Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer; forming a dielectric material adjacent the die forming a coreless substrate by building up layers on the dielectric material and then removing the top layer carrier material and etch stop layer from the bottom layer carrier material.
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material wherein the carrier material comprises a top layer and a bottom layer separated by an etch stop layer; forming a dielectric material adjacent the die forming a coreless substrate by building up layers on the dielectric material and then removing the top layer carrier material and etch stop layer from the bottom layer carrier material.
| Section | Controller | Decision Date |
|---|---|---|
| # | Name | Date |
|---|---|---|
| 1 | Form-1.pdf | 2012-09-13 |
| 2 | Drawings.pdf | 2012-09-13 |
| 3 | 7614-CHENP-2012 CORRESPONDENCE OTHERS. 05-10-2012.pdf | 2012-10-05 |
| 4 | 7614-CHENP-2012 CORRESPONDENCE OTHERS 05-10-2012.pdf | 2012-10-05 |
| 5 | 7614-CHENP-2012 POWER OF ATTORNEY 05-10-2012.pdf | 2012-10-05 |
| 6 | 7614-CHENP-2012 FORM-18 05-10-2012.pdf | 2012-10-05 |
| 7 | 7614-CHENP-2012 CORRESPONDENCE OTHERS 10-10-2012.pdf | 2012-10-10 |
| 8 | 7614-CHENP-2012 ASSIGNMENT 10-10-2012.pdf | 2012-10-10 |
| 9 | 7614-CHENP-2012 POWER OF ATTORNEY 12-10-2012.pdf | 2012-10-12 |
| 10 | 7614-CHENP-2012 CORRESPONDENCE OTHERS 12-10-2012.pdf | 2012-10-12 |
| 11 | FORM-2.pdf | 2014-12-04 |
| 12 | abstract7614-CHENP-2012.jpg | 2014-12-04 |
| 13 | ABSTRACT.pdf | 2014-12-04 |
| 14 | 7614-CHENP-2012-FER.pdf | 2018-02-27 |
| 15 | 7614-CHENP-2012-Information under section 8(2) (MANDATORY) [17-04-2018(online)].pdf | 2018-04-17 |
| 16 | 7614-CHENP-2012-FORM 3 [17-04-2018(online)].pdf | 2018-04-17 |
| 17 | 7614-CHENP-2012-OTHERS [30-05-2018(online)].pdf | 2018-05-30 |
| 18 | 7614-CHENP-2012-FER_SER_REPLY [30-05-2018(online)].pdf | 2018-05-30 |
| 19 | 7614-CHENP-2012-Correspondence to notify the Controller [12-10-2020(online)].pdf | 2020-10-12 |
| 20 | 7614-CHENP-2012-Written submissions and relevant documents [11-11-2020(online)].pdf | 2020-11-11 |
| 21 | 7614-CHENP-2012-PatentCertificate25-03-2021.pdf | 2021-03-25 |
| 22 | 7614-CHENP-2012-IntimationOfGrant25-03-2021.pdf | 2021-03-25 |
| 23 | 7614-CHENP-2012-US(14)-HearingNotice-(HearingDate-27-10-2020).pdf | 2021-10-17 |
| 24 | 7614-CHENP-2012-RELEVANT DOCUMENTS [24-09-2022(online)].pdf | 2022-09-24 |
| 25 | 7614-CHENP-2012-POWER OF AUTHORITY [07-01-2023(online)].pdf | 2023-01-07 |
| 26 | 7614-CHENP-2012-FORM-16 [07-01-2023(online)].pdf | 2023-01-07 |
| 27 | 7614-CHENP-2012-ASSIGNMENT WITH VERIFIED COPY [07-01-2023(online)].pdf | 2023-01-07 |
| 28 | 7614-CHENP-2012-RELEVANT DOCUMENTS [28-09-2023(online)].pdf | 2023-09-28 |
| 29 | 7614-CHENP-2012-FORM-27 [28-09-2024(online)].pdf | 2024-09-28 |
| 1 | 7414chenp2012search_13-02-2018.pdf |