Description:TITLE OF THE INVENTION:
High powered industrial grade LED lighting system

FIELD OF THE INVENTION:
The present invention relates to the field of LED lights and provides a uniquely designed industrial grade LED lighting system having high power, high thermal dissipation, uninterrupted ventilation, low thermal interference between LED module and driver housing and ease and speed of manufacturing.

BACKGROUND OF THE INVENTION:
LED stands for light emitting diode which is today’s most energy-efficient and rapidly-developing lighting technology. LED lights produce light upto 90% more efficiently as compared to non-LED normal lights, last longer and are more durable. There are 3 major components of a LED lighting system:
1. LED module which has LED chips mounted on metal Printed Circuit Board. The circuit is designed to have proportional distribution of current and voltage according to the LED chip specifications.
2. Heat sink to remove the heat generated by the LED chips when direct current is applied, which if not removed, damages the LED chips and reduces its performance because “Cooler the LED chip, higher the lumen per watt efficiency and longer the life of the chip.”
3. Constant Current Driver which converts input alternate current to direct current of fixed ampere and slightly variable voltage. A constant current driver is specifically designed for a given LED module and its requirement of certain quantum of direct current and the voltage range. The constant current driver also produces heat which has to be dissipated because its sensitive electronic components can be damaged by its own heat or the heat generated from the LED module.
LED chips are semi-conductor devices. When specified direct current is applied through them, they produce light from one side and heat from the other side. This heat, if retained near the LED chips, proves detrimental to their performance. For this purpose, heat sinks are provided in the LED light systems to dissipate the heat generated from the LED chips. The lumen output, aging speed and overall age of the LED chips depends on the temperature at which the LED operates. Only the best heat sinking devices ensure that the LED chips perform well throughout their life time which is fifty thousand to one lac hours.
A number of LED lights for industrial usage are present in the prior art:

US 11649937 describes a decorative light applicable for landscaping which includes an expandable and collapsible main body and a lighting portion. The main body includes a plurality of first elongated members and a plurality of second elongated members that are pivotally connected to overlap the first elongated members. The main body is expandable and collapsible between its two opposite lateral sides through pivotal movement of the first and the second elongated members. The lighting portion includes a power supply unit and a plurality of light strings. The light strings are electrically connected to the power supply unit and extend into the first and the second elongated members respectively. Each light string is provided with a plurality of light-emitting diode (LED) lamp beads that are arranged at intervals.
US 2023123362 discusses an LED system without heat sink which is a powerful, robust and durable light-emitting diode lighting system with a protection rating of up to IP69, while maintaining a low manufacturing cost. This LED system consists of an insulated metal substrate, on which at least one light-emitting diode is placed, supplied by a cable or a connector. The resulting circuit is then wrapped in a heat-shrinkable sheath, which will remove the air and dissipate the heat from the substrate and diodes in an optimal manner, the heat dissipation power thereof being about ten times that of air. Each end is then overmoulded, in order to make the system sealed and robust. The overmoulding can be used to add a sealing lip around the connector, as well as specific recesses to allow various attachment methods, individually or in groups. The device according to the invention is intended for domestic, industrial and horticultural lighting, depending on whether a translucent or transparent substrate is used.
WO 2022169087 discloses a micro-LED device alignment, a manufacturing method therefor, and a method for manufacturing an array module comprising micro-LED devices, and the micro-LED device alignment according to the present invention which comprises: a micro-LED device; a polymer layer formed to encompass the micro-LED device; and a metal layer formed on the polymer layer in the direction of one end portion of the micro-LED device. Therefore, micro-LED devices of an aspect ratio with high light-emitting efficiency can be aligned at a high yield rate by using a dielectrophoretic method.
WO 2023103158 provides an LED base module (10), an LED module (20), and an LED light strip (30) wherein the LED base module (10) comprises an LED light holder (11) and a bearing base (12) for bearing the LED light holder (11), the LED light holder (11) comprises an insulating base (111) and a plurality of conductive terminals (112), and the plurality of conductive terminals (112) are fixed to the insulating base (111); each conductive terminal (112) is provided with a die bonding part (1121) used for being electrically connected to an LED chip assembly (211) and a pin part (1122) exposed out of the insulating base (111); the bearing base (12) is provided with a plurality of conductive parts (121) and at least one relief through hole (120); each conductive part (121) is provided with a first end part (12101) and a second end part (12102), the first end part (12101) and the second end part (12102) are respectively exposed on two opposite end surfaces of the bearing base (12), the first end part (12101) is used for being electrically connected to the pin part (1122), and the second end part (12102) is used for being electrically connected to a wire; the at least one relief through hole (120) allows for avoidance during punching of one wire. The structural design of the LED base module (10) facilitates improving the yield and reliability of processing of the LED light strip (30).
