[0001]The present disclosure, in general, relates to an electric driver and, in particular, relates to an electric driver that produces light using Light emitting diode (LED) bulb.
BACKGROUND
[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] Light-emitting diode (LED) devices are more efficient than most forms of widely used lamps, for example, incandescent, high-intensity discharge (HID) light sources, and the like. One advantage of using LED devices is that LEDs are more efficacious than incandescent light and more efficacious than some fluorescent and low wattage HID light sources. Another advantage of LED device usage is that the LEDs may be configured as low voltage, low energy devices. Another advantage of the LED devices is that of the longer life when compared to other light forms.
[0004] In traditional DOB LED bulbs a metal core printed circuit board (MCPCB) comprises of all the components which are mounted on the MCPCB, which poses certain difficulties in the effective functioning of the LED bulb and thus reduces its efficiency. In the existing state of the art the conventional designs consist of direct AC wire soldering having a Metal oxide varistor or a Wire wound resistor (WWR) on the MCPCB due to which the High Voltage (HV) dielectric layer on the MCPCB has to be 2KV.

[0005] MCPCB need to be 2 KV The disadvantages associated with the conventional design are the following:
a. Reduced life of surge protection drive (SPD) component.
b. Possibility of development of a shade or spot on diffuser due to
a SPD component
c. Requirement of high grade dielectric materials for handling of
alternate current (AC) on MCPCB.
d. Overloading of components on the MCPCB.
e. Possibility of a disconnection amongst the components of the
MCPCB due to overheating of the board.
f Reduced lamp life due to excessive heating.
g. In some cases, input wire is connected with the help of a connector which may loosen up its fitting in case of improper handling thus resulting in lamp not burn.
h. Connector may pose disadvantages in the longer run due to a loose or improper connection over a period of time or may have chances of multiple ON & OFF, which in return affects the over life of a lamp and is not suitable for a longer use.
i. Connection issues over certain time interval thus resulting in reduction in life of lamp.
j. Overheating of surge protection device (SPD) component heats up frequently and thus reduces the consumer preference.
[0006] Therefore, there is a need for such a device or such an LED driver which can overcome the above-described limitations and obtain maximum

operating efficiency in a cost-effective manner which is unique in its design and exhibits prime quality for use over a sufficient period of time.
OBJECTS OF THE DISCLOSURE
[0007] Some of the objects of the present disclosure, which at least one embodiment herein satisfy, are listed here in below.
[0008] It is a general object of the present disclosure to ensure a cost-effective and efficient operation of a LED Bulb.
[0009] It is another object of the present disclosure to ensure an improved beam pattern if a lamp.
[0010] It is another object of the present disclosure to reduce the possibility of spot formation over the diffuser in the LED bulb.
[0011] It is another object of the present disclosure to provide for a reduced use of high grade dielectric material.
[0012] It is another object of the present disclosure to reduce the overcrowding of components on the MCPCB.
[0013] It is another object of the present disclosure to provide for ease in assembly of the different components of a LED bulb.
[0014] These and other objects and advantages of the present invention will be apparent to those skilled in the art after a consideration of the following detailed description taken in conjunction with the accompanying drawings in which a preferred form of the present invention is illustrated.
SUMMARY
[0015] This summary is provided to introduce concepts related to DOB LED bulb luminaries having light-emitting diodes. The concepts are further described

below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
[0016] In an embodiment, the present disclosure relates to a light-emitting diode (LED) DOB LED bulb luminaries comprising of grooves formed inside a housing body for holding a DOB metal core printed circuit board (MCPCB) driver, wherein the grooves are being formed longitudinally at MCPCB for connection of hybrid child PCB.
[0017] In an aspect of the invention, a hybrid driver for a retrofit LED bulb comprising of a child printed circuit board (PCB), and a metal core printed circuit board (MCPCB), wherein the child printed circuit board (PCB) is connected through soldering to the metal core printed circuit board (MCPCB) in a U-shaped locking orientation through a slot provided on the surface of the MCPCB.
[0018] In another aspect of the invention, the child PCB is connected to surface of the MCPCB (400) at an angle of 90°.
[0019] In another aspect of the invention, the child PCB comprises metal oxide varistor (MOV) embedded on the surface of the child PCB.
[0020] In another aspect of the invention, the child PCB comprises a wire wound resistor (WWR) embedded on the surface of the child PCB.
[0021] In another aspect of the invention, AC components are embedded on the child PCB.
[0022] In another aspect of the invention, the MCPCB comprises a dielectric layer for transmission of heat.
[0023] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description

