Technical field
[0001]
　The present invention, housing for electronic equipment, a manufacturing method of an electronic equipment enclosure, to developed view like metal resin bonding plate and the electronic device.
BACKGROUND
[0002]
　Audio device, a vehicle mounted mobile telephone device, or the communication and information system for use in vehicles typified by a car navigation device or the like, an electronic device using a large high-performance IC fever degree with the electronic and higher performance of the vehicle There has come to be adopted.
　On the other hand, problems due to electromagnetic waves these electronic devices are generated, i.e. EMI (electromagnetic interference) is required as much as possible to suppress. Therefore, the shielding member of the electronic apparatus is accommodated enclosure highly conductive material (e.g., galvanized steel, copper, aluminum foil, etc.) constituted by a method of shielding by surface reflection of radio waves is employed mainly to have. Such by using the shielding member can enjoy a merit of easy to radiate the heat generated in the apparatus (for example, see Patent Documents 1, 2 and 3).
CITATION
Patent Document
[0003]
Patent Document 1: JP 2002-176282 Patent Publication
Patent Document 2: JP 2005-108328 Patent Publication
Patent Document 3: Real-Open 5-72180 JP
Summary of the Invention
Problems that the Invention is to Solve
[0004]
　By weight oriented recent vehicles, weight reduction are required also for the electronics enclosure to be mounted on a vehicle. Therefore, with the electromagnetic wave shielding function, excellent heat dissipation characteristics and mechanical strength, and housing for lightweight electronic device-accommodating has been strongly demanded by industry.
[0005]
　The present invention has been made in view of the above circumstances, is to provide a lightweight, electromagnetic shielding, heat dissipation characteristics, and an electronic device housing excellent in balance of mechanical strength.
Means for Solving the Problems
[0006]
　The present inventors have conducted intensive studies in order to achieve the above object. As a result, by a metal member having an electromagnetic shielding function and the heat dissipation function as the main part of the electronics housing, which reinforcement portions of both surfaces of the metal member with a thermoplastic resin member, electromagnetic shielding, heat dissipation characteristics and while maintaining the mechanical strength, it is possible to replace the lightweight resin member from heavy metal member for some electronics housing, as a result, the conventional housing in which the overall casing is constituted by a metal member compared to the body, light weight, electromagnetic shielding, heat dissipation characteristics and found that the electronic device housing excellent in balance of mechanical strength can be obtained, thereby achieving the present invention.
[0007]
　That is, according to the present invention, the housing for the electronic device illustrated in the following, a manufacturing method of an electronic equipment enclosure, exploded view like metal resin bonding plate and the electronic device is provided.
[0008]
[1]
　and a metal bottom plate, and a metal plate connected by bending integrally with the bottom plate, a housing for housing the electronic equipment inside,
　at least the bottom plate and the in the metal member (M) comprising a side plate, the thermoplastic resin member are bonded to a portion of the surface of the plate-like of the metal member (M), the metal member (M) has been reinforced by the thermoplastic resin member ,
　plate of the metal member duplex in the thermoplastic resin member is a housing for electronic equipment that is bonded (M).
[2]
　above in the electronics housing according to [1],
　the electronic device housing the average thickness of 0.2mm or more 1.0mm or less of the metal member (M).
[3]
　In the above-mentioned [1] or electronics housing according to [2],
　the metal member (M) has a fine uneven structure on the joint surface of at least the thermoplastic resin member,
　the metal member (M) and the thermoplastic resin member and the housing for electronic equipment that is joined by a portion of the thermoplastic resin member from intruding to the micro-relief structure.
[4]
　In the above [1] to electronics housing according to any one of [3],
　a plate-like of the metal member (M) while the thermoplastic resin member bonded to a surface of, and at least a portion of which is joined to the other surface the thermoplastic resin member, the metal member for electronic equipment housing is arranged so as to face each other in the vertical direction of the plate surface of (M).
[5]
　In the above [1] to electronics housing according to any one of [4],
　the thermoplastic resin member is joined to at least the peripheral portion of the surface of the metal member (M) for the electronics enclosure.
[6]
　In the electronic apparatus housing according to any one of the above [1] to [5],
　at least a portion of the thermoplastic resin member, forming the skeleton shape on the surface of the metal member (M) a housing for electronic equipment that is.
[7]
　[1] to the electronics enclosure according to any one of [6],
　the electronic device housing the thermoplastic resin member including the injection molded article.
[8]
　above [1] to the electronics enclosure according to any one of [7],
　the electronic device housing the average thickness of the thermoplastic resin member is 1.0mm or more 10mm or less.
[9]
　above [1] to the electronics enclosure according to any one of [8],
　housing for electronic equipment including a metal metal material constituting the metal member (M) has an electromagnetic wave shielding property body.
[10]
　the above-mentioned [1] to the electronics enclosure according to any one of [9],
　further comprising a metallic cover plate which is connected by bending integrally with the side plate,
　the cover plate thermoplastic resin member are bonded to a portion of the surface, the electronic device housing where the cover plate is reinforced by the thermoplastic resin member.
[11]
　In the electronics housing according to [10],
　the cover plate has a fine uneven structure on the joint surface of at least the thermoplastic resin member,
　the heat in the micro-relief structure the cover plate and the thermoplastic resin member and the housing for electronic equipment that is joined by a portion of the thermoplastic resin member from entering.
[12]
　the above-mentioned [1] to the electronics enclosure according to any one of [11],
　the electronic device is a boundary portion between the bottom plate and the side plate the thermoplastic resin member are not bonded Yokatamitai.
[13]
　In the above [1] to electronics housing according to any one of [12],
　the surface area of the junction of the thermoplastic resin member in the total surface area of the metal member (M) is 1 area% or more 50 area% or less is an electronic equipment enclosure.
[14]
　a metallic bottom plate, the bottom plate and a metal plate coupled bent integrally, the developed view like metal for producing a housing for accommodating electronic equipment inside a resin bonding plate,
　the metal member consisting of at least the bottom plate and the side plate (M), a part of the surface of the plate-like of the metal member (M), the thermoplastic resin member are joined, the metal member ( development view like metal resin bonding plate M) is reinforced by the thermoplastic resin.
[15]
　A manufacturing method for manufacturing an electronic apparatus housing as claimed in any one of the above [1] to [13],
　a metallic base plate, which is integrally connected to the bottom plate comprising a metal plate, and a step of preparing a development view like metal plate having a fine uneven structure on the joint surface of at least the thermoplastic resin member are bonded (a),
　a mold the development view like metal plate process established to produce a developed view like metal resin bonded sheet a thermoplastic resin composition by joining a thermoplastic resin member on the surface of the developed view like metal plate and injected into the mold within (B) When,
　by bending the boundary portion between the bottom plate and the side plates of the developed view like metal resin bonding sheet, and step (C) of a box-type shape of the developed view like metal resin bonding sheet
for electronic apparatus including the manufacturing method of the housing.
[16]
　In the method for manufacturing an electronic apparatus housing according to [15],
　the in step (B), the boundary line portions between the bottom plate and the side plate, said as the thermoplastic resin member is not joined manufacturing method of the electronics housing to inject the thermoplastic resin composition into the mold.
[17]
　[1] to [13] electronic device comprising the electronics housing according to any one, and an electronic apparatus housed in a housing for the electronic equipment.
Effect of the invention
[0009]
　According to the present invention, it is possible to provide a lightweight, electromagnetic shielding, heat dissipation characteristics, and an electronic device housing excellent in balance of mechanical strength.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010]
　Above objects, and other objects, features and advantages, preferred embodiments described below, and become more apparent from the following drawings associated therewith.
[0011]
FIG. 1 is a perspective view schematically showing an example of a structure of the electronics housing according to the embodiment of the present invention.
FIG. 2 is a perspective view schematically showing an example of the structure of the cover plate of the embodiment of the present invention.
3 is a perspective view schematically showing an example of the structure of the thermoplastic resin member is expanded view like metal plate bonded embodiment of the present invention (a developed view like metal resin bonding plate).
Is a perspective view schematically showing an example of the structure of FIG. 4 the invention the thermoplastic resin member of the embodiment of the is joined a developed view like metal plate (developed view like metal resin bonding plate).
FIG. 5 is a perspective view schematically showing an example of the structure of the thermoplastic resin member is expanded view like metal plate bonded embodiment of the present invention (a developed view like metal resin bonding plate).
6 is a perspective view of a metal-resin joint plate Mechanical properties evaluation used in Example 1.
7 is a perspective view of the exploded view like metal plate according to the second embodiment.
8 is a perspective view of the exploded view like metal-resin joint plate according to the second embodiment.
[9] on the joint surface of the metal member (M) according to the present embodiment, parallel any third straight portion in a relationship, and the 3 Total 6 straight portions consisting of any three straight portion perpendicular to the straight portion it is a schematic diagram for explaining the location of the measurement.
DESCRIPTION OF THE INVENTION
[0012]
　Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings are denoted by the same reference numerals are used for the same components, description thereof is omitted as appropriate. Further, figures are schematic, not the actual dimensional ratios match. If there is between the statement of the numbers "-" in particular otherwise stated, represent the following from the above.
[0013]
[Electronics enclosure]
　First, the housing 100 for an electronic device according to the present embodiment to FIGS. 1 and 2 described as an example.
　Note Figure 1 is a perspective view schematically showing an example of a structure of the electronics housing 100 of the embodiment of the present invention. Figure 2 is a perspective view schematically showing an example of the structure of the cover plate 203 of the embodiment of the present invention.
[0014]
　Electronic equipment enclosure 100 according to this embodiment includes a metal base plate 201, bottom plate integrally bent metal plate 202 coupled to (202-1,202-2,202-3 to, and and 202-4) comprises, inside a housing for accommodating electronics, in the metal member (M) comprising at least a bottom plate 201 and side plate 202, plate-shaped metal member on the surface of (M) some thermoplastic resin member 301 is joined to, preferably directly joined, the metal member (M) are reinforced by thermoplastic resin member 301, the thermoplastic resin member on both sides of a plate-shaped metal member (M) 301 is bonded. Incidentally, the direct bonding in the present embodiment means a junction intervening layers such as adhesive-containing layer is not present between the metal member (M) and the thermoplastic resin member 301.
