CLIAMS:We claim:
1) A method for testing semiconductor wafer in a fabrication testing environment, wherein said method comprising of performing said execution of an E84 testing and a 300mm testing in a concurrent manner.
2) The method as in claim 1, wherein said method of concurrently executing said E84 testing and said 300mm testing further comprises:
executing E84 loading of said semiconductor wafer in said fabrication environment;
executing said 300mm testing of said semiconductor wafer in said fabrication environment; and
executing E84 unloading said semiconductor wafer from said load port.
3) The method as in claim 1, wherein said executing E84 loading of said semiconductor wafer further comprises:
sending a load command to E84 simulator;
initiating a load process upon receiving said load command, wherein said load process involves loading a carrier on load port; and
acknowledging status of said load process.
4) The method as in claim 2, wherein said executing 300mm testing of said semiconductor wafer further comprises:
sending a 300mm command to a 300mm simulator;
initiating a 300mm testing process, wherein said 300mm testing further comprises performing a plurality of 300mm test cases; and
acknowledging status of said 300mm testing process.
5) The method as in claim 2, wherein said executing E84 unloading of said semiconductor wafer further comprises:
initiating an unloading process, wherein said carrier is unloaded from said load port; and
acknowledging status of said unloading process.
6) A system for testing semiconductor wafer in a fabrication testing environment, wherein said system is further configured to perform said execution of an E84 testing and a 300mm testing in a concurrent manner using a simulator controller module.
7) The system as in claim 6, wherein said simulator controller module is further configured to execute said E84 testing and said 300mm testing concurrently by:
executing E84 loading of said semiconductor wafer in said fabrication environment using an E84 simulator and an E84 hardware module;
executing said 300mm testing of said semiconductor wafer in said fabrication environment using a 300mm simulator; and
executing E84 unloading said semiconductor wafer from said load port using said E84 simulator and said E84 hardware module.
8) The system as in claim 7, wherein said E84 simulator and said E84 hardware module are further configured to execute E84 loading of said semiconductor wafer by:
receiving a load command from a scenario controller module said simulator controller module;
initiating a load process upon receiving said load command, wherein said load process involves loading a carrier on load port using said E84 hardware module; and
acknowledging status of said load process.
9) The system as in claim 7, wherein said 300mm simulator is further configured to execute said 300mm testing of said semiconductor wafer by:
receiving a 300mm command from a scenario controller module of said simulator controller module;
initiating a 300mm testing process, wherein said 300mm testing further comprises performing a plurality of 300mm test cases; and
acknowledging status of said 300mm testing process.
10) The system as in claim 7, wherein said E84 simulator and said E84 hardware module are further configured to execute said E84 unloading of said semiconductor wafer by:
initiating an unloading process, wherein said carrier is unloaded from said load port; and
acknowledging status of said unloading process.

Date: 2nd December 2013 Signature:
Vikram Pratap Singh Thakur
Patent Agent
,TagSPECI:FORM 2
The Patent Act 1970
(39 of 1970)
&
The Patent Rules, 2005

COMPLETE SPECIFICATION
(SEE SECTION 10 AND RULE 13)

TITLE OF THE INVENTION

“FAB TEST SUITE FRAMEWORK”
APPLICANTS:
Name : HCL Technologies Limited
Nationality : Indian
Address : HCL Technologies Ltd., 50-53 Greams
Road,Chennai – 600006, Tamil Nadu, India
The following Specification particularly describes and ascertains the nature of this invention and the manner in which it is to be performed:
TECHNICAL FIELD
[001] The embodiments herein relate to concurrent testing of Semiconductor Equipment and Materials International (SEMI) standards in Fabrication (Fab) environment and, more particularly, to test Fab scenario covering an Automated Material Handling System (AHMS) scenario followed by 3000mm standards.

