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"Fine Particle Structure/Substrate Composite Member And Process For Producing Same"

Abstract: The present invention relates to a fine-particle structure/substrate composite member having a microstructure, such as a three-dimensional raised microstructure, which is formed by an assembly of fine particles, such as nanoparticles, on a substrate, and a method for producing the composite member without the need for a step of heating to a high temperature. A substrate (1) having a smooth surface is prepared, a fine-particle layer (4) including fine particles (2) which are arranged along the surface is formed, and substituent molecules (4) are bonded to the fine particles (2) to change the fine-particle layer (4) to a fine-particle assembly layer (6) including the fine particles (2) to which the substituent molecules (4) are bonded, so that the center-to-center distance between the adjacent fine particles is increased to form a three-dimensional microstructure (7) in which a portion of the fine-particle assembly layer (6) is raised from the surface or the center-to-center distance between the adjacent fine particles is decreased to form a microstructure in which the fine-particle assembly layer (6) is absent in a portion of the surface, the substrate (1) being exposed in the absent portion (8).

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
27 May 2011
Publication Number
14/2012
Publication Type
INA
Invention Field
MECHANICAL ENGINEERING
Status
Email
Parent Application

Applicants

SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO 1080075, JAPAN

Inventors

1. DAISUKE HOBARA
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO 1080075, JAPAN

Specification

Documents