ELECTRONIC DEVICES WITH LIGHT SOURCE

BACKGROUND OF THE INVENTION

The present invention relates, in general, to electronic devices with a light source.
Universal Serial Bus (USB) flash drives are most widely used portable storage devices these days. USB flash drives are quite expensive as compared to other portable storage devices. A typical USB flash drive includes a flash Integrated Circuit (IC) and other supporting electronic components. The USB flash drive may also include a light source for indicating its current state. It is desired that USB flash drives be protected against mechanical and chemical damage, so that they can operate reliably. It is also desired that less expensive USB flash drives be made available.

However, conventional encapsulation techniques have often failed to encapsulate USB flash drives with light sources hermetically. Moreover, USB flash drives with light sources are bigger in size than USB flash drives without light sources. This, in turn, leads to an increase in the cost of manufacture.

In light of the foregoing discussion, there is a need for a storage device that is reliable, has a light source, is smaller in size, and is less expensive, compared to conventional storage devices.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an electronic device with a light source (and manufacturing methods and systems thereof).

Another object of the present invention is to provide a storage device that is reliable, is smaller in size, and is less expensive, compared to conventional storage devices.
Embodiments of the present invention provide an electronic device that includes a base substrate, one or more electronic components mounted on the base substrate, and a light source mounted on the base substrate. The electronic device also includes a plurality of connectors for electrically connecting the electronic components and the light source in a pre-specified manner.

In accordance with an embodiment of the present Invention, the electronic components and the light source are mounted on the same surface of the base substrate. In accordance with an embodiment of the present invention, the light source is located near a periphery of the base substrate.

A molding material is molded over the electronic components and the light source, such that the molding material covers the light source partially, and light emitted from the light source is visible to a viewer. In accordance with an embodiment of the present invention, the molding material is molded over a surface of the base substrate on which the electronic components and the light source are mounted. The molding material encapsulates the electronic components and the light source hermetically, thereby making the electronic device reliable.

In accordance with an embodiment of the present invention, the light source is capable of indicating a pre-specified state of the electronic device. The pre-specified state may, for example, include at least one of: the electronic device being connected to a Universal Serial Bus (USB), the electronic device performing data read and/or write, or an occurrence of an error. The light source may, for example, be a Light-Emitting Diode (LED).

In an embodiment of the present invention, the electronic device is a storage device, and at least one of the electronic components is capable of storing data.

In an embodiment of the present invention, the electronic device is a Chip-On-Board (COB) type device. In another embodiment of the present invention, the electronic device is a Surface Mount Technology (SMT) type device.

In one embodiment of the present invention, a COB type storage device is manufactured by a COB process. As the COB process requires less space, a base substrate of a small size may be used. Therefore, the overall size of the COB type storage device is smaller, compared to conventional storage devices.

Moreover, the cost of manufacture is reduced, as small-sized base substrates and bare semiconductor dies are used. Therefore, the COB type storage device is less expensive, compared to conventional storage devices.

BRIEF DESCRIPTION OF DRAWINGS

Embodiments of the present invention will hereinafter be described in conjunction with the appended drawings provided to illustrate and not to limit the scope of the claims, wherein like designations denote like elements, and in which;

FIGs. 1A, 1B and 1C depict top, front and side views of an electronic device, in accordance with an embodiment of the present invention;

FIGs. 2A, 2B and 2C depict top, front and side views of the electronic device, in accordance with an embodiment of the present invention;

FIG. 3 depicts a system for manufacturing an electronic device, in accordance with an embodiment of the present invention; and

FIG. 4 depicts a method of manufacturing an electronic device, in accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION
Various embodiments of the present invention provide an electronic device with a light source. The electronic device includes a base substrate, one or more electronic components mounted on the base substrate, and a light source mounted on the base substrate. The electronic device also includes a plurality of connectors for electrically connecting the electronic components and the light source in a pre-specified manner. In accordance with an embodiment of the present invention, the light source is capable of indicating a pre-specified state of the electronic device. In addition, a molding material is molded over the electronic components and the light source. The molding material covers the light source partially, such that light emitted from the light source is visible to a viewer.

Referring now to figures. FiGs. 1A, 1B and 1C depict top, front and side views of an electronic device, in accordance with an embodiment of the present invention. The electronic device includes a base substrate 102, one or more electronic components, shown as an electronic component 104a and an electronic component 104b, and a light source 106. Electronic component 104a and electronic component 104b are hereinafter referred as electronic components 104.

