[001] This disclosure relates generally to heat management, and more particularly to a heat management system for a motor controller system of an electrical vehicle for managing heat generated at the motor controller system.

BACKGROUND
[002] A motor controller system in an electric vehicle is responsible for controlling various operations, such as output torque and speed of the electric motor of the electric vehicle. The motor controller system is configured regulate and monitor the current being supplied to the electric motor from a battery while maintaining the optimum potential difference across the circuit. As a result, heat generation takes place in the silicon-based circuitry that may directly affect the functioning of the motor controller system. For example, uncharacteristic voltage fluctuations, irregularity in the torque variation with the sudden surge in acceleration, mechanical stress leading to overload on the motor and the controller, etc. may ensue as a result of the heat generation.
[003] Some techniques for addressing the heat generation issue are known that provide for cooling (i.e. heat removal) by convection (air) or conduction by coolant. The heat removal by convection can be achieved by providing thin fins on a heatsink and throwing surrounding air on the fins. Alternately, heat removal can be achieved by circulating a coolant through copper tubes (because of their high conduction coefficient which enables it to not store the heat but to let the heat flux travel across the material thickness).
[004] However, the above techniques may not be suitable for controlling the temperature of the motor controller systems. As it will be appreciated by those skilled in the art, heat removal by convection-based techniques is higher than by the conduction-based techniques. However, the infrastructure required for the convection-based techniques (e.g. a coolant, fans, etc.) require a large number of components which makes the apparatus bulky, complex, and expensive. Further, these techniques are unable to provide for localized cooling, i.e. cooling on a designated node. Furthermore, greater number of components result in a shorter lifespan of the apparatus. (for example, the vapor compression refrigeration systems have flowing fluids and moving parts). Additionally, the problem of fluid leakage may persist. Moreover, with cooling by heatsink, there is a continuous requirement of flow over the device in a very specific orientation to give maximum efficiency in cooling the circuitry. This limits the positioning of the motor controller system on only certain places, thereby curtailing the flexibility of system design. Also, such limitations in the positioning create problems during performing of maintenance-related activities for the apparatus and the vehicle. Further, the overall design and manufacturing becomes complex and intricate.

SUMMARY
[005] In one embodiment, a heat management system for a motor controller system of an electrical vehicle is disclosed. The heat management system may include one or more Peltier modules. Each of the one or more Peltier modules may have a hot side and a cold side. Each of the one or more Peltier modules may be positioned in proximity to the motor controller system. The heat management system may further include a heat conductive plate positioned in proximity to the one or more Peltier modules. The heat conductive plate may be configured to be conductively coupled to the motor controller system via a first surface of the heat conductive plate. The heat conductive plate may be conductively coupled to the one or more Peltier modules via a second surface of the heat conductive plate and the cold side of the one or more Peltier modules. The heat management system may further include a heat sink having a heat absorbing side and a heat dissipating side. The hot side of each of the one or more Peltier modules may be conductively coupled to the heat absorbing side of the heat sink. The heat management system may further include a convection unit positioned in proximity to the heat dissipating side of the heat sink. The convection unit may be configured to fan air at the heat dissipating side.
[006] In another embodiment, an apparatus is disclosed. The apparatus may include a motor controller system for controlling output torque and speed of a motor of an electrical vehicle. The apparatus may further include a heat management system thermally coupled to the motor controller system for heat management of the motor controller system. The heat management system may include one or more Peltier modules. Each of the one or more Peltier modules may have a hot side and a cold side. Each of the one or more Peltier modules may be positioned in proximity to the motor controller system. The heat management system may further include a heat conductive plate positioned in proximity to the one or more Peltier modules. The heat conductive plate may be configured to be conductively coupled to the motor controller system via a first surface of the heat conductive plate. The heat conductive plate may be conductively coupled to the one or more Peltier modules via a second surface of the heat conductive plate and the cold side of the one or more Peltier modules. The heat management system may further include a heat sink having a heat absorbing side and a heat dissipating side. The hot side of each of the one or more Peltier modules may be conductively coupled to the heat absorbing side of the heat sink. The heat management system may further include a convection unit positioned in proximity to the heat dissipating side of the heat sink. The convection unit may be configured to fan air at the heat dissipating side.