TW 202310386 relates to a LED display structure and its display module thereof which includes a LED array, a substrate below the LED array, and at least one trace configuration layer, which is disposed below the LED array and adjacent to the substrate. The at least one trace configuration layer includes a plurality of wires, and a distribution density of the wires varies according to a distance between the wires and the LED array. When the distance increases, the distribution density of the wires is denser. Otherwise, the distribution density is sparse when the wires are closer to the LED array. In view of the simulation experimental analyses of the present invention, it is believed that at least 30% of the scattered light ratio can be reduced so as to enhance the LED display structure with better transparency and image quality.
CN 218480576 gives a safe and efficient heat dissipation LED lamp which comprises an LED light source, a power source, a heat dissipation sectional material and a power source cavity sectional material. The power source cavity profile is located in the center of the top of the heat dissipation profile and is integrally formed or fixedly connected with the heat dissipation profile, a light source installation plane is formed at the bottom of the heat dissipation profile, and the LED light source is fixedly installed on the light source installation plane at the bottom of the heat dissipation profile. The top and the end faces of the two sides of the power source cavity profile are open, a cover plate is slidably installed at the opening of the top of the power source cavity profile, the power source is detachably installed in the power source cavity profile through the cover plate and is in a suspended state in the power source cavity profile, and the LED light source is connected with the power source through the heat dissipation profile and wires in the power source cavity profile. According to the safe and efficient-heat-dissipation LED lamp, the LED light source and the power source are not in direct contact ingeniously through the heat dissipation sectional material and the power source cavity sectional material, heat energy of the light source is prevented from being directly guided into the power source, the service life of the product is guaranteed, and the safe and efficient-heat-dissipation LED lamp is suitable for being used for fixed illumination in the severe industrial and mining working environment.
CN 218721065 describes a LED industrial and mining illuminating lamp which comprises a lighting lamp shell, a power box is arranged at the top of the lighting lamp shell, a plurality of heat dissipation metal sheets are evenly arranged on the side wall of the lighting lamp shell, a light source adjusting seat is detachably connected to the bottom of the lighting lamp shell, and a light source is arranged on the light source adjusting seat. Limiting threads are arranged on the outer wall of the illuminating lamp shell, and an L-shaped handle is arranged on one side of the top of the power box. The light source adjusting seat is of a hollow cylinder structure, a connecting inner seat is arranged in the light source adjusting seat, and an internal thread is arranged on the inner wall of the connecting inner seat; the light source adjusting seat is detachably connected to the outer portion of the illuminating lamp shell and is of a hollow circular truncated cone structure, when the light source emitted by the illuminating lamp shell needs to be dispersed and the area is large, the end, with the short diameter, of the light source adjusting seat can be fixedly connected with the illuminating lamp shell, at the moment, the light source irradiation area is large, and the illuminating effect is further improved.

It is well known that of all the power supplied to an LED lighting system, 30-40% is converted to photons (Lumens) and 60-70% is converted to heat. This heat is the main cause of damage to LED chips and LED drivers. Although a number of heat dissipation components for LED lighting systems are available in the prior art, most of them are unable to quickly transfer the complete heat produced in LED lighting systems due to which the LED chips and drivers get damaged. Hence an LED lighting system with efficient ventilation, which effectively dissipates the heat generated by LED light systems and drivers such that the heat generated by the LED panel doesn’t pass to the driver chamber and the heat generated by LED driver is not transferred to the LED chips, is the need of the day.

OBJECT OF THE INVENTION:
The main object of the invention is to provide for a high powered industrial grade LED lighting system which contains two levels of heat sinks for faster heat dissipation.
Another object of the invention is to provide for a high powered industrial grade LED lighting system which comprises of an end to end assembly making the product rugged.
Still another object of the invention is to provide for a high powered industrial grade LED lighting system which has multiple special components designed towards easing the assembly.
Yet another object of the invention is to provide for a high powered industrial grade LED lighting system which comprises twin drivers with unique driver positioning minimizing driver to driver heat transfer.