　Here, the side plate 202 to each other is preferably, for example, being engaged by mechanical means. (Also referred to as a physical engagement means.) Mechanical engagement means is not particularly limited, for example, screwing, and the like. The cover plate 203 which is provided if necessary with the side plate 202, may be engaged by the mechanical means, may be connected by bending integrally on one arbitrary side plates. In Figure 1, the side plate is 202-1,202-2,202-3 and 202-4 is set to four, but in the present invention also encompasses embodiments where three of the side plates is selected from these. However, it is preferred in this case the cover plate is connected by bending integrally with any one of the three side plates.
[0015]
　Electronic equipment enclosure 100 according to this embodiment, since the part is replaced with lightweight resin member from heavy metal member, as compared with the conventional housing in which the overall casing is constituted by a metal member, a lightweight can do.
　The electronic device housing 100 according to this embodiment, by providing the metal base plate 201 and the metal plate 202 in a part thereof, conventional housing in which the overall casing is constituted by a metal member it is possible to obtain the same electromagnetic wave shielding function and.
　Furthermore, electronic equipment enclosure 100 according to this embodiment, by a metallic member comprising at least a bottom plate 201 and side plates 202 (M) is reinforced by the thermoplastic resin member 301, to reduce the thickness of the metal member (M) it is possible to suppress the reduction in the mechanical strength of the electronics housing 100 by. That is, while realizing weight reduction of electronic equipment enclosure 100, it is possible to maintain the mechanical strength.
　Furthermore, electronic equipment enclosure 100 according to this embodiment, since the bottom plate 201 and a metal plate 202 made of metal is integrally connected parts is not required for connecting the bottom plate and the side plate parts it is possible to reduce the number, the result can be simplified process control. In addition, the reduction of the ground installation point is also possible. Then, the electronic device housing 100 according to this embodiment, since the number of parts can be reduced and the ground installation location, it is possible to realize a lighter electronic equipment enclosure 100.
　Further, only a portion of the surface of the plate-shaped metal member (M), since the thermoplastic resin member 301 is formed, that the entire surface of the metal member (M) of a thermoplastic resin member 301 will be covered suppressing can, the heat radiation characteristics of the electronic equipment enclosure 100 can be maintained.
[0016]
　In electronics enclosure 100 of the present embodiment, the thermoplastic resin member 301 are joined to both surfaces of the plate-shaped metal member (M). In this way, it is possible to reinforce the metal member (M) from both sides of the metal member (M), it is possible to improve the mechanical strength of the electronics housing 100. Thus, it is possible to reduce the thickness of the metal member (M), it is possible to obtain a lightweight electronic equipment enclosure 100.
[0017]
　From the above, the electronic device housing 100 according to this embodiment, light weight, electromagnetic wave shielding property, are excellent in balance of heat radiation properties and mechanical strength.
[0018]
　Metal member according to the present embodiment (M) is preferably in the junction surface between the thermoplastic resin member 301 having a fine uneven structure. In this case, since the metal member (M) and the thermoplastic resin member 301 are joined by a portion of the thermoplastic resin member 301 to the micro-relief structure from entering the metal member (M) and the thermoplastic resin member 301 it can be a bonding strength of the better. Accordingly, it is possible to better the mechanical strength of the electronics housing 100, it is possible to further reduce the thickness of the metal member (M) constituting the electronic device housing 100. As a result, it is possible to obtain a lighter electronic equipment enclosure 100.
[0019]
　Further, the thermoplastic resin member 301 which is joined to one surface of the plate-shaped metal member (M), and at least a portion of the thermoplastic resin member 301 that is bonded to the other surface, the metal member (M) it is preferably arranged so as to face each other in the vertical direction of the plate surface. In this way, it is possible to prevent the metal member (M) is deformed by shrinkage during the molding of the thermoplastic resin member 301.
[0020]
　In electronics enclosure 100 of the present embodiment, the surface area of ​​the junction of the thermoplastic resin member 301 to the entire surface area of ​​the metal member (M) (hereinafter, sometimes abbreviated as junction area rate), for example 1 area% or more 50 area% or less, preferably 40 area% or more 2 area% or less, more preferably 5% or more by area 30 area% or less. By joint area ratio is less than the above lower limit, it is possible to better the mechanical strength of the housing 100 electronic device. Can be bonded portion area rate is a lightweight electronic equipment enclosure 100 more excellent by heat dissipation by at most the upper limit value.
[0021]
　In electronics enclosure 100 of the present embodiment, the thermoplastic resin member 301, as shown in FIGS. 1-4, it is preferably joined to at least the peripheral portion of the surface of the metal member (M). Thereby, it is possible to reinforce the metal member (M) in a smaller amount of the thermoplastic resin member 301 more effectively. Furthermore, it is possible to reduce the amount of the thermoplastic resin member 301, a metal member by shrinkage during the molding of the thermoplastic resin member 301 (M) can be suppressed to become deformed.
　Further, in the electronic device housing 100 according to the present embodiment, at least a portion of the thermoplastic resin member 301 is, for example, as shown in FIGS. 1-4, are formed in the skeleton shape on the surface of the metal member (M) it is preferred that. The skeleton-like, for example, brace-like, grid-like, include at least one shape selected from a truss shape and noodle shape. By forming the thermoplastic resin member 301 in the framework-like on the surface of the metal member (M), it is possible to reinforce the metal member (M) in a smaller amount of the thermoplastic resin member 301 more effectively preferred.
　Further, by forming the thermoplastic resin member 301 in the framework-like on the surface of the metal member (M), it is possible to reduce the amount of the thermoplastic resin member 301, the contraction in molding the thermoplastic resin member 301 it and the metal member (M) is deformed, the heat dissipation properties of the housing 100 for the electronic device by the thermoplastic resin member 301 can be suppressed decrease.
[0022]
　The thickness of the thermoplastic resin member 301 according to this embodiment can be the same thickness everywhere, may have different thicknesses depending on the location.
　In electronics enclosure 100 of the present embodiment, the average thickness of the thermoplastic resin member 301 which is bonded to the surface of the metal member (M) is the average thickness and the overall housing size of the metal member (M) Although it depends, for example, 1.0 mm ~ 10 mm, preferably 1.5 mm ~ 8 mm, more preferably 1.5 mm ~ 5.0 mm.
　When the average thickness of the thermoplastic resin member 301 is less than the above lower limit, it is possible to the mechanical strength of the electronic device enclosure 100 obtained better.
　When the average thickness of the thermoplastic resin member 301 is more than the above upper limit, it is possible to a housing 100 for an electronic device obtained lighter. Further, it is possible to reduce the amount of the thermoplastic resin member 301, a metal member by shrinkage during the molding of the thermoplastic resin member 301 (M) can be suppressed to become deformed.
[0023]
　In electronics enclosure 100 of the present embodiment, it is preferable that the thermoplastic resin member 301 is not bonded to the boundary portion 205 of the bottom plate 201 and side plate 202. Thereby, it is possible to be bent the border portion 205 of the bottom plate 201 and side plates 202 becomes easier to obtain an electronic device housing 100 more easily.
[0024]
　In the metal member (M) according to the present embodiment, the surface of the metal base plate 201, for each of the surfaces of the metal plate 202 (202-1,202-2,202-3, and 202-4) it is preferable that the thermoplastic resin member 301 are joined. By doing so, it is possible to better the mechanical strength of the housing 100 the electronic device can be thinner the thickness of the metal member (M). As a result, it is possible to obtain a lighter electronic equipment enclosure 100.
[0025]
　The electronic device housing 100 according to the present embodiment preferably further comprises a metal cover plate 203 which is connected by bending integrally with the side plate 202. In this case, as shown in FIGS. 2-4, the thermoplastic resin member 301 is joined to the portion of the surface of the cover plate 203, it is preferable that the cover plate 203 is reinforced by the thermoplastic resin member 301. By doing so, it is possible to better the mechanical strength of the electronics housing 100, it is possible to further reduce the thickness of the metal member (M) constituting the electronic device housing 100. As a result, it is possible to obtain a lighter electronic equipment enclosure 100. Further, it is preferable that the thermoplastic resin member 301 is not bonded in the boundary portion of the side plate 202 and cover plate 203 to facilitate bending in this case. Incidentally, a metal cover plate 203, apart from preparing the metal member (M), may engage by mechanical means on the side plate 202.
[0026]
　Cover plate 203 of the present embodiment, the junction surface between the thermoplastic resin member 301 preferably has the same fine concavo-convex structure and the joint surface of the metal member (M). In this case, since the cover plate 203 and the thermoplastic resin member 301 are joined by a portion of the thermoplastic resin member 301 from entering the above fine unevenness, the bonding strength between the cover plate 203 and the thermoplastic resin member 301 it can be better. Accordingly, it is possible to better the mechanical strength of the electronics housing 100, it is possible to further reduce the thickness of the cover plate 203 constituting the electronic device housing 100. As a result, it is possible to obtain a lighter electronic equipment enclosure 100.
[0027]
　Here, the fine concave-convex structure of the metal member (M) surface, including the cover plate 203 is, for example, a fine concavo-convex structure in which the convex portion is bristled interval period is 5nm or more 500μm or less.
　By a portion of the thermoplastic resin member 301 penetrates into such a fine unevenness, a thermoplastic resin member 301 are bonded to the metal member (M) or the cover plate 203. By doing so, the physical resistance between the metal member (M) or the cover plate 203 and the thermoplastic resin member 301 (anchor effect) is effectively expressed, the metal member (M) or the cover plate 203 it is possible to more firmly bond the thermoplastic resin member 301.
[0028]
　The electronic device housing 100 according to the present embodiment, as shown in FIG. 1, may have an opening 207 or the slit 209 to the side plate 202. By having an opening 207 in the side plate 202, blowers and the like wind can a letter from the opening 207 in the housing 100 for an electronic device using, as a result, electronics housing 100 for the electronic device is thermally If with, it may be cooled by blowing the electronic apparatus.
　Further, by the side plate 202 has a slit 209, it is possible to discharge the air taken in from the opening 207 to the outside of the housing 100 electronic device.
[0029]
　Electronic device according to the present embodiment includes an electronic device housing 100, and an electronic device accommodated in the electronic device housing 100. The electronic device the electronic device is housed in an electronic device housing 100 according to the present embodiment, for example, an audio device, a vehicle mounted mobile telephone device, a car navigation apparatus, the vehicle-mounted cameras, vehicle-mounted device represented by a drive recorders and the like.
[0030]
　Hereinafter, respective members constituting the electronic device housing 100 according to the present embodiment to FIGS. 1 and 2 described as an example.
