TECHNICAL FIELD
[0001] The present disclosure, in general, relates to an electric driver and, in particular, relates to an electric driver that produces light using Light emitting diode (LED) luminaire, wherein the LED luminaire can be a bulb, a spotlight, a downlight, and so forth.
BACKGROUND
[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] Light-emitting diode (LED) devices are more efficient than most forms of widely used lamps, for example, incandescent, high-intensity discharge (HID) light sources, and the like. One advantage of using LED devices is that LEDs are more efficacious than incandescent light and more efficacious than some fluorescent and low wattage HID light sources. Another advantage of LED device usage is that the LEDs may be configured as low voltage, low energy devices. Another advantage of the LED devices is that of the longer life when compared to other light forms.
[0004] In traditional DOB LED bulbs a metal core printed circuit board (MCPCB) comprises of all the components which are mounted on the MCPCB, which poses certain difficulties in the effective functioning of the LED bulb and thus reduces its efficiency. In the existing state of the art the conventional designs consist of direct AC wire soldering having a Metal oxide varistor or a Wire wound

resistor (WWR) on the MCPCB due to which the High Voltage (HV) dielectric layer on the MCPCB has to be 2KV.
[0005] MCPCB need to be 2 KV The disadvantages associated with the conventional design are the following:
a. Reduced life of surge protection drive (SPD) component.
b. Possibility of development of a shade or spot on difluser due to
a SPD component.
c. Requirement of high grade dielectric materials for handling of
alternate current (AC) on MCPCB.
d. Overloading of components on the MCPCB.
e. Possibility of a disconnection amongst the components of the
MCPCB due to overheating of the board.
f Reduced lamp life due to excessive heating.
g. In some cases, input wire is connected with the help of a connector which may loosen up its fitting in case of improper handling thus resulting in lamp not burn.
h. Connector may pose disadvantages in the longer run due to a loose or improper connection over a period of time or may have chances of multiple ON and OFF, which in return affects the over life of a lamp and is not suitable for a longer use.
i. Connection issues over certain time interval thus resulting in reduction in life of lamp.
j. Overheating of surge protection device (SPD) component heats up frequently and thus reduces the consumer preference.
[0006] Therefore, there is a need for such a device or such an LED driver which can overcome the above-described limitations and obtain maximum operating

efficiency in a cost-effective manner which is unique in its design and exhibits prime quality for use over a sufficient period of time.
OBJECTS OF THE DISCLOSURE
[0007] Some of the objects of the present disclosure, which at least one embodiment herein satisfy, are listed here in below.
[0008] It is a general object of the present disclosure to ensure a cost-effective and efficient operation of a LED luminaire.
[0009] It is another object of the present disclosure to ensure an improved beam pattern if a lamp.
[0010] It is another object of the present disclosure to reduce the possibility of spot formation over the diffuser in the LED luminaire.
[0011] It is another object of the present disclosure to provide for a reduced use of high grade dielectric material.
[0012] It is another object of the present disclosure to reduce the overcrowding of components on the MCPCB.
[0013] It is another object of the present disclosure to provide for ease in assembly of the different components of a LED luminaire.
[0014] It is still another object of the present disclosure to provide a hybrid driver for said retrofit Light Emitting Diode (LED) luminaire, which is a HD LED downlight.
[0015] It is yet another object of the present disclosure to provide a hybrid driver fixed on the slot of an Aluminium Insert heat sink fixed on the plastic part of the outer based of said downlight.

