Claims:1. A system (100) for mounting of hard disk drive (HDD) assembly, said system comprising:
a printer circuit board (PCB) (106) mounted on a base (108) within an enclosure (104), one or more connectors (112) mounted on the PCB (106);
a guide element (110) configured on the base (108), the guide element (110) adapted to facilitate the hard disk drive (HDD) assembly (202) to couple with the one or more connectors (112) of the PCB (106); the HDD assembly comprising:
a front panel (204) having at least two spring lock screws (208), the at least two spring lock screws (208) adapted to clamp the HDD assembly with the one or more connectors (112) of the PCB;
one or more first grooves (210) configured on the font panel for mounting any or a combination of electromagnetic interference (EMI) and and electromagnetic compatibility (EMC) gasket to protect against electromagnetic interference; and
a support panel (206) configured with one or more holes for fixing HDD (212) to the support panel (206),
wherein, the guide element (110) facilitates the HDD assembly (220) to move between a first position and a second position.
2. The system as claimed in claim 1, wherein the HDD assembly (202) is mounted in any or a combination of vertical orientation and horizontal orientation.
3. The system as claimed in claim 1, wherein the front panel (204) and the support panel (206) are made of a combination of aluminium alloy.
4. The system as claimed in claim 3, wherein the one or more screws are used to fix the HDD (212) with the support panel (206).
5. The system as claimed in claim 1, wherein the guide element (110) comprises one or more second grooves for the guided entry of the HDD assembly (202), the guide element (110) is made of a combination of a teflon material.
6. The system as claimed in claim 5, wherein the guide element (110) is provided with a dovetail profile at the end that mates with a dovetail cut in the PCB at the rear side to ensure proper mating of the one or more connectors 112 with the HDD
7. The system as claimed in claim 1, wherein a memory card (214) provided on the PCB (106), wherein a set of instructions are installed in the memory card (214).
8. The system as claimed in claim 1, wherein movement of the HDD assembly (202) to the first position creates a uniform pushing force to act on the HDD assembly (202) to facilitate the HDD (212) to couple with the corresponding one or more connectors (112) of the PCB (106).
9. The system as claimed in claim 1, wherein movement of the HDD assembly (202) to the second position creates a uniform pulling force to act on the HDD assembly (202) to facilitate the HDD (212) to de-couple with the corresponding one or more connectors (112) of the PCB (106).
10. The system as claimed in claim 1, wherein, at the first position, the HDD assembly (202) is towards the guide element (110), and at the second position the HDD assembly (202) is away from the guide element (110).
, Description:TECHNICAL FIELD
[0001] The present disclosure relates, in general, to compact hard disk drive (HDD) assembly structure, and more specifically, relates to a hot-swappable and modular hard disk drive assembly.

BACKGROUND
[0002] Hard disk is an electromechanical device that is fixed inside a computer and is used for storing data and programs permanently. Hard disks generally provided with threaded holes for mounting purpose. Usually, hard disks are mounted inside the chassis of an electronic device with the help of these mounting holes, while the computer/server (electronic enclosure) is in switched off condition. This involves the removal of multiple parts and screws, to access the hard disk, which makes the HDD assembling and disassembling difficult.
[0003] Few exemplary existing HDD mounting methods and mechanisms include one or more drive per enclosure in a horizontal or vertical orientation. However, these carriers are unable to support hot-swapping of drive simultaneously without opening the chassis of the electronic enclosure. Further, the existing HDD mounting mechanism known in the art do not permit tool-less insertion or removal of HDD from electronic enclosure while the system is in on condition without opening the enclosure.
[0004] Therefore, there is a need in the art to provide a means that permits tool-less insertion or removal of HDD from the electronic enclosure with hot-swappable and modular operation while ensuring electromagnetic interference (EMI)/electromagnetic compatibility (EMC) protection.

OBJECTS OF THE PRESENT DISCLOSURE
[0005] An object of the present disclosure relates, in general, to hard disk drive (HDD) assembly structure, and more specifically, relates to a hot-swappable and modular hard disk drive assembly.