[0031]

　metal member according to the present embodiment (M) includes a bottom plate 201, side plates 202-1, side plates 202-2, side plates 202-3, and at least one selected from the side plate 202-4 consisting of the side plate 202.. One preferred embodiment includes a bottom plate 201, side plates 202-1, side plates 202-2, consists of side plates 202-3, and the side plate 202-4. Second preferred embodiment, consists of a bottom plate 201, side plates (front plate) 202-1, side plates (side plate) 202-2 and 202-4, and cover plate 203. Third preferred embodiment consists of a bottom plate 201, side plates 202-1, side plates 202-2, side plates 202-3, side plates 202-4, and cover plate 203. Among these embodiments, second and third aspects are particularly preferred.
　By doing so, it is possible to further reduce the number of parts of the electronic device housing 100, as a result, or be a process control more easily, or can be further reduced ground installation location. Then, it is possible to further reduce the number of parts and the ground installation location, it is possible to realize a housing 100 for more lightweight electronic equipment.
[0032]
　A metal material constituting the metal member (M) according to the present embodiment is not particularly limited, but is preferably a metal having electromagnetic shielding properties, for example, iron, steel material, stainless steel, aluminum, aluminum alloys, magnesium, magnesium alloy, copper , mention may be made of copper alloy, titanium and titanium alloys. These may be used alone or may be used in combination of two or more.
　Among these, light weight, low cost, and in view of high strength, preferably of aluminum (pure aluminum) and aluminum alloys, aluminum alloys and more preferred.
[0033]
　Aluminum alloy is not particularly limited, an alloy mainly composed of aluminum. Specifically, there can be mentioned aluminum, copper, manganese, silicon, magnesium, zinc, and an alloy of at least one metal selected from nickel.
　The aluminum alloy according to the present embodiment, JIS four digits of the international aluminum alloy name defined in (JIS H4140) is 2000 series aluminum / copper-based alloy, 3000 series aluminum / manganese alloy , 4000 series aluminum / silicon alloy, 5000 series aluminum / magnesium alloy, 6000 series aluminum / magnesium / silicon alloy, 7000 series aluminum / zinc / magnesium alloy, aluminum / zinc / magnesium / copper-based alloy etc. are preferably used. Among these, availability, viewpoints from 5000 series aluminum / magnesium alloy mechanical and thermal properties are preferably used in particular.
[0034]
　The thickness of the metal member (M) according to the present embodiment may be the same thickness everywhere, may have different thicknesses depending on the location. The average thickness of preferably 0.2mm or more 1.0mm or less of the metal member (M), more preferably 0.2mm greater than 1.0mm or less, particularly preferably 0.2mm beyond 0.8mm or less.
　When the average thickness of the metal member (M) is less than the above lower limit, the mechanical strength of the housing 100 for an electronic device to be obtained, it is possible to heat radiation characteristics and electromagnetic shielding properties better.
　When the average thickness of the metal member (M) is more than the above upper limit, it is possible to a housing 100 for an electronic device obtained lighter. Further, by the average thickness of the metal member (M) is more than the above upper limit, it becomes more easy to bend the metal member (M), it is possible to improve the productivity of the electronic equipment enclosure 100.
[0035]
　The shape of the metal member (M), for example, be a plate. The metal member (M) of the metal material, cutting, plastic working by pressing or the like, punching, cutting, polishing, after being processed into a predetermined shape by removing meat and the like methods known discharge machining or the like, described later crude preferable that processing has been performed. In short, by various processing methods, it is preferable to use those which are processed into desired shapes.
[0036]
　The junction surface between the thermoplastic resin member 301 of the metal member (M), for example, the fine uneven structure projections bristled is formed interval period is 5nm or more 500μm or less.
　Here, the interval period of the fine unevenness is the average value of the distance to the convex portion adjacent the convex portions, photograph taken with an electron microscope or laser microscope, or can be determined using a surface roughness measuring device.
　Interval periods as measured by electron microscopy or laser microscope is the spacing period of usually less than 500 nm, in particular for photographing the joint surface of the metal member (M). From the photograph, any protrusions were selected 50, for measuring a distance to the convex portion adjacent from their convex portions, respectively. By integrating all of the distance to the convex portion adjacent the convex portions and distance cycle divided by 50. On the other hand, the interval period exceeding 500nm is typically determined using the surface roughness measuring device.
　Normally, not only the joint surface of the metal member (M), since on the whole surface of the metal member (M), the surface roughening treatment is performed, identical to the joint surface of the metal member (M) in terms it can also measure the interval period from locations other than the junction surface.
[0037]
　The interval period is preferably 10nm or more 300μm or less, more preferably 20nm or more 200μm or less.
　When the interval period is not less than the above lower limit, it is possible to thermoplastic resin composition that constitutes the thermoplastic resin member 301 in the recess of the fine unevenness (P) is sufficiently enters, the metal member (M) and heat it is possible to further improve the bonding strength between the thermoplastic resin member 301. Further, when the interval period is more than the above upper limit, generation of a gap junction portion of the metal member (M) and the thermoplastic resin member 301 can be suppressed. As a result, metal - because the gap between the resin interface can be suppressed impurities such as moisture from entering, when using the electronic device enclosure 100 high temperature under high humidity, can be suppressed strength decreases.
[0038]
　As a method for forming a fine concavo-convex structure having the spacing period, an inorganic base aqueous solution and / or HCl containing NaOH or the like, HNO 3 method in an inorganic acid aqueous solution containing such immersing the metal member; metal by anodic oxidation how to handle member; mechanical cutting, for example, a method for forming irregularities on the surface of the metal member by pressing a mold punch having irregularities produced by the diamond abrasive grinding or blasting, sand blasting, knurling, laser processing the method for making an uneven shape on the surface of the metal member; as disclosed in WO 2009/31632 pamphlet, hydrazine hydrate, ammonia and one or more metal members in an aqueous solution selected from water-soluble amine compound how immersing the like. These methods, type of the metal material constituting the metal member (M), it is possible to selectively use the uneven shape formed within the above interval period. In the present embodiment, an inorganic base aqueous solution and / or HCl containing NaOH or the like, HNO 3 is a method of immersing the metal member in an inorganic acid aqueous solution containing such, Ya that can be processed collectively metallic member over a wide range also preferred because of its excellent bonding force between the metal member (M) and the thermoplastic resin member 301.
[0039]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), optional third straight portion in parallel relationship, and the 3 for a total of 6 straight portions consisting of any three straight portion perpendicular to the straight portion, JIS B0601 (corresponding international standard: ISO4287) in compliance with the measured surface roughness following requirements (1) and (2) it is preferable to satisfy at the same time.
　(1) cut level of 20%, 30% or less load length ratio (Rmr) of roughness curve in the length 4mm of the linear portion includes first straight portions or evaluation
　(2) of all the straight portions, evaluation length the ten-point average roughness of 4 mm (Rz) is more than 2μm
[0040]
　9, on the joint surface 104 of the metal member (M), optional third straight portion in parallel relationship, and a total of 6 to explain the straight portions consisting of any three straight portion perpendicular to the third straight portion it is a schematic diagram.
　The 6 straight portion, for example, can be selected 6 straight portion B1 ~ B6 as shown in FIG. First, as a reference line, selects the center line B1 passing through the center portion A of the joint surface 104 of the metal member (M). Then selects a line B2 and B3 which is in parallel relationship with the center line B1. Then, select the center line B4 perpendicular to the center line B1, perpendicular to the center line B1, selects a line B5 and B6 in parallel relationship with the center line B4. Here, the vertical distance D1 ~ D4 between the straight lines, for example, 2 ~ 5 mm.
　Normally, the metal member (M) is not only the joint surface 104 of the thermoplastic resin member 301 of the metal member (M), relative to the total metal element (M), the surface roughening treatment is applied Therefore, for example, the junction surface 104 flush with the thermoplastic resin member 301 of the metal member (M) or on the opposite side, may be selected 6 straight portion from a portion other than the junction surface 104.
[0041]
　Satisfies the requirement (1) and (2) at the same time, but not necessarily clear even better reason electronics housing 100 is obtained by bonding strength of the metal member (M) and the thermoplastic resin member 301, joint surface 104 of the thermoplastic resin member 301 of the metal member (M) is considered because that is effectively expressed structure capable anchoring effect between the metal member (M) and the thermoplastic resin member 301 It is.
[0042]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), optional third straight portion in parallel relationship, and the third straight line for a total of 6 straight portions consisting of any three straight portion perpendicular to the section, JIS B0601 (corresponding international standard: ISO4287) surface roughness is measured according to the of the following requirements (1A) ~ (1C) 1 One or more, further preferably meet the requirements, it is particularly preferable to satisfy the requirement (1C).
(1A) cut level of 20%, the load length ratio of the roughness curve in evaluation length 4 mm (Rmr) is preferably a straight section is less than 30% 2 straight section or more, more preferably 3 straight parts or more, and most preferably includes 6 straight portion
(1B) cut level of 20%, the load length ratio of the roughness curve in evaluation length 4 mm (Rmr) is preferably a straight portion is 20% or less 1 straight section or more, more preferably 2 linear parts or more, more preferably 3 straight parts or more, most preferably 6 straight portion
(1C) cut level of 40%, the linear portion load length ratio of the roughness curve in evaluation length 4 mm (Rmr) is not more than 60% the preferably 1 straight portions or more, more preferably 2 straight section or more, more preferably 3 straight parts or more, most preferably 6 straight portion
[0043]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), JIS B0601 (corresponding international standard: ISO4287) conforming to cut level of 20% as measured Te, the average value of the load length ratio of the roughness curve (Rmr) is preferably in the evaluation length 4mm or less 40% 0.1%, more preferably 0.5% or more 30% or less, still more preferably 1% to 20%, and most preferably 15% or less than 2%.
　The average value of the load length ratio (Rmr), it is possible to adopt a load length ratio of an arbitrary 6 linear portion above the (Rmr) and averaged.
[0044]
　Load length ratio of the joint surface 104 of the metal member according to the present embodiment (M) (Rmr) may be controlled by appropriately adjusting the conditions of the roughening treatment to the surface of the metal member.
　In the present embodiment, in particular the type and concentration of the etchant, the temperature and time of the roughening treatment, timing of the etching process may be mentioned as a factor for controlling the load length rate (Rmr).
[0045]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), optional third straight portion in parallel relationship, and the third straight line for a total of 6 straight portions consisting of any three straight portion perpendicular to the section, JIS B0601 (corresponding international standard: ISO4287) is the surface roughness measurement in conformity with it is preferable to further satisfy the following requirements (2A).
