DESCRIPTION
HEADPHONE
TECHNICAL FIELD
5 [000X1
The present disclosure relates to a headphone. In
particular, the present disclosure relate;: to a headphone
capable of reducing uncomfortable feelings whileimproving
stablonoss in wearing Lhe headphone.
10
BACKGROUND ART
[0002|
With the progress of digital electronic devices and
the Interne!: technology, users of the digital electronic
15 devices have come to easily enjoy various types of
content including musical content and v:ida<-j content
recorded on optical discs or distributed via the Internet.
For example, a user of a portable electronic device car,
enjoy various types of content even in the outdoors.
20 [0003]
With i?ttpr;oved convenience of content by digital
electronic devices, etc., there is an increased demand of
users who want to enjoy content at a better sound quality.
[0004]
25 In general, a headphone is used tc vi ew or listen
to the content outdoors. A headphone may also be used
even in an $ ndocr environment to seek. lor a better sound
quality during indoor viewing and listening of the
content. Therefore, there is a very high demand for
30 improvinq audio quality for the headphone.
[00Q5J
2
SP338911WQ00
To improve the sound quality of musical content to
ho reproduced by the headphone, the size of an electroacoustic
conversion unit of the headphone would be bigger
loading to an increased weight of the headphone units
5 including right and left parts corresponding Lo both ears
[0006]
Generally, a set of the headphone units are
supported by a pad being in contact with the head of a
User- The pad is provided on a head band connecting the
10 headphone units. There is a -case, however, where the
headphone may cause uncomfortable feelings to the user
wearing the headphone due to an insufficient support of
the set of the headphone units.
[0007]
15 To improve stableness in wearing the headphone,
Patent Document 1 below discloses, fox example, two head
bands and a head cushion arranged between the head bands,
with the head cushion being in contact with the head of a
person.
20
CITATION LIST
PATENT DOCUMENT
[0008]
Patent Document 1: Japanese Patent Application
25 Laid-Open No, 2005-311630
SUMMARY OF THE IftVtfftTION
PROBLEMS TO B£ SOLVED BY THK INVENTION
[0009]
30 It is desired to improve stableness in wearing a
headphone.
3
SP33B911WGD0
SOLUTION TG PROBLEMS
[0010]
According to a preferred embodiment of the present
5 disclosure, a headphone includes a pair of acoustic
reproduction uni^s, a supporting member connecting the
pair of acoustic reproduction units, and a soft member
configured to be rotatable relative to the supporting
member and arranged on the side opposite to the head of a
10 person wearing thy headphone.
[00111
In the present disclosure, Lhe soft member arranged
en the side opposite to the head of the person wearing
the headphone is configured to be rotatable relative to
15 the supporting member connecting the pair of the acoustic
reproduction units. Therefore, the drrangeEiient of the
soft member fellows tilting of Lhe top of the head of the
headphone user in the fronL-back direction. This
prevents application of pressure locally en the head of
20 the user, and the uncomfortable feelings of the user
wearing the headphone can be decreased. In addition, the
weight of the headphone is equally aisLributed ever the
top of the head of the user to thereby improve stsbloness
in wearing Lhe headphone.
MFFECT3 Oi-' THE "INVENTION
[00121
According to aL least one embodiment of the present
disci osure, it is possible to improve stablertess in
30 wearing a headphone.
4
SP3309UWOOO
BRIEF DESCRIPTION OF DRAWINGS '
[00131
Fig, 1A is a perspective view illustrating a
headphone according to an embodiment of the present
5 disclosure.
Pig. IB is a schematic view illustrating a user
wearing the headphone according to the embodiment of the
present disclosure.
Fig. 2A is a perspective view illustrating a head
10 band of the headphone according Lo the embodiment of the
present disclosure,
Fig. 2B is EI schematic view illustrating an example
of a cross-section of a pad portion when cut along a
plane perpendicular to a direction connecting right and
15 left headphone units.
Fig. 3A is a schematic view illustrating an example
of a cross-section of the head band when cut along a
plane in a direction connecting the right and left
headphone units and along a vortical plane.
20 F±q. 3B is an enlarged view of a part E of Fig. 3A,
surrounded by a broken line.
b'igs. ••A and 4B are schematic views illustrating
cross-sections of an end cover,
i-'igs. bA and 5B are cross-sectional views
25 illustrating a first modified example of the pad portion
of the headphone of the present disclosure.
Fig. 6A is ^.n expl oded perspective view
illustrating the first modified example of the pad
portion of the headphone of the present disclosure.