[0016] It is still yet another object of the present disclosure to provide a proposed HD LED downlight, which facilitates improved heat dissipation by using said Aluminium (AT) insertion heat sink which is pre-moulded and fixed into the plastic part of said downlight and the MCPCB is mechanically locked in the downlight.
[0017] These and other objects and advantages of the present invention will be apparent to those skilled in the art after a consideration of the following detailed description taken in conjunction with the accompanying drawings in which a preferred form of the present invention is illustrated.
SUMMARY
[0018] This summary is provided to introduce concepts related to hybrid driver for a retrofit Light Emitting Diode LED luminaire having light-emitting diodes. The concepts are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
[0019] The present disclosure relates to a hybrid driver for a retrofit Light Emitting Diode (LED) luminaire. The hybrid driver includes a metal core printed circuit board (MCPCB) having light emitting diodes mounted thereon. The hybrid driver includes a child printed circuit board (PCB) directly connected to the MCPCB in a U-shaped locking orientation through a slot provided on the surface of the MCPCB. The child PCB includes a metal oxide varistor (MOV) and a wire wound resistor (WWR) embedded on the surface of the child PCB. The LED luminaire is a downlight, where the hybrid driver is fixed inside a metal heat sink that is insert moulded in an inner side of a plastic base part of the downlight.
[0020] In another aspect of the invention, the child PCB is connected to surface of the MCPCB (400) at an angle of 90°.

[0021] In another aspect, AC Protection components are embedded on the child PCB.
[0022] In another aspect, the MCPCB comprises a dielectric layer for transmission of heat.
[0023] In an aspect, the metal heat sink is an aluminum (AT) heat sink.
[0024] In an aspect, the downlight is 2 inch diameter downlight, 3 inch diameter downlight, or 4 inch diameter downlight.
[0025] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.
[0026] It is to be understood that the aspects and embodiments of the disclosure described above may be used in any combination with each other. Several of the aspects and embodiments may be combined to form a further embodiment of the disclosure.
[0027] The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The illustrated embodiments of the subject matter will be best understood by reference to the drawings, wherein like parts are designated by like numerals throughout. The following description is intended only by way of example, and simply illustrates certain selected embodiments of devices, systems, and methods that are consistent with the subject matter as claimed herein, wherein:
[0029] FIG. 1 illustrates an orthogonal view of the existing state of the art;

[0030] FIG. 2 illustrates an orthogonal view of a child printed circuit board (PCB) and DOB MCPCB, in accordance with an exemplary embodiment of the present disclosure;
[0031] FIG. 3 illustrates a different view of the printed circuit board (PCB), in accordance with an exemplary embodiment of the present disclosure;
[0032] FIG. 4 illustrates an orthogonal view of a metal core printed circuit board MCPCB, in accordance with an exemplary embodiment of the present disclosure;
[0033] FIG. 5 illustrates a schematically illustrate a process of locking a child driver PCB with the MCPCB resulting into a hybrid driver, in accordance with an exemplary embodiment of the present disclosure;
[0034] FIG. 6 illustrates a schematically illustrate a hybrid driver fixed inside an Aluminium (Al) heat sink inserted moulded inside the plastic base part of the down light, in accordance with an exemplary embodiment of the present disclosure;
[0035] FIG. 7 illustrates an exploded view of the downlight in accordance with an exemplary embodiment of the present disclosure;
[0036] FIGS.8A-8D illustrate different top views of the downlight in accordance with an exemplary embodiment of the present disclosure;
[0037] FIG. 9 illustrates a different views of a PC Diffuser in accordance with an exemplary embodiment of the present disclosure; and
[0038] FIG. 10 illustrates a downlight in an assembled state as per an embodiment of the present disclosure.
DETAILED DESCRIPTION
[0039] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not

intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
[0040] As used in the description herein and throughout the claims that follow, the meaning of "a," "an," and "the" includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of "in" includes "in" and "on" unless the context clearly dictates otherwise.
[0041] The present disclosure aims to solve a technical problem of reducing the requirement of high amount of di-electric layer in a metal core printed board in a LED luminaire in such a way that it comprises of an integrated hybrid structure that increases the operating efficiency of the LED luminaire in a cost-effective manner.
[0042] In the LED illuminations, heat transmission and its management during the operation of a LED luminaire, such as LED Bulb or LED downlight, is always a major concern. The conventional systems of existing LED Bulb 100 are designed in such a way that all the components are mounted on a metal core printed circuit board (MCPCB) 101, due to which board becomes over-crowded as shown in FIG. 1 which illustrates the structure of the existing connection between a PCB driver and a MCPCB in LED Bulbs. It has been observed that the heating profile onboard is not stable and the assembly process is also complex in the existing system. The uncontrolled heat dissipation may have chances to form shade on difiuser due to which overall product appearance gets disturbed.
[0043] Further, along with heat management, it becomes necessary that the device is cost-effective, easy to assemble and capable of mass production in order to meet the large market demands as compared to the conventional DOB LED bulbs available in the market.
[0044] To address this, the present disclosure provides a hybrid driver for a retrofit LED bulb leading to a reduction of di-electric requirement of the metal core printed circuit board (MCPCB) and a simplified design of the child PCB connected

