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Field Effect Transistor, Method For Manufacturing The Same, And Wireless Communication Device And Goods Tag Including The Same

Abstract: Provided are: a field effect transistor wherein a semiconductor solution is able to be uniformly applied the hysteresis is reduced and the cracking resistance of a gate insulating layer is improved; and a production method of this field effect transistor which exhibits excellent productivity. The present invention is a field effect transistor which is provided with at least a substrate a source electrode a drain electrode a gate electrode a semiconductor layer that is in contact with the source electrode and the drain electrode and a gate insulating layer that insulates the semiconductor layer from the gate electrode and which is characterized in that the gate insulating layer contains at least a polysiloxane that has a structural unit represented by general formula (1). (In general formula (1) A1 represents an organic group which has at least two groups selected from among a carboxyl group a sulfo group a thiol group a phenolic hydroxyl group and derivatives of these groups or alternatively at least one group selected from among functional groups wherein the above-mentioned groups are fused into a ring shape within the A1 moiety and derivatives thereof.)

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
14 June 2019
Publication Number
25/2019
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application
Patent Number
Legal Status
Grant Date
2023-09-21
Renewal Date

Applicants

TORAY INDUSTRIES, INC.
1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 103-8666

Inventors

1. SAKII, Daisuke
c/o Shiga Plant, Toray Industries, Inc., 1-1, Sonoyama 1-chome, Otsu-shi, Shiga 520- 8558
2. MURASE, Seiichiro
c/o Shiga Plant, Toray Industries, Inc., 1-1, Sonoyama 1-chome, Otsu-shi, Shiga 520- 8558
3. WAKITA, Junji
c/o Tokyo Head Office, Toray Industries, Inc., 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 103-8666

Specification

1. A field-effect transistor comprising at least:
a substrate;
a source electrode;
a drain electrode;
a gate electrode;
a semiconductor layer in contact with the source electrode and with the drain electrode; and
a gate insulating layer insulating between the semiconductor layer and the gate electrode,
the semiconductor layer comprising an organic semiconductor and/or a carbon material, and
the gate insulating layer comprising at least a polysiloxane having a structural unit represented by a general formula (1):
in the general formula (1), R1 represents a hydrogen atom, an alkyl group, a cycloalkyl group, a heterocyclic group, an aryl group, a heteroaryl group, or an alkenyl group; R2 represents a hydrogen atom, an alkyl group, a cycloalkyl group, or a silyl group; m represents 0 or 1; A1 represents an organic group including at least two groups selected from a carboxy group, a sulfo group, a thiol group, a phenolic hydroxy group, or a derivative of these groups; when the derivative is a cyclic condensed structure formed by two groups out of the carboxy group, the sulfo group, the thiol group, and the phenolic hydroxy group, A1 represents an organic group having at least one the cyclic condensed structure.

2. The field-effect transistor according to claim 1, wherein A1 in the general formula (1) is an organic group having at least two carboxy groups or derivatives of the carboxy groups, or an organic group having at least one cyclic acid anhydride group.
3. The field-effect transistor according to claim 1 or 2, wherein
A in the general formula (1) is a group represented by a following general formula (2) or (3):
in the general formula (2), X1 represents a single bond, an alkylene group having 1 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms; R3 and R4 represent independently a hydrogen atom, an organic group, or a silyl group; in the general formula (3), X2 represents a single bond, an alkylene group having 1 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms.
4. The field-effect transistor according to any one of claims 1 to 3, wherein the polysiloxane contains the structural unit represented by the general formula (1) with a rate of at least 0.5% by mole and up to 20% by mole relative to entire silane structural units.
5. The field-effect transistor according to any one of claims 1 to 4, wherein the polysiloxane further has a

structural unit represented by a following general formula (4) :
in the general formula (4), R5 represents a hydrogen atom, an alkyl group, a cycloalkyl group, a heterocyclic group, an aryl group, a hetero-aryl group, or an alkenyl group; R6 represents a hydrogen atom, an alkyl group, a cycloalkyl group, or a silyl group; n represents 0 or 1; B1 represents an organic group including an addition reaction structure formed among an acryl group and/or a methacryl group themselves.
6. The field-effect transistor according to claim 5, wherein the polysiloxane contains the structural unit represented by the general formula (4) with a rate of at least 5% by mole and up to 50% by mole relative to entire silane structural units.
7. The field-effect transistor according to any one of claims 1 to 6, wherein the semiconductor layer includes a carbon nanotube.
8. The field-effect transistor according to claim 7, wherein the carbon nanotube includes a carbon nanotube composite having a conjugated polymer attached to at least part of surface of the carbon nanotube.
9. The field-effect transistor according to any one of claims 1 to 8, wherein the source electrode, the drain