A further object of the invention is to provide for a high powered industrial grade LED lighting system which has excellent arrangement for air movement and ventilation.
A yet further object of the invention is to provide for a high powered industrial grade LED lighting system which is easy to manufacture and is economical.

SUMMARY OF THE INVENTION:
The present invention describes a high powered industrial grade LED lighting system which has two levels of heat dissipation surface areas namely high fin heat sink and heat sink cum reflector, for dissipating the heat generated by the LED chips and the constant current driver. The LED printed circuit board with the LED chips is mounted on the reflector cum heat sink. The LED driver housing is vertical and has a uniquely designed finned extruded aluminum housing to enhance heat dissipation from LED driver. The LED light comprises of twin drivers which ensure light functioning in the case of failure of a driver wherein the twin drivers positioning is such that minimal driver to driver heat transfer occurs. The driver base plate is mounted at a height on High fin heat sink so that the heat liberated from the LED chips is not transferred to the driver base plate and does not damage the drivers. The High fin heat sink is so designed that on one side it holds and securely fastens the reflector cum heat sink, printed circuit board mounted with LED chips and optical lens cluster which provides proper beam angle to individual LED chips using fasteners which are then tightened on the other side of the heat sink using dome nuts. The other side of the High fin heat sink holds the entire driver housing, LED drivers and hanging mechanism consisting of base plate for driver housing, aluminum housing profile for LED drivers, top plate with alternate current cable gland assembly and cable gland assembly. This design of LED light provides very high heat dissipation surface area and superior ventilation for cooler LED junction temperature improving the product performance and its life.

BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 gives the diagram of the exploded view of the high powered industrial grade LED light.
Fig. 2 gives the diagram of the front and perspective views of the high powered industrial grade LED light.
Fig. 3 gives the diagram of the top view of the high powered industrial grade LED light.
Fig. 4 gives the diagram of the high fin heat sink with driver housing base plate and ventilation paths.
Fig. 5 gives the diagram of the exploded view of the high fin heat sink with bolts.
Fig. 6 gives the diagram of the driver base plate mounted at a height on the high fin heat sink.
Fig. 7 gives the diagram of the top view of the driver housing with the ridges and holes.
Fig. 8 gives the diagram of the half vertically sliced view of the driver box and its fitting.
Fig. 9 gives the diagram of the exploded view of the driver housing with top and bottom plates.
Fig. 10 gives the diagram of the assembled view of the driver housing with top and bottom plates.
Fig. 11 gives the diagram of the half horizontally sliced view of the driver with its bottom plate assembly.
Fig. 12 gives the diagram of the cable gland assembly and its exploded view.
Fig. 13 gives the vertically sliced picture of the driver housing showing the assembling of its drivers.
Fig. 14 gives the diagram of the top plate of the driver housing.
Fig. 15 gives the diagram of close up view of the insertion of the cylindrical label on the cylindrical surface.
Fig. 16 gives the diagram showing the insertion of label on the driver housing surface.
Fig. 17 gives the diagram showing the inserted label on the driver housing surface.

DETAILED DESCRIPTION:
The nature of the invention and the manner in which it is performed is clearly described in the specification. The invention has various components and they are clearly described in the following pages of the complete specification.
LED lights are being used in all kinds of lighting systems throughout the world as they provide increased luminescence, are highly efficient, have increased life-span and are economical. They are semi-conductor devices which generate light through light emitting diodes, in proportion to the quantity of direct current passing through them. Along with the emission of light, these diodes also generate heat from the opposite side of light. Most of the LED lights are provided with heat dissipating systems which remove the heat from the system so that the LED chips are minimally damaged due to the heat generated. LED lighting systems to be used in the industries require higher power due to which more LED chips have to be used which generate greater amount of heat. Such LED systems will require more than one heat dissipation sinks.
The present invention relates to high powered industrial grade LED lighting system which has two levels of high heat dissipation surface areas to dissipate the heat generated by the LED chips, a unique end to end assembly which increases the ruggedness of the LED light and a unique LED driver housing which is a finned extruded aluminium housing which enhances the heat radiation from LED driver, is at an elevated level so that it doesn’t catch the heat produced by the LED light PCB or dissipated by the heat sinks and has twin drivers with unique driver positioning to minimize driver to driver heat transfer along with thermal compound potting which ensures that the LED lights function properly even in case of one driver failure.