to the metal core printed board (MCPCB) resulting in an improved beam pattern of the lamp and removal of spot formation over the difiiiser and further advantages.
[0045] Hybrid driver 200 is shown in FIG. 2, in accordance with an exemplary embodiment. The hybrid driver 200 can be easily converted to a conventional utility fixture using Incand.
[0046] FIG.2 provides a perspective view of the complete set of assembly of a hybrid driver 200 with an insight into the interconnection between the child PCB 300 and the metal core printed board (MCPCB) 400 along with a layout of the AC components on the hybrid driver 200.
[0047] As shown in FIGs 2, 3 and 4, the child PCB 200 is connected to a MCPCB 400 through a slot 401 provided on the surface of the MCPCB 400. The connecting portion 301 on the child PCB 300 is inserted into the slot 401 from the bottom of the MCPCB 400 at an angle in range of 70° to 120° at particular to 90° wherein the child PCB 300 is fixed into the MCPCB 400 using the soldering so as to attain a stable structure and connection.
[0048] In accordance with the above description, the connection of the child PCB 300 with the MCPCB 400 is in form of a U-shape such that the connecting portion 301 has a provision of a slot to insert and solder the slot 401 on the MCPCB 400 directly. Further, the child PCB 300 as shown in FIG. 2 and FIG. 3 (top, bottom and side view of the child driver PCB 200) comprises of components such as metal oxide varistor (MOV) or wire wound resistors (WWR) or MPP/MPET capacitor and/or all alternate current (AC) components which convert the alternate current (AC) into direct current (DC). The child PCB 300 supplies voltage and current with reduced and controlled surge to the MCPCB 400 which results into a reduced requirement of di-electric layer on the MCPCB 400 for a better performance and cost efficiency.

[0049] Further illustrated in FIGs.2, 3 and 4 the child PCB 300 is connected to the MCPCB 400 in such away the locking mechanism is a U-shaped lock wherein the connecting portion (301) is interlocked inside the slot (401) provided on the surface of the MCPCB 400 and further the connecting portion 301 is soldered to the surface of the MCPCB 400. This also reduces the component count on the MCPCB 400 which in return controls heat dissipation and transmission of heat in the heating zone over the MCPCB 400.
[0050] As illustrated in FIG. 5 during the assembly of a LED bulb, firstly the child PCB 300 is inserted into the MCPCB 400 through the slot 401 wherein the connecting portion 301 is interlocked into the slot 401 wherein the child driver PCB 300 is slided to match the output solder pad of the slot 401 provided on the MCPCB.
[0051] The hybrid driver 200 provides for best output of light with an innovative design concept. Thermal regulation is optimized due to lesser components on the MCPCB 400 which also has the heating zone and thus life of the components on the child PCB 300 is also increased as they are not exposed to the heat dissipated on the surface of MCPCB 400. Further, the light distribution of lamp is also enhanced as the components on the child PCB 300 are not in the vicinity of the LED light source and no shade is casted on the difiuser which usually affects the distribution of light from the lamp.
[0052] Further, the AC voltage operation with controlled and low surge power supply is controlled by the child PCB 300 and thus the requirement of high di-electric in the MCPCB 400 is reduced which in turn reduces the cost of MCPCB 400 and possibilities of failure due to a AC-voltage spike are also removed.
[0053] Additionally, the requirement of a output wire gets removed due to a direct connection between the child PCB 300 and MCPCB 400 via the connecting portion 301 provided in such a manner that the connecting portion 301 has a provision of a slot to insert and solder the slot 401 on MCPCB 400 directly thus reducing the complexity of process and time of production at the same time.

