12 and
22 coming in contact with the other switching elements 12 and 22.
[0076] Similarly, the first partition 31a included in the partition assembly 31 and
the partition assembly 32 may extend from the base 10 to the fixing frame 41, and the
20 second partition 31b included in the partition assembly 31 may extend from the surface of
the housing 40 having the opening 40a to the fixing frame 41.
[0077] To suppress Y-direction movement of pieces hitting any of the partition
assemblies 30 to 32, the partition assemblies 30 to 32 may each include a protrusion
protruding in X-direction. A partition assembly 34 included in an electronic device 4
25 illustrated in FIG. 19 and FIG. 20 that is a cross-sectional view taken along line XX-XX
as viewed in the direction indicated by the arrows in FIG. 19 includes a first partition 34a
including protrusions 34c, and two second partitions 34b. More specifically, the first
24
partition 34a includes the protrusions 34c protruding in X-direction from two main
surfaces of the first partition 34a. The protrusions 34c suppress movement of pieces
hitting the first partition 34a in the negative Y-direction from the first partition 34a. The
second partitions 34b have the same shape as the second partitions 30b.
5 [0078] In Embodiment 1, the first partition 30a and the second partitions 30b are in
contact with one another. In some embodiments, the first partition 30a and the second
partitions 30b may be fitted to one another. A partition assembly 35 included in an
electronic device 5 illustrated in FIG. 21 includes a first partition 35a having the same
shape as the first partition 30a, and two second partitions 35b that hold the first partition
10 35a therebetween in Z-direction to be fitted to the first partition 35a. The second
partitions 35b are formed from a material that deforms when pressed, such as an elastic
material. Thus, the first partition 35a and the second partitions 35b can be fitted to one
another independently of manufacturing tolerances of the first partition 35a.
[0079] The switching elements 12 and 22 may be attached to the base 10 with any
15 method other than the above method. In the above embodiments, the switching
elements 12 and 22 are directly attached to the base 10, but may be indirectly attached to
the base 10. More specifically, as illustrated in FIG. 22 and FIG. 23 that is a
cross-sectional view taken along line XXIII-XXIII as viewed in the direction indicated by
the arrows in FIG. 22, the switching elements 12 and 22 in the electronic device 1 may be
20 attached to fixing members 17 attached to the base 10. In the example illustrated in
FIGS. 22 and 23, four fixing members 17 are attached to the base 10. Each fixing
member 17 is a plate having a side surface in contact with the base 10 and is attached to
the base 10 by, for example, welding, bonding, or fastening with a fastener.
[0080] The switching elements 12 and 22 are attached to the main surfaces of the
25 fixing members 17. More specifically, two switching elements 12 or 22 are attached to
at least one main surface of the corresponding fixing member 17.
[0081] One partition assembly 30 is located between two fixing members 17
25
adjacent to each other. More specifically, three partition assemblies 30 are located
between the four fixing members 17. The partition assemblies 30 suppress broken
pieces of one of the switching elements 12 and 22 attached to the corresponding fixing
members 17 scattering and coming in contact with the other one of the switching
5 elements 12 and 22. At least one of the partition assemblies 30 to 35 may be located
between the four fixing members 17. For example, the partition assemblies 30, 31, and
32 may be located between the four fixing members 17.
[0082] Each of the electronic devices 1 to 5 is not limited to a standby redundant
DC-three-phase converter, and may be any electronic device accommodating electronic
10 components in the housing 40. In an example, the first power converter 11 and the
second power converter 21 may be connected to separate loads. In another example, the
electronic devices 1 to 5 may each be a standby redundant converter that converts
three-phase AC power to DC power. In still another example, the electronic devices 1
to 5 may each include multiple electronic circuits connected to a common power source
15 parallel to one another. In this case, each of the partition assemblies 30 to 35 may
separate an electronic component included in at least one of the electronic circuits from
an electronic component included in another of the electronic circuits.
[0083] The electronic devices 1 to 5 may be installed in any movable body such as
an automobile, an aircraft, or a vessel, rather than a railway vehicle, or installed at any
20 stationary location.
[0084] Any shape and any number of first attachments 16 and second attachments
26 may be used. The first attachments 16 and the second attachments 26 may have any
shape that can attach the capacitors CU1 and CU2 to the base 10. In an example, the
electronic device 1 may include four rod-like first attachments 16 and four rod-like
25 second attachments 26. In another example, the electronic device 1 may include four
pillar-like first attachments 16 and four pillar-like second attachments 26.
[0085] The cooler 50 may have any structure other than in the above examples, and
26
the cooler 50 may have any structure that can cool the electronic components. In an
example, the cooler 50 may include multiple heat transferrers including metal rods
attached to the base 10 and extending away from the base 10, and multiple fins 52
attached to the heat transferrers.
5 [0086] The capacitors CU1 and CU2 may be arranged in any manner other than in
the above examples. In an example, the electronic devices 1 to 5 may each include the
capacitors CU1 and CU2 adjacent to each other in Z-direction.
[0087] Any number of power converters other than in the above examples may be
used. The first power converter 11 may include any number of the switching elements
10 12 other than in the above examples, and the second power converter 21 may include any
number of switching elements 22 other than in the above examples.
