FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
(See section 10, rule 13)
1. Title of the invention: GEMSTONE PLANNING
2. Applicant(s)
NAME NATIONALITY ADDRESS
SAHAJANAND
TECHNOLOGIES PRIVATE
LIMITED
Indian A1, Sahajanand Estate, Wakharia
Wadi, Near Dabholi Char Rasta, Ved
Road, Surat, Gujarat 395004, India
3. Preamble to the description
COMPLETE SPECIFICATION
The following specification particularly describes the invention and the manner in which it
is to be performed.
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TECHNICAL FIELD
[0001] The present subject matter relates to the processing of rough gemstones,
and particularly, relates to the planning of rough gemstones.
 BACKGROUND
[0002] Gemstone found in natural states, commonly known as rough gemstone, is
an unfinished or unprocessed form of gemstone. Further, rough gemstone may be
processed to obtain a finished gemstone. Generally, the rough gemstone may undergo
a series of operations, such as planning, sawing, cutting, polishing, or the like to obtain
 a processed gemstone. Further, the planning operation is a process in which the rough
gemstone may be mapped to develop a three-dimensional (3D) model depicting
deformities and cavities on gemstone’s surface. The 3D model of the rough gemstone
may further be used to determine the geometry of processed gemstone. Based on the
geometry, a planned rough stone may be obtained. Based on the planning, the rough
 gemstone may undergo a cutting operation, in which the rough gemstone may be cut
based on a determined geometry. Finally, the cut gemstone may be polished to obtain
the processed gemstone.
BRIEF DESCRIPTION OF DESCRIPTION
[0003] The detailed description is described with reference to the accompanying
 figures. In the figures, the left-most digit(s) of a reference number identifies the figure
in which the reference number first appears. The same numbers are used throughout
the drawings to reference like features and components.
[0004] Fig. 1 illustrates a schematic an assembly for inserting 3D objects in a
rough gemstone, in accordance with one implementation of the present subject matter.
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[0005] Fig. 2 illustrates a planning unit, in accordance with one implementation
of the present subject matter.
[0006] Fig 3A-3B illustrates views of a 3D model, in accordance with one
implementation of the present subject matter.
[0007] Fig. 4A-4B illustrates views of a regenerated 3D model  with the 3D object
present therein, in accordance with one implementation of the present subject matter.
[0008] Fig. 5A-5B illustrates an enlarged view of a portion of the 3D model of
the rough gemstone depicting replacement of the cavities with the 3D objects, in
accordance with one implementation of the present subject matter.
 [0009] Fig. 6 illustrates a method of planning a rough gemstone, in accordance
with one implementation of the present subject matter.
[00010] Fig. 7 illustrates a non-transitory computer readable medium planning the
rough gemstone, in accordance with one implementation of the present subject matter.
DETAILED DESCRIPTION
 [00011] Planning operation may be performed by identifying the cavities on the
surface of the rough gemstone. Further, the cavities may be identified for planning the
rough gemstone in a way that when the gemstone is cut, the cavities may be removed.
As may be understood, the cavities, if present in the polished gemstone may degrade
the value of the polished gemstone. In addition, the gemstone may be reprocessed to
 remove the cavities because a polished gemstone with cavities has little or no
monetary value. Conventionally, a planning operation is performed by scanning a
rough gemstone to measure basic geometry of the surface of the rough gemstone.
Thereafter, physical attributes of the rough gemstone may be stored for further
operations, such as a cutting operation. Various methods may be employed to
 determine the geometry of the rough gemstone by three-dimensional profiling
techniques. One such method is to create a volumetric model of the rough gemstone
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by capturing multiple images of the rough gemstone that corresponds to different
positions of the gemstone. Generally, the images may be captured by placing the
gemstone between a light source and an image capturing device, such as a camera
such that the light source is positioned behind the gemstone and the camera is
positioned in the front. Further, the captured images may be integrated  together to
form the volumetric model.
[00012] Another method of determining the geometry of the rough gemstone is a
conventional laser mapping. In the conventional laser mapping method, a structured
light pattern is made incident on the rough gemstone at a pre-defined angle and a
 reflected light may come out of the rough gemstone. Further, the reflected light may
be captured and observed at a predetermined angle to observe distortion in the
reflected light that may indicate geometry of the surface of the rough gemstone.