In the present invention, the LED mounted printed circuit board is mounted on the reflector cum heat sink over which is present another heavy duty high fin heat sink which results in superior heat conduction away from the LED chips and superior ventilation for cooler LED junction temperature. The components of the LED lighting system have been designed to form a unique end to end assembly making the product assembling easy and having rugged structural strength. The LED driver housing is a finned extruded aluminium housing which enhances heat dissipation away from the driver. It is cylindrical in shape and has a very low footprint and is elevated by 4 legs so as not to be in the catchment area of heat produced by LED chips and the heat sinks. Moreover the present invention is equipped with twin drivers which are positioned such that driver to driver heat transfer is minimal and thermal compound potting is provided to ensure the functioning of light even in cases of one driver failure. This feature enhances thermal performance, eases repairs and replacement of drivers.
The list of the various components of the high powered industrial grade LED light of the present invention is as follows:
(1) – Assembly bolts
(2) – Lens cluster for LED
(3) – LED mounted PCB
(4) – Central shaft for DC cable
(5) – Reflector cum heat sink
(6) – Bolts for high fin heat sink and driver assembly
(6A) – Holes in the high fin heat sink for introducing the bolts
(6B) – Nuts to fasten the bolts (6) over the driver base plate
(7) – High fin heat sink
(8) – Nuts to fasten LED assembly
(9) – Driver / Driver base plate
(9A) – Legs for elevating high fin heat sink from the driver profile base plate
(9B) – Bottom plate
(9C) – Insulation gasket
(10) – Fasteners to hold driver housing
(11) – Driver housing
(12) – Label
(12A)- Label slide guide
(12B)- Slots for label insertion
(13) – Fasteners for top plate
(14) – Top plate
(15) – Central hook assembly
(16) – Cable gland assembly
(16A)- Cable gland main housing
(16B)- Security nut
(16C)- O-ring
(16D)- Nut cap
(16E)- Alternate current cable
(17) – Ventilation paths
(18) – Label slide guide
(19) – External hole guide
(20) – Internal ridges
Fig. 1 gives the diagram of the exploded view of the high powered industrial grade LED light of the present invention. As shown in the figure, the assembly bolts (1) attach the lens cluster (2) and LED mounted PCB (3) to the reflector cum heat sink (5). The central shaft for DC cable (4) passes from the center of the reflector cum heat sink (5). Another heat sink, high fin heat sink (7) is fitted with the help of bolts for driver assembly (6) to the driver base plate (9). The assembly bolts (1) are fastened with nuts (8) thereby attaching the lens cluster (2), LED mounted PCB (3) and reflector cum heat sink (5) using a single set of bolts and nuts. The driver base plate (9) is attached to the driver housing (11) with the help of fasteners (10). A unique label attachment system helps in aesthetic fixing of the label (12) on the curved surface of the driver housing (11). The driver housing is covered on the top with a top plate (14) which is attached to the driver housing with the help of fasteners for top plate (13). The top plate has a central hook assembly (15) attached to it which attaches to the cable gland assembly (16) which supplies electric current to the LED light.
This LED light has two levels of very high heat dissipation surface areas to dissipate the heat generated by the LED chips facilitating superior heat conduction out of the LED chips and superior ventilation to provide cooler LED junction temperature which increases the product performance and its life.
Fig. 2 gives the diagram of the front and perspective views of the high powered industrial grade LED light displaying its 3 major components, reflector cum heat sink (5), high fin heat sink (7) and driver housing (11), all of which are made of aluminium and work as heat sinks. Free space is provided above the primary heat sink (reflector cum heat sink - 5) and secondary heat sink (high fin heat sink – 7) to facilitate free movement of air upwards. The driver housing (11) is a cylindrical finned structure having greater length as compared to breadth due to which there isn’t any obstruction to the heat escaping upwards from the primary and secondary heat sink. Fig. 3 gives the diagram of the top view of the high powered industrial grade LED light which specifically displays the view from the top of the driver assembly mounted on the high fin heat sink. Fig. 4 also gives the diagram of the top view of the high fin heat sink embedded with driver base plate (9) and ventilation paths (17).
