TITLE OF THE INVENTION: Heating Element Fixing Structure,
Power Conversion Unit, and Power Conversion Apparatus
FIELD OF THE INVENTION
5 [0001]
The present invention relates to a heating element fixing
structure, a power conversion unit, and a power conversion
apparatus.
10 BACKGROUND OF THE INVENTION
[0002]
In the case of air-cooling a heating element such as a
semiconductor module, it is necessary to fix or couple the
heating element such as a semiconductor module and an air cooler.
15 Generally, a heating element such as a semiconductor module
and an air cooler are fixed or coupled with a fixing element
such as a bolt or a screw by using a tool such as a driver or
a wrench. Although the fixing/coupling method is simple, the
process is increased and a space for the work is necessary.
20 It causes decrease in economic performance and increase in the
size of the apparatus.
[0003]
In Patent literature 1, it is described that “a pressuring
jig is constructed by stacking an elastic member 8 and a DC
25 positive-electrode-side wiring member 5 and a DC
2
negative-electrode-side wiring member 6 in which current flows
bidirectionally, a first fixing jig 1 is pressed by the
pressurizing jig, a semiconductor device 3 is pressed by the
first fixing jig 1, and the semiconductor device 3 is fixed
to a heat radiating member 2 in a state where a heat 5 radiation
face of the semiconductor device 3 is in contact with side-wall
faces 2c and 2d of the heat radiating member 2”.
Related Art Literature
10 Patent Literature
[0004]
Patent Literature 1
Japanese Unexamined Patent Application Publication No.
2006-286676
15
SUMMARY OF THE INVENTION
[0005]
In the patent literature 1, the first fixing jig 1 is
pressed by the pressurizing jig, the semiconductor device 3
20 is pressed by the first fixing jig 1, and the semiconductor
device 3 is fixed to the heat radiating member 2 in a state
where the heat radiation face of the semiconductor device 3
is in contact with the side-wall faces 2c and 2d of the heat
radiating member 2. Consequently, the pressurizing force is
25 applied to the semiconductor and there is also the possibility
3
that the size of a cooler increases.
[0006]
The present invention has been achieved in consideration
of the above-described circumstances and an object of the
invention is to provide a small heating element fixing 5 structure
which efficiently cools a heating element such as a semiconductor
module.
[0007]
To solve the problem, for example, there is provided a
10 heating element fixing structure including: a heating element
having opposed two planes, at least one of the two planes being
a cooling face; a pair of heat receiving plates provided so
as to cover the two planes; an elastic member provided in a
region in which the pair of heat receiving plates face each
15 other; and a cooler having a slot in which the heating element
and the pair of heat receiving plates are inserted and cooling
the pair of heat receiving plates. When the heating element
and the pair of heat receiving plates are inserted in the slot,
a pressing force which makes the pair of heat receiving plates
20 come into contact with an inner wall face of the slot is applied
by the elastic member.
[0008]
The present invention provides a small heating element
fixing structure which efficiently cools a heating element such
25 as a semiconductor module.
4
BRIEF DESCRIPTION OF THE DRAWINGS
[0009]
FIG. 1 is a circuit diagram of a power conversion apparatus
5 100 according to an embodiment of the present invention.
FIG. 2 is a circuit diagram of a converter 102 in the
power conversion apparatus 100.
FIG. 3 is a circuit diagram of an inverter 103 in the
power conversion apparatus 100.
10 FIG. 4 is a circuit diagram of a chopper 104 in the power
conversion apparatus 100.
FIG. 5A is an external view of a double-side cooling power
module 600.
FIG. 5B is a circuit diagram of the double-side cooling
15 power module 600.
FIG. 6A is a perspective view of a heat receiving spacer.
FIG. 6B is a perspective view of a heat receiving spacer.
FIG. 7 illustrates a state where the heat receiving spacers
630A and 630B are attached to the double-side cooling power
20 module 600.
FIG. 8 is an enlarged plan view of a part B surrounded
with the broken line in FIG. 7.
FIG. 9 is an enlarged view of a main part (end part) in
the section taken along line A-A’ in FIG. 7.
25 FIG. 10A illustrates a state before the double-side
5
cooling power module 600 is attached to a cooler 610, which
is seen from the x-axis direction.
FIG. 10B illustrates a state where the double-side cooling
power module 600 is attached to the cooler 610, which is seen
5 from the x-axis direction.
FIG. 10C illustrates a state where the double-side cooling
power module 600 is attached to the cooler 610, which is seen
from the z-axis direction.
FIG. 11A is an external view of a unit-converter unit
10 1101 seen from the y-axis direction.
FIG. 11B is an external view of the unit-converter unit
1101 seen from the z-axis direction.
FIG. 12 is an external view of a power conversion apparatus
150 in which a plurality of unit-converter units 1101 are
15 disposed.
FIG. 13 is an external view in the case of fixing the
double-side cooling power module 600 in the embodiment to the
cooler.
FIG. 14 is an external view in the case of fixing the
20 double-side cooling power module 600 in the embodiment to the
cooler 610.
FIG. 15 illustrates a modification of a slot 611 in the
cooler.
FIG. 16 illustrates a modification of the slot 611 in
25 the cooler.
