Flexible Semiconductor Device Method For Manufacturing The Same And

Flexible Semiconductor Device Method For Manufacturing The Same And Image Display Device

Abstract: There is provided a method for manufacturing a flexible semiconductor device. The method of the present invention comprises the steps of: (a) preparing a metal foil having a concave portion; (b) forming a gate insulating film on a bottom face of the concave portion of the metal foil; (c) forming a semiconductor layer above the bottom face of the concave portion via the gate insulating film while making use of the concave portion as a bank member; and (d) forming a source electrode and a drain electrode such that they make contact with the semiconductor layer.

Patent Information

Application #

Filing Date

12 July 2012

Publication Number

48/2013

Publication Type

INA

Invention Field

ELECTRONICS

Status

Email

Parent Application

Applicants

Panasonic Corporation

1006 Oaza Kadoma Kadoma-shi Osaka 571-8501

Inventors

1. SUZUKI Takeshi

c/o Panasonic Corporation 1006 Oaza Kadoma Kadoma-shi Osaka 571-8501

2. NAKATANI Seiichi

c/o Panasonic Corporation 1006 Oaza Kadoma Kadoma-shi Osaka 571-8501

3. HIRANO Koichi

c/o Panasonic Corporation 1006 Oaza Kadoma Kadoma-shi Osaka 571-8501

Specification

Please see the attachments.

Documents

Application Documents

#	Name	Date
1	6144-CHENP-2012 CORRESPONDENCE OTHERS 09-01-2013.pdf	2013-01-09
1	Power of Authority.pdf	2012-07-17
2	6144-CHENP-2012 FORM-3 09-01-2013.pdf	2013-01-09
2	Form-5.pdf	2012-07-17
3	Drawings.JPG	2012-07-17
3	Form-3.pdf	2012-07-17
4	Form-1.pdf	2012-07-17
5	Drawings.JPG	2012-07-17
5	Form-3.pdf	2012-07-17
6	6144-CHENP-2012 FORM-3 09-01-2013.pdf	2013-01-09
6	Form-5.pdf	2012-07-17
7	6144-CHENP-2012 CORRESPONDENCE OTHERS 09-01-2013.pdf	2013-01-09
7	Power of Authority.pdf	2012-07-17