[0088] The foregoing describes some example embodiments for explanatory
purposes. Although the foregoing discussion has presented specific embodiments,
persons skilled in the art will recognize that changes may be made in form and detail
15 without departing from the broader spirit and scope of the invention. Accordingly, the
specification and drawings are to be regarded in an illustrative rather than a restrictive
sense. This detailed description, therefore, is not to be taken in a limiting sense, and the
scope of the invention is defined only by the included claims, along with the full range of
equivalents to which such claims are entitled.
20 Reference Signs List
[0089]
1, 2, 3, 4, 5 Electronic device
1a Positive input terminal
1b Negative input terminal
25 1c, 1d, 1e Output terminal
10 Base
10a First main surface
27
10b Second main surface
11 First power converter
12, 22 Switching element
13, 23 IGBT
5 14, 24 Freewheeling diode
15, 25 Busbar
16 First attachment
17 Fixing member
21 Second power converter
10 26 Second attachment
30, 31, 32, 33, 34, 35 Partition assembly
30a, 31a, 33a, 34a, 35a First partition
30b, 31b, 31c, 33b, 34b, 35b Second partition
34c Protrusion
15 40 Housing
40a Opening
41 Fixing frame
42 Gap
50 Cooler
20 51 Heat pipe
52 Fin
61 Load
CU1, CU2 Capacitor
MC1, MC2 Contactor

We Claim:
[Claim 1] An electronic device, comprising:
a housing accommodating a plurality of electronic components;
5 a base that is removably attached to the housing and to which at least two of the
plurality of electronic components are attached; and
a partition assembly separating at least one electronic component of the at least two
electronic components attached to the base from another electronic component of the at
least two electronic components attached to the base,
10 wherein the partition assembly includes a first partition and a second partition, the
first partition is located to separate the at least one electronic component of the at least
two electronic components from the another electronic component of the at least two
electronic components, and the second partition is located adjacent to the first partition
and closes at least a part of a gap between the first partition and the housing.
15
[Claim 2] The electronic device according to claim 1, further comprising:
a cooler to dissipate heat transferred from the at least two electronic components
attached to the base,
wherein the housing has an opening, and
20 the base is a heat conductive plate having a first main surface and a second main
surface opposite to the first main surface, the at least two electronic components are
attached to the first main surface, the cooler is attached to the second main surface, and
the base is attached to the housing, with the first main surface closing the opening in the
housing.
25
[Claim 3] The electronic device according to claim 1 or 2, wherein
the first partition is attached to the base.
29
[Claim 4] The electronic device according to claim 3, wherein
the partition assembly includes
the first partition being a plate extending away from the base, and having
5 one main surface facing the at least one electronic component of the at least two
electronic components and another main surface facing the another electronic component
of the at least two electronic components, and
two of the second partitions being plates holding the first partition between
the two second partitions in a direction along the main surfaces of the first partition.
10
[Claim 5] The electronic device according to claim 4, wherein
one of the main surfaces of the first partition faces main surfaces of the two second
partitions.
15 [Claim 6] The electronic device according to claim 4, wherein
one of the main surfaces of the first partition is in contact with main surfaces of the
two second partitions.
[Claim 7] The electronic device according to claim 4, wherein
20 the first partition is fitted to the two second partitions.
[Claim 8] The electronic device according to claim 4, wherein
the two second partitions hold the first partition between the two second partitions
in a vertical direction, and
25 an upper second partition of the two second partitions in the vertical direction
separates the at least two of the plurality of electronic components attached to the base
from the plurality of electronic components excluding the at least two electronic
30
components.
[Claim 9] The electronic device according to claim 8, wherein
the upper second partition has a main surface facing a surface of the housing
5 having the opening.
[Claim 10] The electronic device according to claim 8 or 9, wherein
a lower second partition of the two second partitions in the vertical direction has a
main surface facing one of the main surfaces of the first partition.
10
[Claim 11] The electronic device according to claim 1 or 2, wherein
the first partition and the second partition are integral with each other.
[Claim 12] The electronic device according to any one of claims 1 to 11, further
15 comprising:
a plurality of electronic circuits connected in parallel to one another and each
including an electronic component,
wherein the electronic component in each of the plurality of electronic circuits is
attached to the base, and
20 the partition assembly separates the electronic component included in at least one
of the plurality of electronic circuits from the electronic component included in another of
the plurality of electronic components.
[Claim 13] The electronic device according to claim 12, wherein
25 the plurality of electronic circuits include a first power converter including a
capacitor and a plurality of switching elements to convert power, and a second power
converter connected in parallel to the first power converter and including a capacitor and
31
a plurality of switching elements to convert power,
the plurality of switching elements included in the first power converter and the
plurality of switching elements included in the second power converter are directly
attached to the base,
5 the capacitor included in the first power converter is attached to the base with a
first attachment, with the plurality of switching elements held between the capacitor and
the base,
the capacitor included in the second power converter is attached to the base with a
second attachment, with the plurality of switching elements held between the capacitor
10 and the base, and
the first partition has one main surface facing the plurality of switching elements
included in the first power converter, and another main surface facing the plurality of
switching elements included in the second power converter.