6
FIG. 17 is an external view in the case of employing a
heatsink 1701 in which heat radiation fins 1702 are provided
for the cooler 610.
FIG. 18 is an external view in the case of providing the
5 cooler 610 with heat pipes 1801 and radiation fins 1802.
FIG. 19 is an external view in the case where two or more
double-side cooling power modules 600 are inserted per cooler
610 and coupled in electrically parallel.
FIG. 20 illustrates a modification of heat receiving
10 spacers 630A and 630B which are attached to the double-side
cooling power module 600.
FIG. 21 illustrates a second modification of heat
receiving spacers 630A and 630B which are attached to the
double-side cooling power module 600.
15
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010]
Electrical Configuration of Power Conversion Apparatus
The configuration of a power conversion apparatus 100
20 according to an embodiment of the present invention will be
described.
[0011]
FIG. 1 is a circuit diagram of the power conversion
apparatus 100 according to the embodiment.
25 [0012]
7
As illustrated in FIG. 1, to the power conversion apparatus
100, AC power adjusted to proper voltage is supplied from a
power reception point 107 of a power system via a transformer
105. The AC power supplied is supplied to a converter 102 and
converted to DC power. The DC power is supplied to 5 an inverter
103 and converted to AC power. The AC power is consumed by
a three-phase AC load 108.
[0013]
On the other hand, when power is not supplied to the
10 converter 102 due to a trouble in the power system or the like,
it is detected by a high-order control circuit 109, and a chopper
104 operates. The DC power supplied from a battery 106 is
adjusted to proper power by the chopper 104 and the proper power
is supplied to the inverter 103. The DC power supplied to the
15 inverter 103 is converted to AC power and consumed in the
three-phase AC load 108.
[0014]
The above operation is adjusted by determining desired
operation in the high-order control circuit 109 by an instruction
20 signal 110C to the converter 102, an instruction signal 110I
to the inverter 103, and an instruction signal 110X to the chopper
104. At the time of the operation, heat is generated and
temperature rises in the converter 102, the inverter 103, and
the chopper 104. To suppress the temperature rise, a cooling
25 air 111 generated by a cooling fan 101 (air blower) is sent
8
to cool them. The cooling fan 101, the converter 102, the
inverter 103, the chopper 104, the high-order control circuit
109, and the like in the electric system configured as described
above are housed in the power conversion apparatus 100 in the
embodiment. As necessary, a filter circuit may 5 be disposed
between the converter 102 and the transformer 105 or between
the inverter 103 and the AC load 108.
[0015]
FIG. 2 is a circuit diagram of the converter 102 in the
10 power conversion apparatus 100. FIG. 3 is a circuit diagram
of the inverter 103 in the power conversion apparatus 100. FIG.
4 is a circuit diagram of the chopper 104 in the power conversion
apparatus 100. Hereinafter, the circuits of the converter 102,
the inverter 103, and the chopper 104 will be described with
15 reference to FIGS. 2 to 4.
[0016]
The converter 102 illustrated in FIG. 2 is constructed
by legs 203 (203R, 203S, and 203T) made by a plurality of
semiconductor elements, and the leg 203 is constructed by a
20 plurality of switching elements 204 (for example, 204RH and
204RL) and diode elements 205 (for example, 205RH and 205RL).
Hereinafter, in the case of referring to the elements, they
will be called collectively as the legs 203, the switching
elements 204, and the diode elements 205.
25 [0017]
9
Both ends of the legs 203 are coupled to a capacitor 201.
The upper arm of the leg 203R is constructed by the switching
element 204RH and the diode element 205RH for reflux. The lower
arm of the leg 203R is constructed by the switching element
204RL and the diode element 205RL for reflux. Similarly, th5 e
upper arm of the leg 203S is constructed by a switching element
204SH and a diode element 205SH for reflux. The lower arm of
the leg 203S is constructed by a switching element 204SL and
a diode element 205SL for reflux. The upper arm of the leg
10 203T is constructed by a switching element 204TH and a diode
element 205TH for reflux. The lower arm of the leg 203T is
constructed by a switching element 204TL and a diode element
205TL for reflux. Switching signals to the switching elements
204RH, 204RL, 204SH, 204SL, 204TH, and 204TL are controlled
15 by a converter gate control unit 202 as a low-order control
unit.
[0018]
As the switching element of the embodiment, an element
which can switch on/off of current can be used. For example,
20 an IGBT (Insulated Gate Bipolar Transistor) or a power MOSFET
(Metal Oxide Semiconductor Field Effect Transistor) can be used.
[0019]
The inverter 103 illustrated in FIG. 3 is constructed
by legs 203 (203U, 203V, and 203W) made by a plurality of
25 semiconductor elements, and both ends of the legs 203 are coupled
10
to a capacitor 301. The upper arm of the leg 203U is constructed
by a switching element 204UH and a diode element 205UH for reflux.