　(2A) of all of the linear portion, the ten-point average roughness of the evaluation length 4 mm (Rz) is preferably 5μm, more preferably above 10μm or more, more preferably 15μm or more.
[0046]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), the average value of the ten-point average roughness (Rz) is preferably 50μm or less than the 2 [mu] m, more preferably 45μm or less beyond 5 [mu] m, more preferably 10μm or more 40μm or less, particularly preferably 15μm or 30μm or less.
　Incidentally, the ten-point average roughness average value of (Rz) may be employed which ten-point average roughness of any 6 linear portion above the (Rz) were averaged.
[0047]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), optional third straight portion in parallel relationship, and the third straight line for a total of 6 straight portions consisting of any three straight portion perpendicular to the section, JIS B0601 (corresponding international standard: ISO4287) is the surface roughness measurement in conformity with it is preferable to further satisfy the following requirements (4).
(4) All of the linear portion, the average length of roughness curve element (RSm) of less than 300μm exceed 10 [mu] m, more preferably 20μm or more 200μm or less.
[0048]
　From the viewpoint of further improving the bonding strength of the metal member (M) and the thermoplastic resin member 301, on the joint surface 104 of the metal member (M), the average value of the average length of roughness curve element (RSm) is preferably less than 300μm exceed 10 [mu] m, more preferably 20μm or more 200μm or less.
　The average length of the roughness curve element average value of (RSm) may be employed which ten-point average roughness of any 6 linear portion above the (Rz) were averaged.
　In the present embodiment, when the average thickness of the metal member (M) is in the range of more than 500 [mu] m, the average length of the roughness curve element average value of (RSm) is the interval period.
[0049]
　Ten-point average roughness of the joint surfaces 104 of the metal member (M) according to the present embodiment (Rz) and average length of roughness curve element (RSm) is suitably the conditions of roughening treatment to the surface of the metal member It can be controlled by adjusting the.
　In the present embodiment, in particular the temperature and time of roughening treatment, etching amount, etc. may be mentioned as a factor for controlling the ten-point average roughness (Rz) and average length of roughness curve element (RSm) .
[0050]
　Then, the interval period, the load length ratio (Rmr), ten-point average roughness (Rz), a process for the preparation of the average length of roughness curve element (RSm) metal satisfies the like member (M) will be described.
　Such metal member (M), for example, can be formed by roughening a surface of a metallic member using an etching agent.
　Hereinafter, the interval period, the load length ratio (Rmr), ten-point average roughness (Rz), average roughness curve element satisfies the length (RSm) such roughness of the metal member to obtain a metal member (M) It shows an example of a processing method. However, roughening treatment method of a metal member according to the present embodiment is not limited to the following examples.
[0051]
(1) pre-treatment step
　First, a metal member, there is no thick coating on the bonding side of the surface of the thermoplastic resin member 301 made of an oxide film or a hydroxide and the like are desirable. To remove such a thick coating, prior to the step of treating the following etchant, sandblasting, shot blasting, grinding, mechanical polishing and the barrel finishing or the like, even by polishing the surface layer by chemical polishing good. Further, if the surface of the bonding side of the thermoplastic resin member 301 there is a significant contamination of such machinery oil, and treatment with an alkaline aqueous solution such as aqueous sodium or potassium hydroxide solution hydroxide, it is preferable to perform degreasing.
[0052]
(2) a surface roughening treatment step
　as the surface roughening treatment method for a metal member in the present embodiment, it is preferable to perform the treatment by later-described acid-based etchant at a specific timing. Specifically, it is preferable to perform the treatment with acid-based etchant at the final stage of surface roughening process.
[0053]
　As a method of roughening treatment with the acid etchant, dipping, it includes treatment method by spraying or the like. The processing temperature is preferably 20 to 40 ° C., the treatment time is preferably about 5 to 350 seconds, from the viewpoint of more uniformly roughen the surface of the metal member, and more preferably 20 to 300 seconds, particularly preferably 50 to 300 seconds.
[0054]
　By roughening treatment with the acid etching agent, the surface of the metal member is roughened uneven. Etching amount in the depth direction of the metal member at the time of using the acid etching agent (dissolution amount), the mass of the dissolved metal member, when calculated from the specific gravity and surface area, preferably from 0.1 ~ 500 [mu] m , more preferably 5 ~ 500 [mu] m, even more preferably from 5 ~ 100 [mu] m. If the etching amount is less than the above lower limit, it is possible to further improve the bonding strength of the metal member (M) and the thermoplastic resin member 301. Further, the amount of etching is not more than the above upper limit, it is possible to reduce the processing cost. Etching amount can be adjusted by the processing temperature and the processing time and the like.
[0055]
　In the present embodiment, when the roughening treatment of the metal member by using the acid etching agent may be roughened over the entire surface of the metallic member surface, only the surface of the thermoplastic resin member 301 is joined to it may be partially roughened.
[0056]
(3) post-treatment process
　in the present embodiment, after the surface roughening treatment step, usually, it is preferable to carry out rinsing and drying. It is not particularly limited how the washing washing predetermined time by a dip or running water is preferred.
[0057]
　Furthermore, as the post-treatment step in order to remove the smut, etc. caused by treatment with the acid etching agent is preferably subjected to ultrasonic cleaning. Conditions of ultrasonic cleaning is not particularly limited insofar as the conditions that can remove the resulting smut like, preferably water as the solvent to be used, and as the treatment time is preferably 1 to 20 minutes.
[0058]
(Acid etching agent)
　In the present embodiment, the etchant used in the roughening treatment of the surface of the metal member, certain acid etching agent to be described later are preferable. By treatment with the specific etching agent, on the surface of the metal member, the fine uneven structure suitable for improving adhesion between the thermoplastic resin member 301 is formed, the metal member (M) and heat by the anchor effect It is believed that the bonding strength between the thermoplastic resin member 301 is further improved.
[0059]
　The following describes components of the acid etching agent which can be used in the present embodiment.
[0060]
　The acid etching agent comprises at least one of ferric ions and cupric ions, an acid, and if desired, may contain manganese ions, various additives.
[0061]
· Ferric ion
　the ferric ion is a component that oxidizes the metal member, by incorporating ferric ion source, it is possible for containing said ferric ions in the acid-based etchant. Examples of the ferric ion source, ferric nitrate, ferric sulfate, ferric chloride. Among the ferric ion source, ferric excellent solubility chloride, from the viewpoint that it is inexpensive.
[0062]
　In the present embodiment, the content of the ferric ion in the acid etching agent is preferably from 0.01 to 20 wt%, more preferably 0.1 to 12 mass%, more preferably from 0.5 to 7 mass%, even more preferably 1-6% by weight, particularly preferably from 1 to 5 mass%. When the content of the ferric ion is less than the above lower limit, it is possible to prevent the lowering of roughening rate of the metal member (dissolution rate). On the other hand, if less than the above upper limit content of ferric ion, it is possible to properly maintain the roughened speed, bonding strength improved between the metal member (M) and the thermoplastic resin member 301 uniform roughening becomes possible to more suitable.
[0063]
· Cupric ion
　the cupric ion is a component that oxidizes the metal member, by blending cupric ion source, can be said cupric ions contained in the acid-based etchant. Examples of the cupric ion source, cupric sulfate, cupric chloride, cupric nitrate, and cupric hydroxide, etc. is. Among the cupric ion source, preferably from the viewpoint of cupric sulfate, cupric chloride is inexpensive.
[0064]
　In the present embodiment, the content of the cupric ion in the acid etching agent is preferably 0.001 to 10 mass%, more preferably from 0.01 to 7% by weight, more preferably 0. 05-1% by weight, still more preferably 0.1 to 0.8 mass%, even more preferably from 0.15 to 0.7% by weight, particularly preferably 0.15 to 0.4 mass%. When the content of the cupric ion is less than the above lower limit, it is possible to prevent the lowering of roughening rate of the metal member (dissolution rate). On the other hand, if less above the upper limit content of the cupric ion, it is possible to properly maintain the roughened speed, bonding strength improved between the metal member (M) and the thermoplastic resin member 301 uniform roughening becomes possible to more suitable.
[0065]
　The acid etching agent may comprise only one of ferric ions and cupric ions, both may contain a but both the ferric ion and the cupric ion it will be preferable to include. By acid-based etchant containing both ferric ions and cupric ions, readily good roughened shape suitable for bonding strength enhancement between the metal member (M) and the thermoplastic resin member 301 can get.
[0066]
　The acid-based etchant, when containing both ferric ions and cupric ions, the content of each of ferric ion and a cupric ion is preferably within the above range. Further, the total content of ferric ion and a cupric ion in the acid etching agent is preferably 0.011 to 20 mass%, more preferably from 0.1 to 15 mass%, more preferably from 0.5 to 10 mass%, particularly preferably 1 to 5 mass%.
[0067]
Manganese ions
　in the acid etching agent in order to uniformly roughened evenly the surface of the metal member may contain manganese ions. Manganese ions by incorporating manganese ion source may contain the manganese ions in the acid-based etchant. The source said manganese ions, manganese sulfate, manganese chloride, manganese acetate, manganese fluoride, and manganese nitrate and the like. Among the manganese ion source, from the viewpoint of equal manganese sulfate, manganese chloride is inexpensive.
[0068]
　In the present embodiment, the content of the manganese ions in the acid etching agent is preferably 0 to 1 mass%, more preferably from 0 to 0.5 mass%. The content of the manganese ions, thermoplastic resin (P1) is the present inventors to develop sufficient bonding strength even 0 wt% in the case of the polyolefin resin constituting the thermoplastic resin member 301 It has been confirmed. That is, as the thermoplastic resin (P1) is preferably in the case of using a polyolefin resin the manganese ion content is 0 mass%, on the other hand, when using a thermoplastic resin other than the polyolefin resins of more than the above upper limit manganese ions are used as appropriate.
[0069]
Acid
　The acid is a component capable of dissolving the oxidized metal by ferric ions and / or cupric ion. The acid, hydrochloric acid, hydrobromic acid, sulfuric acid, nitric acid, phosphoric acid, perchloric acid, and inorganic acids such as sulfamic acid, sulfonic acid, and organic acids such as carboxylic acids. As the carboxylic acid, formic acid, acetic acid, citric acid, oxalic acid, and malic acid. The above acid etching agent can be compounded these acids singly or in combination. Among the inorganic acids, odor almost no sulfuric acid is preferred from the viewpoint is inexpensive. Further, in the among the organic acids, from the viewpoint of the uniformity of the roughened shape, carboxylic acids are preferred.