Base substrate 102 may, for example, be a substrate that provides mechanical support and electrical connectivity. Examples of base substrate 102 include, but are not limited to, Printed Circuit Boards (PCBs), hybrid microcircuits, and extended PCBs. An extended PCB is a PCB including one or more conductive strips capable of facilitating a Universal Serial Bus (USB) connection.

Electronic components 104 and light source 106 are electrically connected in a pre-specified manner. Electronic components 104 and light source 106 may, for example, be thermally and electrically bonded to base substrate 102 using an electrically-conductive paste. In addition, electronic components 104 may be wire-bonded to preset bond pads on base substrate 102 using one or more electrical connectors.

In accordance with an embodiment of the present Invention, electronic components 104 and light source 106 are mounted on the same surface of base substrate 102. In accordance with an embodiment of the present invention, light source 106 is located near a periphery of base substrate 102, as shown in the figures.

The electronic device also includes a molding material 108 molded over electronic components 104 and light source 106. Molding material 108 encapsulates electronic components and light source 106, as shown in the figures. Molding material 108 may, for example, include at least one of: epoxy resin, silicone, acrylic and polyurethane.
In accordance with an embodiment of the present invention, a portion of molding material 108 molded around light source 106 is removed. For example, base substrate 102 and molding material 108 may be cut across a plane represented by a line 110, as shown in the figures.

FIGs. 2A, 2B and 2C depict top, front and side views of the electronic device, after base substrate 102 and molding material 108 are cut across the plane, in accordance with an embodiment of the present invention. A portion 202 of base substrate 102 and molding material 108 is removed, as shown in the figures. Consequently, light source 106 is uncovered at least partially, such that light emitted from light source 106 is visible to a viewer.

In accordance with an alternative embodiment of the present invention, only molding material 108 may be cut across the plane to uncover light source 106 partially.

In accordance with an embodiment of the present invention, a portion of light source 106 is cut across a pre-specified plane, such that any traces of molding material 108 left over that portion of light source 106 are removed. This further enhances the visibility of light.
Light source 106 may, for example, be a Light-Emitting Diode (LED).

In accordance with an embodiment of the present invention, light source 106 is capable of indicating a pre-specified state of the electronic device. In addition, light source 106 may indicate different states of the electronic device, for example, by emitting light of different colors, or by flickering.

In an embodiment of the present invention, the electronic device is a storage device, and at least one of electronic components 104 is capable of storing data. In such a case, light source 106 may indicate whether the storage device is ready to be operated on.

In an embodiment of the present invention, the electronic device is a USB flash drive. In such a case, the pre-specified state may, for example, include at least one of: the USB flash drive being connected to a USB, the USB flash drive performing data read and/or write, or an occurrence of an error.

In accordance with an embodiment of the present invention, the electronic device is a Chip-On-Board (COB) type device manufactured by a COB process. A COB process includes directly mounting a bare semiconductor die on a base substrate, and electrically connecting the bare semiconductor die to appropriate bond pads on the base substrate.

In accordance with another embodiment of the present invention, the electronic device is a Surface Mount Technology (SMT) type device manufactured by an SMT process. An SMT process includes mounting an Integrated Circuit (IC) on a base substrate. Consider, for example, that the electronic device is a storage device. In such a case, at least one of electronic components 104 may be a flash IC.

It is to be understood that the specific designation for the electronic device so manufactured and its various components is for the convenience of the reader and is not to be construed as limiting the electronic device to a specific size, shape, type, or arrangement of its components.

FIG. 3 depicts a system 300 for manufacturing an electronic device, in accordance with an embodiment of the present invention. System 300 includes a mounting unit 302, a connecting unit 304, a molding unit 306, and a removing unit 308.
Mounting unit 302 obtains a base substrate, and mounts one or more electronic components and a light source on the base substrate. In accordance with an embodiment of the present invention, the electronic components and the light source are mounted on the same surface of the base substrate. In accordance with another embodiment of the present invention, the electronic components and the light source are mounted on different surfaces of the base substrate. In accordance with an embodiment of the present invention, the light source is located near a periphery of the base substrate.

Mounting unit 302 may, for example, be a pick-and-place unit that is programmed to pick the electronic components and the light source, and place them on appropriate slots on the base substrate. In accordance with an embodiment of the present invention, separate mounting units may be used to mount different types of electronic components. For example, a first pick-and-place unit may be used to mount SMT components like an LED on a base substrate, while a second pick-and-place unit may be used to mount a bare semiconductor die on the base substrate.