Fig. 5 gives the diagram of the exploded view of the high fin heat sink with bolts. As shown in the figure, long bolts (6) are used to attach the high fin heat sink (7) with the driver base plate (9). These bolts (6) are introduced inside the high fin heat sink (7) through the holes (6A) provided on the base of the high fin heat sink (7) and pass through the driver base plate (9) and are fastened with the help of nuts (6B).
The high fin heat sink (7) is designed in pressure die cast aluminium such that it has a very high surface area for heat dissipation (due to the presence of fins) wherein the passages (fins) are so designed that it creates ways to keep the cool air to keep moving in and hot air to keep moving upwards. The logger fins have some angularity which makes the fins easy to cast in pressure die casting and gives the fins the requisite strength to bear any rough handling. The pressure die casting technology is comparatively cheaper and faster, making the LED light economical.
Fig. 6 gives the diagram of the driver base plate mounted at a height on the high fin heat sink. As shown in the figure, the driver base plate (9) which is present over the high fin heat sink (7) which is elevated by 4 legs (9A) which prevents the transfer of even a small amount of heat from the high fin heat sink (7) to the driver base plate (9), thereby protecting the driver, present in the driver housing, from being heated. The driver base plate (9) is made of good, thermally resistant engineering plastic. The elevated legs, engineering plastic body, in conjunction with high airflow heat sink, provides excellent air movement and ventilation due to which the heat generated from LED panel doesn’t thermally load the driver.
Fig. 7 gives the diagram of the top view of the driver housing with the ridges and holes. As shown in the figure, the external surface of the driver housing is finned in a special pattern which performs multiple functions besides providing enhanced surface area for heat sinking. It has 4 inner ridges (20) at 900, which act as a guide to top plate (14) and bottom plate (9B) of the driver. Both the top and bottom plates have counter grooves which ensure a perfect and easy fit of the plates in the housing. There are 4 external expanded and thickened ridges, with a small groove which has a hole (19) at a specific position. These holes then work as receptacle for fasteners. The expanded and thickened ridges give a stronger, structural bearing to the fasteners. Moreover there are two fins which are extruded longer than others and have angular shape pointing in opposite direction. These two are Label Slide Guide (18) which together act as a special receptacle for the special sliding product label (12).
Fig. 8 gives the diagram of the empty half vertically sliced view of the driver box and its fitting displaying the holes for the nuts and bolts. Fig. 9 gives the diagram of the exploded view of the driver housing with top and bottom plates. As shown in the figure, the bottom plate (9B) is attached to the driver housing (11) with the help of bolts for bottom plate (10) while the top plate (14) is fastened to the driver housing (11) with the help of fasteners for top plate (13). Fig. 10 gives the diagram of the assembled view of the driver housing with top and bottom plates which shows the legs (9A) provided to elevate the high fin heat sink from the driver base plate (9). The bottom plate (9B) is attached to the driver housing (11) with the help of bolts for bottom plate (10) while the top plate (14) is fastened to the driver housing (11) with the help of fasteners for top plate (13). Fig. 11 gives the diagram of the half horizontally sliced view of the driver with its bottom plate assembly showing the driver housing (11) and the driver base plate (9) fastened to the driver housing (11) with the help of bolts for bottom plate (10).
Fig. 12 gives the diagram of the cable gland assembly (16) and its exploded view. The top plate (14) of the driver housing (11) has a central hook assembly (15) which is used for hanging the LED light assembly and a specially designed cable gland assembly (16) which comprises of cable gland main housing (16A), security nut (16B), O-ring (16C), nut cap (16D) and alternate current cable (16E). The alternate current cable (16E) transfers the alternate current to the drivers (9) present in the driver housing (11), which convert the alternate current into direct current and transfers it to the LED chips.