[007] In yet another embodiment, an electric vehicle is disclosed. The electric vehicle may include an electric motor for powering the electric vehicle. The electric vehicle may further include a motor controller system communicatively coupled to the electric motor for controlling output torque and speed of the electric motor of the electrical vehicle. The electric vehicle may further include a heat management system thermally coupled to the motor controller system for heat management of the motor controller system. The heat management system may include one or more Peltier modules. Each of the one or more Peltier modules may have a hot side and a cold side. Each of the one or more Peltier modules may be positioned in proximity to the motor controller system. The heat management system may further include a heat conductive plate positioned in proximity to the one or more Peltier modules. The heat conductive plate may be configured to be conductively coupled to the motor controller system via a first surface of the heat conductive plate. The heat conductive plate may be conductively coupled to the one or more Peltier modules via a second surface of the heat conductive plate and the cold side of the one or more Peltier modules. The heat management system may further include a heat sink having a heat absorbing side and a heat dissipating side. The hot side of each of the one or more Peltier modules may be conductively coupled to the heat absorbing side of the heat sink. The heat management system may further include a convection unit positioned in proximity to the heat dissipating side of the heat sink. The convection unit may be configured to fan air at the heat dissipating side.
[008] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS
[009] The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate exemplary embodiments and, together with the description, explain the disclosed principles.
[010] FIG. 1 is a schematic diagram of side view of a heat management system for a motor controller system of an electrical vehicle, in accordance with an embodiment of the present disclosure.
[011] FIG. 2 is a schematic diagram of a perspective view of a heat conductive plate, in accordance with an embodiment.
[012] FIG. 3 is a schematic diagram of a perspective view of a heat sink, in accordance with an embodiment.
[013] FIG. 4 is a schematic diagram of a side view of a fin of the plurality of fins, in accordance with an embodiment.
[014] FIG. 5 illustrates a top view of the heat management system, in accordance with an embodiment.
[015] FIG. 6 illustrates a rear view of the heat management system, in accordance with an embodiment.
[016] FIG. 7 illustrates a perspective view of the heat management system, in accordance with an embodiment.
[017] FIG. 8 is a schematic diagram of an apparatus, in accordance with an embodiment.
[018] FIG. 9 illustrates a flowchart of a method of assembling the heat management system for the motor controller system of an electrical vehicle, in accordance with an embodiment.
[019] FIG. 10 is a graph showing variation of heat flux with different thickness of Aluminium, in accordance with an embodiment.

DETAILED DESCRIPTION
[020] Exemplary embodiments are described with reference to the accompanying drawings. Wherever convenient, the same reference numbers are used throughout the drawings to refer to the same or like parts. While examples and features of disclosed principles are described herein, modifications, adaptations, and other implementations are possible without departing from the spirit and scope of the disclosed embodiments. It is intended that the following detailed description be considered as exemplary only, with the true scope and spirit being indicated by the following claims. Additional illustrative embodiments are listed below.
[021] Thermoelectric solid-state cooling, for example, Peltier effect-based techniques can be used for heat management of the motor controller system of the electric vehicle. These techniques can be used to achieve localized cooling zones which can be targeted according to the geometry and heat distribution on the motor controller system’s processing chip and supporting capacitors. Further, the size of Peltier module is compact (e.g. 40 millimeters (mm) x 40 mm x 4 mm), which is favorable to be used at a specific location of a heat spot. Furthermore, the heat transfer curve is characteristic to mandatory specifications (e.g. “TEC1 12715” specifications) and can produce a temperature difference of 65 °C for a power input of 255 Watts, thereby making these techniques favorable for implementation in electric vehicles. Furthermore, these solid-state cooling techniques are stationary, i.e. require minimal number of components and moving parts, and therefore, provide for a greater life span of the apparatus, easy serviceability and repairability.
[022] The optimal motor controller system’s temperature should be 35°C to 65°C, depending upon the environmental factors such as ambient temperature, climate and altitude. It may be noted that the basis of conduction heat transfer is dependent on the coefficient of thermal conductivity k (which is the characteristic property of the material). A relation between temperature range which is required dT, and the thickness of the material dx, through which the heat flux Q travels is given by Fourier’s Law, and is as mentioned below:
?? = -?? ???? ????
.