of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.
[0024] It is to be understood that the aspects and embodiments of the
disclosure described above may be used in any combination with each other.
5 Several of the aspects and embodiments may be combined to form a further
embodiment of the disclosure.
[0025] The foregoing summary is illustrative only and is not intended to be in
any way limiting. In addition to the illustrative aspects, embodiments, and features
described above, further aspects, embodiments, and features will become apparent
10 by reference to the drawings and the following detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The illustrated embodiments of the subject matter will be best
understood by reference to the drawings, wherein like parts are designated by like
numerals throughout. The following description is intended only by way of
15 example, and simply illustrates certain selected embodiments of devices, systems,
and methods that are consistent with the subject matter as claimed herein, wherein:
[0027] FIG. 1 illustrates an orthogonal view of the existing state of the art;
[0028] FIG. 2 illustrates an orthogonal view of a child printed circuit board
20 (PCB) & DOB MCPCB, in accordance with an exemplary embodiment of the
present disclosure;
[0029] FIG. 3 illustrates a different view of the printed circuit board (PCB), in
accordance with an exemplary embodiment of the present disclosure;
6

[0030] FIG. 4 illustrates an orthogonal view of a metal core printed circuit
board MCPCB, in accordance with an exemplary embodiment of the present disclosure; and
[0031] FIG. 5 illustrates a schematically illustrate a process of locking a child
5 driver PCB with the MCPCB resulting into a hybrid driver, in accordance with an
exemplary embodiment of the present disclosure.
DETAILED DESCRIPTION
[0032] The following is a detailed description of embodiments of the
disclosure depicted in the accompanying drawings. The embodiments are in such
10 detail as to clearly communicate the disclosure. However, the amount of detail
offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
15 [0033] As used in the description herein and throughout the claims that
follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
20 [0034] The present disclosure aims to solve a technical problem of reducing
the requirement of high amount of di-electric layer in a metal core printed board in a LED bulb in such a way that it comprises of an integrated hybrid structure that increases the operating efficiency of the LED bulb in a cost-effective manner.
[0035] In the LED illuminations, heat transmission and its management
25 during the operation of a LED Bulb is always a major concern. The conventional
systems of existing LED Bulb 100 are designed in such a way that all the
components are mounted on a metal core printed circuit board (MCPCB) 101, due
7

to which board becomes over-crowded as shown in FIG. 1 which illustrates the
structure of the existing connection between a PCB driver and a MCPCB in LED
Bulbs. It has been observed that the heating profile on board is not stable and the
assembly process is also complex in the existing system. The uncontrolled heat
5 dissipation may have chances to form shade on diffuser due to which overall
product appearance gets disturbed.
[0036] Further, along with heat management, it becomes necessary that the
device is cost-effective, easy to assemble and capable of mass production in order
to meet the large market demands as compared to the conventional DOB LED
10 bulbs available in the market.
[0037] To address this, the present disclosure provides a hybrid driver for a
retrofit LED bulb leading to a reduction of di-electric requirement of the metal
core printed circuit board (MCPCB) and a simplified design of the child PCB
connected to the metal core printed board (MCPCB) resulting in an improved
15 beam pattern of the lamp and removal of spot formation over the diffuser and
further advantages.
[0038] Hybrid driver 200 is shown in FIG. 2, in accordance with an
exemplary embodiment. The hybrid driver 200 can be easily converted to a conventional utility fixture using Incand.
20 [0039] FIG.2 provides a perspective view of the complete set of assembly of a
hybrid driver 200 with an insight into the interconnection between the child PCB 300 and the metal core printed board (MCPCB) 400 along with a layout of the AC components on the hybrid driver 200.
[0040] As shown in FIGs 2, 3 and 4, the child PCB 200 is connected to a
25 MCPCB 400 through a slot 401 provided on the surface of the MCPCB 400. The
connecting portion 301 on the child PCB 300 is inserted into the slot 401 from the
bottom of the MCPCB 400 at an angle of 90° wherein the child PCB 300 is fixed
8