Further, the structured light may be made incident on the rough gemstone at different
angles to obtain and capture the reflected light. The captured images may be used to
 form the 3D model of the rough gemstone. Further, the reflected light may also
provide details, such as curvature and depth of any cavity on the surface of the
gemstone.
[00013] Although the conventional planning techniques may provide details of the
geometry of the rough gemstone, the conventional planning techniques are unable to
 accurately determine the depth of the cavities on the surface of the gemstone. As a
result, the 3D model of the rough gemstone may not be accurate. Further, cutting the
rough gemstone using the inaccurate 3D model may result in retention of cavities that
may need reprocessing to remove the cavities. Further, in order to remove the cavities,
mapping of the cut gemstone may be performed again thereby consuming power and
 time. In addition, reprocessing may result in a reduction in the weight of the polished
gemstone in each subsequent cutting operation thereby reducing the value of the
gemstone. Moreover, remapping may still not be able to accurately determine the
depth of the cavities.
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[00014] To end this, techniques for forming a better 3D model of a rough
gemstone is provided. The techniques based on the present subject matter may provide
the 3D model of the rough gemstone that may be free from any measurement defects.
Such a 3D model may be used to plan cutting planes to cut the rough gemstone.
[00015] According to an aspect, a rough gemstone may be  mapped during the
planning operation and a first 3D model may be obtained. In one example, the first 3D
model may depict the geometry of the surface of the gemstone including the cavities
in the surface. In addition, the first 3D model may also depict curvature and the depth
of all the cavities in the rough gemstone. Once the first 3D model is obtained, the
 cavities in the 3-model may be mapped. In one example, the cavities in the first 3D
model may be supplemented with one or more 3D objects. In one example, the 3D
objects can be, but not limited to, spheres, cube, cuboid, cylinder, or any other
commonly known three-dimensional shape. Further, based on a depth of cavities, 3D
objects of a predetermined size corresponding to the depth of the cavities may be
 supplemented by the 3D objects. In one example, the 3D objects may be supplemented
along a length of the cavity to rectify the errors caused during the measurement of the
depth. Such insertion does away the need for subsequent mapping, that otherwise
would have occurred if the first 3D model was based on the incorrect measurements
occurred during the mapping. In one example, upon supplementing the cavities with
 the 3D objects, a second 3D model of the rough gemstone may be generated that may
include 3D objects in place of the cavities. In other words, each cavity is replaced with
the 3D objects of the predetermined size. Further, the second 3D model may be,
cutting planes may be determined that may not include cavities thereby resulting in no
cavities in the cut gemstone.
 [00016] These and other advantages of the present subject matter would be
described in greater detail in conjunction with the following figures. While aspects of
planning of the gemstone can be implemented in any number of different
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configurations, the embodiments are described in the context of the following
device(s) and method(s).
[00017] Fig. 1 illustrates a gemstone planning apparatus 100, in accordance with
one implementation of the present subject matter. The gemstone planning apparatus
100 may create a 3D model of a rough gemstone. The gemstone  planning apparatus
100 may include a platform 102 to hold the rough gemstone. Further, the platform 102
may be coupled to an actuator 104 that may rotate the platform 102 to change the
orientation of the rough gemstone. The gemstone planning apparatus 100 may also
include a light source 106 to illuminate the rough gemstone to facilitate capturing of
 images of the rough gemstone. Further, the light source 106 may include, but not
limited to, fluorescent lamp, or the like. The gemstone planning apparatus 100 may
also include a mapping assembly that may capture a plurality of images of light
reflected by the rough gemstone. In addition, the mapping assembly may also
determine contours of the rough gemstone.
