Claims:1. A semiconductor package comprising:
a substrate having first and second opposed substantially planar major surfaces extending in an x-y direction;
a bridge die having third and fourth opposed substantially planar major surfaces extending in the x-y direction, wherein the third substantially planar major surface of the bridge die is in direct contact with the second substantially planar major surface of the substrate;
a through silicon via extending in a z-direction through the first substantially planar major surface of the substrate and the fourth substantially planar major surface of the bridge die;
a power source coupled to the through silicon via;
a first electronic component electronically and a second electronic component at least one of which electronically coupled to the bridge die; and
an overmold at least partially encasing the first electronic component, second electronic component, and the bridge die.
, Description:BACKGROUND
[0001] Microelectronics typically include a central processing unit (CPU). To enhance performance, CPU products are increasingly integrating multi-die into CPU packages in the form of side-by-side or other multi-chip modules (MCMs). Embedded Multi-die Interconnect Bridging (EMIB) is the way to electrically connect multiple dies within a microelectronic package.

BRIEF DESCRIPTION OF THE FIGURES
[0002] The drawings illustrate generally, by way of example, but not by way of limitation, various examples of the present invention.
[0003] FIG. 1 is sectional view of a semiconductor package assembly, in accordance with various examples.
[0004] FIG. 2 is a system level diagram of a system that can include a semiconductor package assembly, in accordance with various examples.

DETAILED DESCRIPTION OF THE INVENTION
[0005] Reference will now be made in detail to certain examples of the disclosed subject matter, examples of which are illustrated in part in the accompanying drawings. While the disclosed subject matter will be described in conjunction with the enumerated claims, it will be understood that the exemplified subject matter is not intended to limit the claims to the disclosed subject matter.
[0006] Throughout this document, values expressed in a range format should be interpreted in a flexible manner to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited. For example, a range of “about 0.1% to about 5%” or “about 0.1% to 5%” should be interpreted to include not just about 0.1% to about 5%, but also the individual values (e.g., 1%, 2%, 3%, and 4%) and the sub-ranges (e.g., 0.1% to 0.5%, 1.1% to 2.2%, 3.3% to 4.4%) within the indicated range. The statement “about X to Y” has the same meaning as “about X to about Y,” unless indicated otherwise. Likewise, the statement “about X, Y, or about Z” has the same meaning as “about X, about Y, or about Z,” unless indicated otherwise.