30 Fig. 6tt is a cross-sectional view illustrating a
second modified example of the pad portion of" the
5
SP338911WOO0
headphone of the present disclosure*
MOn>E FOR CARRYING OUT THF, INVENTION
L0014]
5 Embodiments of a. headphone will be described by low.
Description will be given in the following order.
<1. One Embodiment
L i-1. Schematic Structure of Headphone]
(1-1-1. Headphone Unit)
10 (1-1-2. Head Band)
[1-2, first Modified Example]
(1-2-1. Supporting Plate)
[1-3. Second Modified Example]
(1-3-1. Low Friction Material}
15 <2. Modified Examp]e>
[0015]
Embodiments described below are specific and
preferable examples of the headphone, in the description
below, technically preferable various limitations have
20 been provided; however, the examples of the headphone
will not be Limited to the embodiments described below
Unless otherwise specifi ed to limit the scope of the
present dj sciosure.
[0016]
25 <1. One Embodiment>
Ll-1. Schematic Structure of headphone]
Fig. IA is a perspective view illustrating a
headphone according Lo an embodiment of the present
disclosure. Pig, "IB is a schematic view illustrating a
30 user wearing the headphone according to the embodiment of
the oresent disclosure.
6
SP33B91IWO00
[0017]
A3 illustrated in Pig. 1A, a headphone 1 includes,
for exarnpler a head band 3, headphone uniits 5L and 5Rr
and hangers 7L and 7R.
5 [0018]
As illustrated in Fig. IB, the headphone units 5L
and 5R .arc located on the right and left, respectively,
corresponding to right and left ears of the user wearing
the headphone 1, The headphone units 5L and 5R are
0 connected by th^ head band 3, for example, via the
hangers 7L and 7R, respectively.
[0019]
The head band 3 is shaped in an arc: to generally
protrude upward in a vertical direction in order to fit
5 the shape of the haad of the user, A pad 11 is arranged
substantial]y in the cenLcr of the head band 3.
[0D20J
As described below, the pad 11 includes a cushion
material. Since; the pad 11 includes the cushion material
0 and is in contact with the head of the user, the weight
of the headphone 1 is transmitted to the head of I ho user
via the cushion material,
[0021]
Also, the pad 11 is configured to be ror.atdble
5- relative to a core material placed inside the head band 3,
as will be described below. Accordingly, the pad 11
rotates to follow the tilting of the Lop of the head of
the ua^r wearing the headphone 1, as illustrated in. Fig.
IB. That is, the pcid !'• may be configured to be
0 rotat^ble, for example, along a direction indicated by an
arrow Q ol Fig. IB.
7
5P333D11WQ00
[0022]
The headphone unity 5L and 5R and the head band 3
wil3 be described below i.n this order. The headphone 1
has a substanrial.1 y symmetrical configuration in a
5 horizontal direction. For example, the headphone unit 5L
located on the left of the user and the headphone unit 5R
located on the right of the user have Ttsostly similar
configurations- Therefore, with regard to the
constituent elements, such as the members to be arranged
1.0 symmetrically on the right and left of tho user, only
left side eJeaiients of the user will be described below
[0023]
(1-1-1. Headphone Unit)
The headphone unit 5L generally intrudes a speaker
15 unit 17Ti used for electro-acoustic conversion, a housing
19L storing the speaker unit 17L, and an ear pad 15h.
[0024]
A voicft signal used lor electro-acoustic conversion
is sent from an acoustic reproduction apparatus via a
20 code 9 connected to the acoustic reproduction apparatus
and a connecter portion provided in one of the two
headphone units 5L and 5R. In Fias. 1.A and lbr an
exemplary structure where the code 9 is connected to the
connector portion forced in the headphone unit !>L is
2b illustrated.
[0025]
A voice signal having been sent to one of the two
headphone units is sent to the other headphone unit, for
exarcple, via a transmission line placed inside the head
30 b^ind 3- Transmission of the voice siqnai between the
right and left headphone units, or between the headphone
8
SP338911WGQ0
unit and the acoustic reproduction appainLus is nob
limited to a wired system. Instead, the transmission of
voice signals may, of course, be carded out by a
wireless system.
5 L0G26]
The speaker units receive a voice signal and
execute electro-acousLic conversion corresponding to the
received voice signal. Sound is reproduced from the
respective speaker unita to reach ears of the user. Thus,
?L0 the "user recognizes the reproduced sound from the speaker
units -
[0027]
An car pad I5L has a cushion characteristic and is
arranged circumferenti&ily at a porLion where the
15 headphone unit 5L is in contact with an area surrounding
the ear of the user,
[0028]
The ear pad 151. is provided to alleviate the
feeling of pressure or, the user around the ear caused by
?0 Lhe contact with the headphone unit bL. Since the heart
band 3 is generally shaped in an arc, a side pressure is
applied to the usor wearing Lhe headphone through the
right and left headphone units. In a sound-isolating
type headphone, the ear pad 15L serves to form a closed
25 space around the ear of Lh& user.