 [00018] In one example, the mapping assembly may include a laser mapping
device 108 to measure contours of the surface of the rough gemstone 100. In one
example, the laser mapping device 108 may incident structured laser light on a surface
of the rough gemstone at a pre-defined angle. When the structured light pattern falls
onto the gemstone at a certain angle, a bright line of light appears on the surface of the
 rough gemstone. This bright line of light may, when observed from a pre-defined
angle, include distortions that correspond to the surface contours of the rough
gemstone. In one example, the laser mapping device 108 may capture the reflected
laser light. The laser mapping device 108 may translate the distortion in the line of
bright light into the details of the surface. During the scanning of the entire surface of
 the rough gemstone, the bright lines of light may be obtained for different orientations
of the rough gemstone. Such lines of bright light may be used to construct the 3D
information about the rough gemstone. In one example, the laser mapping device 108
may employ line projection techniques that includes triangulation method on the
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bright lines of light to obtain curvature and depth of any cavity on the surface of the
rough gemstone.
[00019] The mapping assembly may also include an image capturing device 110 to
capture light reflected by the rough gemstone upon illumination. In one example, the
image capturing device 110 can be, but not limited to, a camera. During  operation, the
image capturing device 110 may capture images of the rough gemstone at different
orientations of the gemstone.
[00020] According to an aspect, the gemstone planning apparatus 100 may include
a planning unit 112 coupled to other components of the gemstone planning apparatus
 100 that may perform various tasks including actuating the actuator 104 to rotate the
platform 102, controlling the light source 106 to illuminate the rough gemstone,
controlling the image capturing device 110 to capture light reflected by the rough
gemstone upon illumination, and actuating the laser mapping device 108 to obtain
laser mapping of the rough gemstone as explained above. In addition, the planning
 unit 112 may also generate a first 3D model of the rough gemstone based on the
captured image and laser mapping. Further, based on the generated first 3D model, the
planning unit 112 may also identify cavities in the rough gemstone’s surface. In
addition, the planning unit 112 may also measure the depth and curvature of all the
cavities. Moreover, for each cavity, the planning unit 112 may also insert 3D objects
 corresponding to the depth of each of the cavity. Further, the planning unit 112 may
also generate a second 3D model of the rough gemstone after inserting the 3D objects
in place of the cavities. A manner by which the planning unit 112 work will be
explained in detail with respect to Fig 2 onwards.
[00021] Fig. 2 illustrates the planning unit 112, in accordance with one
 implementation of the present subject matter. The planning unit 112 may be employed
as any of a variety of conventional computing devices, including, servers, a desktop
personal computer, a notebook or portable computer, a workstation, a mainframe
computer, a mobile computing device, and a laptop. Further, in one example, the
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planning unit 112 may itself be a distributed or centralized network system in which
different computing devices may host one or more of the hardware or software
components of the planning unit 112.
[00022] In one example, the planning unit 112 may include a controller 202 for
controlling the operation of the gemstone planning apparatus 100. In  one example, the
controller 202 can be implemented as a microcontroller, a microcomputer, and/or any
device that manipulates signals based on operational instructions. According to said
embodiment, controller 202 can include a processor 202-1 and a device memory 202-
2. The processor 400 can be a single processing unit or a number of units, all of which
 could include multiple computing units. The processor 400 may be implemented as
one or more microprocessors, microcomputers, microcontrollers, digital signal
processors, central processing units, state machines, logic circuitries, and/or any
devices that manipulate signals, based on operational instructions. Among other
capabilities, the processor(s) is provided to fetch and execute computer-readable
 instructions stored in the device memory 402. The device memory 402 may be
coupled to the processor 400 and can include any computer-readable medium known
in the art including, for example, volatile memory, such as Static-Random Access
Memory (SRAM) and Dynamic-Random Access Memory (DRAM), and/or nonvolatile
memory, such as Read Only Memory (ROM), erasable programmable ROM,
 flash memories, hard disks, optical disks, and magnetic tapes.
[00023] The planning unit 112, among other things and in addition to the modules
204, a memory 206 having data 208, and interface(s) 210. The modules 204, among
other capabilities, may fetch and execute computer-readable instructions stored in the
memory 206. The memory 206, communicatively coupled to the modules 204, may
 include a non-transitory computer-readable medium including, for example, volatile
memory, such as Static-Random Access Memory (SRAM) and Dynamic-Random
Access Memory (DRAM), and/or non-volatile memory, such as Read-Only-Memory
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(ROM), erasable programmable ROM, flash memories, hard disks, optical disks, and
magnetic tapes.