[0070]
　In the present embodiment, the content of the acid in acid etching agent is preferably 0.1 to 50 mass%, more preferably 0.5 to 50 mass%, 1-50 mass% still more preferably, even more preferably 1 to 30 mass%, still more preferably from 1 to 25 mass%, and still more preferably 2 to 18 mass%. When the content of the acid is less than the above lower limit, it is possible to prevent deterioration of roughening rate of the metal member (dissolution rate). On the other hand, if the above-described upper limit or less the content of the acid, it is possible to prevent the crystallization of the metal salt of a metal member when the liquid temperature decreases, the workability can be improved.
[0071]
- Other components
　The acid etching agent that can be used in the present embodiment, added may be added a surfactant, optionally other additives in order to prevent unevenness of the roughened by surface contaminants such as fingerprints it may be. Other additives, a source of halide ions to be added to form deep irregularities, for example, can be exemplified sodium chloride, potassium chloride, sodium bromide, potassium bromide and the like. Alternatively, imidazole, triazole, azoles tetrazoles such or to be added to obtain thiosulfate ions added to increase the roughening processing speed, thio compounds and the like thiourea, a more uniform roughening shape, crude can also be exemplified such pH adjusting agent is added to control the reaction. When adding these other components, their total content is preferably about 0.01 to 10 wt% in the acid-based etchant.
[0072]
　Acid etching agent of the present embodiment can be readily prepared by dissolving the above respective components in ion-exchanged water and the like.
[0073]

　The following describes a thermoplastic resin member 301 according to this embodiment.
　Thermoplastic resin member 301 according to this embodiment is constituted by a thermoplastic resin composition (P). The thermoplastic resin composition (P), the thermoplastic resin (P1) comprising as essential components, and may include other compounding agents as required (P2). For convenience, the thermoplastic resin member 301 even when consisting only of a thermoplastic resin (P1), the thermoplastic resin member 301 are described as being constituted by a thermoplastic resin composition (P).
[0074]
(Thermoplastic resin (P1))
　is not particularly restricted but includes thermoplastic resin (P1), for example, polyolefin resins, poly (meth) such as methyl acrylate resin (meth) acrylic resins, polystyrene resins, polyvinyl alcohol - polyvinyl chloride copolymer resin, polyvinyl acetal resins, polyvinyl butyral resins, polyvinyl formal resins, polymethyl pentene resins, maleic anhydride - styrene copolymer resin, polycarbonate resin, polyphenylene ether resin, polyether ether ketone resins, polyether aromatic polyether ketone such as ketone resins, polyester resins, polyamide resins, polyamideimide resins, polyimide resins, polyetherimide resins, styrene-based elastomers, polyolefin elastomers, polyurethane Emissions-based elastomer, polyester elastomer, polyamide elastomer, ionomer, amino polyacrylamide resin, isobutylene maleic anhydride copolymers, ABS, ACS, AES, AS , ASA, MBS, ethylene - vinyl chloride copolymers, ethylene - vinyl acetate copolymer, ethylene - vinyl acetate - vinyl graft polymers chloride, ethylene - vinyl alcohol copolymers, chlorinated polyvinyl chloride resin, chlorinated polyethylene resins, chlorinated polypropylene resins, carboxyvinyl polymers, ketone resins, amorphous copolyester resins, norbornene resins, fluorine plastic, polytetrafluoroethylene resin, fluorinated ethylene polypropylene resin, PFA, polychlorofluoroethylene resin, ethylene tetrafluoroethylene Nko polymers, polyvinylidene fluoride resins, polyvinyl fluoride resins, polyarylate resins, thermoplastic polyimide resins, polyvinylidene chloride resins, polyvinyl chloride resins, polyvinyl acetate resins, polysulfone resins, poly-para-methyl styrene resins, polyallylamine resin, polyvinyl ether resins, polyphenylene oxide resins, polyphenylene sulfide (PPS) resin, polymethyl pentene resin, oligoester acrylate, xylene resins, maleic acid resins, polyhydroxybutyrate resins, polysulfone resins, polylactic acid resins, polyglutamic acid resins, polycaprolactone resins, polyether sulfone resins, polyacrylonitrile resins, styrene - acrylonitrile copolymer resins, acrylonitrile - butadiene - styrene copolymer resin, Polyacetal resins. It may be used in these thermoplastic resins alone, or may be used in combination of two or more.
[0075]
　Among these, from the viewpoint of achieving bonding strength improving effect of the metal member (M) and the thermoplastic resin member 301 more effectively, polyolefin resins, polyester resins, polyamide resins, polyphenylene sulfide resins, polycarbonate resins, polyether ether ketone resin, polyether ketone resin, polyimide resin, polyether sulfone resin, polystyrene resin, polyacrylonitrile resins, styrene - acrylonitrile copolymer resins, acrylonitrile - butadiene - styrene copolymer resin, (meth) acrylic system resin, and one or more kinds of thermoplastic resin selected from polyacetal resin is suitably used.
[0076]
　The polyolefin-based resin can be used without particular limitation a polymer obtained by polymerizing olefins.
　The olefin constituting the polyolefin resin, for example, ethylene, alpha-olefin, cyclic olefin, a polar olefin, and the like.
[0077]
　Examples of the α- olefin having 3 to 30 carbon atoms, with preference given to straight-chain or branched α- olefin of 3 to 20 carbon atoms. More specifically, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1- decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, and the like.
[0078]
　Examples of the cyclic olefin, include cyclic olefins having 3 to 30 carbon atoms, preferably from 3 to 20 carbon atoms. More specifically, cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, 2-methyl-1,4,5,8-dimethano-1,2,3,4,4a, 5 , 8,8a-octahydro-naphthalene, and the like.
[0079]
　As the polar olefin, such as vinyl acetate, methyl methacrylate, methyl acrylate, ethyl acrylate.
[0080]
　Preferably the olefin constituting the polyolefin resin, ethylene, propylene, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1- pentene and the like. Of these, more preferably, ethylene, propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, more preferably ethylene or propylene.
[0081]
　The polyolefin-based resin, one obtained by polymerizing an olefin as described above alone, or a random copolymer in combination of two or more, the block copolymer may be one obtained by graft copolymerization .
[0082]
　The polyolefin-based resin may be a blend of different polyolefins in properties. As such an example, a propylene homopolymer, propylene random copolymer, and one or more selected from propylene block copolymers, propylene-ethylene copolymer rubber, ethylene-alpha-olefin copolymer (wherein alpha- olefins are 1-butene, 1-hexene, it may include blends of a such elastomer-octene, etc.).
[0083]
　Further, examples of the polyolefin resin, be of straight chain, it may be obtained by introducing a branched structure.
[0084]
　As the polyester resin, for example, polylactic acid, polyglycolic acid, polycaprolactone, aliphatic polyesters such as polyethylene succinate, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate (PBT), poly cyclohexylene dimethylene terephthalate (PCT ), and the like.
[0085]
　As the polyamide resin, for example, PA6, ring-opening polymerization based aliphatic polyamides such PA12; PA66, PA46, PA610, PA612, polycondensation polyamide such as PA11; MXD6, PA6T, PA9T, PA6T / 66, PA6T / 6, semi-aromatic polyamide amorphous PA and the like; poly (p- phenylene terephthalamide), poly (m-phenylene terephthalamide), poly (m-phenylene isophthalamide) wholly aromatic polyamide such as an amide elastomer and the like can be mentioned It is.
[0086]
(Other blending agents (P2))
　The thermoplastic resin composition (P), may include other compounding agents for the purpose of imparting particular functions (P2). As the compounding agent (P2), fillers, flame retardants, flame retardant agents, heat stabilizers, antioxidants, pigments, weathering agents, plasticizers, dispersing agents, lubricants, mold release agents, antistatic agents, anti impact modifiers and the like.
[0087]
　In the present embodiment, from the viewpoint of improving the mechanical strength of the adjustment and the thermoplastic resin member 301 of the linear expansion coefficient difference of the metal member (M) and the thermoplastic resin member 301, a thermoplastic resin member 301 is further a filler it is preferable to include.
　As the filler, for example, be chosen hydrotalcites, glass fibers, carbon fibers, metal fibers, organic fibers, carbon particles, clay, talc, silica, minerals, one or two or more from the group consisting of cellulose fibers can. Among these, preferably, hydrotalcite is glass fiber, carbon fiber, talc, one or more selected from minerals.
　The shape of the filler is not particularly limited, fibrous, particulate, and it may be any shape and plate shapes.
[0088]
　When the thermoplastic resin member 301 including the filler, the content is, when the entire thermoplastic resin member 301 and 100 wt%, e.g., 5 wt% to 95 wt% or less, preferably 10 mass% or more and 90 mass % or less, more preferably 90 to 20 mass%, more preferably 30 mass% or more and 90 mass% or less, particularly preferably 90 wt% or less than 50 wt%.
[0089]
　The filler is another effect of enhancing the rigidity of the thermoplastic resin member 301, there is an effect that can control the linear expansion coefficient of the thermoplastic resin member 301. In particular, if the electronic equipment enclosure 100 of the present embodiment, the metal member (M) and often differ greatly temperature-dependent dimensional stability of the thermoplastic resin member 301, a large temperature change occurs distortion is likely to take to the electronic device housing 100. By thermoplastic resin member 301 contains a filler, it is possible to reduce this distortion. Further, the content of the filler is within the above range, it is possible to suppress the reduction in toughness.
[0090]
　In the present embodiment, it is preferred that the filler is a fibrous filler, more preferably glass fibers and carbon fibers, particularly preferably glass fibers.
　Accordingly, it is possible to suppress the shrinkage of the thermoplastic resin member 301 after molding, it is possible to make the joining of the metal member (M) and the thermoplastic resin member 301 more strong.