BACKGROUND
[002] Semiconductor industry strictly adheres to SEMI (Semiconductor Equipment and Materials International) standards for all equipments, which are manufactured for use in the semiconductor fabrication units. E84 standards and 300mm standards such as E40, E94, E90, E87 and E116 enable IC makers to communicate and control wafer fabrication equipment that enables greater automation in the semiconductor fabrication plant (commonly called a Fab).
[003] Semiconductor equipment has many steps to process the wafers and ‘standards’ at every process helps in understanding various states of hardware modules such as load port, aligner, wafer transporter, and inspection chamber located in a fab. For example, SEMI E87 defines specification for carrier management (Load Port), E40 defines specification for process job management (wafer configuration), E94 defines the specification for control job management (carrier configuration), E90 defines the specification for substrate tracking (wafer transporter) and E84 is for communication between the active equipment (AMHS) and the passive equipment (production equipment).
[004] Currently, there are separate simulators for E84 simulation and for 300mm standards simulation. Further, in the current development environment, the user tests the E84 scenarios with E84 simulator and then tests the 300mm standards including but not limited to E40, E94, and E87 separately. In Fab scenario, sequence of operations are typically executing a job from loading the carrier through AMHS (Automated Material Handling System) (E84), followed by E87 carrier operations and running jobs using E40, E94 standards and finally unloading the carrier AMHS (E84). Hence, the real fab scenario is not replicated currently as the two tests are executed separately. As a result, there is always a chance of detecting issues related to synchronization, execution time, reliability, and throughput and so on while performing concurrent testing in the real Fab environment.