The lower arm of the leg 203U is constructed by a switching
element 204UL and a diode element 205UL for reflux. Similarly,
the upper arm of the leg 203V is constructed by a s5 witching
element 204VH and a diode element 205VH for reflux. The lower
arm of the leg 203V is constructed by a switching element 204VL
and a diode element 205VL for reflux. The upper arm of the
leg 203W is constructed by a switching element 204WH and a diode
10 element 205WH for reflux. The lower arm of the leg 203W is
constructed by a switching element 204WL and a diode element
205WL for reflux. Switching signals to the switching elements
204UH, 204UL, 204VH, 204VL, 204WH, and 204WL are controlled
by an inverter gate control unit 302 as a low-order control
15 unit.
[0020]
The chopper 104 illustrated in FIG. 4 is constructed by
a leg 203X made by a semiconductor element, and both ends of
the leg 203X are coupled to a capacitor 401. The upper arm
20 of the leg 203X is constructed by a switching element 204XH
and a diode element 205XH for reflux. The lower arm of the
leg 203X is constructed by a switching element 204XL and a diode
element 205XL for reflux. An interconnection point of the
switching elements 204XH and 204XL is coupled to the battery
25 106 (refer to FIG 1) via a reactor 403. Switching signals to
11
the switching elements 204XH and 204XL are controlled by a
chopper gate control unit 402 as a low-order control unit.
[0021]
As an example of the control operation, an example of
5 the chopper gate control unit 402 will be described.
[0022]
A switching signal supplied to the chopper 104 is given
via a voltage increase/decrease switching circuit (not
illustrated). The selection depends on the magnitude relation
10 between the DC voltage value between the converter 102 and the
inverter 103 and an output voltage value of the converter 102
(rectifying function). When an output of the chopper 104 is
larger than the output voltage of the converter 102, a PWM (Pulse
Width Modulation) signal is transmitted to the switching element
15 204XL. When the output voltage of the converter 102 is larger
than an output of the chopper 104, a PWM signal is transmitted
to the switching element 204XH.
[0023]
In the case of discharging power of the battery 106, the
20 switching element 204XL is switched according to the PWM signal.
When the switching element is turned on, energy is accumulated
in the reactor 403. On the other hand, when the switching element
is off, the capacitor 401 is charged with a voltage higher than
the voltage of the battery 106 by the voltage of the battery
25 106 and the energy of the reactor 403 via a diode element 205XH
12
coupled to the switching element 204XH.
[0024]
In the case of charging the battery 106 with power, the
switching element 204XH is switched according to the PWM signal.
When the switching element 204XH is turned on, the 5 power of
the capacitor 401 is charged with the battery 106 via the reactor
403. When the switching element 204XH is off, the energy
accumulated in the reactor 403 is circulated via the diode
element 205XL coupled to the switching element 204XL. By the
10 operations, the power of the battery 106 can be
charged/discharged.
[0025]
In a general power conversion apparatus, although there
is a case that capacitors are disposed in a lump, in the embodiment,
15 the capacitors 201, 301, and 401 are separated from the viewpoint
of standardizing the configuration of a unit-converter unit
960 (refer to FIG. 12) which will be described later. Concretely,
the capacitors 201 and 301 are further divided every leg 203.
[0026]
20 By passing/checking current by the switching elements
204 and the diode elements 205 of the legs 203 illustrated in
FIGS. 2 to 4, the converter 102 performs AC to DC conversion
and the inverter 103 performs DC to AC conversion. At the time
of current passage, a loss occurs due to resistors provided
25 in the switching elements 204 and the diode elements 205. A
13
loss also occurs at the time of switching from the current passage
state to the current checking state. Consequently, the
operation of the power conversion apparatus 100 accompanies
heat generation.
5 [0027]
Configuration of Power Unit 600
Next, a double-side cooling power module 600 (a heater,
a semiconductor device for a power conversion apparatus) used
in the embodiment will be described with reference to the
10 external view of FIG. 5A and the circuit diagram of FIG. 5B.
[0028]
In FIG. 5A, the double-side cooling power module 600 is
constructed by a body 710 having an almost rectangular
parallelepiped shape, a flange 720 having an almost rectangular
15 parallelepiped shape formed so as to expand one side face of
the body 710, and a terminal part 730 made of a plurality of
terminals projected from the face opposite to the body 710 in
the flange 720. The terminals constructing the terminal part
730 are constructed by a P terminal 704P, an N terminal 704N,
20 an AC terminal 704AC, and gate terminals 751 illustrated in
FIG. 5B.
[0029]
In FIG. 5B, the double-side cooling power module 600
includes switching elements 204MH and 204ML and diode elements
25 205MH and 205ML mounted over a not-illustrated insulator 753.
14
The semiconductor elements are coupled so as to construct the
leg 203 (refer to, for example, FIG. 2). To the not-illustrated
insulator 753, the P terminal 704P (DC positive-electrode
terminal), the N terminal 704N (DC negative-electrode terminal),
the AC terminal 704AC (AC terminal), and the gate 5 terminal 701
controlling the on/off state of the switching element are
attached.
[0030]
Referring again to FIG. 5A, from a face 760A of the body
10 710, a number of (total about 200 or more) pin fins 762A as
minute-cylinder-shaped projections are projected. Also in
another face 760B opposite to the face 760A in the body 710,
pin fins 762B (not illustrated) of the same number are formed.
