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Epoxy Resin Composition Method For Producing Same And Semiconductor Device Using Same
Abstract: Disclosed is an epoxy resin composition which has excellent workability and excellent heat resistance after curing. The epoxy resin composition contains: a compound which has a specific imide structure is obtained by reacting a diamine having a phenolic hydroxyl group such as 2 2 bis(3 amino 4 hydroxyphenyl)hexafluoropropane (6FAP) with a tetracarboxylic acid dianhydride and has a number average molecular weight of 1 000 5 000; and a compound having at least two epoxy groups such as a bisphenol A epoxy resin.
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Notices, Deadlines & Correspondence
Notices, Deadlines & Correspondence
Patent Information
Application #
Filing Date
13 September 2013
Publication Number
25/2016
Publication Type
INA
Invention Field
POLYMER TECHNOLOGY
Status
Email
patent@depenning.com
Parent Application
Applicants
TORAY INDUSTRIES INC.
1 1 Nihonbashi Muromachi 2 chome Chuo ku Tokyo
1038666
Inventors
1. TAKEDA Sayaka
c/o Shiga Plant Toray Industries Inc. 1 1 Sonoyama 1 chome Otsu shi Shiga
5208558
2. TOMIKAWA Masao
c/o Shiga Plant Toray Industries Inc. 1 1 Sonoyama 1 chome Otsu shi Shiga
5208558
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 7373-CHENP-2013 FORM-3 05-03-2014.pdf | 2014-03-05 |
| 1 | GPA.pdf | 2013-09-17 |
| 2 | 7373-CHENP-2013 CORRESPONDENCE OTHERS 05-03-2014.pdf | 2014-03-05 |
| 2 | FORM-5.pdf | 2013-09-17 |
| 3 | FORM-3.pdf | 2013-09-17 |
| 3 | 7373-CHENP-2013 AMENDED CLAIMS 30-10-2013.pdf | 2013-10-30 |
| 4 | 7373-CHENP-2013.pdf | 2013-09-17 |
| 4 | 7373-CHENP-2013 AMENDED PAGES OF SPECIFICATION 30-10-2013.pdf | 2013-10-30 |
| 5 | 4414-2013-COMPLETE SPECIFICATION.pdf | 2013-09-17 |
| 5 | 7373-CHENP-2013 CORRESPONDENCE OTHERS 30-10-2013.pdf | 2013-10-30 |
| 6 | 7373-CHENP-2013 FORM-13 30-10-2013.pdf | 2013-10-30 |
| 7 | 4414-2013-COMPLETE SPECIFICATION.pdf | 2013-09-17 |
| 7 | 7373-CHENP-2013 CORRESPONDENCE OTHERS 30-10-2013.pdf | 2013-10-30 |
| 8 | 7373-CHENP-2013 AMENDED PAGES OF SPECIFICATION 30-10-2013.pdf | 2013-10-30 |
| 8 | 7373-CHENP-2013.pdf | 2013-09-17 |
| 9 | 7373-CHENP-2013 AMENDED CLAIMS 30-10-2013.pdf | 2013-10-30 |
| 9 | FORM-3.pdf | 2013-09-17 |
| 10 | FORM-5.pdf | 2013-09-17 |
| 10 | 7373-CHENP-2013 CORRESPONDENCE OTHERS 05-03-2014.pdf | 2014-03-05 |
| 11 | GPA.pdf | 2013-09-17 |
| 11 | 7373-CHENP-2013 FORM-3 05-03-2014.pdf | 2014-03-05 |