[0091]
　As the hydrotalcite has a natural product and a synthetic product, for example, magnesium, calcium, zinc, aluminum, those containing no hydrated basic carbonate or a water of crystallization, such as bismuth. The natural product, Mg 6 Al 2 (OH) 16 CO 3 · 4H 2 include those having the O structure. The synthetic, Mg 0.7 Al 0.3 (OH) 2 (CO 3 ) 0.15 · 0.54H 2 O, Mg 4.5 Al 2 (OH) 13 CO 3 · 3.5 H 2 O, mg 4.2 Al 2 (OH) 12.4 (CO 3 ) 0.15 , Zn 6 Al 2 (OH) 16 CO 3 · 4H 2 O, Ca 6 Al 2 (OH) 16 CO 3 · 4H 2 O, mg 14 Bi 2 (OH) 29.6 · 4.2H 2 O, and the like. The amount of hydrotalcite to a thermoplastic resin composition (P) 100 parts by weight per, for example, preferably not more than 2 parts by mass or more 0.01 part by mass. If the amount of the hydrotalcite is not less than the above lower limit, it is possible to more improve the heat resistance of the thermoplastic resin member 301 to be obtained. When the amount of hydrotalcite is less than the above upper limit, it is possible to better the flame retardancy of the thermoplastic resin member 301 to be obtained.
[0092]
　As the flame retardant, for example, bis tetrabromobisphenol A (2,3-dibromopropyl) ether, bis tetrabromobisphenol S (2,3-dibromopropyl) ether, tetrabromobisphenol A bis (2,3 - dibromopropyl) ether, and tris (2,3-dibromopropyl) isocyanurate and mixtures consisting of two or more. Content of the flame retardant thermoplastic resin composition (P) 100 parts by weight per, for example, 5 to 25 parts by weight, preferably 10 to 20 parts by weight. When the content of the flame retardant is not less than the above lower limit, it is possible to better the flame retardancy of the thermoplastic resin member 301 to be obtained. When the content of the flame retardant is more than the above upper limit, it is possible to better the mechanical properties of the thermoplastic resin member 301 to be obtained.
[0093]
　The thermoplastic resin composition (P) may include a flame retardant aid. When the thermoplastic resin composition (P) comprises a flame retardant agent, the content of the thermoplastic resin composition (P) 100 parts by weight per 0.5 to 20 parts by weight, preferably from 1 to 10 parts by weight is there. If the content of the flame retardant aid is not less than the above lower limit, it is possible to obtain a sufficient synergistic effect with the flame retardant. When the content of the flame retardant agent is more than the above upper limit, it is possible to better the mechanical properties of the thermoplastic resin member 301 to be obtained. As the flame retardant aid, antimony trioxide (Sb 2 O 3 ), antimony pentoxide (Sb 2 O 5 include), and the like.
[0094]
　The thermoplastic resin composition (P) preferably has high fluidity to facilitate the penetration of the granted fine unevenness on the metal member (M) surface. Therefore, the thermoplastic resin composition in the present embodiment (P) conforms to ASTM D1238, under 230 ° C., preferably MFR is measured under the conditions of 2.16kg load is 1 ~ 200g / 10min, 5 and more preferably from ~ 50g / 10min.
[0095]
(Thermoplastic resin composition production method of (P))
　The method for producing a thermoplastic resin composition (P) is not particularly limited, generally can be prepared by known methods. For example, the following methods can be mentioned. First, the thermoplastic resin (P1), other compounding agents as required (P2), using a Banbury mixer, single screw extruder, twin-screw extruder, a mixing device such as a high-speed twin screw extruder, mixing or by melt mixing, the thermoplastic resin composition (P) is obtained.
[0096]
Manufacturing method of an electronic equipment enclosure]
　Next, a method for manufacturing the electronic device housing 100 according to the present embodiment.
　3, 4 and 5 are perspective that an example of the structure shown schematically in exploded view like metal plates thermoplastic resin member 301 are bonded embodiment of the present invention (a developed view like metal resin bonding sheet 20) it is a diagram.
　Method for manufacturing a housing 100 electronic device according to the present embodiment, for example, comprises the following steps (A) ~ (C).
　Comprising (A) a metal base plate 201, a metal base plate 201 integrally connected to a metallic plate 202 (202-1,202-2,202-3 and 202-4) and the, least a thermoplastic preparing a development view like metal plate having a fine uneven structure on the junction surface of the resin member 301 are bonded
　to (B) exploded view like metal plate was placed in a mold, the thermoplastic resin composition ( process for producing a developed view like metal resin bonding sheet 20 to P) by bonding the thermoplastic resin member 301 on the surface of the developed view like metal plate and injected into the mold
　(C) development view like metal resin bonded sheet by bending the boundary portion 205 of the bottom plate 201 and side plates 202 of 20, developed view like metal resin bonding plate 20 steps to box-shape a
　manufacturing method of the housing 100 for an electronic device according to this embodiment, bending development view like metal plate and deployment is before the intermediate product The shape of the Jo metal-resin bonding plate 20 is flat, there is a merit of improving the storage efficiency and transportation efficiency of mass intermediate product.
[0097]
(Step (A))
　First, a metal bottom plate 201, side plates 202 made integrally linked metal to metal base plate 201 (202-1,202-2,202-3, and 202-4) When, wherein at least a thermoplastic resin member 301 having a fine concave-convex structure on the joint surfaces to be joined, to prepare a development view like metal plate in the form of a developed view of an electronic equipment enclosure 100. Here, exploded view like metal plate, as shown in FIG. 3, may be further provided with a metal cover plate 203 which is integrally connected to one of the side plates 202, the cover plate as shown in FIG. 5 203 may not be provided with. Or it may not be provided with one (back plate) 202-3 of the side plate as shown in FIG. If it has no cover plate 203, separately prepared cover plate 203 shown in FIG. 2, the lid plate 203 to one of the side plates 202, for example, it can engage the mechanical engagement means. Similarly, if not provided with a back plate 202-3, the backplate 202-3 (not shown) separately prepared, the bottom plate 201, the surface constituted by the side plates 202-2,202-4 and the cover plate 203 , for example, it can engage the mechanical engagement means.
　Here, it exploded view like metal plate corresponds to the metal member (M) which constitutes a housing 100 for an electronic device, for example, a metallic member formed into a developed view shape shown in FIGS. 3, 4 and 5, at least a thermoplastic it can be obtained by roughening process resin member 301 described above the junction surface to be bonded.
　Details of the metal member and the roughening treatment is omitted here.
[0098]
(Step (B))
　Then, the developed view like metal plate was placed in a mold, the thermoplastic resin composition (P) of the thermoplastic resin member on the surface of the developed view like metal plate and injected into the mold 301 joining.
　As a method of joining a thermoplastic resin member 301 is, for example, injection molding, transfer molding, compression molding, reaction injection molding, blow molding, thermoforming method, and a press molding method and the like. Injection molding Among these, preferred. That is, it is preferable the thermoplastic resin member 301 is injection molded. The following describes an example using the injection molding method.
[0099]
　Bonding a thermoplastic resin member 301 to the developed view like metal plate using an injection molding method, for example, it includes the following of (i) ~ (ii) step.
　(I) development view like metal plates arranged in an injection mold process
　at least partially in contact with the development view like metal plate, thermoplastic resin composition into a mold of (ii) a thermoplastic resin member 301 object (P) is injection molded, a step of molding the thermoplastic resin member 301
　will be specifically described below.
[0100]
　First, (i) preparing an injection molding die, placing the developed view like metal plate open that mold to the cavity (space). (Ii) Thereafter, the mold is closed, so that at least a portion of the thermoplastic resin member 301 is in contact with the development view like metal plate, by injection thermoplastic resin composition (P) in the cavity of the mold solidified, it bonds the developed view like metal plate and the thermoplastic resin member 301. Thereafter, by releasing the mold is opened, it is possible to obtain a development view like metal resin bonding plate 20 thermoplastic resin member 301 is joined to the developed view like metal plate. As the mold, for example, it can be used high-speed heat cycle molding (RHCM, Heat & Cool molding) injection mold commonly used in.
[0101]
　Here, in the step of the above (ii), between the start of injection of the thermoplastic resin composition (P) to pressure holding completion, the surface temperature of the mold, preferably a glass transition temperature of the thermoplastic resin member 301 ( hereinafter to as Tg referred.) or more and more preferably maintained at Tg + (5 or more and 100 or less) ° C. or higher.
　Thus, while maintaining the state where the thermoplastic resin composition (P) is softened, may be contacted longer time thermoplastic resin composition to the surface of the developed view like metal plate (P) at high pressure.
　As a result, it is possible to improve the adhesion between the developed view like metal plate and the thermoplastic resin member 301, it is possible to obtain an electronic device housing 100 more excellent by joining strength more stably.
[0102]
　Further, in the above described process (ii), after the hold pressure completion, the surface temperature of the mold, preferably below the glass transition temperature of the thermoplastic resin member 301, and more preferably Tg- (5 or more 100 or less) ° C. or less It is cooled to the temperature.
　Thus, it is possible to rapidly solidify the thermoplastic resin member 301 in a softened state. As a result, it is possible to shorten the molding cycle of an electronic device housing 100, it is possible to obtain an electronic device housing 100 efficiently.
[0103]
　Adjustment of the surface temperature of the mold, a rapid heating cooling device by connecting to the mold can be carried out. Rapid heating and cooling device, a method may be employed that is generally used.
[0104]
　As the heating method, a steam jet, pressurized hot water type, hot water type thermal oil type, an electric heater type, may be any one method or scheme combining a plurality of those electromagnetic induction heating type.
　Specifically, to introduce the heating medium selected in a flow path provided in the vicinity of the mold surface steam from the hot water and hot oil, or by using an electromagnetic induction heating, the surface temperature of the mold that is preferably maintained a temperature higher than the glass transition temperature of the thermoplastic resin member 301.
[0105]
　As the cooling method, chilled water, may be any one method or system combining those cold oil type.
　Specifically, by introducing a cooling medium selected from the cold water and the cold oil in the flow passage provided in the vicinity of the mold surface, the surface temperature of the mold below the glass transition temperature of the thermoplastic resin member 301 it is preferable to cool the temperature.
[0106]
　In the step (ii), the time from the start of injection to the above pressure holding completion, preferably not more than 60 seconds 1 seconds, more preferably 50 seconds or less 10 seconds or more.
　While maintaining the state above time obtained by melting the thermoplastic resin member 301 when is not less than the above lower limit, be contacted longer time thermoplastic resin member 301 at high pressure to the fine uneven structure of the developed view like metal plate it can. This makes it possible to obtain more excellent electronics housing 100 by bonding strength more stably.
　Further, when the time is more than the above upper limit, it is possible to shorten the molding cycle of an electronic device housing 100 can be obtained more efficiently electronics housing 100.