[0054] In the above disclosure, the hybrid driver for retrofit LED bulb is having a few disadvantages related to heat management which can be associated with mechanical fitment of aluminium heat sink which provides more generation of heat and further it affects the functionality of MCPCB and child PCB and in total it provides an impact on the bulb functionality. To minimising above problem, the use of thermal paste is applied between aluminium heat sink and the MCPCB so as to minimize the air gap between them for better heat management. However, air is a big insulator, it does not provide the solution. The thermal paste application increase process and production cost and also add an additional thermal resistance to the flow of heat from LED to outside environment. Further, with respect to design concept, whole component were mounted on MCPCB, due to which the board looks so crowded, also heating profile on board is not stable. In addition to this, there may be chances of component disconnection due to overheat of LEDs. Moreover, the longevity of the LED bulb is reduced due to overheating. Therefore, there is a requirement to improvise the heat dissipation and provide solutions of problems existing in the currently designed LED bulbs.
[0055] Also, it can be appreciated by those skilled in the art that the LED luminaire/bulb may include, but not limited to, downlight, spotlight, false ceiling light, ceiling light, wall light, and the like. FIG. 6 illustrates an improvised version with technical advancement of the hybrid driver 200 for aHDLED downlight 600 in an embodiment of the present disclosure.
[0056] In the embodiment of the present disclosure as shown in FIGS. 6 and 10, the HD LED downlight 600 is incorporating the hybrid driver 200 inside a heat sink insert moulded within a plastic base part 702 (FIG. 7) of the HD LED downlight 600. In an aspect, the heat sink is an aluminium (Al) heat sink 701 which is insert moulded in the plastic base part 702 of downlight 600. This structure of the downlight 600 helps in better heat dissipation of overall lamp. Further, the downlight 600 includes the child PCB 300, wherein new electronic component of

MO V/WWR are mounted on the child PCB 300, which facilitates the high dielectric requirement of the MCPCB along with insertion of Al heat sink 701.
[0057] Further, the Al heat sink 701 facilitates mechanical locking of the MCPCB 400 to provide better heat management, wherein this mechanical locking avoids screw and eliminates the use of thermal paste in between a metallic heat sink and the plastic base part of the downlight 600. The special fitment ofMCPCB 400 to the Al heat sink 701 provides improvised heat management, wherein the thermal resistance points are reduced in the concept of mechanically locking the MCPCB 400 on the Al heat sink 701 which has special groove which is made with tight tolerance between the MCPCB Outer diameter and the inner diameter of the Al heat sink groove.
[0058] FIG. 7 illustrates an exploded view of the downlight 600 comprising a polycarbonate (PC) difiuser 703, the MCPCB 400, the child PCB 300, the Al heat sink 701, and the plastic base part 702. The assembly of each parts of the downlight 600 is explained in detail in Experiment Result section.
[0059] In an aspect, the downlight 600 may be 2/3/4 inch diameter downlight, including various major parts mentioned as PC/PA/PBT (Poly carbonate/Polyamide/Polybutylene terephthalate) Body, PC (Polycarbonate) difiuser, MCPCB with LED, and Child PCB/SPD Driver PCB. The detailing of the PC/PA/PBT Body describes that this special shaped set of LED lamp heat sink would be able to provide multiple options, & effectively as per details explained in detailed on the later part. This is possible due to combination of best class electrically insulated plastic material like PBT or PC/PA having a lower conductivity up to 2w/m-k but with complete electrical insulation properties to end user. Experiments carried to optimize the material's cost, manufacturing costs, meeting ANSI dimensional requirements, manufacturing process. The combinations created in special manner to meet the objectives as it in insert moulded with Al insert for better thermal operation, this special shaped set of Al insert would be able to provide multiple option, & effectively. This is possible due