Fig. 13 gives the vertically sliced picture of the driver housing (11) showing the assembling of its drivers. Special round shaped drivers (9) have been made for the LED light of the present invention. These drivers convert alternate current into direct current of specific voltage and forward the current in specified ampere as per the LED PCB design. LED drivers have two major components which produce significant heat namely the Transformer and MOSFET. The heat generated by these two components can affect other heat sensitive components and the circuitry of LED driver which may ultimately shorten the life or result in failure of the LED driver. Hence it is important to eliminate the heat of the driver in the most effective and quick manner so that their working is prolonged. As shown in the figure, the driver housing of the present invention contains multiple numbers of drivers (9) so that failure of one driver does not cause complete shutdown of the LED light and repairs or replacement of the damaged driver can be done while the LED light functions with the other driver. These drivers are potted in thermally conductive and electrically insulating compound to prevent their damage due to the heat generated from the LED chips. The driver housing (11) is divided into two parts by a special divider insulating gasket (9C) and two drivers (9) are placed on two sides of the gasket (9C) facing in opposite directions. This physical and directional separation causes both the drivers to expel heat in opposite directions. Moreover the drivers are potted twice with thermal heat conductive compound from both the directions of the driver housing (11). The drivers are electrically connected but thermally isolated at their base by rubber gasket and air. In this manner, both the drivers and their most heated components i.e. Transformer and MOSFET, expel heat in opposite directions. Moreover the driver housing (11) is a cylindrical, finned aluminium housing which provides a larger surface area to expel heat reaching the housing. The central hook assembly (15) is attached to the top plate (14) of the driver housing (11).
Fig. 14 gives the diagram of the top plate (14) of the driver housing (11) which has been specially designed to accommodate the cable gland housing (16A) and a housing for the central hook assembly (15). This top plate (14) is made of structural engineering grade thermoplastic. It has a slot in which the uniquely designed hexagonal cable gland housing (16A) fits in. The hexagonal shape ensures that the cable gland (16) does not move freely and fits properly in the slot. The cable gland is tightened with the help of the security nut (16B). The top plate (14) also has another similar hexagonal slot in the center to host the central hook assembly (15) for the hanging mechanism. The top plate (14) has grooves complementary to the internal ribs of the aluminium cylindrical driver housing (11) which ensures easy and perfect fitting and proper orientation. The top plate (14) is thick at 4 corner points where it is tightened with fasteners which gives very good grip and structural system to the LED lighting assembly.
It is usually difficult to make a cylindrical label and fit it on a cylindrical surface. The present invention provides a unique way of label fitting on the finned surface. The driver housing of the present invention has innovative slots in which the specially engineered label slides in. Fig. 15 gives the diagram of close up view of the insertion of the cylindrical label on the cylindrical surface. As shown in the figure, the curvaceous label has special angular element at its end which makes the label slide in perfectly in the angularly shaped fins. This results in a very aesthetic product labeling and provides significant ease of fixing the label on a curved surface.
Fig. 16 gives the diagram showing the insertion of label on the driver housing surface. As shown in the figure, the driver housing (11) has two fins which are longer than others and has an angular shape pointing in opposite direction. These two fins act as the label slide guide (18) which have receptacles for the special sliding curved label (12). A curved label is specially prepared which has a special angular element at its two ends which makes the label slide in perfectly in the angularly shaped fins. Fig. 17 gives the diagram showing the inserted label on the driver housing surface.
The various inventive features of the LED lighting system of the present invention are as follows:
• The major components of the LED lighting system of the proposed invention are made of aluminium which has high thermal conductivity due to which it immediately transfers the heat released from the LED chips, outside in the atmosphere. As is well known, of all the power (wattage) supplied to any LED lighting system, 30-40% is converted to photons (lumen) and almost 60-70% is converted to heat. The 3 main components reflector cum heat sink (5), high fin heat sink (7) and driver housing (11) work as heat sink, which enables immediate transfer of heat from the LED chips and the driver assembly to the atmosphere. Space has been provided between the primary heat sink (5) and secondary heat sink (7) to facilitate free movement of hot air upwards. This unique design of the LED light assembly with very high dissipation surface area and superior ventilation ensures cooler LED junction as well as driver temperature thereby increasing the product performance and life.
• The vertical cylindrical finned driver housing (11) is placed above the LED light panel and is tall and has comparatively smaller cross sectional area so that the heat escaping from the primary (5) and secondary (7) heat sink isn’t obstructed by the driver housing (11) and can move higher in the air without any obstruction. This is because if the heat generated from the LED panel reaches the driver chamber, it may completely damage the driver (9) or reduce the life and efficiency of the driver. Hence a vertical driver housing (11) has been designed which has minimal footprint as compared to that of LED PCB, primary heat sink and secondary heat sink.
• A small cross-section area of the top portion of the high fin heat sink (7) overlaps with the base plate of the driver housing (9) due to which heat may be transferred from the high fin heat sink to the driver housing (11). To prevent this transfer of heat, the top portion of the high fin heat sink is provided with 4 legs (9A)which elevate the base plate of driver housing (9) such that the hot air released from the high fin heat sink (7) escapes through the space between the legs and does not heat up the base plate of driver housing (9B). These elevated legs and engineering plastic body along with high air flow heat sinks provides excellent air movement and ventilation due to which the heat generated from the LED panel does not thermally load the driver housing.