[00024] In an example, the modules 204 may include a model generation module
212, a mapping module 214, and other module(s) 216. The other module(s) 216 may
provide functionalities that supplement applications or functions  performed by the
planning unit 112.
[00025] Further, the data 204 includes data that is generated as a result of the
functionalities carried out by any of the modules 204. The data 204 may include
reference data 218 and other data 220. The reference data 218 may include
 information related between a depth of the cavity and size of the 3D object. Further,
the other data 220 may include data generated and saved by the modules 204 to
provide various functionalities to the planning unit 112.
[00026] According to an aspect, the controller 202 may be coupled to the actuator
104, the light source 106, and the image capturing device 110. Further, the controller
 202 may receive instructions from an operator to initiate capturing of the images of the
rough gemstone. Further, according to the illustrated aspect, the model generation
module 212 may be coupled to the image capturing device 110 to receive multiple
images of the rough gemstone. In addition, the model generation module 212 may
generate the first 3D model of the rough gemstone based on the captured images. The
 model generation module 212 may also identify the cavities captured in the first 3D
model. In one example, the mapping module 214 may compute the depth and
curvature of the identified cavities. In addition, the mapping module 214 may
supplement the cavities with the 3D objects of a predetermined size. In one example,
the mapping module 214 may use reference data 218 to determine the size of the 3D
 object to be supplemented based on the computed depth of the cavities. A manner by
which the planning unit 112 captures the first 3D model and supplement the cavities
with the 3D objects will be explained with respect to Fig. 2, 3A-3B, and 4A-4B.
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[00027] Thereafter, the laser mapping device 108 may be turned on by the
controller 202 and the structured laser light may be incident on the rough gemstone at
a predetermined angle. The laser light reflected by the surface of the gemstone and a
line of bright light is captured by the image capturing camera 110. Further, the
reflected line of bright light may also include distortions that correspond  to the surface
contours of the rough gemstone. Further, the 3D information of the surface counters
may be extracted using the line projection methods, such as the triangulation method
and may be represented as coordinates. Once the image is captured, the rough
gemstone may be rotated by a predetermined angle and the same process is repeated
 until all the images are captured.
[00028] In another implementation, the normal/shadow mapping and the laser
mapping may be performed in parallel that may be defined as combined mapping.
This reduces the processing time.
[00029] Once all the images are captured, the images may be sent to the model
 generation module 212. The model generation module 212 may generate a 3D model
300 (as shown in Fig. 3A) of the rough gemstone based on the coordinates from the
shadow images and the laser mapping images. Accordingly, the model generation
module 212 may also identify all the cavities 302-1, 302-2, 302-3, …. collectively to
referred to as 302 hereinafter, on the surface of the 3D model 300 as shown in Fig. 3A.
 Once the 3D model is generated, the model generation module 212 may also
determine dimensions of a polished gemstone 304 that needs to be carved out from the
rough gemstone.
[00030] According to one example, upon identification of the cavities 302, the
mapping module 214 may map the cavities 302. In one example, the mapping module
 214 may determine the depth of each cavity 302. The depth of the cavities 302 may be
determined by any known techniques. Once the depth is measured, the mapping
module 214 may determine a size of 3D object corresponding to the depth of cavities
302. In one example, the mapping module 214 may use reference data 218 determine
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the 3D object corresponding to the depth of the cavities. An example, of reference data
218 depicting the relationship between the depth of the cavity and the size of the 3D
object is given in the table below:
Sr. No. Cavity Depth
(in microns)
3D Object size
(in microns)
1. 50 30
2. 70 40
3. 100 50
[00031] Accordingly, the mapping module 214 may supplement, for each cavity,
the 3D objects. In one example, the mapping module 214 may add  multiple 3D object
along a length of the cavity such that the complete cavity 302 is replaced by the 3D
object. Once all the cavities 302 are replaced by the 3D objects, the model generation
module 212 may regenerate a second 3D model. Since all the cavities are replaced, the
3D model is free from any measurement defects.