[023] Therefore, according to the design parameters, the selection of Aluminium plate with respective heat flux is selected. A graph 1000 (as represented in the FIG. 10) shows the variation of heat flux with different thickness of Aluminium.
[024] The determination, selection and heat balance of the Peltier module with respect to the heat flux is performed. The Peltier module works as a heat sink for the heat from the motor controller system. The temperature of the heat sink can be controlled with the input voltage and the desired change in temperature. The characteristic phenomena of electron transfer from N-type semiconductor to P-type semiconductor in the presence of an external potential difference creates a temperature difference which can be used to develop desired temperatures at the interface of the cold ceramic side of the Peltier module and hot side of the Aluminium plate. The first layer 112 of thermal compound is evenly applied between the Aluminium plate 110 and the one or more Peltier modules 102. The micronized silver particles suspended in the ceramic based compound enable the smooth flow of heat flux through the interface. The curing age of the compound is subject to the quality, thickness of layer, the size and quantity of suspended material in the compound, and the amount of heat that the material needs to transfer. With the hot side 102h of the one or more Peltier modules 102, a second layer of thermal compound 114 is applied to the heatsink flat face and the Peltier modules 102 are sandwiched between the Aluminium plate 110 and the heatsink 104. The Aluminium-based heatsink 104 has tapered long fin geometry. Forced convection heat transfer Q is the basis of cooling the fins 116 which depends upon the convection heat transfer coefficient h (which is the varying thermal property of the air depending upon the flow of air over a specific geometry and Prandtl number). The change in the temperature required is represented as below:
?T. ?? = h???
[025] A parametric experimentally developed relationship consisting of Reynolds number, Prandtl number is responsible for generating the values of h.
[026] The cabinet fans are mounted over the heatsink to force the air over the fins to cool them. This geometry enables the Peltier module to function as a sink.
[027] Referring to FIG. 1, a schematic drawing of a side view of a heat management system 100 for a motor controller system 108 of an electrical vehicle is illustrated, in accordance with some embodiments of the present disclosure. In some embodiments, the heat management system 100 may include one or more Peltier modules 102. Each of the one or more Peltier modules 102 may have a hot side 102h and a cold side 102c. Each of the one or more Peltier modules 102 may include a Peltier thermoelectric heat pump.
[028] As it will be understood by those skilled in the art, the Peltier thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of a device to the other side, with consumption of electrical energy, depending on the direction of the current. As such, the Peltier thermoelectric heat pump can be used either for heating or for cooling, and therefore, suitable for being used as a temperature controller. As such, based on the electrical energy supplied, the Peltier thermoelectric heat pump develops a hot side and a cold side. The hot side and the cold side may be separated by a distance. This allows to create a hot side and a cold side across each of the one or more Peltier modules 102. As such, this cold side can be used to create a cooling effect at the motor controller system 108.
[029] The one or more Peltier modules 102 may be adapted to remove the heat generated at the motor controller system 108, so as to maintain an optimum temperature at the motor controller system 108. To this end, each of the one or more Peltier modules 102 may be positioned in proximity to the motor controller system 108.
[030] In some embodiments, each of the one or more Peltier modules 102 may be a ceramic-based Peltier module.
[031] In some embodiments, the one or more Peltier modules 102 may be mounted on the motor controller system 108 via a heat conductive plate. As such, the heat management system 100 may include a heat conductive plate 110. The heat conductive plate 110 may have a plate-like flat structure having a first surface 110A and a second surface 110B.
[032] In some embodiments, the heat conductive plate 110 may be conductively coupled to the cold side 102c of the one or more Peltier modules 102 via a first layer 112 of a thermal compound. The thermal compound may include micronized silver particles suspended in a ceramic-based compound. The thermal compound is a heat conductive material capable of transferring heat from one body to another with high efficiency. It may be understood that the first layer 112 of thermal compound may provide for conductively coupling the heat conductive plate 110 to the cold side 102c of the one or more Peltier modules 102 in an efficient manner so as to allow maximum heat transfer between the heat conductive plate 110 and the one or more Peltier modules 102. For example, the first layer 112 of thermal compound may be applied in liquid or semi-liquid state which ensures filling the gaps and crevices between and on the surfaces of the heat conductive plate 110 and the cold side 102c of the one or more Peltier modules 102.
