Electronics Packaging System
Abstract:
A system (1) for mounting electronic devices comprises a printing device (3), a mounting device (4) and a reflow device (5). In the mounting system (1), a printed-circuit board (2) is conveyed upright. Solder is applied by printing to lands on both sides of the board (2) simultaneously, and electronic devices (10) are soldered to the lands. The mounting system (1) is small and capable of reducing mounting time.
Patent Information
Filing Date
20 December 2001
Publication Number
17/2007
Invention Field
ELECTRONICS
Applicants
Country: Japan
7-35 KITASHINAGAWA
6-CHOME, SHINAGAWA-KU,
TOKYO 141-0001,
Inventors
Country: Japan
1. KAZUHISA MOCHIDA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
2. KATSUMI TOGASAKI
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
3. KATSUMI MORITA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
4. YUSUKE MASUTANI
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
5. HIROJI KAMEDA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
6. NOBORU SEKIGUCHI
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
7. MINORU SHIMADA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
8. TOSHIO TOYAMA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
9. AKIHIRO KOGA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
10. MITSUO INOUE
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
11. KAZUHIRO ABE
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
12. TETSUYA YONEMOTO
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
13. KENJI ISHIHARA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
14. SYUNJI AOKI
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
15. FUMIO MATSUMOTO
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
16. TAKANORI ARAI
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209
Country: Japan
17. HISASHI NAOSHIMA
C/O SONY EMCS CORPORATION
SAITAMA TEC, 1300,
TSUKAGOSHI, SAKADO-SHI,
SAITAMA 350-0209