 [00032] Fig 4A-B illustrates a regenerated 3D model 400 of the rough gemstone,
in accordance with one implementation of the present subject matter. The regenerated
model 400 generated by the model generation module 212 may include a plurality of
3D objects 402 in place of the cavities 302 (shown in Fig. 3A). Since the regenerated
3D model 400 does not include cavities, any inaccuracy due to an error in
 measurement of the depth of the cavity is alleviated. The model generation module
212 may again compute the dimensions of a polished gemstone that may be carved out
from the rough gemstone.
[00033] Fig. 5A-5B illustrates an enlarged view of a portion of the 3D model of
the rough gemstone depicting replacement of the cavities with the 3D objects. Fig. 5A
 illustrates the cavities 302 and the dimensions of the polished gemstone 304 while fig.
5B illustrates the 3D objects that have replaced the cavities 302. As a result, any
measurement defects that may have occurred during mapping is alleviated.
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[00034] Once the regenerated 3D model is obtained, the model generation module
212 may compute planes for a cutting machine along which the rough gemstone may
be cut to carve out the polished gemstone.
[00035] Fig. 6 illustrates a detailed method of planning a rough gemstone, in
accordance with one implementation of the present subject matter.  The method(s) may
be described in the general context of computer executable instructions. Generally,
computer executable instructions can include routines, programs, objects, components,
data structures, procedures, engines, functions, etc., that perform particular functions
or employ particular abstract data types. The method may also be practiced in a
 distributed computing environment where functions are performed by remote
processing devices that are linked through a communications network. In a distributed
computing environment, computer executable instructions may be located in both
local and remote computer storage media, including memory storage devices.
[00036] The order in which the method is described is not intended to be construed
 as a limitation, and any number of the described method blocks can be combined in
any order or can be performed in parallel to employ the method 600, or an alternative
method. Additionally, individual blocks may be deleted from the methods without
departing from the spirit and scope of the subject matter described herein.
Furthermore, the methods 600 can be employed in any suitable hardware, software,
 firmware, or combination thereof. The methods 600 is explained with reference to the
gemstone planning apparatus 100, however, the methods can be employed in other
systems as well.
[00037] The method begins at block 602 where a plurality of images of the rough
gemstone at different orientations is captured by the image capturing device 110. In
 one example, the rough gemstone may be rotated by predefined angle and the image is
captured after the rough gemstone when the rough gemstone is rotated by the
predetermined angle. This step is performed until the rough gemstone is rotated by
360 degrees.
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[00038] At block 604, laser light may be made incident on the rough gemstone by
the laser mapping device 108 such that the rough gemstone reflects the laser light. The
laser light is captured by the laser mapping device 108 so that the laser mapping
device 108 can determine contours of the surface of the rough gemstone.
[00039] At block 606, the planning unit 112 receives the captured  images and
determined contours to generate the first 3D model.
[00040] At block 608, once the first 3D model is generated, the planning unit 112
may identify the cavities in the rough gemstone. In addition, the planning unit 112
may also determine the size of the identified cavities.
 [00041] At block 610, once the size of the cavities is determined, the planning unit
112 may supplement the cavities in the first 3D model with one or more 3D object of a
predetermined size. In one example, the planning unit 112 may determine the 3D of
predetermined size based on information stored as reference data 218.
[00042] At block 612, the planning unit 112 may generate the second 3D model in
 which the 3D object is replaced with the cavities. This 3D model is then used to
determine the cutting planes. Further, when the cutting planes are determined, the
cutting planes does not include the 3D object. In one example, the 3D object of
predetermined size inside the second 3D model accommodates any error in
measurement made during determining the size of cavities. As a result, the identified
 cutting planes does not include any cavity and accordingly, when the rough gemstone
is cut, no cavity exists in the rough gemstone.
[00043] Fig. 7 illustrates a detailed method of planning a rough gemstone, in
accordance with one implementation of the present subject matter. The method(s) may
be described in the general context of computer executable instructions. Generally,
 computer executable instructions can include routines, programs, objects, components,
data structures, procedures, engines, functions, etc., that perform particular functions
or employ particular abstract data types. The method may also be practiced in a
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distributed computing environment where functions are performed by remote
processing devices that are linked through a communications network. In a distributed
computing environment, computer executable instructions may be located in both
local and remote computer storage media, including memory storage devices.