[033] With reference to FIG. 2, a schematic diagram of a perspective view of a heat conductive plate 110 is illustrated, in accordance with an embodiment of the present disclosure. As shown in the FIG. 2, the heat conductive plate 110 may have rectangular shape. For example, the heat conductive plate 110 may have a length of 200 millimeters (mm), a breadth of 150 mm, and a width of the 9 mm.
[034] In some embodiments, the heat conductive plate 110 may be made of Aluminium. In alternate embodiments, the heat conductive plate 110 may be made of any heat conductive material, for example, a metal, an alloy, etc.
[035] The heat conductive plate 110 may be positioned in proximity to the motor controller system 108. The heat conductive plate 110 may be configured to be conductively coupled to the motor controller system 108 via the first surface 110A of the heat conductive plate 110. Further, the heat conductive plate 110 may be conductively coupled to the one or more Peltier modules 102 via the second surface 110B of the heat conductive plate 110. In particular, the heat conductive plate 110 may be conductively coupled to the cold side of the one or more Peltier modules 102 via the second surface 110B of the heat conductive plate 110.
[036] By way of conductively coupling to the heat conductive plate 110, the one or more Peltier modules 102 may cause a cooling effect (i.e. remove heat) at the heat conductive plate 110 at the second surface 110B of the of the heat conductive plate 110. As such, the heat conductive plate 110 is cooled down due to the cooling effect generated by the one or more Peltier modules 102. This cooling of the heat conductive plate 110 can be utilized to remove heat from (i.e. cool) the motor controller system 108.
[037] Therefore, the heat conductive plate 110 may be conductively coupled to the one or more Peltier modules 102 via the second surface 110B of the heat conductive plate 110 and the cold side 102c of the one or more Peltier modules 102. As a result of the cooling effect caused by the one or more Peltier modules 102 at the heat conductive plate 110, the heat conductive plate 110 may cause a cooling effect at the motor controller system 108 through the first surface 110A of the heat conductive plate 110. Therefore, the temperature at the motor controller system 108 can be controlled.
[038] As mentioned above, the one or more Peltier modules 102 develop the cold side 102c and the hot side 102h. While the cold side 102c of the one or more Peltier modules 102 may be used to cool the motor controller system 108, it may be desirable to remove or dissipate the heat generated at the hot side 102h of each of the one or more Peltier modules 102.
[039] To this end, the heat management system 100 may further include a heat sink 104. The heat sink 104 may have a heat absorbing side 104a and a heat dissipating side 104d. The hot side 102h of each of the one or more Peltier modules 102 may be conductively coupled to the heat absorbing side 104a of the heat sink 104.
[040] In some embodiments, the hot side 102h of each of the one or more Peltier modules 102 may be conductively coupled to the heat absorbing side 104a of the heat sink 104 via a second layer 114 of a thermal compound. This thermal compound may include micronized silver particles suspended in a ceramic-based compound. Further, this thermal compound may be made of a heat conductive material capable of transferring heat from one body to another with high efficiency. It may be understood that the second layer 114 of thermal compound may provide for conductively coupling the hot side 102h of one or more Peltier modules 102 with the heat absorbing side 104a of the heat sink 104, in an efficient manner to allow maximum heat transfer therebetween. For example, the second layer 114 of thermal compound may be applied in liquid or semi-liquid state which ensures filling the gaps and crevices between and on the surfaces of the hot side 104h of the one or more Peltier modules 102 and the heat absorbing side 104a of the heat sink 104.
[041] In some embodiments, the heat sink 104 may be made of Aluminium. Alternately, the heat sink 104 may be made of any other heat conductive material selected from a metal, and alloy, etc.
[042] The heat absorbing side 104a of the heat sink 104 may have a flat face, and the heat dissipating side 104d of the heat sink 104 may include a plurality of fins 116. In other words, the plurality of fins 116 may be configured to be positioned towards the heat dissipating side 104d of the heat sink 104, and facing away from the heat absorbing side 104a of the heat sink 104. The heat sink 104 may therefore have a plate like structure having the flat face on the heat absorbing side 104a and the plurality of fins 116 projecting out away from the flat face at the heat dissipating side 104d. Each of the plurality of fins 116 may therefore have a proximal end positioned towards the heat absorbing side 104a and a distal end positioned away from the heat absorbing side 104a.