Hereinbelow, in some cases, the pin fins 762A and 762B will
15 be collectively simply called “pin fins 762”. The faces 760A
and 760B will be called “cooling faces”. The thickness of the
body 710 excluding the pin fins 762, that is, the distance between
the cooling faces 760A and 760B is set as “d1”.
[0031]
20 In the embodiment of the present invention, a mode that
pin fins are not provided for the cooling faces 760A and 760B
and a mode that a cooling face is provided only on one side
not both sides are also assumed. In the following embodiment,
the double-side cooling power module 600 in which pin fins are
25 provided on the cooling faces will be described as an example.
15
[0032]
When the above-described semiconductor elements operate,
electric conduction is obtained with the outside via the terminal
part 730 and, on the other hand, heat is discharged via the
cooling faces 760A and 760B. That is, the terminal 5 part 730
is formed on one side face adjacent to the cooling faces 760A
and 760B and the cooling faces 760A and 760B are electrically
insulated, so that a heat transport path and an electric path
are independent.
10 [0033]
Mechanical Configuration of Cooling-Type Double-Side Cooling
Power Unit
FIGS. 6A and 6B are perspective views of heat receiving
spacers.
15 [0034]
A pair of heat receiving spacers 630A and 630B illustrated
in FIG. 6A is attached to the cooling faces 760A and 760B of
the double-side cooling power module 600. The heat receiving
spacer 630A is constructed by a heat receiving part 631A (heat
20 receiving plate) having an almost rectangular plate shape and
a pair of space assuring parts 632A having an almost rectangular
parallelepiped shape, which project from both ends of the heat
receiving part 631A toward the heat receiving spacer 630B. In
the heat receiving part 631A, a number of cylindrical through
25 holes 633A (holes) are formed. The through holes 633A are formed
16
in positions facing the pin fins 762A of the cooling face 760A
and have a diameter slightly larger than the diameter of the
pin fin 762A. Although it is ideal that the pit fins 762A fit
in the through holes 633A without a gap, since a very small
manufacture error occurs in the diameter and position of 5 the
pin fin 762A, the diameter of the through hole 633A is widened
to the degree that the manufacture error can be absorbed. Except
for the case that one pin fin 762A is inserted in one through
hole 633A, there is also a case that a plurality of pin fins
10 762A are inserted in one through hole 633. The shape of the
through hole 633 is not limited to the cylindrical shape but
may be any shape such as a quadratic prism shape as long as
a pin fin can be inserted. By inserting the pin fins into the
through holes as described above, even when a power unit is
15 mounted so that gravity acts in the – y-axis direction, the
assembled state that the heat receiving spacers 630A and 630B
are attached to the double-side cooling power module 600 is
maintained. In the mode of no pin fins, there are no engagement
parts serving as retaining parts. It is therefore concerned
20 that the heat receiving spacers 630A and 630B slide across the
double-side cooling power module 600. In this case, to prevent
occurrence of sliding, for example, the flange 720 of the
double-side cooling power module 600 and a cooler 610 which
will be described later are fixed by screwing or the like.
25 [0035]
17
The heat receiving spacer 630B is constructed by a heat
receiving part 631B having an almost rectangular plate shape
and a pair of space assuring parts 632B having an almost
rectangular parallelepiped shape, which project from both ends
of the heat receiving part 631B toward the heat 5 eat receiving spacer
630B. The heat receiving spacer 630B has a shape which is line
symmetric to the heat receiving spacer 630A. In the heat
receiving part 631B, through holes 633B are formed in positions
facing the pin fins 762B projected from the cooling face 760B
10 of the double-side cooling power module 600. Similarly, the
heat receiving spacer 630A is constructed by the heat receiving
part 631A having an almost rectangular plate shape and the pair
of space assuring parts 632A having an almost rectangular
parallelepiped shape, which project from both ends of the heat
15 receiving part 631A toward the heat receiving spacer 630B. The
heat receiving space 630B has a shape which is line symmetric
to the heat receiving spacer 630A.
[0036]
The heat receiving spacers 630A and 630B are preferably
20 made of a highly heat-conductive metal such as aluminum or copper
from the viewpoint of heat radiation characteristic. When it
is necessary to insulate the double-side cooling power module
600 and the cooler 610 from each other, resin, ceramics, or
the like may be used for the heat receiving spacers 630A and
25 630B.
18
[0037]
The space assuring parts 632A and 632B do not have to
be provided at both ends in the x-axis direction in the xz plane
of the heat receiving spacer but may be provided in positions
so that the interval between the heat receiving spacers 5 cers can
be assured when they are assembled to the double-side cooling
power module 600. The space assuring parts do not have to be
integrated with the heat receiving spaces but may be assembled
as separate parts to the heat receiving spacers.
10 [0038]
FIG. 7 illustrates a state where the heat receiving spacers
630A and 630B are attached to the double-side cooling power
module 600.
[0039]
15 At the time of attaching the heat receiving spacers 630A
and 630B to the double-side cooling power module 600, a heat
conduction grease 606 is sufficiently applied to the cooling
faces 760A and 760B and, while adjusting the positions of the
through holes 633A and 633B to the pin fins 762, the space assuring
20 parts 632A and 632B are attached. An elastic member 801 is
provided for the attachment faces of the space assuring parts
632A and 632B. Although an end face 710a of the body 710 is
exposed, most part of the cooling faces 760A and 760B is covered
with the heat receiving spacers 630A and 630B. In place of
25 the heat conduction grease 606, a heat conduction sheet may
19
be used.