[0029]
(1-1-7. Head Hand)
The head band 3 is formed, for example, by slider
portions 13h and "I3K, and Lhe pad II.
30 E0030]
The slider portion 13L is formed, for exampJe, by a
9
SP338911WO00
plurality of members to allow expansion and contraction
along the extending direction o± the slider portion 13L.
Thus, the: user can adjust positions of the right and left
headphone units according to the shape and size of the
5 he^d of the user.
[0031]
R banger 7L, for example, is arranged between the
slider portion 13L and the headphone unit 5L, A hanger
7R, for example, is arranqed between the slider portion
1.0 13R and Lhe headphone unit 5R.
[0032]
The hangez. 7L is formed in an arc, tor example, and
the cenLer pari of the arc is coupled with the slider
portion 13L, while both ends of the arc is coupled with
15 the headphone unit 5L. Thus, the headphone unit 5L is
supported by Lhe head band 3.
[0033]
The hanger 11, isr for example, coupled with the
slider portion 1 3L in a rotaLable manner, with a rotation
20 axis being in a direction in which the slider portion 13L
extends. The headphone unit 5L may, lor example, be
rota Labiy connected with the hanger 7L by regarding an
axis connecting both ends of the arc-shaped hanger 7L as
a roLation axis. Thus, the headphone unit 5L is
25 supported on the head band 3, so as to follow Lhe side of
the face of the user.
[0034]
Fig. 2A is a perspective view illustra Ling a head
band of the headphone according to the embodiment of tha
30 present disclosure. In the following description, a
direction Lraveling from Lhe left side toward the right
10
3P338911WQ0G
aide of the us or wearing the; he'adphonc is regarded as an
X direction. A]so, a direction toward the front of the
User is regarded as a Y direction, arid a direcLion going
upward of the user is regarded as a 3 direction. AL this
b time, as illustrated in Fig. 2A, a plane provided in
parallel with a VS plane and passing through the center
cf the pad 11 is regarded ay El, and a plane provided in
parallel with a ZX piano and passing through the center
of the head band 3 is regarded as S2, Specifically, ill
10 is vertical to a direction connecting the right and loft
headphone units- JJ2 is a plane including a direction
connecr.ing the right and left headphone units and a
vertical dlrecLion.
[0035]
15 Tho pad 11 includes, for example, a pad portion 21
and end covers 27L and 27R, 5.5 illustrated in b'ig. 2A,
The pad 11 is located above tho head of Lhe user when the
headphone ] is worn such Lhat the pad portion 21 located
in Lhe center of tho pad 11 touches the head of the user,
2Q [0036]
As described below, the pad portion 21 includes,
for example, a lower cushion materiai 31, a core material
33, an upper cushion material 35, and a covering inaLeria.l
3V.
?!> [0037]
Fig. 2B is a schematic view illustrating an example
of a cross-sec Lion of the pad portinn when cut along a
plane Oil illustrated in t'ia. 2A) vertical to a direction
connecting the right and left headphone units. Viq. 3A
30 is a schemaLic view illustrating an example cf a crosssection
of the head band when cut: along a plane (£2
13
SP33&911WO0Q
illustrated in Fig, 7A) in a direction connecting the
righL and left headphone units and also including a
vertical direction- Pig. 3B is an enlarged view of a
part E of Fig. 3A, surrounded by a broken line. In Figs.
5 3A and 3B, the covering material 37 is not shown,
[01)38]
As illustrated in Fig. 2B, the inside of ths pad
portion 21 is a stacked sLructure including, for example,
the lower cushion maLerial 31, Lhe core material 33, and
10 the upper cushion material 35 stacked on top of each
other. A stroked body including Lhe lower cushion
material. 31, the core material 33, and the upper cushion
material 35 i s covered wiLh. the covering iuaLerial 37.
[0039J
15 Both ends of the covering material 37 are fixed by,
for example, Lhe end covers 27L and 21R. Therefore, the
pad II of the head band 3 is formed inLeg^aily by the
stacked body including the lower cushion material 31, the
core material 33, and the upper cushion material 35, the
20 covering material 37, and Lhe end covers 2'fL and 27R.