[0107]
　The manufacturing method of the housing 100 electronic device according to the present embodiment, in step (B), the boundary line 205 between the bottom plate 201 and side plate 202, the thermoplastic resin composition as the thermoplastic resin member 301 is not joined the (P) it is preferred to inject into the mold.
　In this way, the boundary portion 205 of the bottom plate 201 and side plate 202 can be obtained exploded view like metal resin bonding plate 20 thermoplastic resin member 301 are not bonded, so that the bottom plate 201 and side plates 202 bending the boundary portion 205 between becomes easier, and easier to expand diagram form metal-resin bonding sheet 20 in a box-type shape. Therefore, it is possible to improve the productivity of the electronic equipment enclosure 100.
[0108]
(Step (C))
　Next, by bending the boundary portion 205 of the bottom plate 201 and side plate 202, by a development view like metal resin bonding sheet 20 in a box-type shape, obtain a electronics enclosure 100.
　How to make development view like metal resin bonding sheet 20 in a box-type shape is not particularly limited, generally it can be a known method. For example, bending the boundary portion 205 of the bottom plate 201 and side plates 202, housing 100 for the electronic device by attaching the cover plate 203 as needed can be obtained.
　In this case, the adjacent side plates 202 to each other, and a side plate 202 and a cover plate 203 which is connected as needed may engage by mechanical means. No particular limitation is imposed on the mechanical engagement means, screwing and the like.
[0109]
　Having described embodiments of the present invention, these are illustrative of the present invention, it is also possible to adopt various other configurations.
Example
[0110]
　Hereinafter, the present embodiment will be described in detail with reference to Examples and Comparative Examples. Note that this embodiment is not intended to be limited to the description of these Examples. Incidentally, it utilized as a diagram for explaining the embodiment of FIG. 6, 7 and 8.
[0111]
Example 1
　In Example 1, focusing on the metal-resin bonding plate constituting a part of the electronics housing according to the present embodiment. A metal member constituting the metal-resin joint plate and an aluminum alloy was joined to the thermoplastic resin member to produce a metal-resin joint plate E10 to both surfaces of the metallic member. Then, the metal resin bonding plate E10 is, the existing technology is that the steel sheet material while maintaining the strength not inferior as compared with the metal plate used in Comparative Example 1 composed only of (SECC), experimental exhibits high weight reduction results show.
[0112]
(Metal Production of resin bonding plate roughened aluminum alloy plate E101 E10 is a metal member constituting a)
　shape 180 mm (width) × 129 mm (vertical width) × aluminum alloy plate is 0.3 mm (thickness) (in JIS H4000 defined alloy number 5052) was prepared. Incidentally, the aluminum alloy plate, a resin (not shown) small holes for a plurality of resin through to allow flow communication from the fixed side (cavity side) to the movable side (core side) is provided there.
　Then, after the aluminum alloy plate was degreased with a commercially available degreasing agent, alkaline etching agent containing 3 wt% zinc oxide of sodium hydroxide and 15 mass% (30 ° C.) is filled treatment vessel 1 after 3 minutes immersion (in the following description sometimes abbreviated as "alkaline etching agent process"), of 30 wt% at nitric acid (30 ° C.), for 1 minute, further an alkaline etching agent treatment 1 times were repeated. Then, the resulting aluminum alloy plate, and 3.9 wt% ferric chloride, and 0.2% by weight cupric chloride, the acid etching aqueous solution containing 4.1 wt% sulfuric acid to the filling process tank 2, (sometimes abbreviated as "acid etching agent process" in the following description) which immersed was swinging under 30 ° C. 5 min. Then, subjected to ultrasonic cleaning with running water (water, 1 minute), to give a crude aluminum alloy plate E101 by subsequent drying.
[0113]
　The surface roughness of the resultant roughened aluminum alloy plate E101, using a surface roughness measuring device "SURFCOM 1400D (manufactured by Tokyo Seimitsu Co., Ltd.)", JIS B0601 (corresponding international standard: ISO4287) is measured according to of the surface roughness, the load length ratio of the roughness curve (Rmr), ten-point average roughness (Rz) and average length of roughness curve element (RSm) was measured. The results obtained are shown below. The measurement locations, as shown in FIG. 9, any three straight portions on the fine uneven surface of the roughened aluminum alloy plate E101, and a total of 6 straight portions consisting of any three straight portion perpendicular to the straight line portion is there.
And cutting level 20%, the load length ratio of the roughness curve in evaluation length 4 mm (Rmr): longitudinal 3 points = 6.4% / 4.0% / 3.7%, the shorter three-point = 6.9 % / 2.0% / 6.4%
and cutting level 40%, the load length ratio of the roughness curve in evaluation length 4 mm (Rmr): longitudinal 3 points: 28.5% / 28.3% / 26. 5%, the shorter three-point = 38.5% / 18.4% / 19.3%
- ten-point average roughness (Rz): longitudinal 3 points = 17.0μm / 18.4μm / 16.6μm, shorter 3-point 17.9Myuemu = / 18.0 / 19.8
· average length of roughness curve element (RSm): longitudinal 3 points = 120μm / 165μm / 127μm, shorter 3 points = 119μm / 145μm / 156μm
[0114]
(Preparation of metal-resin bonding plate E10 by insert molding)
　The Japan Steel Works Co., Ltd. of special metal insert metal mold mounted to an injection molding machine (JSW J400AD110H), roughened aluminum obtained by the above method in the mold It was installed alloy plate E101. Then, as the thermoplastic resin composition within the mold, the glass fiber reinforced polypropylene (Prime Polymer Co. V7100, polypropylene (230 ° C., of 2.16kg load MFR = 18 g / 10 min) 80 parts by weight, the glass fiber 20 weight the section), cylinder temperature 230 ° C., a mold temperature of 55 ° C., injection speed 100 mm / sec, holding pressure 15 MPa, dwell time 5 seconds, subjected to injection molding at a cooling time of 50 seconds conditions, producing a metal-resin joint plate E10 did. Note that in the metal-resin bonding plate E10, all thermoplastic resin member E102 are joined so as to face both sides of the roughened aluminum alloy plate E101. Bonding thermoplastic resin member (hereinafter, may be referred to as the resin rib portion) width of commonly 3.6 mm, the resin rib height was 2.1mm in common. The total weight of the metal-resin bonding plate E10 was 39.6 g.
　Further, the joint area ratio was 14 area%.
[0115]
(Measurement of the amount of displacement in the bending test)
　using a Shimadzu bent I saw measuring apparatus autograph, when stressed in the vertical direction 2kgf the center portion of the metal-resin bonding plate E10 of (symbol F in FIG. 6) displacement the amount of the measurement (25 ° C.) result was 1.8 mm.
[0116]
Comparative Example 1
　in a manner similar to shift measuring method of Example 1, when multiplied by the stress of 2 kgf, the same amount of displacement and the metal resin bonding plate E10 obtained in Example 1 (1.8 mm) It was determined thickness; existing materials (SECC galvanized steel sheet) shown. That is, have the same length and width and the aluminum alloy plate used in Example 1. As a result only the thickness was measured displacement amount when multiplied by the 2kgf buoyancy for different commercial SECC material, implementation SECC of 0.8mm thickness Example It was found to exhibit the same displacement amount and the metal-resin bonding plate E10 obtained in 1 (1.8 mm). Total weight of the SECC plate was 146.2G.
[0117]
　Comparing the Comparative Example 1 and Example 1. Metal-resin bonding plate E10 according to the present embodiment has been found that the amount of displacement of the under constant load as compared with SECC plate an existing material despite identical, have achieved lighter about 73%.
[0118]
Example 2
(exploded view like metal manufacturing a resin bonding plate E30 is a metal member constituting the roughened aluminum alloy plate E20)
　commercial 0.3mm aluminum alloy plate having a thickness (JIS H4000 to a defined alloy No. 5052 ) shape shown in FIG. 7 (units: as well as cut into mm), an opening portion E207 and slits E209 shown in FIG. 7 by sheet metal working or the like. The aluminum alloy plate (material plate), the resin (not shown) small holes for a plurality of resin through to allow flow communication from the fixed side (cavity side) to the movable side (core side) is provided It is. The number of small holes for resin penetration is not particularly limited, it is generally the side plates, each side plate per one cover plate is 2 to 5.
[0119]
　Then, the aluminum alloy plate by exactly like surface roughening treatment with the method described in Example 1, the bottom plate E201, to obtain a roughened aluminum alloy plate E20 with side plates E202 and cover plate E203.
[0120]
　The surface roughness of the resultant roughened aluminum alloy plate E20, using a surface roughness measuring device "SURFCOM 1400D (manufactured by Tokyo Seimitsu Co., Ltd.)", JIS B0601 (corresponding international standard: ISO4287) is measured according to of the surface roughness, the load length ratio of the roughness curve (Rmr), ten-point average roughness (Rz) and average length of roughness curve element (RSm) was measured. As a result, it was confirmed that indicates the value to reproduce the surface roughness parameters shown in the first embodiment.
[0121]
(Insert molding by development view like metal manufacturing a resin bonding plate E30)
　fitted with a special metal insert molds Japan Steel Works, Ltd. of the injection molding machine (JSW J400AD110H), obtained by the above method in the mold the roughened aluminum alloy plate E20 installed. Then, as the thermoplastic resin composition within the mold, the glass fiber reinforced polypropylene (Prime Polymer Co. V7100, polypropylene (230 ° C., of 2.16kg load MFR = 18 g / 10 min) 80 parts by weight, the glass fiber 20 weight the section), cylinder temperature 230 ° C., a mold temperature of 55 ° C., performs injection speed 100 mm / sec, holding pressure 15 MPa, dwell time 5 seconds, the injection molding under the conditions of the cooling time 50 seconds, developed view shown in FIG. 8 the Jo metal resin bonded plate E30 were prepared. As shown in FIG. 8, the thermoplastic resin member, it was confirmed that are joined to both surfaces of the roughened aluminum alloy plate E20 (8, not shown the resin portion of the back surface side). Although not shown in FIG. 8, any part of the thermoplastic resin member, the recess and the protrusion (claw portion) to the cover plate and side plates may snap-fit engagement is formed.