SUMMARY
[005] In view of the foregoing, an embodiment herein provides a method for testing semiconductor wafer in a fabrication testing environment. In this method execution of an E84 testing and a 300mm testing are performed in a concurrent manner.
[006] Embodiments further disclose a system for testing semiconductor wafer in a fabrication testing environment. The system is further configured to perform the execution of an E84 testing and a 300mm testing in a concurrent manner using a simulator controller module.
[007] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings.
BRIEF DESCRIPTION OF THE FIGURES
[008] The embodiments herein will be better understood from the following detailed description with reference to the drawings, in which:
[009] FIG. 1 illustrates a block diagram of Fab test suite framework environment, as disclosed in the embodiments herein;
[0010] FIG. 2 illustrates a block diagram that shows various components of simulator controller module, as disclosed in the embodiments herein; and
[0011] FIG. 3 is a flow diagram which shows various steps involved in the process of executing concurrent testing of SEMI standards in Fab environment, as disclosed in the embodiments herein.
DETAILED DESCRIPTION OF EMBODIMENTS
[0012] The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
[0013] The embodiments herein disclose a system and method for concurrent testing of SEMI standards in Fab environment by testing Fab scenario covering AHMS scenario followed by 300mm standards. Referring now to the drawings, and more particularly to FIGS. 1 through FIG. 3, where similar reference characters denote corresponding features consistently throughout the figures, there are shown embodiments.
[0014] FIG. 1 illustrates a block diagram of Fab test suite framework environment, as disclosed in the embodiments herein. The environment comprises of a simulator controller module 101, an E84 simulator 102, a 300mm simulator 103, an E84 hardware module 104 and an equipment module 105. The equipment module 105 further comprises of a hardware module 105.a and a compliance checking module 105.b. The simulator controller module 101 co-ordinates the E84 testing and 300mm testing processes. Further, the simulator controller module 101 can send/receive commands to/from E84 simulator 102 and 300mm simulator 103 based on the test suite framework designed. Furthermore, the simulator controller module 101 coordinates the testing scenarios by combining E84 load scenario through AHMS followed by 300m testing (including E30, E87, E40, E94 testing processes) and finally executes E84 unload scenario. In an embodiment, the term “scenario” may refer to a specific function being executed by different components of the Fab test suite framework environment. The E84 simulator 102 of test suite framework environment possesses all test cases that are related to E84 testing. Further, E84 simulator 102 is capable of sending acknowledgement signals to simulator controller module 101 indicating status of the testing scenarios (either load or unload). Furthermore, E84 simulator 102 receives commands from simulator controller module 101 based on Fab test suite frame work designed in it. Similarly, the 300mm simulator 103 comprises all test cases that are related to 300mm testing i.e., test cases including but not limited to E87, E94, E40 and is capable of sending acknowledgement signals to simulator controller module 101 indicating status of the testing scenarios. Further, the 300mm simulator 103 receives commands from the simulator controller module 101 based on Fab test suite frame work designed in it. Furthermore, the simulator controller module 101 takes care of coordinating the compliance test cases from E84 standards and 300mm standards as per real Fab testing environment.
[0015] The hardware module 105.a of equipment module 105 comprises a load port and all other hardware components related to the equipment. The term ‘equipment’ further refers to a device which is used for holding wafers. The component ‘load port’ is a kind of place holder where set of wafers are placed to test. Furthermore, the set of wafers are placed on the load port using a container (called as ‘carrier’ which has inbuilt slots to carry wafers) through AMHS. The interface that exists between the load port and AMHS is known as an E84 interface. The compliance checking module 105.b of equipment module 105 incorporates equipment software related to 300mm SEMI standards which is used to check the compliance of the equipment. Further, the compliance checking module 105.b checks the equipment for SEMI standards compliance using incorporated software.
[0016] FIG. 2 illustrates a block diagram that shows various components of simulator controller module, as disclosed in the embodiments herein. The simulator controller module 101 further comprises of a scenario controller module 201, a command module 202, a memory module 203 and a communication module 204. The scenario controller module 201 of simulator controller module 101 coordinates testing scenarios between simulator controller module 101 and simulators (E84 and 300mm) by sending appropriate command signals using command module 202. In an embodiment, the scenario controller module 201 receives acknowledgement signals from E84 simulator 102 and 300mm simulator 103 regarding status of the testing scenarios. Further, the command module 202 fetches the corresponding commands from memory module 203 which is pre-configured with the Fab test suite framework. Furthermore, the communication module 204 provides necessary communication interface between different modules present in the Fab test suite framework environment. In an embodiment, the communication interface that exists between different modules may be a standard TCP/IP protocol.
[0017] FIG. 3 is a flow diagram which shows various steps involved in the process of executing concurrent testing of SEMI standards in Fab environment, as disclosed in the embodiments herein. Initially, the simulator controller module 101 sends (302) a ‘loading’ command to E84 simulator 102 in order to perform ‘loading’ scenario. Further, the load port of hardware module 105.a gets corresponding loading commands from E84 simulator 102 through E84 hardware module 104 and executes the loading (304) of carrier (containing wafers) into load port of the equipment module 105. Further, E84 simulator 102 updates and checks (306) the status of the 'loading' scenario. Later, the simulator controller module 101 receives an acknowledgement signal from E84 simulator 102 describing the status of the scenario ‘loading’. If the process of loading is unsuccessful, then the simulator controller module 101 receives (308) a ‘loading error’ acknowledgement signal through communication module 204 of simulator controller module 101 and an error message indicating failure is provided to the user using suitable interface such as a display device, printer and so on. If loading of carrier into the load port of the equipment module 105 is successful, then simulator controlling module 101 receives (310) a 'loading successful' acknowledgement signal.