[043] With reference to FIG. 3, a schematic diagram of a perspective view of a heat sink 104 is illustrated, in accordance with an embodiment of the present disclosure. As shown in the FIG. 3, the heat conductive plate 110 may have the heat absorbing side 104a and the heat dissipating side 104d. The heat absorbing side 104a of the heat sink 104 has a flat face, and the heat dissipating side 104d of the heat sink 104 includes the plurality of fins 116. For example, the heat absorbing side 104a may have a length of 200 millimeters (mm), a breadth of 150 mm, and a width of the 50 mm.
[044] With reference to FIG. 4, a schematic diagram of a side view of a fin 400 of the plurality of fins 116 is illustrated, in accordance with an embodiment of the present disclosure. As it will be understood that the plurality of fins 116 may be provided to so as to increase the effective surface area of the heat sink 104. In some embodiments, as shown in the FIG. 4, the thickness of each of the plurality of fins 116 may be tapering away from the heat absorbing side 104a of the heat sink 104. In other words, the thickness of each of the plurality of fins 116 at the proximal end may be greater than the thickness at the distal end. Further, the thickness from the proximal end may reduce (taper) gradually and uniformly along the length of the fin. Tapering shape of the fins allows for maximum efficiency of heat dissipation by convective heat transfer.
[045] For example, the fin 400 may have a length of 40 mm. Further, the thickness of the fin 400 at the proximal end may be 4 mm, and the thickness of the fin 400 at the distal end may be 1.5 mm. The taper angle (?) may be 2 degrees. It may be noted that the heat sink 104 may include any number of fins depending upon the cooling requirement.
[046] The heat management system (100) may further include a convection unit 106. The convection unit 106 may be positioned in proximity to the heat dissipating side 104d of the heat sink 104. The convection unit 106 may be configured to fan air at the heat dissipating side 104d. To this end, the convection unit 106 may include one or more fans 118. For example, the one or more fans 118 may be powered by electric supply. The one or more fans 118 may such atmospheric air and throw the air at the plurality of fins 116, thereby removing heat from the plurality of fins 116 of the heat sink 104.
[047] In some embodiments, the heat management system 100may further include a temperature controller (not shown in the FIGS. 1-4) provided at the electric supply side of each of the one or more Peltier modules 102. The temperature controller may be configured receive an input to change the temperature at the cold side 102c of each of the one or more Peltier modules 102. Further, the temperature controller may be configured to control the input voltage of each of the one or more Peltier modules 102, in response to the received input. As a result, the temperature developed at the cold side 102c may be controlled. In other words, depending on the extent of heating of the motor controller system 108, the temperature controller may control (i.e. decrease increase or increase) the temperature at the cold side 102c of the one or more Peltier modules 102. To this end, in some embodiments, a temperature sensor may be used to detect the temperature of the motor controller system 108. Based on this detected temperature (i.e. input), the temperature controller may control the input voltage of each of the one or more Peltier modules 102 to thereby control the temperature (low temperature) developed by the one or more Peltier modules 102, to effectively remove heat from the motor controller system 108.
[048] Referring now to FIG. 5, a top view of the heat management system 100 is illustrated in accordance with an embodiment of the present disclosure. The heat management system 100 may include the one or more Peltier modules 102 (not visible in the FIG. 5) and the heat conductive plate 110 (not visible in the FIG. 5) inside a housing 502. Further, as shown in the FIG. 5, the heat management system 100 includes the heat sink 104 and the convention unit 106. The convention unit 106 unit includes one or more fans 118. The fans 118 may be configured to pull ambient air (as indicated by thick arrows) from the surroundings and throw the air at the heat sink 104 (as indicated by thick arrows).
[049] Referring now to FIG. 6, a rear view of the heat management system 100 is illustrated in accordance with an embodiment of the present disclosure. The heat management system 100 includes the one or more Peltier modules 102 (not shown in the FIG. 6) and the heat conductive plate 110 (not shown in the FIG. 6). Further, the heat management system 100 includes the heat sink 104 and the convention unit 106. As shown in the FIG. 6, the heat sink 104 includes the plurality of fins 116. Further, the convention unit 106 includes four fans 118.
