Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises a mold material. In an embodiment, a first photonics integrated circuit (PIC) is within the second layer. In an embodiment, a second PIC is within the second layer, and a waveguide is in the first layer. In an embodiment, the waveguide optically couples the first PIC to the second PIC.
| # | Name | Date |
|---|---|---|
| 1 | 202347070673-PRIORITY DOCUMENTS [17-10-2023(online)].pdf | 2023-10-17 |
| 2 | 202347070673-POWER OF AUTHORITY [17-10-2023(online)].pdf | 2023-10-17 |
| 3 | 202347070673-FORM 1 [17-10-2023(online)].pdf | 2023-10-17 |
| 4 | 202347070673-DRAWINGS [17-10-2023(online)].pdf | 2023-10-17 |
| 5 | 202347070673-DECLARATION OF INVENTORSHIP (FORM 5) [17-10-2023(online)].pdf | 2023-10-17 |
| 6 | 202347070673-COMPLETE SPECIFICATION [17-10-2023(online)].pdf | 2023-10-17 |
| 7 | 202347070673-Proof of Right [27-12-2023(online)].pdf | 2023-12-27 |
| 8 | 202347070673-FORM 3 [12-04-2024(online)].pdf | 2024-04-12 |
| 9 | 202347070673-FORM 18 [03-06-2024(online)].pdf | 2024-06-03 |