Thereafter, the base substrate with the mounted electronic components and the mounted light source is provided to connecting unit 304. Connecting unit 304 connects the electronic components and the light source electrically, in accordance with a pre-specified manner. Connecting unit 304 may, for example, thermally and electrically bond the electronic components and the light source to appropriate slots on the base substrate. In addition, connecting unit 304 may wire-bond the electronic components to preset bond pads on the base substrate, using one or more electrical connectors.

Subsequently, the base substrate with the connected electronic components and the connected light source is provided to molding unit 306. Molding unit 306 molds a molding material over the electronic components and the light source, such that the molding material encapsulates the electronic components and the light source, for example, as shown in FlGs. 1A-1C.

Molding unit 306 may, for example, be a transfer molding machine that molds the molding material over a surface of the base substrate on which the electronic components and the light source are mounted. In another embodiment of the present invention, the molding material may be molded over more than one surface of the base substrate.
The molding material so molded covers the light source completely, as shown in FIGs. 1A-1C. In order to uncover the light source at least partially, removing unit 308 removes a portion of the molding material molded around the light source. In an embodiment of the present invention, removing unit 308 includes a dicing saw that is programmed to mechanically cut through the molding material as desired. In another embodiment of the present invention, removing unit 308 includes a laser-cutting device that is programmed to remove the portion of the molding material as desired.

Removing unit 308 may also cut a portion of the light source across a pre-specified plane, such that any traces of the molding material left over that portion of the light source are removed, in accordance with an embodiment of the present invention. In an embodiment of the present invention, removing unit 308 includes a dicing saw that is programmed to mechanically cut through the molding material and the light source as desired. In another embodiment of the present invention, removing unit 308 includes a laser-cutting device that is programmed to remove the portion of the molding material and the portion of the light source as desired.

Further, removing unit 308 may be automated and controlled by a work file that describes the location and the direction in which the cut is to be made.

As described above, the removal of the portion of the molding material molded around the light source facilitates transmission of light emitted from the light source. In addition, the removal of the portion of the light source further enhances the transmission of light emitted from the light source. The light source so uncovered is capable of indicating a pre-specified state of the electronic device, as described earlier.

FIG. 3 is merely an example, which should not unduly limit the scope of the claims herein. For instance, the electronic device so manufactured may be cased in a casing, in order to protect the electronic device from external factors, such as heat, moisture and scratches. The casing may be attached to the base substrate and/or the molded molding material, for example, through a gluing process or an ultrasonic welding process.

FIG. 4 depicts a method of manufacturing an electronic device, in accordance with an embodiment of the present invention. At step 402, one or more electronic components are mounted on a base substrate. Step 402 may, for example, be performed by a pick-and-place unit that is programmed to pick the electronic components and place them on appropriate slots on the base substrate.

At step 404, a light source is mounted on the base substrate. Step 404 may, for example, be performed by a pick-and-place unit that is programmed to pick the light source and place it on an appropriate slot on the base substrate. In accordance with an embodiment of the present Invention, the light source is located near a periphery of the base substrate.
At step 406, the electronic components and the light source are electrically connected in a pre-specified manner. For this purpose, the base substrate may, for example, include one or more embedded connectors. In accordance with step 406, the electronic components and the light source may be thermally and electrically bonded to appropriate slots on the base substrate. Additionally, the electronic components may be wire-bonded to preset bond pads on the base substrate using one or more electrical connectors.

At step 408, a molding material is molded over the electronic components and the light source, such that the molding material encapsulates the electronic components and the light source. Step 408 may, for example, be performed by a transfer molding machine that molds the molding material over a surface of the base substrate on which the electronic components and the light source are mounted. In an alternative embodiment of the present invention, the molding material may be molded over more than one surface of the base substrate.

At step 410, a portion of the molding material molded around the light source is removed, such that the light source is uncovered at least partially. In addition, at step 410, a portion of the light source may be cut across a pre-specified plane, such that any traces of the molding material left over that portion of the light source are removed.

In an embodiment of the present invention, step 410 includes sawing, using a dicing saw. In another embodiment of the present Invention, step 410 includes laser cutting, using a laser-cutting device. Step 410 may be automated and controlled by a work file that describes the location and the direction in which the cut is to be made.

As described above, the removal of the portion of the molding material molded around the light source facilitates transmission of light emitted from the light source. In addition, the removal of the portion of the light source further enhances the transmission of light emitted from the light source. The light source so uncovered is capable of indicating a pre-specified state of the electronic device, as described earlier.

It should be noted here that steps 402-410 are only illustrative and other alternatives can also be provided where steps are added, one or more steps are removed, or one or more steps are provided in a different sequence without departing from the scope of the claims herein. For instance, step 404 may be performed before step 402.