[00^0]
In the present disclosure, the core maLerial 33 is
not fixed with a surface that has been in contacL with
the lower cushion material 31, Thai is, the pad 11 is,
2b for example, iixed to Lhe core material 33 with a freedom
of rotation re]ative to the core material 33, by the end
covers 27L and 27^ arranged on both ends of the pad 11.
Thua, the lower cushion material 31 is formed rotatably
relative to the core material 33.
30 [0041]
The lower cushion material 31 is a cushion material
12
SP33891.1WO00
arranged on the opposite side 6f the head of the user
when the headphone 1 is worn. As .illustrated In Fig. 3A,
the lower cushion material 31 is generally shaped like an
arc with a predetermined width to fit the shape of the
5 top of the head of the user. The lower cushion material
31 is held by, for example, the covering material. 37 in a
rotatable manner relative to the core material 33 which
is described below, so a^ to fo.llow a slant of the top of
the head of the user.
10 [0042]
Preferably, Lhe lower cushion material 31 is formed
by a material having a suitable cushioning property, such
as urethane resin (pelyurethane}, rubber, silicone, and
felt. The lower cushion material 31 may have a spongo-
11> like porous structure.
•[0043]
The core material 33 provides a proper strength to
Lho head band 3 to keep the arc-like shape of the head
band 3, while supporting the weight of the laterally held
2D headphone units bL and 5R,
[0044]
As illustrated in Figs, ?M and 3A, the core
material 33 is arranged bcLwoen the lower and upper
cushion materials 3! and 35. The core materia] 33 is
2b generally shaped like an are, and both ends of Lho core
material 33 are extended to the positions of the hangers
7L and 7R. A transmission line 28 connecting the right
and left headphone units is, as illustrated in Fig. 2B,
arranged between the upper and lower cushion materials 35
30 and 31 along the core material 33,
[OOAb]
13
SP338911WO00
The core material "33 is formed by a substantially
reverse U-shaped plate material having a spring
characteristic. The core material 33 is required to have
a spring characteristic because a lateral pressure has to
b be applied to the headphone units attached on both sides
of the core material 33 when Lhc headphone is worn on the
head, to thereby push and support the head by the
headphone units. The core material 33 Is made of, for
example, a metal such as stainless steel {SUB) OE iron, a
10 carbon composite material such as a carbon fiber
reinforced plastic, or a crystalline resin such as
polyoKymethylenc (POM) (also referred to as a polyacctal
resin), polypropylene (PP) , or polybuty"* ene terephthalate
(PBT).
15 [0046]
In view of making the pad 11 rotatablc abo^t the
core materia] 33, as illustrated in Fig. 2Br an aspect
ratio of a cross-section of Lhc core material 33 is
preferably closer to lr when cut along a plane
2 0 perpendicular to a direction connecting the riqht and
left headphone units. Alternative]y, it is prefer able
that a cross-section of the core maLcriai 33 be close to
a circle when cut along a piano perpendicular to the
direction connecting the right and left headphone units.
25 [0047]
The upper cushion material 35 is a protecting
member of the core material 33 and arranged opposite to
the lower cushion material 31 relative to the core
material 33. Similar to the lower cushion material 31,
30 the upper cushion material 35 is generally shaped like an
arc with a predetermined width to lit to the shape of the
14
SF338911WO00
tap o£ the head of the u^Gr.
[0048]
A material of the upper cushion material 35 is noL
particularly limited, and may include a urethane rosin
5 and other resin materials, a metal, etc.
[0049]
As illustrated in Pig. 2B, the pad portion 21 is
formed, for example, by a stacked body including the
lower cushion material 31, th£ core material 33, ancj the
10 upper cushion material 35, with the slacked body being
covered with Lhe covering material 37, At Lhis time, the
space between the lower and upper cushion materials 31
and 35 may Include only the core material. 33 and the
transmission line 2ti. Alternatively, the space beLween
IT: Lhe lower and upper cushion materials 31 and 35 may of
coy r st? be filled ws th a arethane resin, etc.
[0050]
The covering material 37 is a tubular-shaped
covering materia] made of, for example, a textile
20 material such d.s polyester fiber, leather, oi synthetic
leather. The covering material 37 is formed to havo a
proper tensile strength in order to exert a force to the
lower and upper cushion materials 31 and 35 in directions
toward each other. By exerting a force to the lower and
2b upper cushion materials 31 and 35 in directions toward
each other, it is possible to hold the shape of the
stacked body including Lhe lower iind upper cushion
materials 31 and 35, and the cere material 33.
[005J]
30 Both ends of Lhe tubular-shaped covering material
37 are fixed by, for example, tho end covers £7L and 27R.