[0006] Another object of the present disclosure is to provide a system that operates as hot-swappable and modular arrangement of hard disk drive (HDD) assembly.
[0007] Another object of the present disclosure is to provide a system that enables quick and efficient extraction of HDD assembly from electronic enclosure.
[0008] Another object of the present disclosure provides EMI/EMC gasket for protection against electromagnetic interference.
[0009] Another object of the present disclosure is to provide a system that includes HDD assembly which ensure blind mating of HDD with its mating connector present on motherboard.
[0010] Another object of the present disclosure is to provide HDD assembly mount that can be mounted in any orientation either vertical or horizontal.
[0011] Another object of the present disclosure provides a structure that is unique and compact in design and can be installed in minimum space.
[0012] Another object of the present disclosure provides a system that ensures the positive clamping of the HDD assembly mount by two numbers of captive spring lock screws present on facia panel.
[0013] Another object of the present disclosure provides Teflon material for manufacturing Teflon guide which offers very less friction to the HDD assembly and in turn aids in smooth insertion of HDD assembly.
[0014] Another object of the present disclosure provides Morse-Taper principle that has been adopted in Teflon guide for proper guiding of the HDD assembly mount.
[0015] Another object of the present disclosure provides dovetail projection on the Teflon guide to maintain critical tolerance.
[0016] Yet another object of the present disclosure is to provide HDD assembly mount that withstands the shock load of 50 g for11 millisecond.

SUMMARY
[0017] The present disclosure relates, in general, to hard disk drive (HDD) assembly structure, and more specifically, relates to a hot-swappable and modular hard disk drive assembly.
[0018] The present disclosure ensures easy removal and insertion of HDD into an electronic enclosure with hot-swappable and modular operation while ensuring electromagnetic interference (EMI)/electromagnetic compatibility (EMC) protection and it can also withstand the shock load of 50g for11 millisecond. The HDD assembly mount is electrically connected to a printed circuit board (PCB) assembly motherboard using a connector on the HDD assembly connected with a mating connector mounted on the base card. The HDD is mounted on the mechanical structure to enable modularity and hot-swapping in operation. Separate guides and fitment panels are provided on the system for fixing the HDD assembly mount. The compact and unique structure is made to meet the requirement of modularity in the fitment of HDD.
[0019] In an aspect, the present disclosure provides a system for mounting of hard disk drive (HDD) assembly, the system includes a printer circuit board (PCB) mounted on a base within an enclosure, one or more connectors mounted on the PCB, a guide element configured on the base, the guide element adapted to facilitate the hard disk drive (HDD) assembly to couple with the one or more connectors of the PCB; the HDD assembly comprising a front panel having at least two spring lock screws, the at least two spring lock screws adapted to clamp the HDD assembly with the one or more connectors of the PCB; one or more first grooves configured on the font panel for mounting any or a combination of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) gasket to protect against electromagnetic interference; and a support panel configured with one or more holes for fixing HDD to the support panel, wherein, the guide element facilitates the HDD assembly to move between a first position and a second position.
[0020] In an embodiment, the HDD assembly is mounted in any or a combination of vertical orientation and horizontal orientation.
[0021] In another embodiment, the front panel and support panel are made of a combination of aluminium alloy.
[0022] In another embodiment, the one or more screws are used to fix the HDD with the support panel.
[0023] In another embodiment, the guide element may include one or more second grooves for the guided entry of the HDD assembly, the guide element may be made of a combination of a teflon material.
[0024] In another embodiment, the guide element may be provided with a dovetail profile at the end that mates with a dovetail cut in the PCB at the rear side to ensure proper mating of one or more connectors with the HDD.
[0025] In another embodiment, memory card provided on the PCB, wherein a set of instructions are installed in the memory card.
[0026] In another embodiment, the movement of the HDD assembly to the first position creates a uniform pushing force to act on the HDD assembly to facilitate the HDD to couple with the corresponding one or more connectors of the PCB.