[050] Referring now to FIG. 7, a perspective view of the heat management system 100 is illustrated in accordance with an embodiment of the present disclosure. The heat management system 100 includes the one or more Peltier modules (not shown in the FIG. 7) and the heat conductive plate (not shown in the FIG. 7). Further, the heat management system 100 includes the heat sink 104 and the convention unit 106. As shown in the FIG. 7, the heat sink 104 includes the plurality of fins 116. Further, the convention unit 106 includes four fans 118. The fans 118 are configured to pull ambient air (as indicated by thick arrows) from the surroundings and throw the air at the plurality of fins 116 of the heat sink 104, such that the air may escape passing through the plurality of fins 116 (as indicated by thick arrows). As a result, the air may remove the heat absorbed by the heat sink 104 from the hot side 102h of the one or more Peltier modules 102.
[051] Referring now to FIG. 8, a schematic diagram of an apparatus 200 is illustrated in accordance with an embodiment of the present disclosure. The apparatus 200 may be configured to be installed in an electric vehicle to control the operations of the electric motor of the electric vehicle. The apparatus 200 is further capable of performing heat management.
[052] The apparatus 200 may include a motor controller system 108. The motor controller system 108 may control output torque and speed of the electric motor of the electrical vehicle. The apparatus 200 may further include a heat management system 100 thermally coupled to the motor controller system 108 for heat management of the motor controller system 108.
[053] The heat management system 100 may include the one or more Peltier modules 102. Each of the one or more Peltier modules 102 may include comprises a hot side 102h and a cold side 102c. Further, each of the one or more Peltier modules 102 may be positioned in proximity to the motor controller system 108. The heat management system 100 may further include the heat conductive plate 110 positioned in proximity to the one or more Peltier modules 102. The heat conductive plate 110 may be configured to be conductively coupled to the motor controller system 108 via the first surface 110A of the heat conductive plate 110. The heat conductive plate 110 may be conductively coupled to the one or more Peltier modules 102 via a second surface 110B of the heat conductive plate 110. The heat management system 100 may further include the heat sink 104 having the heat absorbing side 104a and the heat dissipating side 104d. The hot side 102h of each of the one or more Peltier modules 102 may be conductively coupled to the heat absorbing side 104a of the heat sink (104). The heat management system 100 may further include the convection unit 106 positioned in proximity to the heat dissipating side 104d of the heat sink 104. The convection unit 106 may be configured to fan air at the heat dissipating side 104d.
[054] An electric vehicle is disclosed. The electric vehicle may include an electric motor for powering the electric vehicle. The electric vehicle may further include the motor controller system 108 communicatively coupled to the electric motor for controlling output torque and speed of the electric motor of the electrical vehicle. The electric vehicle may further include the heat management system 100 thermally coupled to the motor controller system 108 for heat management of the motor controller system 108.
[055] The heat management system 100 may include the one or more Peltier modules 102. Each of the one or more Peltier modules 102 may include the hot side 102h and the cold side 102c. Each of the one or more Peltier modules 102 may be positioned in proximity to the motor controller system 108. The heat management system 100 may further include the heat conductive plate 110 positioned in proximity to the one or more Peltier modules 102. The heat conductive plate 110 may be configured to be conductively coupled to the motor controller system 108 via the first surface 110A of the heat conductive plate 110. The heat conductive plate 110 may be conductively coupled to the one or more Peltier modules 102 via the second surface 110B of the heat conductive plate 110. The heat management system 100 may further include a heat sink 104 having the heat absorbing side 104a and the heat dissipating side 104d. The hot side 102h of each of the one or more Peltier modules 102 may be conductively coupled to the heat absorbing side 104a of the heat sink 104. The heat management system 100 may further include the convection unit 106 positioned in proximity to the heat dissipating side 104d of the heat sink 104. The convection unit 106 may be configured to fan air at the heat dissipating side 104d.
[056] Referring now to FIG. 9, a flowchart of a method 900 of assembling the heat management system 100 for the motor controller system 108 of an electrical vehicle is illustrated, in accordance with an embodiment of the present disclosure.
[057] At step 902, the one or more Peltier modules 102 may be provided. Each of the one or more Peltier modules 102 may be configured to be positioned in proximity to the motor controller system 108. Each of the one or more Peltier modules 102 may have the hot side 102h and the cold side 102c.