[0122]
(Electronic Production of equipment housing by bending the boundary portion)
　of the developed view like metal resin bonding plate E30 obtained, after each boundary portion E205 bent inward at a right angle shape, a convex provided in the resin portion to prepare a box-shaped electronic appliance housing by the parts and recesses for a snap-fit locking. This is the housing for the electronic device peeling warpage or metal and resin was not observed at all. The heat cycle test housing a in a heat cycle tester (test conditions: After -20 2 hours ° C. held for 2 hours holding the 80 ° C., heating, a heat cycle applied respectively 1 hour cooled to 4 times a day , 7 days repeatedly) a result, the metal member and the thermoplastic resin member maintains a state of being strongly bonded, the occurrence of warpage or peeling phenomenon was not observed at all.
　Further, the joint area ratio was 21 area%.
[0123]
Comparative Example 2
　In Example 2, except for using aluminum alloy plate having no small holes for the resin through any (material plate) were treated in the same manner in exactly the same conditions as in Example 2. By insert molding, to obtain a developed view like metal resin bonded boards thermoplastic resin composition are bonded only to the fixed side of the developed view like metal plate (cavity-side). Immediately after molding, already peeling a portion of the metal member and the thermoplastic resin member it was visually observed. And a box-type shape of the one side only in the resin are bonded expanded view like metal resin bonding plate is bent in the same manner as in Example 2. In this case, bonding thermoplastic resin member are bent so that the inside of the box. Then subjected to heat cycle test this electronics housing in the same manner as in Example 2. As a result, the bottom plate, each side of all of the total side plates and the cover plate is deformed in a convex shape, also (more than 90% of the total junction area) most of the joint between the metal member and the thermoplastic resin member is peeled off, also it was deformed boundary connecting the edges to each other of each surface is made a gap was confirmed.
[0124]
　This application, and based on Japanese Patent Application No. 2017-010265, filed on priority and January 24, 2017 based on Japanese Patent Application No. 2016-165527, filed on August 26, 2016 the priority to be claimed, the entire disclosure of which is incorporated herein.
[0125]
　The present invention also includes the following aspects.
(Supplementary Note 1)
　and a metal bottom plate, and a metal plate connected by bending integrally with the bottom plate, a housing internal to the electronic device is accommodated,
　at least the bottom plate and the in the metal member consisting of the side plate (M), the thermoplastic resin member is joined to at least a portion of the surface of said metal member (M), an electronic device wherein the metal member (M) is reinforced by the thermoplastic resin member Yokatamitai.
(Supplementary Note 2)
　note the electronics housing according to 1,
　wherein the metal member for electronic equipment enclosure average thickness is 0.2mm or more 1.0mm below (M).
(Supplementary Note 3)
　In the electronic device housing according to appendix 1 or 2,
　wherein the metal member (M) has a fine uneven structure on the joint surface of at least the thermoplastic resin member,
　wherein the fine irregularities It said metal member (M) and the thermoplastic resin member and the housing for electronic equipment that is joined by a portion of the thermoplastic resin member on the structure from penetrating.
(Supplementary Note 4)
　Appendix at 1 to electronics housing according to any one of 3,
　the thermoplastic resin member is a housing for electronic equipment that is bonded to both surfaces of said metal member (M).
(Supplementary Note 5)
　In the electronic device housing according to appendix 4,
　wherein said thermoplastic resin member bonded to one surface of the metal member (M), and the thermoplastic resin member joined to the other surface but the metallic member for an electronic device housing is arranged in the same position as to face each other in the vertical direction of the plate surface of (M).
(Supplementary Note 6)
　In the electronics housing according to any one of Supplementary Notes 1 to 5,
　wherein the thermoplastic resin component for electronic equipment that is joined to at least the peripheral portion of the surface of said metal member (M) housing.
(Supplementary Note 7)
　In the electronic equipment enclosure according to any one of Supplementary Notes 1 to 6,
　the electronic device housing comprising a metal metal material constituting the metal member (M) has electromagnetic shielding property.
(Supplementary Note 8)
　In the electronics housing according to any one of Supplementary Notes 1 to 7,
　further comprising a metallic cover plate which is connected by bending integrally with the side plate,
　at least the cover plate surface some thermoplastic resin member are bonded, housing for electronic equipment in which the cover plate is reinforced by the thermoplastic resin member.
(Supplementary Note 9)
　In the electronic device housing according to appendix 8,
　wherein the cover plate has a fine uneven structure on the joint surface of at least the thermoplastic resin member,
　said thermoplastic in said fine unevenness the cover plate and the thermoplastic resin member and the housing for electronic equipment that is joined by a portion of the resin member from entering.
(Supplementary Note 10)
　note in 1 to electronics housing according to any one of 9,
　the bottom plate and the side plate and the thermoplastic resin member is an electronic device housing which is not bonded to the boundary portion of the .
(Supplementary Note 11)
　A manufacturing method for manufacturing an electronic apparatus housing according to any one of Supplementary Notes 1 to 10,
　a metal bottom plate, said bottom plate integrally linked metal comprising a side plate, and a step of preparing a development view like metal plate having a fine uneven structure on the joint surface of at least the thermoplastic resin member are bonded (a),
　placing the developed view like metal plate in the mold and, a step (B) of the thermoplastic resin composition is injected into the mold bonding the thermoplastic resin member on the surface of the developed view like metal plate,
　bending the boundary portion between the bottom plate and the side plates Te, the thermoplastic the developed view like metal plate resin member is joined to the step (C) of a box-type shape, and
manufacturing method for the electronic device housing comprising a.
(Supplementary Note 12)
　In the manufacturing method of an electronic equipment enclosure according to appendix 11,
　wherein the step (B), the boundary line portions between the bottom plate and the side plate, the heat so that the thermoplastic resin member is not joined manufacturing method of the electronics housing to inject the thermoplastic resin composition into the mold.

The scope of the claims
[Requested item 1]
　Comprising a metallic base plate, a metallic plate which is connected by bending integrally with the bottom plate, and a housing for housing the electronic equipment therein,
　comprising at least the bottom plate and the side plate in the metal member (M), the thermoplastic resin member are bonded to a portion of the surface of the plate-like of the metal member (M), which is reinforced the metal member (M) is by the thermoplastic resin member,
　a plate-like the metal member on both surfaces of the thermoplastic resin member is a housing for electronic equipment that is bonded (M) of the.
[Requested item 2]
　In electronics housing according to claim 1,
　wherein said metal member for electronic equipment enclosure average thickness is 0.2mm or more 1.0mm below (M).
[Requested item 3]
　In electronics housing according to claim 1 or 2,
　wherein the metal member (M) has a fine uneven structure on the joint surface of at least the thermoplastic resin member,
　wherein the fine concavo-convex structure It said metal member (M) and the thermoplastic resin member and the housing for electronic equipment that is joined by a portion of the thermoplastic resin member from entering.
[Requested item 4]
　In electronics housing according to any one of claims 1 to 3,
　and the thermoplastic resin member bonded to one surface of the plate-like of the metal member (M), is bonded to the other surface at least a portion is, the metallic member for an electronic device housing is arranged so as to face each other in the vertical direction of the plate surface of the (M) of the thermoplastic resin member.
[Requested item 5]
　In electronics housing according to any one of claims 1 to 4,
　the thermoplastic resin member, the metal member at least peripheral electronics housing is joined to the portion of the surface of (M).
[Requested item 6]
　In electronics housing according to any one of claims 1 to 5,
　at least a portion of the thermoplastic resin component, the electronic apparatus is formed in a framework shape on the surface of the metal member (M) housing.
[Requested item 7]
　In electronics housing according to any one of claims 1 to 6,
　wherein the thermoplastic resin component housing for electronic equipment, including injection molding.
[Requested item 8]
　In electronics housing according to any one of claims 1 to 7,
　wherein the thermoplastic resin electronics enclosure average thickness is less than 1.0mm 10mm following members.
[Requested item 9]
　In electronics housing according to any one of claims 1 to 8,
　housing for electronic equipment comprising a metal metal material constituting the metal member (M) has electromagnetic shielding property.
[Requested item 10]
　In electronics housing according to any one of claims 1 to 9,
　further comprising a metallic cover plate which is connected by bending integrally with the side plate,
　heat in a portion of the cover plate surface thermoplastic resin member are bonded, housing for electronic equipment in which the cover plate is reinforced by the thermoplastic resin member.
[Requested item 11]
　The electronic device enclosure of claim 10,
　wherein the cover plate has a fine uneven structure on the joint surface of at least the thermoplastic resin member,
　said thermoplastic resin member to the fine unevenness the cover plate and the thermoplastic resin member and the housing for electronic equipment that is joined by a portion from entering.
[Requested item 12]
　In electronics housing according to any one of claims 1 to 11,
　wherein the bottom plate and the thermoplastic resin member is an electronic device housing which is not bonded to the boundary portion between the side plates.
[Requested item 13]
　In electronics housing according to any one of claims 1 to 12,
　the surface area of the junction of the thermoplastic resin member in the total surface area of the metal member (M) is 1 area% or more 50 area% housing electronics or less.
[Requested item 14]
　Comprising a metallic base plate, a metallic plate which is connected by bending integrally with the bottom plate, a developed view like metal-resin joint plate for making a housing for accommodating electronic equipment inside a is,
　in the metal member (M) comprising at least the bottom plate and the side plate, a portion of the surface of the plate-like of the metal member (M), the thermoplastic resin member are joined, said metal member (M) is development view like metal resin bonding plate is reinforced by the thermoplastic resin.
[Requested item 15]
　A manufacturing method for manufacturing an electronic apparatus housing according to any one of claims 1 to 13,
　a metallic base plate, a metallic plate which is integrally connected to the bottom plate, the provided, the step of preparing a development view like metal plate having a fine uneven structure on the joint surface of at least the thermoplastic resin member are bonded (a),
　the development diagram shaped metal plate was placed in a mold, heat a step of producing a developed view like metal resin bonding plate thermoplastic resin composition by joining a thermoplastic resin member on the surface of the developed view like metal plate is injected into the mold (B),
　the developed view shape by bending the boundary portion between the bottom plate and the side plates of the metal-resin bonding sheet, and step (C) of a box-type shape of the developed view like metal resin bonded sheet
manufacturing method of the electronics housing comprises a.
[Requested item 16]
　In the manufacturing method of an electronic equipment enclosure according to claim 15,
　wherein the step (B), the boundary line portions between the bottom plate and the side plate, the thermoplastic resin composition as the thermoplastic resin member is not joined manufacturing method of the electronics housing to inject an object into the mold.
[Requested item 17]
　Electronic device comprising a housing for an electronic apparatus according, to an electronic device housed in the housing for the electronic device in any one of claims 1 to 13.