Claims:1. An electronic device comprising:
a first chassis;
a second chassis;
a hinge assembly configured to rotatably couple the first chassis and the second chassis together, wherein the hinge assembly includes:
a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween; and
a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position; and
a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area.
, Description:CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present patent application claims the benefit of U.S. Non-Provisional Patent Application No. 17/100,849, filed November 21, 2020, and titled: “HINGE ASSEMBLY AND GUIDE ASSEMBLY FOR ELECTRONIC DEVICES USING A HEAT CARRYING MEMBER”, which is incorporated herein by reference in its entirety.

TECHNICAL FIELD
[0002] This disclosure relates in general to the field of computing, and more particularly, to a hinge assembly and a guide assembly for electronic devices using a heat carrying member.

BACKGROUND
[0003] As technology evolves, electronic devices offer increasingly more features and functionalities. New features and functionalities are often coupled with the creation of thinner and lighter systems and are typically associated with increased thermal demands on a system. For example, new generations of electronic devices often experience significant increases in total system power as well as power density. Increased thermal demands can affect system performance by causing hardware, such as a hard drive and processor, to slow down. Thus, both compute and memory resources can be negatively impacted when thermal demands are high. Consequently, designing thinner and lighter systems with maximized system performance is challenging.

BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1A is an isometric view of an electronic device in an example open position with a hinge assembly and a heat carrying member according to one or more embodiments.
[0005] FIG. 1B is an isometric view of an electronic device with a hinge assembly and a heat carrying member in a closed position according to one or more embodiments.
[0006] FIG. 1C is an isometric view of an electronic device with a hinge assembly and a heat carrying member in a fully rotated position according to one or more embodiments.
[0007] FIG. 2 is a cross-sectional view of a heat carrying member with a protective layer according to one or more embodiments.
[0008] FIG. 3A is an isometric view of a hinge assembly for an electronic device using a heat carrying member according to one or more embodiments.
[0009] FIG. 3B is a partially exploded view of a hinge assembly for an electronic device with an interior view of one side according to one or more embodiments.
[0010] FIG. 3C is a cut away interior view of one side of a hinge assembly for an electronic device according to one or more embodiments.
[0011] FIG. 3D is an exploded view of a hinge assembly for an electronic device according to one or more embodiments.
[0012] FIG. 4 is a cross-sectional view of a portion of a hinge assembly for an electronic device according to one or more embodiments.
[0013] FIG. 5A is an isometric view of a guide unit of a hinge assembly for an electronic device according to one or more embodiments.
[0014] FIG. 5B is another isometric view of a guide unit of a hinge assembly for an electronic device according to one or more embodiments.
[0015] FIG. 5C is another isometric view of a guide unit of a hinge assembly with a heat carrying member extended therethrough according to one or more embodiments.
[0016] FIG. 6A is a schematic diagram illustrating a cross-sectional view of a hinge assembly of an electronic device in a closed position according to one or more embodiments.
[0017] FIG. 6B is a schematic diagram illustrating a cross-sectional view of a hinge assembly of an electronic device in a fully rotated position with according to one or more embodiments.
[0018] FIGS. 7A-7I are cross-sectional views of a hinge assembly and heat carrying member in various positions during rotational movement of an electronic device according to one or more embodiments.
[0019] FIGS. 8A-8E are other cross-sectional views of a hinge assembly in various positions during rotational movement of an electronic device with a heat carrying member according to one or more embodiments.
[0020] FIG. 9 is a line graph illustrating an example change in a curve length of a heat carrying member during rotational movement of an electronic device.
[0021] FIG. 10 is a line graph illustrating an example change in the curve length of a heat carrying member during rotational movement of an electronic device with a hinge assembly according to one or more embodiments.
[0022] FIG. 11A is a side view of an electronic device with a hinge assembly in an example open position according to one or more embodiments.
[0023] FIG. 11B is a side view of a portion of an electronic device with a hinge assembly in another example open position according to one or more embodiments.
[0024] FIG. 12A is a top plan view of an electronic device with a guide assembly and side hinge in an example open position according to one or more embodiments.
[0025] FIG. 12B is an isometric view of an electronic device with a guide assembly and side hinge in an example open position according to one or more embodiments.
[0026] FIG. 12C is an isometric view of an electronic device with a guide assembly and side hinge in a closed position according to one or more embodiments.
[0027] FIG. 12D is an isometric view of an electronic device with a guide assembly and side hinge in a fully rotated position according to one or more embodiments.
[0028] FIG. 13 is a cross-sectional view of a heat carrying member with a multiple protective layers according to one or more embodiments.
[0029] FIG. 14A is an isometric interior view of an electronic device in an example open position with a guide assembly and side hinge according to one or more embodiments.
[0030] FIG. 14B is a cut away view of one side of a guide assembly for an electronic device according to one or more embodiments.
[0031] FIG. 14C is a side elevation view of a side hinge for an electronic device according to one or more embodiments.
[0032] FIG. 14D is a cut away cross-sectional view of a side hinge for an electronic device according to one or more embodiments.
[0033] FIG. 15A is an exploded view of a heat carrying member, a flexible printed circuit (FPC), and one guide unit of a guide assembly for an electronic device according to one or more embodiments.
[0034] FIG. 15B is an isometric view of one roller of a guide assembly with a heat carrying member and a flexible printed circuit (FPC) according to one or more embodiments.
[0035] FIG. 15C is a cross-sectional view of one guide unit of a guide assembly for an electronic device according to one or more embodiments.
[0036] FIGS. 16A-16F are cross-sectional views of a guide unit and heat carrying member in various positions during rotational movement of an electronic device according to one or more embodiments.
[0037] FIG. 17 is an isometric view of another embodiment of a guide assembly in an electronic device in a closed position according to one or more embodiments.
[0038] FIG. 18 is a schematic cross-sectional view of another embodiment of a guide assembly in an electronic device in a closed position according to one or more embodiments.
[0039] FIG. 19A is a top plan view of an alternative hinge that may be used with a guide assembly in an electronic device according to one or more embodiments.
[0040] FIG. 19B is a partially exploded view of an alternative hinge for an electronic device according to one or more embodiments.
[0041] FIG. 19C is a top plan view of an alternative hinge for an electronic device according to one or more embodiments.
[0042] FIG. 20 is a block diagram of an example computer architecture that may be used in accordance with one or more embodiments.
[0043] Like reference numbers and designations in the various drawings indicate like elements.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
[0044] The present disclosure provides various possible embodiments, or examples, of systems, methods, and apparatuses to improve the use of heat carrying members for cooling heat producing components in electronic devices. A heat carrying member can spread the heat produced by heat sources from one area of an electronic device to another area and thus enable more effective heat dissipation from the device. Various embodiments disclosed herein improve heat dissipation by a heat carrying member that is extended between two chassis (e.g., lid and base, primary display and secondary display, etc.) of an electronic device (e.g., a laptop, a notebook, a dual display system, a convertible laptop/tablet, etc.). A guide unit provides a passage area through which a heat carrying member and possibly a flexible printed circuit (FPC) can be extended between the two chassis. In one embodiment disclosed herein, a hinge assembly can include a single guide unit configured to ensure that a curve length of a heat carrying member remains substantially the same when one chassis is rotated relative to the other chassis (or as both chassis are rotated relative to each other). In another embodiment disclosed herein, a different guide unit is coupled to each chassis and a separate hinge may facilitate rotation of one chassis relative to the other. A heat carrying member and optionally, a flexible printed circuit (FPC), can be secured to the two guide units to maintain a curve length of the heat carrying member and the FPC and to prevent deformations as a chassis is rotated about the hinge.