[0027] In another embodiment, the movement of the HDD assembly to the second position creates a uniform pulling force to act on the HDD assembly to facilitate the HDD to de-couple with the corresponding one or more connectors of the PCB.
[0028] In another embodiment, at the first position, the HDD assembly is towards the guide element, and at the second position the HDD assembly is away from the guide element.
[0029] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.

BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The following drawings form part of the present specification and are included to further illustrate aspects of the present disclosure. The disclosure may be better understood by reference to the drawings in combination with the detailed description of the specific embodiments presented herein.
[0031] FIG. 1A illustrates an exemplary representation of an electronic device enclosure, in accordance with an embodiment of the present disclosure.
[0032] FIG. 1B illustrates an exemplary view of hard disk drive assembly and hard disk mounting frame assembly, in accordance with an embodiment of the present disclosure.
[0033] FIG. 1C illustrates an exemplary view of a 2-U form factor chassis of the electronic device, in accordance with an embodiment of the present disclosure.
[0034] FIG. 1D illustrates an exemplary view of motherboard with SATA connectors, in accordance with an embodiment of the present disclosure.
[0035] FIG. 1E illustrates an exemplary representation of Teflon guide, in accordance with an embodiment of the present disclosure.
[0036] FIG. 2 illustrates an exemplary top view of the hard disk assembly, in accordance with an embodiment of the present disclosure.
[0037] FIG. 3A illustrates an exemplary representation of Morse taper arrangement in Teflon guide, in accordance with an embodiment of the present disclosure.
[0038] FIG. 3B illustrates an exemplary view of dovetail cut out provided on the Teflon guide, in accordance with an embodiment of the present disclosure.
[0039] FIG. 4A illustrates an exemplary stress plot under 50G shock, in accordance with an embodiment of the present disclosure.
[0040] FIG. 4B illustrates an exemplary strain plot under 50G shock, in accordance with an embodiment of the present disclosure.
[0041] FIG. 4C illustrates an exemplary shock transmitted in terms of G under 50G shock, in accordance with an embodiment of the present disclosure.
[0042] FIG. 4D illustrates an exemplary deformation due to hard disk weight, in accordance with an embodiment of the present disclosure.
[0043] FIG. 4E illustrates an exemplary stress plot due to hard disk weight, in accordance with an embodiment of the present disclosure.
[0044] FIG. 4F illustrates an exemplary strain plot due to hard disk weight, in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION
[0045] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. If the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0046] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0047] The present disclosure relates, in general, to hard disk drive (HDD) assembly structure, and more specifically, relates to a hot-swappable and modular hard disk drive assembly.
[0048] The present disclosure ensures easy removal and insertion of HDD into an electronic enclosure with hot-swappable and modular operation while ensuring electromagnetic interference (EMI)/electromagnetic compatibility (EMC) protection and it can also withstand the shock load of 50g for11 millisecond. The HDD assembly mount is electrically connected to a printed circuit board (PCB) assembly motherboard using a connector on the HDD assembly connected with a mating connector mounted on the base card. The HDD is mounted on the mechanical structure to enable modularity and hot-swapping in operation. Separate guides and fitment panels are provided on the system for fixing the HDD assembly mount. The compact and unique structure is made to meet the requirement of modularity in the fitment of HDD. The present disclosure can be described in enabling detail in the following examples, which may represent more than one embodiment of the present disclosure.
[0049] FIG. 1A illustrates an exemplary representation of an electronic device enclosure, in accordance with an embodiment of the present disclosure.
[0050] Referring to FIG. 1A, the system 100 may include hard disk drive (HDD) assembly structure 202 also interchangeably referred as hard disk drive assembly mount (as illustrated in FIG. 1B and described in detail below) that can allow the HDD to be quickly inserted and removed from an electronic device 102 also interchangeably referred to as digital data storage device 102. The digital data storage device 102 may include an enclosure 104, a motherboard 106 also interchangeably referred to as printed circuit board (PCB) 106, a base 108, a guide element 110 also interchangeably referred to as Teflon guide 110 and one or more connectors 112. The present disclosure provides a unique hot-swappable and modular arrangement for HDD assembly mount while ensuring electromagnetic interference (EMI)/electromagnetic compatibility (EMC) protection.