15
SP338911WO00
The end covers 27L- and 27R are 'each formed by, for
example, an upper cover body and a lower cover body In
such a manner that one end of the tubular covering
•nates:;} ai 37 is sandwiched between the upper and lower
5 cover bodies.
[0052]
Figs. 4A and 4B are schemalic views illustrating
cross-sections of the end cuvcr. t"'H_cr^5. 4J\ and J1B
schematically i -llustrate cross-seeLions of Lhe end cover
10 27L when cut in parallel with a plane perpendicular to
the extending; direction of the core material 33. Kiigs.
4A and 4B correspond to the cross-sectional view when cut
along line VII-VII in Fig. 3B.
[0053]
15 In the exemplary structure .i LlusLrated in Figs. 4A
and 4Br the end cover 27L is formed by upper and lower
cover bodies ?7Lu and 27l*d made of a materia] such as a
resin nsateriaL The upper and lower cover bodies 27Lu
and 27lid are joined together by screws Sel and Sc2. The
20 upper and 1 ower cover bodies 271>u and 27Ld may of course
be joined Logerher by an adhesive or by welding.
[O0EJ4I
As illustrated in Fig. 4Ar Lhe core material 33 is
arranged to penetrate through a space C formed in
25 substantially a center of a cross-section of the end
cover 27L. 'I'he ecre material 33 and Lhe end cover 27L
arc not fixed with each other, and the end cover 27L is
rotatable relative to the core material 33,
[0055]
J0 Preferably, a rotatable angle of Lhe end cov^r 27L
relative to Lhe core material 33 is included within a
1 6
SP338911WOQ0
previously determined fixed r^n'qe. That ia, it is
preferable to seL the range o£ rotatable angle of the
lower cushion material 31 {ar may also be referred to as
the pad 11) relaLive to the core material 33 to be within
5 a previously determined fixed range. This is because bhc
pad porLion 21 may receive an excessive force to cause
deformation and breakage of the pad portion 21 without
any restrictions oi the rotattible angls of the pad 11
relative to the cors maLerial 33-
10 [0056]
For example, in the structural example illustrated
in Fig. 4A, the space C having a rectangular crosssection,
for example, is formed "in substantially the
center of the cross-secLion of the end cover 27Ji. The
15 .rectangular shape is formed by portions of the upper and
lower cover bodies 27Lu and 27Ld. The core material 33
is arranged to penetrate through the space C. At the
same tirae, the core material 33 is provided with a pin
29L that extends in a direction perpendicular to a width
20 direction (Y-direerionl of Lhc pad portion 21 and to the
extending direction of the pad portion 21. Similarly,
the core material 33 is also provided with a pin at a
position GOrrespond"! nq Lo the end cover 27R. Each pin
inay be configured Lo penetrate through the core material
2b 33, or may be formed integrally wiLh the core material 33,
[0057]
By forming the space C by the portions of the upper
and lower cover bodies 27Lu and 27Ldr and arranging the
pin 29L in the core material 33, the pin 29L serves as a
30 stopper to limit the rotation angle of Lhe end cover 27L
relative Lo the core material 33 within a fixed ranqe.
17
SP33e91lWO00
For example, in an example illustrated in Fig. 43, the
rotation angle of the end cover 27L relative to the core
material 33 may be limited wiLhin twice the range of an
angle 5 illustrated in Fig. 4B. That is, the rotation
5 angle of the pad 11 relative to the core material 33 is
limited WJthin the fixed range to thereby prevent such a
defect as breaking the covering material 37, etc. of the
pad portion 21 by the core material 33.
L005G]
10 In the structural examples of Fig, 3B and Figs, 4fl
and 4B, the pin 29f. ia arranged in the coro material 33,
It may also be possible, however, to limit the rotation
angle of the p^d 11 relative to the core material 33
within the fixed rangy by providing a protruding portion
15 in the space C formed in the end cover 27L. When the
protruding portion is provided in the space C where Lhe
core material 33 penetrates through, the location of the
protruding portion is not limited to both ends of the pad
11 (which are rh$ porLions where the end covers 2 7L and
20 27R are arranged}. For example, the protruding portion
may be set in the center of the pad portion 21 so ay to
limit the rotation angle of the pad 31 relative to the
core materia] 33. Accordingly, the location of the
protruding portion can be anywhero in the extending
25 directioEi of the pad IK
[0059!