• The high fin heat sink (7) is designed in pressure die cast aluminium such that it has very high surface areas for heat dissipation, the passages through the fins are designed such that they create ways for cool air to keep moving in and hot air to keep moving upwards and the fins are designed having some angularity which makes them easy to cast in pressure die casting and gives them the requisite strength to bear any rough handling. The pressure die casting technology is much cheaper and fast production technology due to which the LED light produced is economical.
• The driver (7) has a pedestal of high temperature resistance and is made of good thermally resistant engineering plastic which stands on 4 elevated legs (9A) to prevent the heat moving out from the high fin heat sink from reaching the driver housing (11) due to direct contact. The driver housing (11) is made of specially designed cylindrical aluminium profile which has fins on all sides to enhance its surface area and heat dissipation through the surface area.
• The external surface of the driver housing (11) is finned in a special pattern which performs multiple functions apart from providing enhanced surface for heat sinking. The driver housing (11) has 4 internal ribs (20) at 900 angle which act as a guide for quick, easy and accurate fitting of the bottom base plate (9B) and top plate (14). Both the bottom base plate and top plate have counter grooves for perfect and easy fitting. The cylindrical driver housing has 4 grooves on the outer side for accurate positioning of fasteners. These grooves are at an angle of 900 each for accurate positioning of fasteners and making driver change over simple. There are 4 external expanded and thickened ridges with a small groove having a hole at a specific position which works as receptacle for fasteners. These expanded and thickened ridges give a stronger structural bearing to fasteners.
• The driver housing has two special fin elements on the external side which are extruded longer than the others and have angular shape pointing in opposite direction. These two label slide guide (12A) become the receptacles for a unique complementary sliding product label. The curvaceous label (12) has special angular elements at its ends (12B) which makes label slide in perfectly in the angularly shaped fins and label adhering easy on the curved surface of the LED light.
• The high power LED light system of the present invention has a unique end to end assembly mechanism for easy assembling of the light and reduction of manufacturing cost. The high fin heat sink (7) is so designed that on one side it holds and securely fastens the reflector cum heat sink (5) and the printed circuit board populated with LED chips (3) along with the optical lens cluster (2) which provides proper beam angle to individual LED chips, using fasteners (6) which are then tightened on the other side of the heat sink using dome nuts (8), and on the other side the high fin heat sink (7) holds the driver housing (11) along with the hanging mechanism (15) which include the base plate for driver housing (9B), aluminium housing for LED drivers (11) with arrangements for slider label (12), top plate assembly (14) with alternate current cable gland assembly (16) and the hanging assembly (15).

The high powered industrial grade LED lighting system of the present invention is highly advantageous as it has two levels of very high heat dissipation surface areas namely the reflector cum heat sink and the high fin heat sink to quickly and efficiently dissipate the heat generated from the LED chips. It has a vertical cylindrical finned extruded aluminium driver housing which efficiently dissipates the heat generated from the LED drivers and has less cross section area so that it is not in the catchment areas of the heat produced from the LED chips present on the PCB and dissipated from the primary and secondary heat sinks. The driver housing encloses twin drivers with unique positioning which minimizes driver to driver heat transfer and thermal compound potting to ensure that the LED lighting system functions properly even in the case of failure of one driver enhancing thermal performance and easing repairs and replacement of drivers. The base plate of driver housing which overlaps the high fin heat sink is elevated with the help of 4 legs which ensure that the heat being dissipated from the high fin heat sink does not enter the driver housing and gets dissipated in the air due to which the driver housing remains cool. The heat sinks are designed such that they have larger surface areas for heat dissipation, passages in the fins for ventilation and easy to make angular fins manufactured by pressure die casting which provides the required strength to the light and makes the manufacturing process cheaper and fast. The LED lighting system is provided with end to end assembly making the product easy to assemble and rugged in its structural strength. Most part of the LED lighting system is made of aluminium which assists in rapid heat transfer. The driver housing also has special finned elements on its external surface which become the receptacles for unique complementary label profile. The top plate of the driver housing has special slots for the cable gland assembly and hanging assembly. All the components of the LED lighting system are easily and securely fitted for ease in assembling and repairs. The high power LED lighting system of the present invention is also economical. Thus the LED lighting system of the present invention is highly advantageous.