[0051] In an exemplary embodiment, the one or more connections 112 may be serial advanced technology attachment (SATA) connectors 112. The one or more connectors 112 may be mounted on the motherboard 106 to provide an electrical interface for HDD. The system 100 ensure blind mating of HDD with its mating connectors 112 present on the motherboard 106.
[0052] FIG. 1B illustrates an exemplary view of hard disk drive assembly and hard disk mounting frame assembly, in accordance with an embodiment of the present disclosure.
[0053] As shown in FIG. 1B, the HDD assembly 202 also interchangeably referred to as HDD mounting structure 202 may include at least two metallic frames, a front panel 204 also interchangeably referred to as facia panel 204 and a support panel 206. The facia panel 204 may include at least two spring lock screws 208 and holes to rivet the support panel 206. One or more grooves 210 (also referred to as one or more first grooves) may be provided on the facia panel 204 for mounting EMI/EMC gasket. The EMI gasket functions to reduce the susceptibility of HDD to EMI interference originating from other components external to the electronic enclosure. The facia panel 204 and the support panel 206 are made of a combination of aluminium alloy. The HDD assembly mounting structure is made by riveting facia panel 204 and support panel 206.
[0054] In another embodiment, one or more holes may be provided on the support panel 206 for fixing HDD 212 on the support panel 206. One or more screws may be used to fix the HDD with support panel 206. In an exemplary embodiment, the one or more holes may be four countersunk (CSK) holes that are provided on the support panel 206 for fixing HDD 212. In another exemplary embodiment, M3 X 6 CSK screws can be used to fix the HDD 212 with support panel 206. HDD assembly mount can be fixed to any flat surface having sufficient opening for the entry and mating M3 tapped holes at the panel for fixing.
[0055] FIG. 1C illustrates an exemplary view of a 2-U form factor chassis of the electronic device 102, in accordance with an embodiment of the present disclosure. The 2-U form factor chassis may include motherboard 106 mounted on the base 108. The HDD assembly 202 may be inserted inside the enclosure 104.
[0056] FIG. 1D illustrates an exemplary view of motherboard with SATA connectors, in accordance with an embodiment of the present disclosure. In an exemplary embodiment, the two SATA connectors 112 may be mounted on the motherboard 106 in parallel with sufficient distance, for fixing the two hard disks 202 as shown in FIG. 1C.
[0057] FIG. 1E illustrates an exemplary representation of Teflon guide, in accordance with an embodiment of the present disclosure.
[0058] Referring to FIG. 1E, the Teflon guide 110 may be configured in the electronic device 102. Dovetail projection may be provided on the Teflon guide 110 to maintain critical tolerance. To maintain the critical tolerance of the assembly, the teflon guides 110 may be provided with a dovetail profile at the end that mates with a dovetail cut in the motherboard 106 at the rear side to ensure proper mating of SATA connectors 112.
[0059] Teflon guides 110 may be provided for the smooth guiding of the HDD assembly mount 202. Teflon guides 110 may be fixed on the base 108 using screws. Teflon guides 110 may include one or more grooves (also referred to as one or more second grooves) of size 2.2 mm X 3.2 mm for the entry of HDD assembly mount 202. Morse -taper principle may be adopted for the one or more grooves to ensure the connector tightness at the rear side and easy entry of the module at the front side. Though the SATA connector 112 is having a tolerance of ±0.35 mm, the tolerance provided between guide and HDD assembly 202 is ±0.2 mm. Thus, the tolerance provided on the Teflon guide 110 is well within the mating tolerance range of the connectors 112, so facilitates smooth blind insertion and extraction of the HDD assembly 202.
