FIELD OF THE INVENTION
“Flash IC and PCB Transfer Process from crash and burnt Memory Module”
provide the detailed and exhaustive process for the safe and successful removal of
the Flash ICs and Flash PCB (Flexi-Rigid PCB) from the burnt and crashed Memory
Module.
BACKGROUND OF THE INVENTION
At the time of crash or accident of an aircraft, it goes through extreme
environmental conditions like High Temperature fire and mechanical shocks. The
main memory module of an aircraft which stores all the flight data and the cockpit
voice is also severely burnt and damaged in almost all the aircraft accidents. Safe
and successful retrieval of data from the memory module is very important for the
crash investigation and analysis purpose. All the data and cockpit voice is stored in
the Flash ICs which is mounted generally on the Flash PCB (Flexi-Rigid PCB) of the
memory module.
Safe and successful removal of the Flash ICs and Flash PCB (Flexi-Rigid
PCB) from the memory module involves various process and advanced assembly
techniques. “Flash IC and PCB Transfer Process from crash and burnt Memory
Module” list all the detailed and necessary techniques and procedures to remove the
Flash ICs and Flash PCB. This procedure is already verified at workshop level and
the results are excellent.
SUMMARY OF PRESENT INVENTION
“Flash IC and PCB Transfer Process from crash and burnt Memory Module”
provide the detailed and necessary techniques and procedures to remove the Flash
ICs and Flash PCB from Memory Module of the crashed aircraft.
Flash ICs and Flash PCB removal process from Memory Module is shown in
form of process Flow Chart (Figure1 and Figure 2). This flow chart shows all the
detailed and sequential process of data retrieval from the memory Module.
After the safe and successful integration of Flash ICs or Flash flexi PCB into
a serviceable memory module and further integration into flight data recording
system, Data retrieval & analysis can be done to examine the root cause of aircraft
crash and accident. The process involves advance assembly tools and skills.
Annexure‐II
BRIEF DESCRIPTION OF THE DRAWINGS
The features and advantages of the present invention will become more
apparent and descriptive in the description when considered together with
figures/flow charts presented:
Fig. 1 is “Flash IC/PCB Transfer Process and Data Retrieval from Crash and Burnt
Protected Memory Module” (Flow Chart)
Fig. 2 is “Flash IC/PCB Transfer Process and Data Retrieval from Crash and Burnt
Protected Memory Module” (Flow Chart) (Continued)
DETAILED DESCRIPTION
All the aircraft data and cockpit voice are recorded in the Flight data
recorders/ Cockpit voice recorders (FDR/CVR). Protected memory module is the
main memory/storage medium of the solid state flight data recorders. These Memory
Modules are crash and shock protected and can sustain in very high temperatures
and mechanical stresses.
The basic memory inside the Memory Modules is the Flash Chip, which is
mounted into the Flash PCB and is enclosed in the Memory Modules. These flash
chips are not crash protected. During accident and crash of the aircraft, only Memory
Modules is survived. All other parts of Flight Data Recorder such as Data Acquisition
and Processing parts are damaged during accident/crash.
Safe retrieval of data from the Memory Modules is very important and skillful
work. This involves safe and successful removal of flash chip from the Memory
Modules, then assembly of the flash chip into the serviceable Flash PCB (Flexi-Rigid
PCB). Final data is retrieved by the complete assembly of Memory Modules in the
Flight Data Recorder (Integrated with acquisition unit and processor)
The steps involve in the safe and successful removal of the Flash ICs and
Flash PCB from the memory module is listed below. Figure 1 and Figure 2 shows the
detailed steps involved in the Flash ICs and Flash PCB removal process in form of
Flow Chart.
(1) Visual inspection of the memory module and analysis of the intensity
of damage, examination of the memory module Cable and structural changes.
(2) If the memory module is physically satisfactory and cable is not
damaged. Then integrate the PMM into the serviceable Flight Data Recorder System.
(3) If the memory module integration into the Flight Data Recorder is
successful and data retrieval is taking place. Then download the data with the help of
data retrieval system and analyze.
(4) If step (2) and (3) is unsuccessful and not possible due to several
damage of the PMM and the connecting cables of memory module. Then cut the
Annexure‐II
memory module safely and remove the flash connecting PCB from the memory
module. The cutting of the memory module involves advance cutting tools and skills.
(5) After the successful completion of the step (4), PCB is checked for
physical damage. If the physical condition of the flash PCB is satisfactory, then
memory module connector is connected in the PCB and isolation between the pins is
checked. Integrate the flash PCB into the serviceable Flight Data Recorder and
download the data with the help of data retrieval system and analyze.
(6) If the flash PCB is physically damaged or data retrieval after the
completion of step (5) is not working, then remove the flash IC chip from the flash
PCB. Clean the flash chip and integrate into other serviceable flash PCB. Check the
isolation. Integrate this new flash PCB in the serviceable Flight Data Recorder.
Download the data with the help of data retrieval system and analyze.
After successful downloading and retrieval of data from the crashed aircraft,
data can be further analyzed to investigate the root cause of the crash and accident.

WE CLAIMS:-
Accordingly, the description of the present invention is to be considered as illustrative only and is for the purpose of teaching those skilled in the art of the best mode of carrying out the invention. The details may be varied substantially without departing from the spirit of the invention, and exclusive use of all modifications which are within the scope of the appended claims is reserved. We Claim

1. Process and methodology of Data Retrieval Process form Memory Module as explained in Fig 1 & 2.

2. Process and methodology of Flash ICs and Flash PCB (Flexi-Rigid PCB) from the burnt and crashed Memory Module.

3. Integration of Various systems of Data Recorders the safe and successful Data Retrieval from Flash ICs.

4. Process can be extended for amputation of other critical computation.

5. Retrieved data can be verified with standard results. ,TagSPECI:As per Annexure-II