to combination of best class conductivity up to 205w/m-k. Experiments carried to optimize the material's cost, manufacturing costs, meeting ANSI dimensional requirements
[0060] FIGS. 8A-8D illustrate different top views of the Al heat sink 701 fixed in the plastic base part 702 of the said downlight 600. In FIG. 8 A, a red slot provided on the Al heat sink 701 is used to fix the MCPCB 400. With such slot, the Al heat sink 701 makes a proper contact area with the MCPCB 400. Such fixture of the MCPCB 400 within the downlight 600 prevents the MCPCB 400 from getting damaged, which leads to compensate the process time during production. In an aspect, as shown in FIG. 8B, one and more slots can be provided on the top surface of the downlight 600 to press fit the PC diffuser 703 during diffuser fitting process.
[0061] In an aspect, as shown in FIG. 8C, the hybrid driver 200 having the MCPCB 400 locked with the child PCB 300 is inserted from the top side of the downlight 600. Moreover, said MCPCB 400 with LEDs used in the downlight 600 describes that special shaped set of LED lamp would be able to provide multiple options and LED combination. Special Grade of aluminium material used and having best class of manufacturing and thermal conductivity up to 2W/m-k.
[0062] In addition to this, said child PCB/SPD (Surge Protection Devices) 301 based hybrid driver 200 used in the downlight 600 describes that special shaped set of LED lamp part would be able to provide separate SPD control and high voltage (HV) handling, thereby resulting in an increase in life of SPD component & better light distribution, with doing arrangement like below item, HV handling is also reduced over MCPCB result in better isolation to the overall lamp.
[0063] In an aspect FIG. 8D illustrates the top view of the hybrid driver 200 fixed in the plastic base part 702 including aluminium heat sink 701, wherein there is no gap in between insert moulded Al heat sink 701 and plastic base part 702 of the said downlight 600.
[0064] FIG. 9 illustrates the different views of the PC Diffuser 703. Further, said PC diffuser 703 used in the downlight 600 describes that special type of PC

material is used, because of which the LED light may not give harm during direct exposure. Also, the PC diffuser 703 has a special type of locking profile which will provide fine locking with body of the downlight 600.
[0065] FIG. 10 illustrates the downlight 600 in an assembled state as per an embodiment of the present disclosure.
[0066] In the embodiment of the present disclosure, the retrofit LED luminaire is a bulb, downlight, or spotlight, or combination of two and may be used in household and general purpose. Said downlight may be used wide due to its mentioned features like type of material used, shape of the downlight is flexible, unique design concept, simplified design, safety measures including heat sink attached in the plastic part of the downlight, and cost effective and longevity increased.
[0067] The hybrid driver 200 of the present disclosure has applications in HD LED Downlight used in household and general lighting purpose.
[0068] The technical features of the proposed invention are listed herein below:
TECHNICAL ADVANTAGES
[0069] The main feature of the present disclosure is to provide special fitment of MCPCB to the heat sink which facilitate better heat management. As the thermal resistance points are reduce in this concept of mechanically locking the MCPCB on the Al heat sink which has special groove, which is made with tight tolerance between the MCPCB outer diameter and the inner diameter of the Al heat sink groove.
[0070] The present disclosure is to provide HD LED downlight which is better and more cost effective, easy to assemble and easy to mass produce to meet large market requirements, over the conventional type of plastics used in set of LED categories.

[0071] The present disclosure is to provide HD LED downlight which provide multiple mounting option, position of uses and effectively used. This is possible due to combination of best class Electrically Insulated plastic material like PBT or PA having a lower conductivity up to 2w/m-k but with complete electrical insulation properties.
[0072] The important advantages of the HD LED downlight is to provide the locking and assembly arrangements, projections, wherein the configuration is unique in its nature which has been assembled after detailed study, experiments carried out. Further, the configuration is formed in such manner that light output coming out of lamp has better beam angle and do not harm the human eye after direct exposure to lamp.
[0073] Another advantage of the present disclosure is to provide better heat dissipation from Al heat sink insertion as no air gap.
[0074] Another advantage of the present disclosure is to provide mechanical locking ofMCPCB to Body which avoid screw and use of thermal paste.
[0075] Further, it will be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its scope.
[0076] Furthermore, all examples recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor(s) to furthering the art and are to be construed as being without limitation to such specifically recited examples and conditions. Also, the various embodiments described herein are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments.
[0077] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof The scope of the invention is determined by the claims