[00044] The order in which the method is described is not intended  to be construed
as a limitation, and any number of the described method blocks can be combined in
any order or can be performed in parallel to employ the method 700, or an alternative
method. Additionally, individual blocks may be deleted from the methods without
departing from the spirit and scope of the subject matter described herein.
 Furthermore, the methods 700 can be employed in any suitable hardware, software,
firmware, or combination thereof. The methods 700 is explained with reference to the
gemstone planning apparatus 100, however, the methods can be employed in other
systems as well.
[00045] Referring to block 702, the rough gemstone may be placed on the platform
 104 to rotate the rough gemstone at different orientations.
[00046] Thereafter, referring to block 704, shadow mapping of the rough gemstone
may be performed. In shadow mapping, the rough gemstone may be rotated up to 370
degrees and images of a shadow of the rough gemstone formed at different degrees of
rotations may be captured. For instance, the rough gemstone may be rotated from an
 initial position by 90 degrees to capture the images of the shadow formed at different
positions of the rough gemstone. In another instance, the rough gemstone may be
rotated by from the initial position by 180 degrees to capture the images of the shadow
formed at different positions of the rough gemstone. As may be understood, the rough
gemstone may be rotated by any number of degrees as long as an adequate number of
 images are captured to facilitate the generation of a 3D model of the rough gemstone.
In one example, the light source 106 may be turned on by the controller 202 to
illuminate the rough gemstone. As the light falls on the rough gemstone, a portion of
the incident light may get reflected and some portion of the incident light may get
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reflected. Thereafter, the controller 202 may trigger the image capturing device 110 to
capture an image of the shadow of the rough gemstone. As may be understood, the
outline of the shadow depicts the surface of the rough gemstone may be represented as
coordinates. Once the shadow is captured, the controller 202 may actuate the actuator
104 to rotate the platform 102 for positioning the rough gemstone  at a different
orientation with respect to the image capturing device 110. Once the rough gemstone
is placed at a different orientation, the light incident on the rough gemstone may be
reflected in different amount and directions. The shadow now formed by the rough
gemstone may be captured as a separate image by the image capturing device 110.
 This process is repeated until the rough gemstone is rotated 370 degrees and images of
shadows of all different positions of the rough gemstone are captured. Once shadow
mapping is done, the method 700 to the next block.
[00047] At block 708, the laser mapping of the rough gemstone may be performed.
In laser mapping, the rough gemstone may be rotated up to 370 degrees and images of
 a line of reflected bright laser formed at different degrees of rotation may be captured.
For instance, the rough gemstone may be rotated from an initial position by 90 degrees
to capture the images of the line of reflected bright light formed at different positions
of the rough gemstone. In another instance, the rough gemstone may be rotated by
from the initial position by 180 to capture images of the line of reflected bright light
 formed at different positions of the rough gemstone. As may be understood, the rough
gemstone may be rotated by any number of degrees as long as an adequate number of
images are captured to facilitate the generation of the 3D model of the rough
gemstone. In one example, the laser light may be made incident on the rough
gemstone. Further, the laser light reflected by the surface of the rough gemstone and a
 line of reflected bright light is captured by the image capturing device 110. Further,
the reflected line may also represent the surface of the rough gemstone and may be
represented as coordinates. Once captured, the rough gemstone may be rotated by a
predetermined angle and the same process is repeated until all until the rough
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gemstone is rotated 370 degrees and images of a reflected pattern of all different
positions of the rough gemstone are captured.
[00048] In another implementation, the operation at block 704 and 707 may be
performed in parallel. In one example, the rough gemstone may be illuminated by the
light from the light source 106. Simultaneously, the laser light  from the mapping
device 108 may be incident on the rough gemstone. Thereafter, the image capturing
device 110 may capture an image of the shadow formed by the rough gemstone. In
addition, the image capturing device 110 may capture an image of a line of reflected
bright light. Once captured, the rough gemstone is rotated by a predetermined degree
 and the same process is repeated. As may be understood, for each position, the image
capturing device 110 captures a set of two images. First, the shadow image and
second, the laser mapping image. This process is repeated until the rough gemstone is
rotated 370 degrees and images of shadow and the reflected pattern of all different
positions of the rough gemstone are captured.