[1-2. First Modified Example]
Figs. bA and 5B are cross-sectional views
illustrating a first modjfled example of the pad portion
30 of the headphone of the present disclosure. Fig. 6A is
an exploded perspective view illustrating the tirst
10
S^338911WG00
modified example of the pad portion of the headphone? of
the present disclosure. Pig. 5A is a schematic view
illustrating an example of a croau-section of the pad
portion when cut along a plane (El of Fig. 2A)
5 perpendiculax to a direction connecting the right and
left headphone units. Fig. 5B its a schematic view
illustrating an example of a cross-section of the head
band when cut along a plane {T,?. of Fig, 2A) including a
direction connecting the right and left headphone units
10 and including a vertical direction. In Fig. bB, the
covering materia]. 37 is not shown.
[0060]
The pad portion 23 illustrated in Fig. 5A is
equivalent to the pad portion 21 of the ttbove-described
lb embodiment as including the lower cushion material 31,
the core material 33, the upper cushion material 35, and
the covering material 37. The pad portion 23 illustrated
in Figs, 5A and 5B differs from the pad portion 21 of the
above-described embodiment in that a supporting plate 41
20 shaped like an arc is further included between the lower
cushion material 31 and the nor^ material 33. Figs. 5A
and 5B illustrate examples of the pad portion 23 that
further includes a supporting plate 43 shaped like an arc
between the core material 33 and the upper cushion
2b material 35.
[00613
As illustrated in Figs. 5K and 5H, and Fig. 6A, in
the pad portion 23, there is a stacked structure
including, for example, the lower cushion material 31,
30 the supporting plate 41, the core material 33, the
supporting plate 43, and Lhe uppei cushion material 35,
19
SP3383UWO00
The stacked body including the lower cushion material 31.,
the supporting plate 41, the core material 33, the
supporting plate 43, and the upper cushion material 35 is
covered with the covering material 37, Both ends of the
5 covering material 37 are fixed, for example, by the end
covers 27Ti and 27R, respectively. The end cover 27R is
forced like the end cover 27L and includes upper and
lower cover bodies 27Ru and 27Rd made of, for example, a
resin material, The upper and lower cover bodies 27Ru
10 .and 27Rd are joined toqethcr by screws Sc3 and Scd.
[0062}
(1-2-1. Supporting Flare)
The supporting plaLc 41 "is formed to have
substantially the same width as the lower cushion
15 maternal 31 and arranged inside the pad portion 23 along
the core material 33. The supporting plate 41 may be
extended, for example, to the inside ef r.he end covers
27L and 27ft.
[0063]
20 The supporting plate 41 is formed by a hard
material compared to the lower cushion material 31. A
maLerial used to form the supporting plate 41 may include,
for example, a resin material, a metal, ceramics, and a
plant material. Examples of the resin muLerJal may
2b include polyethylene terephthalate (PET}, polybutylone
terephthalate -(FBT) , polycarbonate {PC) , polyamidc (PA) ,
polyacetal (POM), polyphenylene sulfide (PPS),
polyethylene {PE) , polypropylene {PF) , polystyrene [lJSJ ,
an aorylonitrile-bubadi^ne-styrene (AB5) reain, a
30 meLhacrylic re sir, (acrylic-based resi n} , pol y vinyl
chloride fPVC), s phenol resin, a melamine resin, an
20
SP33H911WO00
epoxy resin, and poly^mioe. The supporting plate 41 may
by formed by a composite material, such as Ei carbon fiber
reinforced plastic or a glass fiber reinforced plastic,
IQQ64]
5 The supporting plate 31 has a function to keep the
shape of the? lower cushion material 31, £y arranging the
supporting plate 41, vjhich is harder than the lower
cushion material 31, between tho core material 33 and the
lower cushion maLeriai 31, the load from the core
10 material 33 can be uniformly transmit Led to the lower
cushion material 31- Accordingly, stablencss of the
headphone can be improved in wearing the headphone.
L0065]
As illustrated in Figs. 5A and bB, and Fig. GA, the
15 supporting plate 43 may be arranged on the side opposite
to the contact surface with Lhe head o± the user relative
to the core material 33- That is, the supporting plate
may additionally be arranged between tho core materia] 33
and the cushion material 35. In this case, the pad
20 portion may not include the upper cushion material 35.
[0066]
By forming the p^d by the combination, of a highly
rigid member and a soft material, while arranging the
soft material on r.he aide where the head of the user is
25 in contact with, the weight of the headphone can be
uniformly distributed over the top of the head of the
user. Accordingly, a large force i 5 not applied only to
a part of the head of tho user, alleviating uncomfortable
feelings in wearing the headphone,
30 [00671
Since the soft material ia arranged on the side of
21
31'33B9liWOaO
the contact area against the head oi Lhe user, the
contact area between the pad and Lhe head of the user can
follow not only the til Ling but alto other shapes of tho
head of Lhe user. Accordinqly, Lhe uncomfortable
5 feelings in wearing the headphone can be prevented,
[0Q6B]
[1-3. Second Modified Example]
h'ig- 6B is ik cross-sectional view illustrating a
second modified example oi Lhe pad portion of Lhe
10 headphone of the present disclosure, h'ig. 6B is a
schematic view illustrating an example of a cross-section
of the pad portion when cut along a plane (El in Fig. 2A)
perpendicular to a direction connecting Lhe right and
left headphone units.