electrode, and/or the gate electrode include(s) an organic binder and an electric conductive body.
10. The field-effect transistor according to any one of claims 1 to 9, wherein the gate insulating layer includes a metal compound having a bond between a metal atom and an oxygen atom.
.11. A method for producing the field-effect transistor 3 according to any one of claims 1 to 10, the method comprising:
(I) a step of forming an electric conductive pattern
on a substrate;
(II) a step of applying a solution including at least
a polysiloxane having a structural unit represented by the
general formula (1) onto the substrate having the electric
conductive pattern formed thereon, followed by drying; and
(III) a step of applying a solution including an
organic semiconductor and/or a carbon material so as to be
in contact with the electric conductive pattern, followed
by drying.
12. The method for producing the field-effect transistor according to claim 11, the method comprising:
(I) a step of forming an electric conductive pattern on a substrate,
(II-A) a step of irradiating a film with active actinic light via a photomask, the film being obtained by applying onto the substrate having the electric conductive pattern formed thereon a solution including at least the polysiloxane having the structural unit represented by the general formula (1) and a photosensitive organic component followed by drying, followed by forming of a pattern
91

turning into an opening on the electric conductive pattern using an alkali solution,
(II-B) a step of heating the pattern to form a cured pattern, and
(III) a step of applying a solution including an organic semiconductor and/or a carbon material so as to be in contact with the electric conductive pattern, followed by drying.
13. The method for producing the field-effect transistor according to claim 12, wherein the photosensitive organic component comprises a compound generating a radical by light and a radical polymerizable compound.
14. The method for producing the field-effect transistor according to claim 12, wherein the photosensitive organic component comprises a compound generating an acid by light.
15. A wireless communication device comprising the field-effect transistor according to any one of claims 1 to 10.
16. A goods tag comprising the wireless communication device according to claim 15.

Documents

Application Documents

# Name Date
1 201947023601-TRANSLATIOIN OF PRIOIRTY DOCUMENTS ETC. [14-06-2019(online)].pdf 2019-06-14
2 201947023601-STATEMENT OF UNDERTAKING (FORM 3) [14-06-2019(online)].pdf 2019-06-14
3 201947023601-PROOF OF RIGHT [14-06-2019(online)].pdf 2019-06-14
4 201947023601-PRIORITY DOCUMENTS [14-06-2019(online)].pdf 2019-06-14
5 201947023601-POWER OF AUTHORITY [14-06-2019(online)].pdf 2019-06-14
6 201947023601-FORM 1 [14-06-2019(online)].pdf 2019-06-14
7 201947023601-DRAWINGS [14-06-2019(online)].pdf 2019-06-14
8 201947023601-DECLARATION OF INVENTORSHIP (FORM 5) [14-06-2019(online)].pdf 2019-06-14
9 201947023601-COMPLETE SPECIFICATION [14-06-2019(online)].pdf 2019-06-14
10 201947023601-CLAIMS UNDER RULE 1 (PROVISIO) OF RULE 20 [14-06-2019(online)].pdf 2019-06-14
11 Correspondence by Agent _Form 1_27-06-2019.pdf 2019-06-27
12 201947023601-RELEVANT DOCUMENTS [01-07-2019(online)].pdf 2019-07-01
13 201947023601-MARKED COPIES OF AMENDEMENTS [01-07-2019(online)].pdf 2019-07-01
14 201947023601-FORM 13 [01-07-2019(online)].pdf 2019-07-01
15 201947023601-AMMENDED DOCUMENTS [01-07-2019(online)].pdf 2019-07-01
16 201947023601-FORM 3 [18-11-2019(online)].pdf 2019-11-18
17 201947023601-FORM 3 [08-06-2020(online)].pdf 2020-06-08
18 201947023601-FORM 18 [04-08-2020(online)].pdf 2020-08-04
19 201947023601-FER.pdf 2021-11-15
20 201947023601-OTHERS [26-04-2022(online)].pdf 2022-04-26
21 201947023601-FORM-26 [26-04-2022(online)].pdf 2022-04-26
22 201947023601-FORM 3 [26-04-2022(online)].pdf 2022-04-26
23 201947023601-FER_SER_REPLY [26-04-2022(online)].pdf 2022-04-26
24 201947023601-CLAIMS [26-04-2022(online)].pdf 2022-04-26
25 201947023601-PatentCertificate21-09-2023.pdf 2023-09-21
26 201947023601-IntimationOfGrant21-09-2023.pdf 2023-09-21

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