[0040]
FIG. 8 is an enlarged plan view of a part B surrounded
with the broken line in FIG. 7.
5 [0041]
Since the diameter of the through hole 633A is slightly
larger than that of the pin fin 762A as described above, the
pin fin 762A is loosely fit in an airspace 635 formed between
the through hole 633A and the pin fin 762A. At this time, the
10 heat conduction grease applied to the pin fin 762A penetrates
so as to be pushed into the airspace 635, and the airspace 635
is filled with the heat conduction grease.
[0042]
FIG. 9 is an enlarged view of a main part (end part) in
15 the section taken along line A-A’ in FIG. 7.
[0043]
When the space assuring parts 632A and 632B are attached,
the heat receiving parts 631A and 631B face each other with
a predetermined distance. The distance is set as d2. The space
20 receiving spacers 630A and 630B are formed so that the distance
d2 becomes slightly larger than thickness d1 of the body 710
of the both-side cooling power module 600. As a result, an
airspace 637A is formed between the heat receiving part 631A
and the body 710 and an airspace 637B is formed between the
25 heat receiving part 631B and the body 710. By having the
20
airspaces 637A and 637B, also in the case where a pressing force
F as an external force is applied to the heat receiving parts
631A and 631B, a pressing force to the both-side cooling power
module 600 can be prevented. Since there is allowance for the
heat receiving spacers 630A and 630B in the both-side 5 de cooling
power module 600, the widths of the airspaces 637A and 637B
are not always the same.
[0044]
When the space assuring parts 632A and 632B are attached,
10 the heat conduction grease applied to the pin fins 762 penetrates
so as to be pushed also into the airspaces 637A and 637B, and
the airspaces 637A and 637B are also filled with the heat
conduction grease. A thickness of the body 710 from the tip
of the pin fin 762A to the tip of the pin fin 762B is set as
15 d4, and the width of the entire body when the heat receiving
spacers 630A and 630B is set as d5. The heat receiving spacers
630A and 630B are formed so that the width d5 becomes larger
than the thickness d4. With the configuration, an airspace
639A is formed between the top face of the heat receiving spacer
20 630A and the tip of the pin fin 762A and an airspace 639B is
formed between the under face of the heat receiving spacer 630B
and the tip of the pin fin 762B. By having the airspaces 639A
and 639B, as described above, there is allowance for the heat
receiving spacers 630A and 630B in the both-side cooling power
25 module 600, the widths of the airspaces 637A and 637B are not
21
always the same.
[0045]
At the time of attaching the heat receiving spacers 630A
and 630B to the cooler 610 (whose details will be described
later), pressing forces F as illustrated by arrows hatched 5 tched are
applied. The pressing force F is applied to the attachment
part between the space assuring parts 632A and 632B. In the
embodiment, the airspaces 637A and 637B are formed between the
body 710 and the heat receiving spacers 630A and 630B, and the
10 airspaces 639A and 639B are formed also in the tip parts of
the pin fins 762A and 762B, so that the pressing force can be
prevented from being applied to the both-side cooling power
module 600 via the pin fins 762A and 762B. As a result, breakage
of the both-side cooling power module 600 can be prevented.
15 The elastic member 801 is attached to the attachment part of
the air assuring parts 632A and 632B. As the elastic member
801, a resin plate having elasticity can be used. Alternatively,
a spring member made of metal or the like can be also used.
Accordingly, the interval d2 between the faces opposite to the
20 cooling faces of the heat receiving spacers and the interval
d5 between the surfaces of the heat receiving spacers change
in the expansion and contraction range of the elastic member.
At the time of compressing the elastic member, a repulsion force
f according to the compression amount is generated, and a force
25 of pressing the heat receiving spacer in the vertical directions
22
is generated.
[0046]
FIG. 10A illustrates a state before the double-side
cooling power module 600 is attached to the cooler 610, which
is 5 seen from the x-axis direction.
[0047]
As illustrated in FIG. 10A, the heat receiving spacers
630A and 630B are sandwiched by the both-side cooling power
module 600. The elastic member 801 is provided for the
10 attachment part between the heat receiving spacers 630A and
630B. A cooler 610A has a slot 611 in which the power module
is to be inserted and has a dimension H in the z-axis direction,
a dimension W in the y-axis direction, and a dimension S in
the x-axis direction (not illustrated). In the case of
15 attaching the both-side cooling power module 600 to the cooler
610, as illustrated, the pressing force F in the y-axis direction
is applied to the heat receiving spacers 630A and 630B. By
changing the dimensions d2 and d5, the both-side cooling power
module 600 is attached in the slot 611.
20 [0048]
Concretely, design is made so that the dimension W of
the slot 611 is smaller than the dimension d5 under the situation
that the pressing force F is not applied to the heat receiving
spacers 630A and 630B (the elastic member 801). At the time
25 of inserting the both-side cooling power module 600 into the
23
slot 611, the elastic member 801 is compressed via the heat
receiving spacers 630A and 630B so that the dimension d5 becomes
equal to or smaller than the dimension W of the insertion hole
in the cooler. While maintaining the state, the both-side
cooling power module 600 is inserted in the slot in the 5 cooler.