15 {0069]
The pad porLion 25 illustrated in Fig. SB is
similar to the pad portion 21 of tho embodiment described
above as including Lhe lowe?: cushion material 31, Lhe
core material 33, the upper cushion material 35, and the
20 covering material 37. The pad portion 25 illustrated in
Fig. 6H is also similar to that of the first modified
example described above us including, inside the pad
portion ?.':>, a stacked structure of, for example, the
lower cushion material 31, the supporting plate 41, the
25 core material 33, tho supporting plate 43, and the upper
cushion iiuiteri al 35 - Meanwhile, the pad portion 25
illustrated in Fig, 6B differs from the pad portion 21
and the pad portion £3 described above in that a low
friction material 51 is additionally arranged between the
30 lower cushion material 31 and the core material 33.
[0070|
22
3P338911WO00
As illustrated in Fig. 6R; Lhe pad portion 25
includes a stacked structure in which, for example, the
lower cushion material 31, the supporting piste 41, Lho
low friction material 5]r the core material 33, the
5 supporting piaLe 43, and Lhe upper cushion muLeria] 3b
Eiro stacked on top of each other. The stacked body
including the lower cushion maternal 31, the supporting
plate 4lr the low friction material 51, the core material
33, the supporting plate 43, and the upper cushion
0 material 35 is covered wiLh the covering maLerial 37.
Both ends of the covering material 37 arc fixed, for
example, by the end covers 27L and 27R, respectively.
[0U71]
(1-3-1. Low Friction Material)
b The low friction material 51 is formed Lo have at
]east a width equal to a width of the porLion wh^re the
core material 33 and the lower cushion material 31 are in
contact with each other. For example, the low frieLion
material SI may be attached to Lhe surface of the lower
0 cushion [material 31 or the supporting plate 41 along Lhe
core material 33. AlLernativeiy, the low friction
maLeriai 51 may cover the ouLer side of the core material
33.
[0072]
5 The low friction material 51 is interposed between
the core maLerial 33 and the lower cushion maLerial 31 to
reduce frictional force therebetween. Accordi nqly, the
lower cushion material 31 can easily rotate relative to
Lhe core material 33. Therefore, as the low friction
0 maLerial 51, a maLerial having a reduced rolling frieLion
coefficient, compared Lo the case where Lhe core material
23
spssRyiiwooo
33 is in direct contact, with the lower cushion material
31, between the core material 33 and the lower cushion
material 31 would be selected.
[00V3]
3 thor example, the low friction material 51 ia made
of cloth, and is preferably made of fabric such as felt,
velvet, satin cloth, organdy cloth, and woven cloth
called georgette. Alternatively, the low friction
material 51 may be formed as a supporting plate with a
10 fluororesin layer formed thereon. By providing the
protrusion/recess shape on the surface of the lower
cushion material 31 and thy supporting plate 41, it may
be possible to decrease the contact area between the core
material 33 and the lower cushion material 31 to thereby
15 reduce the friction force therebetween,
[OCTM]
By arranging the low friction material 51 at the
contact surface between the core material 33 and the
lower cushion material 31., the lower cushion material 31
20 can rotate more smoothly relative to- the core material 33
to follow the shape of a head more easily.
[0075]
As described above, in the present disclosure, the
contact surface between the cere material 33 and the
25 lower cushion material 31 is not fixed, and the pad 11 is
made rot at able relative to thta core material 33, That is,
unlike the structure of the headphone jn the related art
in which the cushion material is constantly in contact
with the core material vertically, tho lower cushion
30 material 31 of. the present disclosure rotates about the
core material 33 while being constantly in contact with
24
SP33B911WO0Q
the core maternal 33. In the present disclosure,
therefore, it is possible to uniformly transmit the load
applied to the core material 33 over the lower cushion
material 31.
5 [0076]
In the present disclosure, as illustrated in Fig,
IB, Lhe pad II follows the tilting of the head at the top
of the head of the user wearing the headphone 1 and
rotates in the tilting direction. Accordingly, the
l.n contact area between the pad 11 and the head of the user
is increased, which allows the uniform contact of the
entire surface of the pad portion with the top of the
head of the user to more uniformly transmit the weight of
the headphone l over the top of the head. In the present
15 disclosure, therefore, -che weight of the headphone 1 can
be supported uniformly over the top of the head of the
user.