[058] At step 904, the first layer 112 of thermal compound may be applied on the cold side 102c of each of the one or more Peltier modules 102. The thermal compound may include micronized silver particles suspended in a ceramic-based compound.
[059] At step 906, the heat conductive plate 110 may be positioned in proximity to the one or more Peltier modules 102. The heat conductive plate 110 may be configured to be conductively coupled to the motor controller system 108 via the first surface 110A of the heat conductive plate 110. Further, the heat conductive plate 110 may be conductively coupled to the one or more Peltier modules 102 via the second surface 110B of the heat conductive plate 110 and the cold side 102c of the one or more Peltier modules 102. Further, the heat conductive plate 110 may be conductively coupled to the cold side 102c of the one or more Peltier modules 102 via the first layer 112 of thermal compound.
[060] At step 908, the second layer 114 of the thermal compound may be applied on the hot side 102h of the one or more Peltier modules 102. The thermal compound may include micronized silver particles suspended in a ceramic-based compound.
[061] At step 910, the heat sink 104 having the heat absorbing side 104a and the heat dissipating side 104d may be conductively coupled to the one or more Peltier modules 102, through the second layer 114 of the thermal compound. In particular, the hot side 102h of each of the one or more Peltier modules 102 may be conductively coupled to the heat absorbing side 104a of the heat sink 104 via the second layer 114 of the thermal compound.
[062] At step 912, the convection unit 106 may be positioned in proximity to the heat dissipating side 104d of the heat sink 104. The convection unit 106 may be configured to fan air at the heat dissipating side 104d.
[063] A heat management system for managing heat generated at the motor controller system of an electrical vehicle is disclosed above. The heat management system uses “TEC1 12715” Peltier modules to cool the motor controller system via conduction. The heat management system employs a heat sink with tapered fins for effectively cooling the hot side of the Peltier modules. An intra layer heat transfer function governs the quantity and position of the modules for localized cooling. The above heat management system provides for a simple design with maximum non-moving parts to reduce the complexity. Further, the heat management system provides for a higher life of the attached utility in comparison to the conventional cooling systems. The heat management system is capable of achieving optimum working temperature of the motor controller system in scenarios when approximately 300 Amperes of direct current (DC) current and 350 Amperes of alternating current (AC) current are being regulated. The heat management system provides channels the heat being generated to the heat sink for smooth functioning of the motor system controller with the help of thermoelectric solid state cooling module i.e. Peltier modules. Due to lesser number of moving part employed by this solid state cooling module, the heat management system is more reliable and with greater life expectancy (as compared to systems with compressors and condensers). Further, the heat management system is quiet (low noise) and versatile and is appropriate for any automobile. It is possible to achieve desired temperature differences with less complications.
[064] It is intended that the disclosure and examples be considered as exemplary only, with a true scope and spirit of disclosed embodiments being indicated by the following claims.

We claim:

1. A heat management system (100) for a motor controller system (108) of an electrical vehicle, the heat management system (100) comprising:
one or more Peltier modules (102), wherein each of the one or more Peltier modules (102) comprises a hot side (102h) and a cold side (102c), wherein each of the one or more Peltier modules (102) is positioned in proximity to the motor controller system (108);
a heat conductive plate (110) positioned in proximity to the one or more Peltier modules (102), wherein the heat conductive plate (110) is configured to be conductively coupled to the motor controller system (108) via a first surface (110A) of the heat conductive plate (110), and wherein the heat conductive plate (110) is conductively coupled to the one or more Peltier modules (102) via a second surface (110B) of the heat conductive plate (110) and the cold side (102c) of the one or more Peltier modules (102);
a heat sink (104) having a heat absorbing side (104a) and a heat dissipating side (104d), wherein the hot side (102h) of each of the one or more Peltier modules (102) is conductively coupled to the heat absorbing side (104a) of the heat sink (104); and
a convection unit (106) positioned in proximity to the heat dissipating side (104d) of the heat sink (104), wherein the convection unit (106) is configured to fan air at the heat dissipating side (104d).

2. The heat management system (100) as claimed in claim 1,
wherein the heat conductive plate (110) is made of Aluminium, and
wherein the heat sink (104) is made of Aluminium.