When it is inserted sufficiently, the pressing force F to the
heat receiving spacers 630A and 630B (the elastic member 801)
is released.
[0049]
10 FIG. 10B illustrates a state where the double-side cooling
power module 600 is attached to the cooler 610, which is seen
from the x-axis direction. By the inserted double-side cooling
power module 600, a force pressing the heat receiving spacers
630A and 630B against heat receiving faces 612 of the cooler
15 610 is applied by the repulsion force N of the elastic member
801. By the force, when the double-side cooling power module
600 is moved in the x, y, or z axis direction, a static frictional
force acts. Consequently, the double-side cooling power module
600 can be fixed to the cooler 610. When the heat receiving
20 spacers 630A and 630B come into contact with the heat receiving
faces 612 by the repulsion force N, heat generation from the
both-side cooling power module 600 can be efficiently
transmitted to the cooler 610.
[0050]
25 FIG. 10C illustrates a state where the double-side cooling
24
power module 600 is attached to the cooler 610, which is seen
from the z-axis direction. Although the dimension d5 (refer
to FIG. 10A) can be flexibly changed in the y-axis direction
by the elastic member, there is no such adjustment allowance
in the x-axis direction. There is, consequently, 5 a concern
that the both-side cooling power module 600 cannot be inserted
in the cooler 610 depending on the tolerance of the hole dimension
in the x-axis direction. Consequently, it is preferable that
the hole dimension in the x-axis direction is sufficiently larger
10 than the dimension of the double-side cooling power module 600.
[0051]
Although the cooling faces 760A and 760B of the double-side
cooling power module 600 are flat faces and the heat receiving
parts 631A and 631B have a flat plate shape in the foregoing
15 embodiment, the cooling faces 760A and 760B may not be always
flat faces. By making the shapes of the heat receiving parts
631A and 631B shapes along the cooling faces 760A and 760B,
an effect similar to that of the embodiment can be produced.
[0052]
20 Configuration of Unit-Converter Unit
Next, a unit-converter unit 1101 in the embodiment will
be described with reference to FIGS. 11A and 11B and FIG. 12.
[0053]
FIG. 11A is an external view of the unit-converter unit
25 1101 seen from the y-axis direction.
25
[0054]
The unit-converter unit 1101 is provided with the
double-side cooling power unit 600, the cooler 610 in which
the double-side cooling power unit 600 is inserted, and a
capacitor 152. The P terminal 704P (refer to FIGS. 5A 5 and 5B),
the N terminal 704N, and the AC terminal 704AC of the electric
terminals of the double-side cooling power unit 600 are coupled
to a bus bar. Further, the gate terminal 751 of the electric
terminal is coupled to a gate driver substrate 954. A
10 positive-electrode terminal 952P and a negative-electrode
terminal 952N of a capacitor 951 are coupled to the bus bar.
[0055]
A cooling air is sent from the – x-axis direction to the
unit-converter unit 1101. In this manner, the capacitor can
15 be cooled without receiving fanned heat from the double-side
cooling power unit 600.
[0056]
FIG. 11B is an external view of the unit-converter unit
1101 seen from the z-axis direction.
20 [0057]
External Configuration of Power Conversion Apparatus
FIG. 12 is an external view of a power conversion apparatus
150 in which a plurality of unit-converter units 1101 are
disposed.
25 [0058]
26
In the power conversion apparatus 150, the converter 152,
an inverter 153, and a chopper 154 are disposed side by side.
The converter 152 is constructed by unit-converter units 960
corresponding to the three legs 203R, 203S, and 203T illustrated
in FIG. 2. The inverter 153 is constructed by unit-5 converter
units 960 corresponding to the three legs 203U, 203V, and 203W
illustrated in FIG. 3. The chopper 154 is constructed by one
unit-converter unit 960. The converter 152, the inverter 153,
and the chopper 154 may be arranged in an order different from
10 that of the embodiment, and may be arranged in different phase
sequence in each of the converter 152, the inverter 153, and
the chopper 154.
[0059]
In a method of cooling the unit-converter units in the
15 power conversion apparatus illustrated in FIG. 12, in a manner
similar to FIG. 10, the cooling air is sent to the cooler.
Consequently, there is an advantage that even when the
unit-converter units 960 are arranged closely side by side in
the power conversion apparatus 150, the cooling effect between
20 the unit-converter units 960 is not reduced. When the
semiconductor element temperatures in the converter 152, the
inverter 153, and the chopper 154 are different, the speeds
of cooling airs 853A, 853B, and 853C and the like may be changed.
[0060]
25 As described above, the power conversion apparatus 150
27
is constructed by arranging the unit-converter units 1101 and
coupling them via a bus bar.
[0061]
FIG. 13 is an external view in the case of fixing the
double-side cooling power module 600 in the embodiment 5 ent to the
cooler.
[0062]
At the time of fixing the double-side cooling power module
600 to the cooler 610, as illustrated in FIG. 13, a space for
10 using a conventional fixture such as a bolt and a tool such
as a driver and a space for operation in the y-axis and z-axis
directions are necessary. Consequently, the size of the
apparatus is increased by the amount.