[0060] In an implementation, the PCB 106 may be mounted on the base 108 within the enclosure 104, one or more connectors 112 mounted on the PCB 106. The guide element 110 configured on the base 108, the guide element 110 may be adapted to facilitate the HDD assembly 202 to couple with the one or more connectors 112 of the PCB 106. The HDD assembly 202 may include the front panel 204 having at least two spring lock screws 208, where the at least two spring lock screws 208 adapted to clamp the HDD assembly 202 with the one or more connectors 112 of the PCB 106. The one or more first grooves 210 configured on the front panel 204 for mounting any or a combination of EMI and EMC gasket to protect against electromagnetic interference.
[0061] The HDD assembly 202 may include the support panel 206 configured with one or more holes for fixing HDD 212 to the support panel 206, where, the guide element 110 may facilitate the HDD assembly 202 to move between a first position and a second position. The movement of the HDD assembly 202 to the first position creates a uniform pushing force to act on the HDD assembly 202 to facilitate the HDD 212 to couple with the corresponding one or more connectors 112 of the PCB 106.
[0062] The movement of the HDD assembly 202 to the second position creates a uniform pulling force to act on the HDD assembly 202 to facilitate the HDD 212 to de-couple with the corresponding one or more connectors 112 of the PCB 106. For example, at the first position also interchangeably referred to as insertion position, the HDD assembly 202 may be towards the guide element 110, and at the second position also interchangeably referred to as removal position the HDD assembly 202 may be away from the guide element 110.
[0063] The embodiments of the present disclosure described above provide several advantages. The one or more of the embodiments provide the system 100 with electronic device 102 that includes the guide element 110, which may be made of a combination of Teflon material for manufacturing Teflon guide which offer very less friction to the HDD assembly 202 and in turn aids in the smooth insertion of the HDD assembly 202. The HDD assembly mount withstands the shock load of 50 g for11 millisecond. Dovetail projection is provided on the Teflon guide 110 to maintain critical tolerance. Morse-Taper principle has been adopted in Teflon guide for proper guiding of the HDD assembly mount. The positive clamping of the HDD assembly mount is ensured by two numbers of captive spring lock screws present on facia panel 204. The structure is unique and compact in design and can be installed in minimum space. The HDD assembly mount 202 can be used to mount in any orientation either vertical or horizontal. The HDD assembly mount 202 ensures blind mating of HDD with its mating connector present on the motherboard 106. HDD assembly mount has provision to mount EMI/EMC gasket around facia panel for protection against electromagnetic interference. Further, the system 100 aids in quick and efficient extraction of HDD assembly from electronic enclosure 104.
[0064] FIG. 2 illustrates an exemplary top view of the hard disk assembly 200, in accordance with an embodiment of the present disclosure.
[0065] Referring to FIG. 2, the operating system (OS) may be installed on memory card 214 provided on the motherboard 106 assembly. This arrangement facilitates removal and insertion of HDD 212, while the system 100 is in on condition, without affecting any functionality, thus it is hot-swappable and modular. The mother board assembly 106 and Teflon guide 110 may be fixed to the base 108, a hot-swap port coupled electrically to and mounted directly on the motherboard assembly 106 extending into the slot and the casing.
[0066] The base area of HDD 212 is around 100 mm x70mm and the base area of HDD assembly mount is around 107 mm X 75 mm. Hence the area of the HDD assembly mount is 18% more than the base area of HDD, thereby making it compact.
[0067] Over travel of HDD is avoided during assembly by enclosure front face.
Frictional force encountered by Hard disk assembly during insertion:
Mass of hard disk = 60 grams
Mass of mounting frame= 45 grams
Coefficient of friction of Aluminium on Teflon: 0.19 μ
Total mass of system = mass of hard disk + mass of mounting frame
= 60 grams+ 45 grams = 110 grams
Frictional Force = Coefficient of friction x mass x gravity
= 0.19 x 0.110 x 9.81
= 0.205 Newton.