3. The heat management system (100) as claimed in claim 1, wherein each of the one or more Peltier modules (102) is a ceramic-based Peltier module.

4. The heat management system (100) as claimed in claim 1,
wherein heat conductive plate (110) is conductively coupled to the cold side (102c) of the one or more Peltier modules (102) via a first layer (112) of a thermal compound,
wherein the thermal compound comprises micronized silver particles suspended in a ceramic-based compound.

5. The heat management system (100) as claimed in claim 1,
wherein each of the one or more Peltier modules (102) is conductively coupled to the heat absorbing side (104a) of the heat sink (104) via a second layer (114) of the thermal compound,
wherein the thermal compound comprises micronized silver particles suspended in a ceramic-based compound.

6. The heat management system (100) as claimed in claim 1,
wherein heat sink (104) comprises a plurality of fins (116) positioned towards the heat dissipating side (104d) of the heat sink (104), and
wherein thickness of each of the plurality of fins (116) tapers away from the heat absorbing side (104a) of the heat sink (104).

7. The heat management system (100) as claimed in claim 1,
wherein the convection unit (106) comprises one or more fans (118), and
wherein each of the one or more fans (118) is adjacent to distal ends of the plurality of fins (116).

8. The heat management system (100) as claimed in claim 1, further comprising a temperature controller provided at the electric supply side of each of the one or more Peltier modules (102), wherein, wherein the temperature controller is configured to:
receive an input to change the temperature at the cold side (102c) of each of the one or more Peltier modules (102); and
control the input voltage of each of the one or more Peltier modules (102), in response to the received input.

9. An apparatus (200) comprising:
a motor controller system (108) for controlling output torque and speed of a motor of an electrical vehicle; and
a heat management system (100) thermally coupled to the motor controller system (108) for heat management of the motor controller system (108), the heat management system (100) comprising:
one or more Peltier modules (102), wherein each of the one or more Peltier modules (102) comprises a hot side (102h) and a cold side (102c), wherein each of the one or more Peltier modules (102) is positioned in proximity to the motor controller system (108);
a heat conductive plate (110) positioned in proximity to the one or more Peltier modules (102), wherein the heat conductive plate (110) is configured to be conductively coupled to the motor controller system (108) via a first surface (110A) of the heat conductive plate (110), and wherein the heat conductive plate (110) is conductively coupled to the one or more Peltier modules (102) via a second surface (110B) of the heat conductive plate (110);
a heat sink (104) having a heat absorbing side (104a) and a heat dissipating side (104d), wherein the hot side (102h) of each of the one or more Peltier modules (102) is conductively coupled to the heat absorbing side (104a) of the heat sink (104); and
a convection unit (106) positioned in proximity to the heat dissipating side (104d) of the heat sink (104), wherein the convection unit (106) is configured to fan air at the heat dissipating side (104d).

10. An electric vehicle comprising:
an electric motor for powering the electric vehicle;
a motor controller system (108) communicatively coupled to the electric motor for controlling output torque and speed of the electric motor of the electrical vehicle; and
a heat management system (100) thermally coupled to the motor controller system (108) for heat management of the motor controller system (108), the heat management system (100) comprising:
one or more Peltier modules (102), wherein each of the one or more Peltier modules (102) comprises a hot side (102h) and a cold side (102c), wherein each of the one or more Peltier modules (102) is positioned in proximity to the motor controller system (108);
a heat conductive plate (110) positioned in proximity to the one or more Peltier modules (102), wherein the heat conductive plate (110) is configured to be conductively coupled to the motor controller system (108) via a first surface (110A) of the heat conductive plate (110), and wherein the heat conductive plate (110) is conductively coupled to the one or more Peltier modules (102) via a second surface (110B) of the heat conductive plate (110);
a heat sink (104) having a heat absorbing side (104a) and a heat dissipating side (104d), wherein the hot side (102h) of each of the one or more Peltier modules (102) is conductively coupled to the heat absorbing side (104a) of the heat sink (104); and
a convection unit (106) positioned in proximity to the heat dissipating side (104d) of the heat sink (104), wherein the convection unit (106) is configured to fan air at the heat dissipating side (104d).