 [00049] At block 708, it is determined if the mapping is done. In case it is
determined that the mapping is not completed, the method moves back to block 702
and the process is repeated again. In case the modeling is done, the method moves to
block 710.
[00050] At block 710, the 3D model of the rough gemstone may be generated. In
 one example, the model generation module 212 may generate a 3D model 300 (as
shown in Fig. 3A) of the rough gemstone based on the coordinates from the shadow
images and the laser mapping images.
[00051] At block 712, the depth of all the cavities may be mapped. In one
example, the model generation module 212 may also identify all the cavities 302 on
 the surface of the 3D model 300.
[00052] At block 714, the cavities may be replaced by 3D objects. In one example,
the mapping module 214 may supplement, for each cavity, the 3D objects. In one
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example, the mapping module 214 may add multiple 3D object along a length of the
cavity such the complete cavity 302 is replaced by the 3D object.
[00053] At block 716, once the cavities are replaced with the 3D objects, a second
3D model may be generated that may include a plurality of 3D objects 402 in place of
cavities 302 (shown in Fig. 3A). Since the regenerated 3D model 400  does not include
cavities, any inaccuracy due to an error in measurement of the depth of the cavity is
alleviated.
[00054] At block 718, planning of the rough gemstone may be performed. In one
example, the model generation module 212 may identified planes for a cutting
 machine along which the rough gemstone may be cut to carve out the polished
gemstone. In one example, the cutting planes exclude the 3D objects.
[00055] At block 720, the rough gemstone may be cut along the identified cutting
plane to obtain the cut gemstone. The cut gemstone may be further polished to obtain
the polished gemstone.
 [00056] FIG. 8 illustrates an example of network environment 800 using a nontransitory
computer readable medium 802 for planning the gemstone, according to an
example of the present subject matter. The network environment 800 may be a public
networking environment or a private networking environment. In one example, the
network environment 800 includes a processing resource 804 communicatively
 coupled to the non-transitory computer readable medium 802 through a
communication link 806.
[00057] For example, the processing resource 804 may be a processor of a
computing system, such as system 102. The non-transitory computer readable medium
802 may be, for example, an internal memory device or an external memory device. In
 one example, the communication link 806 may be a direct communication link, such
as one formed through a memory read/write interface. In another example, the
communication link 806 may be an indirect communication link, such as one formed
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through a network interface. In such a case, the processing resource 804 may access
the non-transitory computer readable medium 802 through a network 808. The
network 808 may be a single network or a combination of multiple networks and may
use a variety of communication protocols.
[00058] The processing resource 804 and the non-transitory  computer readable
medium 802 may also be communicatively coupled to data sources 810 over the
network 808. The data sources 810 may include, for example, databases and
computing devices. The data sources 810 may be used by the database administrators
and other users to communicate with the processing resource 804.
 [00059] In one example, the non-transitory computer readable medium 802
includes a set of computer readable and executable instructions, such as the analysis
engine 204. The set of computer readable instructions referred to as instructions
hereinafter may be accessed by the processing resource 804 through the
communication link 806 and subsequently executed to perform acts for network
 service insertion.
[00060] For discussion purposes, the execution of the instructions by the
processing resource 804 has been described with reference to various components
introduced earlier with reference to the description of FIG. 2.
[00061] On execution by the processing resource 804, controller 202 may trigger
 the capturing the images of the rough gemstone. In addition, the model generation
module 212 may generate the 3D model of the rough gemstone based on the captured
images. The model generation module 212 may also identify the cavities captured in
the 3D models. In one example, the mapping module 214 may compute the depth and
curvature of the identified cavities. In addition, the mapping module 214 may
 supplement the cavities with the 3D objects of a predetermined size. In one example,
the mapping module 214 may use reference data 218 to determine a size of the 3D
object to be supplemented based on the computed depth of the cavities.