In accordance with an embodiment of the present invention, steps 402-410 may be performed on a panel including a plurality of base substrates. In such a case, an additional step of de-panelizing individual base substrates may be performed. The step of de-panelizing may, for example, be performed by a laser-cutting device.

Finally, the electronic device so manufactured may be cased in a casing, in order to protect the electronic device from external factors, such as heat, moisture and scratches. The casing may be attached to the base substrate and/or the molded molding material, for example, through a gluing process or an ultrasonic welding process.

Embodiments of the present invention provide a method and system for manufacturing an electronic device, and electronic devices manufactured thereof. In an embodiment of the present invention, the method may be suitably used in the manufacturing of an electronic device with a light source.

In one embodiment of the present invention, a COB type storage device is manufactured by a COB process. As the COB process requires less space, a base substrate of a small size may be used. Consequently, the overall size of the COB type storage device may also be reduced. Moreover, the cost of manufacture is reduced, as small-sized base substrates and bare semiconductor dies are used.

Furthermore, the molding material encapsulates various components of the COB type storage device hermetically, thereby making the COB type storage device reliable.

In the description herein for the embodiments of the present invention, numerous specific details are provided, such as examples of components and/or methods, to provide a thorough understanding of the embodiments of the present invention. One skilled in the relevant art will recognize, however, that an embodiment of the present invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of the embodiments of the present invention.

Reference throughout this specification to "one embodiment", "an embodiment", or "a specific embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at (east one embodiment of an embodiment of the present invention and not necessarily in all embodiments. Thus, respective appearances of the phrases "in one embodiment", "in an embodiment", or "in a specific embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined in any suitable manner with one or more other embodiments. It is to be understood that other variations and modifications of the embodiments of the present invention described and illustrated herein are possible in light of the teachings herein and are to be considered
as part of the spirit and scope of the present invention.

It will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application.

As used in the description herein and throughout the claims that follow, "a", "an", and "the" includes plural references unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of "in" includes "in" and "on" unless the context clearly dictates otherwise.

The foregoing description of illustrated embodiments of the present invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the present invention to the precise forms disclosed herein. While specific embodiments of, and examples for, the present invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention, as those skilled in the relevant art will recognize and appreciate. As indicated, these modifications may be made to the present invention in light of the foregoing description of illustrated embodiments of the present invention and are to be included within the spirit and scope of the present invention.

Thus, while the present invention has been described herein with reference to particular embodiments thereof, a latitude of modification, various changes and substitutions are intended in the foregoing disclosures, and it will be appreciated that in some instances some features of the embodiments of the present invention will be employed without a corresponding use of other features without departing from the scope and spirit of the present invention as set forth. Therefore, many modifications may be made to adapt a particular situation or material to the essential scope and spirit of the present invention. It is intended that the present invention not be limited to the particular terms used in following claims and/or to the particular embodiment disclosed as the best mode contemplated for carrying out this present invention, but that the present invention will include any and all embodiments and equivalents falling within the scope of the appended claims,

Claim:

1. An electronic device comprising:- a base substrate;
- one or more electronic components mounted on the base substrate;
- a light source mounted on the base substrate, the light source being capable of indicating a pre-specified state of the electronic device;
- a plurality of connectors for electrically connecting the electronic
components and the light source in a pre-specified manner; and
- a molding material molded over the electronic components and the light
source, wherein the molding material covers the light source partially, such
that light emitted from the light source is visible to a viewer.

2. The electronic device of claim 1, wherein the electronic components and the light source are mounted on the same surface of the base substrate.

3. The electronic device of claim 1, wherein the light source is located near a periphery of the base substrate.

4. The electronic device of claim 1 is a Chip-On-Board (COB) type device.

5. The electronic device of claim 1 is a Surface Mount Technology (SMT) type device.

6. The electronic device of claim 1 is a storage device, wherein at least one of the electronic components is capable of storing data.

7. The electronic device of claim 1 is a Universal Serial Bus (USB) flash drive,
wherein the pre-specified state comprises at least one of: the USB flash
drive being connected to a USB, the USB flash drive performing data read and/or write, and an occurrence of an error.

8. The electronic device of claim 1, wherein the molding material is molded
over a surface of the base substrate on which the electronic components
and the light source are mounted.

9. The electronic device of claim 1, wherein the light source comprises a Light-
Emitting Diode (LED).

10. An electronic device substantially as herein above described in the
specification with reference to the accompanying drawings.