[0063]
15 FIG. 14 is an external view in the case of fixing the
double-side cooling power module 600 in the embodiment to the
cooler 610.
[0064]
According to the embodiment, the elastic member 801 is
20 compressed via the heat receiving spacers 630A and 630B and,
while maintaining the state, the double-side cooling power
module 600 is inserted in the slot of the cooler, so that the
work space in the y-axis direction becomes unnecessary, and
the size can be reduced. In the embodiment, the power module
25 and the cooler are fixed by the repulsion force generated by
28
the elastic member attached between the space assuring parts
(632A and 632B), fixtures such as bolts and tools such as drivers
are not necessary. Consequently, the manufacturing process
is made simpler and economic performance can be improved.
5 [0065]
Modifications
The present invention is not limited to the foregoing
embodiment but can be variously modified, for example, as
follows.
10 [0066]
FIG. 15 illustrates a modification of the slot 611 in
the cooler.
[0067]
The shape of the slot 611 in the cooler is not limited
15 to that in the embodiment. As long as the double-side cooling
power module 600 can be fixed to the heat receiving faces 612
of the cooler 610 by applying the repulsion force to the heat
receiving spacers, the slot 611 can be changed to various shapes
and dimensions. For example, as illustrated in FIG. 15, a face
20 in the slot width W in the yz plane may not be provided and
the slot can be penetrated in the vertical direction. In this
case, the member of the slot width W in the yz plane can be
reduced, and there is an advantage that the weight of the
apparatus can be reduced.
25 [0068]
29
As illustrated in FIG. 16, the shape of the slot 611 in
the cooler may be constructed so that the walls of the cooler
are only the heat receiving faces 612. In this case, there
is an advantage that the members in the xy plane in the slot
611 can be reduced, and the weight of the apparatus can be 5 reduced.
Further, options of a method capable of forming the structure
increase. For example, the modification can be manufactured
by an extrusion method or the like, and there is an advantage
that mass production can be performed at a time.
10 [0069]
Although the shape of the cooler 610 is not clearly
illustrated in the foregoing embodiment, for example, a cooler
using a heat sink or a heat pipe depicted in FIGS. 17 and 18
may be also employed.
15 [0070]
FIG. 17 is an external view in the case of employing a
heatsink 1701 in which heat radiation fins 1702 are provided
for the cooler 610.
[0071]
20 The heatsink 1701 in the case where the heat radiation
fins 1702 are provided so as to extend in the y-axis direction
on the xz plane of the cooler 610 is illustrated. By providing
a plurality of radiation fins 1702 in the z-axis direction,
the entire heat radiation area is enlarged to increase the heat
25 radiation efficiency. In this case, the cooling air is sent
30
between the heat radiation fins 1702 in the x-axis direction.
[0072]
FIG. 18 is an external view in the case of providing the
cooler 610 with heat pipes 1801 and heat radiation fins 1802.
5 [0073]
The heat pipes 1801 are provided so as to extend in the
 z-axis direction on the xz plane of the cooler 610, and the
heat pipes 1801 are provided with the heat radiation fins 1802
as illustrated in FIG. 18. By sending the cooling air in the
10 y-axis direction, the heat radiation effect can be increased.
The extension direction of the heat pipe may be any of the x-axis
and y-axis directions.
[0074]
FIG. 19 is an external view in the case where two or more
15 double-side cooling power modules 600 are inserted per cooler
610 and coupled in electrically parallel.
[0075]
Since each of the double-side cooling power modules is
fixed by the repulsion force generated by the slot and the elastic
20 member, it is unnecessary to provide a work space between the
power modules, and the double-side cooling power modules can
be disposed compactly. The current capacity can be increased
only by the number of modules arranged in parallel, and larger
power conversion can be realized.
25 [0076]
31
FIG. 20 illustrates a modification of the heat receiving
spacers 630A and 630B which are attached to the double-side
cooling power module 600.
[0077]
The space assuring parts 632A and 632B may not 5 be provided
in the heat receiving spacers 630A and 630B unlike the foregoing
embodiment. It is sufficient to have a configuration that the
heat receiving spacers 630A and 630B are pressed against the
heat receiving faces 612 by the repulsion force f generated
10 when the pressing force F is applied to the heat receiving spacers
630A and 630B as illustrated in FIG. 20. For example, the elastic
member 801 may be provided for faces 1202A and 1202B to which
the heat receiving spacers 630A and 630B are opposed. By the
elastic member 801, dimensions of the interval d2 between the
15 faces opposed to the cooling faces of the heat receiving spacers
and the interval d5 of the surfaces of the heat receiving spacers
can be changed.
[0078]
FIG. 21 illustrates a second modification of the heat
20 receiving spacers 630A and 630B which are attached to the
double-side cooling power module 600. In the case where pin
fins are provided for the double-side cooling power module 600,
the through holes 633A and 633B provided for the heat receiving
spacers 630A and 630B do not have to penetrate in the z-axis
25 direction, and recesses in which the pin fins can be inserted
32
may be provided.