that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.
EXPERIMENTAL RESULT
[0078] In the exemplary retrofit LED downlight is shown in FIG. 9 with below specification:
• PA/PC/PBT/special plastic Body-lpc
• PCDifiuser-lpc
• Driver Child PCB(SPD) with input cable wire-lpc
• DOB MCPCB-lpc
[0079] In the embodiment of the exemplary downlight as shown in FIG.7, the various part of the assembly are described herein below:
[0080] In an aspect, during assembly, the first stage is the insertion of SPD driver PCB (Child PCB) with the help of slot provided into MCPCB and slides the driver PCB to match the output solder pad, this concept of separation of DOB design into small child PCB is means a lot from different points of view for better product.
[0081] In addition to this, at first it shall give better thermal regulation if few SPD components will not available in heating zone; also, it will give life to these SPD components.
[0082] Further, second option describes as, if SPD component will not available on MCPCB then light distribution of lamp is good, because if any SPD

component come near LED light source, then it will give shade on diffuser ultimately it will disturb the light distribution.
[0083] Third option describes that, as high voltage operation handling are mostly covered up by separate child PCB (also called SPD PCB), so MCPCB high dielectric requirement are suppressed down result in reduction in cost of MCPCB and failure due to high voltage is also reduced.
[0084] Fourth option describes that the output wire requirement is vanished as we have added a new concept to make connection in between SPD driver PCB and MCPCB via slot provided in SPD driver PCB in such a manner it will just have provision to insert and solder the slot on MCPCB directly, it will reduce the process and time of production at same time.
[0085] During assembly, the second stage is inserting the whole unit as assembled in first stage into DOWNLIGHT PA/PC/PBT heat sink (heat sink used is of better quality having thermal lower conductivity around 2W/m-k) by matching the outer diameter of MCPCB with groove provided inside the DL heat sink and then next stage is to press the MCPCB with the help of pressing jig into DL heat sink to tight fit the whole unit for better heat dissipation, if contact in between MCPCB and DL heat sink is loose then it directly affect the life of lamp, here we have added the provision of proper contact making in MCPCB and heat sink, which will ultimately give better life to lamp from heat point of view.

We Claim:
1. A hybrid driver (200) for a retrofit Light Emitting Diode (LED)
luminaire, the hybrid driver (200) comprising:
a metal core printed circuit board (MCPCB) (400) having light emitting diodes mounted thereon,
characterized in that,
the hybrid driver (200) comprises a child printed circuit board (PCB) (300) directly connected to the MCPCB (400) in a U-shaped locking orientation through a slot (401) provided on the surface of the MCPCB (400),
wherein the child PCB (300) comprises a metal oxide varistor (MOV) and a wire wound resistor (WWR) embedded on the surface of the child PCB (300),
wherein said LED bulb is a downlight, and
wherein the hybrid driver (200) is fixed inside a metal heat sink (701) that is insert moulded in an inner side of a plastic base part (702) of the downlight.
2. The hybrid driver (200) as claimed in claim 1, wherein the child PCB (300) is connected to surface of the MCPCB (400) at an approximately angle of 90°.
3. The hybrid driver (200) as claimed in claim 1, wherein AC components are embedded on the child PCB (300).
4. The hybrid driver (200) as claimed in claim 1, wherein the MCPCB (400) comprises a dielectric layer for transmission of heat.

5. The hybrid driver (200) as claimed in claim 1, wherein the metal heat sink is an aluminum (AT) heat sink.
6. The hybrid driver (200) as claimed in claim 1, wherein the downlight (600) is 2 inch diameter downlight, 3 inch diameter downlight, or 4 inch diameter downlight.