[0077]
For example, in the case of a so-called free-
20 adjusting structure where a pad is provided independently
from a core material and supported by the force n f- rubber
or a spring, the weight of the headphone cannot uniformly
be transmitted on the pad, and a large force may be
applied to a portion of the head of the user. Meanwhile,
25 in 3_he present disclosure, the pad is movable with both
ears and the head of the user being fixed to prevent
application of a large force to a portion of the bead of
the user. According]y, improved stableness in wearing
the headphone and more comfortable feelings in wearing
30 the headphone can be realised,
[0 07S]
?5
SP33S91J.WQ00
<2. Modified tfxamplc>
Ailthough the preferred embodiments have been
described above, preferred specific examples are not
limited to the above description and various othor
-i modifications can be conceived,
[0079]
for example, in the above description of the
embodiments, the pad portion is formed by the stacked
body including the lower cushion material, the core
10 material, and the upper cushion material. Alternatively,
the lower and upper cushion materials may be formed
integrally with the core material penetrating
therethrough. That is, a hole, for example, may be
forroed in the center part cf the cross-section of the pad
15 to allow the core material to pass through the hole.
[0080]
In this case, the range of the rctatable angle of
the pad relative to the core material can be limited by
the %hape of the cross-sections of the core material and
20 the hole in the pad portion. Alternatively, the range of
the rotatabie angle of the pad relative to the com
material can also be limited by the shape of the crosssections
of the core material and the hole in the end
cover.
25 [00S11
For example, the present: disclosure is applicable
to a noise canceling type headphone, a headphone for
monitoring in studios, a headset for video games,
earmuffs for noise countermeasure used in shooting or at
30 a construction site, etc. The technique of the present
disciosure is applicable to both open-type and closed -
26
SP330911WG00
type headphones.
[0OB2]
It is noted that the structures, methods, shapes,
materials, f-LAmeri oal values, etc. listed in the abovc-
!> described embodiments, are merely examples, and different
structures, methGds, shapes, materials, numerical values,
etc. may be used as needed. The structures, methods,
shapes, materials, numerical values, etc. described above
may be combined in any way without departing froni the
10 sccpe of the present disclosure.
[0033]
For example, the present disclosure may be
implemented by the following structures.
ID
lo A headphone inc.l udivig a pa^ r of acoustic
reproduction units, a supporting member connecting the
pair of acoustic reproduction units, and a soft member
configured to be rota table relative to the supporting
member and arranged on the side opposite to the head of a
20 person wearing the headphone.
(2)
The headphone according to (1), further including a
hard member, wherein the hard member is arranged along
the supporting member.
25 (3)
The headphone according to [2}, wherein the hard
member is arranged between the supporting member and the
sofz member.
(4)
30 The headphone according to •[!) or {?.) , further
including a low fri ction material, wherein the low
27
SP338911WQ00
friction material is arranged between the supporting
member anc; the soft member.
(M
The headphone according to any one of (1) to (4),
5 wherein a rotation ang^e of the scft member relative to
the supporting member is set within a predetermined fiw^d
range.
RKFERENCE SIGNS LIST
0 L0084]
I HEADPHONE
3 HEA£ BAND
5L, 5R HEADPHONE CJNIT
II PAD
b 21, 23r ?5 PAD PORTION
27L, 27R END COVER
?.3~L PIN
31 LOWER CUSHION MATERIAL
33 CORE MATERIAL
0 41f 43 SUPPORTING PLATE
51 LOW FRI.CTION MATERIAL
28
SPl-ijH^l 1WO00
CLAIMS
!• A headphone comprising:
a pair of acouatir, reproduction units;
5 EI support:.1 ng member connecting the pair of acoustic
reproduction units; and
a soft member configured Lo be rotatable relative
to Lhc supporting member and arranged on Lhe side
opposite tc the head of a person wearing the headphone,
10
2. The headphone according to claim I, further
comprising a hard member,
wherein the hard member is arranged along the
supper Liny jisercber.
15
3. The headphone according to claim 2r wherein the
hard member is arranged bcLween the supporting member and
Lhe sofr. member,
20 4. The headphone according to clarim I, lurLher
comprising a low friction material,
wherein the low friction material is arranged
between the supporting member and the soft member.
2b 5. The headphone according to claim 1, wherein a
rotation angle oi Lhe soft member relative Lo Lhe
supporting member is scL within a predetermined fixed
range.