[0079]
The heat receiving spacers 630A and 630B may have a
frame-shaped form having no heat receiving parts 631A and 631B
in areas opposed to the cooling faces 760A and 760B. In 5 this
case, the function of the heat receiving part can be provided
for the cooler 601.
Description of Reference Numerals
10 [0080]
101 cooling fan
105 transformer
106 battery
107 power reception point
15 108 AC load
109 high-order control circuit
110C instruction signal to converter
110I instruction signal to inverter
110X instruction signal to chopper
20 111 cooling air
150 power conversion apparatus
152 converter
153 inverter
154 chopper
25 201 capacitor
33
202 converter gate control unit
204 switching element
205 diode element
253 leg
600 double-5 side cooling power module (heating element)
601 heat receiving block
601A, 601B heat receiving blocks (sandwiching member)
602 heat pipe
603 heat radiation fin
10 604 fixture
606 heat conduction grease
610, 610A, 610B coolers
620 cooling-type double-side cooling power unit
630A, 630B heat receiving spacers
15 631A, 631B heat receiving parts (heat receiving plates)
632A, 632B space assuring parts
633A, 633B, 640A, 642A through holes (holes)
635, 637A, 637B, 639A, 639B airspaces
650A, 650B heat receiving blocks (sandwiching member)
20 652 space assuring part
654B recess
710 body
710a end face
720 flange
25 730 terminal part
34
751 gate terminal
753 insulator
754N N terminal
754P P terminal
754AC 5 AC terminal
760A, 760B cooling face
762, 762A, 762B pin fins
853 cooling air
951 capacitor
10 952N negative-electrode terminal
952P positive-electrode terminal
953N negative-electrode fuse
953P positive-electrode fuse
954 gate driver substrate
15 955 laminate bus bar
955 PNAC layer laminate bus bar
955N N-layer bus bar
955P P-layer bus bar
955S insulating layer
20 955AC AC-layer bus bar
960 unit-converter unit
1051 positive-electrode terminal
1052 negative-electrode terminal
1053 laminate bus bar between PN laminate layers
25
35
WHAT IS CLAIMED IS:
1. A heating element fixing structure comprising:
a heating element having opposed two planes, at least
5 one of the two planes being a cooling plane;
a pair of heat receiving plates provided so as to cover
the two planes;
an elastic member provided in a region in which the pair
of heat receiving plates face each other; and
10 a cooler having a slot in which the heating element and
the pair of heat receiving plates are inserted and cooling the
pair of heat receiving plates,
wherein when the heating element and the pair of heat
receiving plates are inserted in the slot, a pressing force
15 which makes the pair of heat receiving plates come into contact
with an inner wall face of the slot is applied by the elastic
member.
2. The heating element fixing structure according to claim
20 1, wherein the heating element and the pair of heat receiving
plates are inserted into the slot while compressing the pair
of heat receiving plates.
3. The heating element fixing structure according to claim
25 1, wherein when the heating element and the pair of heat receiving
36
plates are inserted in the slot, a force is applied by the elastic
member in a direction that the pair of heat receiving plates
repel each other.
4. The heating element fixing structure according to a5 ny
of claims 1 to 3, further comprising a space assuring part which
assures an interval between the pair of heat receiving plates
so that when the heating element and the pair of heat receiving
plates are inserted in the slot, pressing force applied from
10 the inner wall face of the slot to the pair of heat receiving
plates is not applied to the heating element.
5. The heating element fixing structure according to claim
4, wherein the elastic member is provided for faces with which
15 the opposed space assuring parts come into contact in the space
assuring parts.
6. The heating element fixing structure according to any
of claims 1 to 5, wherein the heating element has the cooling
20 faces on the opposed two planes, and
the pair of heat receiving plates has a shape which is
along the cooling faces of the two planes.
7. The heating element fixing structure according to any
25 of claims 1 to 6, wherein a plurality of pin fins are provided
37
for the cooling face so as to protrude and
holes in which the pin fins are loosely fit are formed
in places facing the pin fins in the pair of heat receiving
plates.
5
8. The heating element fixing structure according to any
of claims 1 to 7, wherein area of the faces of the pair of heat
receiving plates opposed to the cooling faces of the heating
element is larger than that of the cooling faces of the heating
10 element and
when the cooling face is projected to the face of the
pair of heat receiving plates, a force in the direction that
the pair of heat receiving plates repel each other is applied
to a region other than the projection region in the face of
15 the heat receiving plates.
9. A power conversion unit comprising:
a semiconductor device having cooling faces on opposed
two planes and having electric terminals on one of side faces
20 adjacent to the cooling faces;
a pair of heat receiving plates provided so as to cover
the two planes;
an elastic member provided in a region in which the pair
of heat receiving plates face each other; and
25 a cooler having a slot in which the heating element and
38
the pair of heat receiving plates are inserted and cooling the
pair of heat receiving plates,
wherein when the heating element and the pair of heat
receiving plates are inserted in the slot, a pressing force
which makes the pair of heat receiving plates come into 5 contact
with an inner wall face of the slot is applied by the elastic
member, and
the cooler is provided with a radiation fin.
10 10. A power conversion apparatus in which a plurality of the
power converter units according to claim 9 are arranged so that
the coolers are adjacent to each other.