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[00062] Although the subject matter has been described with reference to specific
embodiments, this description is not meant to be construed in a limiting sense. Various
modifications of the disclosed embodiments, as well as alternate embodiments of the
subject matter, will become apparent to persons skilled in the art upon reference to the
description of the subject matter. It is therefore contemplated that  such modifications
can be made without departing from the scope of the present subject matter as defined.
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I/We Claim:
1. A gemstone planning apparatus (100) to plan a rough gemstone, the gemstone
planning apparatus (100) comprising:
a platform (102) to mount the rough gemstone, wherein the platform is
movable to move the  rough gemstone;
an actuator (104) coupled to the platform (102) to rotate the platform (102)
an image capturing device (110) to capture a plurality of images of the rough
gemstone in different orientations with respect to the image capturing device (110);
a laser mapping device (108) to measure contours of a surface of the rough
 gemstone (100);
a planning unit (112) coupled to the image capturing device (110) and the
laser mapping device (108), the planning unit is to:
generate a first three-dimensional (3D) model of the rough gemstone
based the plurality of captured images and measured contours
 identify at least one cavity in the rough gemstone based on the first 3D
model;
determine a size of the identified cavity;
supplement the cavity with at least one 3D object of a predetermined
size, wherein the predetermined size is in accordance with the size of the
 cavity; and
generate a second 3D model of the rough gemstone with the at least
one supplemented 3D object.
2. The gemstone planning apparatus (100) as claimed in claim 1, wherein the
planning unit (112) further determines a plurality of cutting planes based on the
 second 3D model, wherein the plurality of cutting planes one of includes and
excludes the at least one supplemented 3D object.
3. The gemstone planning apparatus (100) as claimed in claim 2, wherein the
rough gemstone is cut based on the plurality of cutting planes.
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4. A method of planning a rough gemstone mounted on a platform, the method
comprising:
capturing, by an image capturing device, a plurality of images of the rough
gemstone at different orientations with respect to the image capturing device;
capturing, by a laser mapping device, a laser light reflected  by the rough
gemstone at different orientations of the rough gemstone to measure contours of a
surface of the rough gemstone;
generating, by a planning unit, a first three-dimensional (3D) model of the
rough gemstone using the plurality of captured images and measured contours;
 identifying, by the planning unit, at least one cavity and determining a size of
the at least one cavity;
supplementing, by the planning unit, at least one cavity with at least one 3D
object having a predetermined size, wherein the predetermined size is in accordance
with the determined size of the cavity; and
 generating a second 3D model of the rough gemstone with at least one
supplemented 3D object.
5. The method as claimed in claim 4 further comprising:
identifying a plurality of cutting planes from the second 3D model, wherein
the plurality of cutting planes exclude the at least one supplemented 3D object.
 6. The method as claimed in claim 4, wherein capturing the plurality of images
includes rotating the platform by a predetermined angle and capturing the image,
wherein the capturing the reflected laser light includes rotating the platform by a
predetermined angle and incidenting the laser light on the rough gemstone to capture
the laser light reflected by the rough gemstone.
 7. The method as claimed in claim 5, further comprising cutting the rough
gemstone based on the plurality of cutting planes.
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8. A non-transitory computer-readable medium comprising computer-readable
instructions for planning a rough gemstone, when executed by a processing resource,
cause the processing resource to:
capture a plurality of images of the rough gemstone at different orientations of
the plurality  of images;
generate a first three-dimensional (3D) model of the rough gemstone using the
plurality of images;
identify at least one cavity in the rough gemstone and determine a size of the
at least one cavity; and
 supplement the at least one cavity with at least one 3D object of a
predetermined size, wherein the predetermined size is based on the size of the at least
one cavity.
9. The non-transitory computer-readable medium as claimed in further claim 8,
comprising instructions to generate a second 3D model using the supplemented at
 least one 3D object.
10. The non-transitory computer-readable medium as claimed in further claim 8,
comprising instructions to identify a plurality of cutting planes from the second 3D
model, wherein the plurality of cutting planes excludes the at least one 3D object.