Although the preferred embodiment as well as the construction and use have been specifically described, it should be understood that variations in the preferred embodiment could be achieved by a person skilled in the art without departing from the spirit of the invention. The invention has been described with reference to specific embodiment which is merely illustrative and not intended to limit the scope of the invention as defined in the claims.
, Claims:We claim,
1. High powered industrial grade LED lighting system which has two levels of heat dissipation surface areas made of aluminium comprising of reflector cum heat sink (5) and high fin heat sink (7) wherein the reflector cum heat sink (5) provides a huge plain surface area for dissipation of heat and the high fin heat sink (7) comprises of fins and ventilation paths (17) for dissipation of heat in the above direction and flowing in of the cold air;
wherein the driver housing (11) has a finned cylindrical aluminium profile for fast dissipation of heat through the increased surface area;
wherein the LED lighting system comprises of multiple drivers (9) which may optimally comprise of two drivers (9) separated by the insulating gasket (9C);
wherein the bottom plate (9B) of the driver housing (11) is elevated from the top portion of the high fin heat sink (7) by the presence of 4 legs (9A) such that the heat from the high fin heat sink (7) escapes from the space between the legs and does not reach the driver housing (11);
wherein the driver housing (11) is a vertical cylinder having a small cross section area as compared to the cross section area of the high fin heat sink so that the heat escaping from the primary heat sink (5) and secondary heat sink (7) is not obstructed by the driver housing (11);
wherein the driver housing (11) has 4 internal ribs (20) at 900 angle which fit in the counter grooves of the bottom plate (9B) and top plate (14) for accurate positioning of fasteners;
wherein the driver housing (11) has 4 external expanded and thickened ridges, each with a small groove having a hole at a specific position which works as receptacle for fasteners;
wherein the driver housing (11) has 2 special fin elements on its external side, which are extruded longer than others and have angular shape pointing in opposite direction which are the label slide guide (12A) in which the complementary curvaceous product label (12) slides in through the angular elements (12B) provided at its ends; and
wherein the high fin heat sink (7), on one side holds and securely fastens the reflector cum heat sink (5) and the printed circuit board populated with LED chips (3) along with the optical lens cluster (2) using fasteners (6) which are then tightened on the other side of the heat sink using dome nuts (8), and on the other side the high fin heat sink (7) holds the driver housing (11) along with the hanging mechanism (15) which include the base plate for driver housing (9B), aluminium housing for LED drivers (11) with arrangements for slider label (12), top plate assembly (14) with alternate current cable gland assembly (16) and the hanging assembly (15), thereby providing an end to end assembly mechanism.
2. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the primary heat sink cum reflector (5) is made of high purity highly conductive 2.5 mm thick aluminum to dissipate the heat faster and keep the LED chips cooler.
3. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the high fin heat sink is cast using pressure die casting technology and the logger fins have angularity for easy casting and strength for rough handling.
4. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the driver housing bottom plate (9B) and the 4 elevated legs (9A) are made of thermally resistant engineering plastic so that they do not thermally load the driver (9).
5. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the bottom plate (9B) is attached to the driver housing (11) with bolts for bottom plate (10) and the top plate (14) is fastened to the driver housing with the fasteners for top plate (13).
6. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the cable gland assembly (16) comprises of cable gland main housing (16A), security nut (16B), O-ring (16C), nut cap (16D) and alternate current cable (16E) wherein the alternate current cable (16E) transfers the alternate current to the drivers (9) which converts the alternate current to direct current and transfers it to the LED chips.
7. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the drivers (9) are potted in thermally conductive and electrically insulating compound to prevent thermal damage and are placed on two sides of the insulating gasket (9C) facing in opposite directions to minimize internal heat transfer wherein the drivers are electrically connected but thermally isolated at their base by rubber gasket and air.
8. The high powered industrial grade LED lighting system as claimed in claim 1 wherein the top plate (14) is made of structural engineering grade thermoplastic and has a hexagonal slot for fitting the hexagonal cable gland housing (16A) which is tightened with the security nut (16B) and another hexagonal slot in the center to host the central hook assembly (15) for the hanging mechanism;
wherein the top plate (14) is thick at 4 corner points where it is tightened with fasteners (13) to attach it with the driver housing (11).