[0018] As in real Fabrication scenario, sequence of operations are typically executing a job from loading the carrier through AMHS (E84) which further followed by 300mm testing, the scenario controller module 201 of simulator controller module 101 sends (312) appropriate commands to 300mm simulator 103 to start executing 300mm test cases for SEMI standards compliance checking using command module 202.. Now, using test cases in 300mm simulator 103, compliance checking module 105.a checks the compliance of corresponding equipment for SEMI standards. After executing 300mm test cases, 300mm simulator 103 updates the status of ‘300mm testing’ and further sends an acknowledgement signal to simulator controller module 101. Furthermore, the scenario controller module 201 of simulator controller module 101 receives (314) an acknowledgement signal regarding the status of ‘300mm testing’. The FAB test suite framework is alerted regarding a failure of the 300mm testing using corresponding control signal; which in turn provides an error message to the user using suitable interface such as a display, printer and so on.
[0019] After receiving ‘successful completion of testing’ status from 300mm simulator, scenario controller module 201 further sends (316) an ‘unloading’ command to E84 simulator 102 in order to perform ‘unloading’ scenario as in a real Fab scenario, 300mm testing follows unloading the carrier through E87 carrier operation and AMHS (E84). Further, the load port of equipment module 105 gets corresponding unloading commands from E84 simulator 102 through E84 hardware module 104 and executes the unloading (318) of carrier (containing wafers) from load port. Further, E84 simulator 102 updates and check (320) the status of the 'unloading' scenario. Later, the simulator controller module 101 receives an acknowledgement signal from E84 simulator 102 describing the status of the ‘unloading’ scenario. If the process of ‘unloading’ is failed, then the simulator controller module 101 receives (322) an ‘unloading error’ acknowledgement signal from E84 simulator 102 and an error message indicating failure is provided to the user using suitable interface such as a display device, printer and so on. If ‘unloading’ of carrier from the load port of the equipment module 105 is successful, then simulator controlling module 101 receives (324) an 'unloading successful' acknowledgement signal from E84 simulator 102 through communication module 204.
[0020] A few advantages of using the simulator controller module are (but not limited to) mentioned below. In the first case, the simulator controller module 101 is capable of loading/unloading the carrier on the load port using E87 test scenarios and the E84 signalling scenarios, and upon receiving response from the load port also performs execution of loading and unloading scenarios without any latency or synchronization issues. As response timing and synchronization are very critical in this case, the simulator control module 101 proves to be efficient in tackling these issues.
[0021] In another case, use of the simulator controller module 101 helps to identify actual issue incase the testing fails. The simulator controller module 101 is configured to execute E84 and 300mm test cases with respect to a FAB production test sequence. When an error occurs at a particular step/stage, the simulator controller module 101 can notify the user; making the process of error detection easier.
[0022] In another case, use of the simulator controller module 101 helps to design the testing sequence to attain desired throughput. This is because the simulator controller module 101 designs test case sequence in compliance with the FAB production testing scenario; which means throughput calculation is done correctly.
[0023] The various actions in method 300 may be performed in the order presented, in a different order or simultaneously. Further, in some embodiments, some actions listed in FIG. 3 may be omitted.
[0024] The embodiments disclosed herein can be implemented through at least one software program running on at least one hardware device and performing network management functions to control the network elements. The network elements shown in Fig. 1 to Fig. 2 include blocks which can be at least one of a hardware device, or a combination of hardware device and software module.
[0025] The embodiment disclosed herein specifies a system for concurrent testing of SEMI standards in Fab environment. The mechanism allows testing of Fab scenario covering AHMS scenario followed by 3000mm standards providing a system thereof. Therefore, it is understood that the scope of the protection is extended to such a program and in addition to a computer readable means having a message therein, such computer readable storage means contain program code means for implementation of one or more steps of the method, when the program runs on a server or mobile device or any suitable programmable device. The method is implemented in a preferred embodiment through or together with a software program written in e.g. Very high speed integrated circuit Hardware Description Language (VHDL) another programming language, or implemented by one or more VHDL or several software modules being executed on at least one hardware device. The hardware device can be any kind of device which can be programmed including e.g. any kind of computer like a server or a personal computer, or the like, or any combination thereof, e.g. one processor and two FPGAs. The device may also include means which could be e.g. hardware means like e.g. an ASIC, or a combination of hardware and software means, e.g. an ASIC and an FPGA, or at least one microprocessor and at least one memory with software modules located therein. Thus, the means are at least one hardware means and/or at least one software means. The method embodiments described herein could be implemented in pure hardware or partly in hardware and partly in software. The device may also include only software means. Alternatively, the invention may be implemented on different hardware devices, e.g. using a plurality of CPUs.
[0026] The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the claims as described herein.

ABSTRACT

Disclosed herein is a system and method for concurrent testing of SEMI standards in fabrication environment by using a simulator controller module. The simulator controller module executes the E84 testing and 300mm testing concurrently by combining E84 load scenarios through AMHS, followed by executing E30, E87, E40 and E94 test cases and executing the E84 unload scenarios.
FIG. 1