[0068] Thus, the frictional resistance force encountered by HDD assembly mount during insertion as well as extraction due to sliding is around 0.205 newton.
[0069] FIG. 3A illustrates an exemplary representation of Morse taper arrangement 300 in Teflon guide, in accordance with an embodiment of the present disclosure. The Morse-Taper principle has been adopted in Teflon guide for proper guiding of the HDD assembly mount 202.
[0070] FIG. 3B illustrates an exemplary view of dovetail cut out provided on the Teflon guide, in accordance with an embodiment of the present disclosure. Dovetail projection may be provided on the Teflon guide 110 to maintain critical tolerance. To maintain the critical tolerance of the HDD assembly 202, teflon guides 110 may be provided with the dovetail profile at the end that mates with the dovetail cut in the motherboard 106 at the rear side to ensure proper mating of SATA connectors 112.
[0071] FIG. 4A illustrates an exemplary stress plot under 50G shock, in accordance with an embodiment of the present disclosure. The stress plot under 50G shock include type as equivalent (von-miss) stress, unit as MPa, and required maximum over time.
[0072] FIG. 4B illustrates an exemplary strain plot under 50G shock, in in accordance with an embodiment of the present disclosure. The illustrated strain plot under 50G shock include type as equivalent elastic strain, unit as mm/mm, and required maximum over time.
[0073] FIG. 4C illustrates an exemplary shock transmitted in terms of G under 50G shock, in accordance with an embodiment of the present disclosure. The illustrated shock transmitted in terms of G under 50G shock may include type as total acceleration, unit as mm/s2 and time as 1.1e-002.
[0074] FIG. 4D illustrates an exemplary deformation due to hard disk weight, in accordance with an embodiment of the present disclosure. Maximum deformation resulted due to static weight of hard disk is 0.03 mm only, which is much less than mating tolerance limit of SATA connector.
[0075] FIG. 4E illustrates an exemplary stress plot due to hard disk weight, in accordance with an embodiment of the present disclosure. As shown in FIG 4E, the maximum Von-misses stress developed on the support panel is 1.3Mpa. The yield stress of aluminium alloy is 160Mpa, hence the stress developed on support panel is within safe limit.
[0076] FIG. 4F illustrates an exemplary strain plot due to hard disk weight, in accordance with an embodiment of the present disclosure. FIG. 4F depicts, the strain caused due to hard disk weight on the support panel of the HDD assembly.
[0077] It will be apparent to those skilled in the art that the system 100 of the disclosure may be provided using some or all of the mentioned features and components without departing from the scope of the present disclosure. While various embodiments of the present disclosure have been illustrated and described herein, it will be clear that the disclosure is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the spirit and scope of the disclosure, as described in the claims.

ADVANTAGES OF THE PRESENT DISCLOSURE
[0078] The present disclosure provides a system that operates as hot-swappable and modular arrangement of HDD assembly.
[0079] The present disclosure provides a system that enables quick and efficient extraction of HDD assembly from electronic enclosure.
[0080] The present disclosure provides EMI/EMC gasket for protection against electromagnetic interference.
[0081] The present disclosure provides a system that includes HDD assembly which ensure blind mating of HDD with its mating connector present on motherboard.
[0082] The present disclosure provides HDD assembly mount that can be mounted in any orientation either vertical or horizontal.
[0083] The present disclosure provides a structure that is unique and compact in design and can be installed in minimum space.
[0084] The present disclosure provides a system that ensures the positive clamping of the HDD assembly mount by two numbers of captive spring lock screws present on facia panel.
[0085] The present disclosure provides Teflon material for manufacturing Teflon guide which offers very less friction to the HDD assembly and in turn aids in smooth insertion of the HDD assembly.
[0086] The present disclosure provides Morse-Taper principle that has been adopted in Teflon guide for proper guiding of the HDD assembly mount.
[0087] The present disclosure provides dovetail projection on the Teflon guide to maintain critical tolerance.
[0088] The present disclosure provides HDD assembly mount that withstands the shock load of 50 g for11 millisecond.