into the MCPCB 400 using the soldering so as to attain a stable structure and connection.
[0041] In accordance with the above description, the connection of the child
PCB 300 with the MCPCB 400 is in form of a U-shape such that the connecting
5 portion 301 has a provision of a slot to insert & solder the slot 401 on the MCPCB
400 directly. Further, the child PCB 300 as shown in FIG. 2 and FIG. 3 (top,
bottom and side view of the child driver PCB 200) comprises of components such
as metal oxide varistor (MOV) or wire wound resistors (WWR) and all alternate
current (AC) components which convert the alternate current (AC) into direct
10 current (DC). The child PCB 300 supplies direct current (DC) voltage to the
MCPCB 400 after a bridge diode which results into a reduced requirement of di-electric layer on the MCPCB 400 for a better performance and cost efficiency.
[0042] Further illustrated in FIGs.2, 3 and 4 the child PCB 300 is connected to
the MCPCB 400 in such a way the locking mechanism is a U-shaped lock wherein
15 the connecting portion (301) is interlocked inside the slot (401) provided on the
surface of the MCPCB 400 and further the connecting portion 301 is soldered to the surface of the MCPCB 400. This also reduces the component count on the MCPCB 400 which in return controls heat dissipation and transmission of heat in the heating zone over the MCPCB 400.
20 [0043] As illustrated in FIG.5 during the assembly of a LED bulb, firstly the
child PCB 300 is inserted into the MCPCB 400 through the slot 401 wherein the connecting portion 301 is interlocked into the slot 401 wherein the child driver PCB 300 is slided to match the output solder pad of the slot 401 provided on the MCPCB.
25 [0044] The hybrid driver 200 provides for best output of light with an
innovative design concept. Thermal regulation is optimized due to lesser components on the MCPCB 400 which also has the heating zone and thus life of the components on the child PCB 300 is also increased as they are not exposed to
9

the heat dissipated on the surface of MCPCB 400. Further, the light distribution of lamp is also enhanced as the components on the child PCB 300 are not in the vicinity of the LED light source and no shade is casted on the diffuser which usually affects the distribution of light from the lamp.
5 [0045] Further, the AC voltage operation is controlled by the child PCB 300
and thus the requirement of high di-electric in the MCPCB 400 is reduced which in turn reduces the cost of MCPCB 400 and possibilities of failure due to a AC voltage spike are also removed.
[0046] Additionally, the requirement of a output wire gets removed due to a
10 direct connection between the child PCB 300 & MCPCB 400 via the connecting
portion 301 provided in such a manner that the connecting portion 301 has a provision of a slot to insert & solder the slot 401 on MCPCB 400 directly thus reducing the complexity of process & time of production at the same time.
[0047] The hybrid driver 200 of the present disclosure has applications in
15 LED bulbs used in household and general lighting.
[0048] Further, it will be appreciated that those skilled in the art will be able
to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its scope.
[0049] Furthermore, all examples recited herein are principally intended
20 expressly to be only for pedagogical purposes to aid the reader in understanding
the principles of the invention and the concepts contributed by the inventor(s) to
furthering the art and are to be construed as being without limitation to such
specifically recited examples and conditions. Also, the various embodiments
described herein are not necessarily mutually exclusive, as some embodiments can
25 be combined with one or more other embodiments to form new embodiments.
[0050] While the foregoing describes various embodiments of the invention,
other and further embodiments of the invention may be devised without departing
10

from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.
Reference Numerals

Reference Numeral Description
100 Prior Art
101 Metal core printed circuit board (MCPCB)
200 Hybrid driver
300 Child PCB
301 Connecting portion in the Child PCB
400 DOB Metal core printed circuit board (MCPCB)
401 Slot on the MCPCB
500 Assembly arrangement in the LED bulb

We Claim:

A hybrid driver (200) for a retrofit LED bulb comprising:
a child printed circuit board (PCB) (300); and
a metal core printed circuit board (MCPCB) (400),
wherein the child printed circuit board (PCB) (300) is connected through soldering to the metal core printed circuit board (MCPCB) (400) in a U-shaped locking orientation through a slot (401) provided on the surface of the MCPCB (400).
2. The hybrid driver (200) as claimed claim 1, wherein the child PCB (300) is connected to surface of the MCPCB (400) at an angle of 90°.
3. The hybrid driver (200) as claimed claim 1, wherein the child PCB comprises metal oxide varistor (MOV) embedded on the surface of the child PCB.
4. The hybrid driver (200) as claimed claim 1, wherein the child PCB comprises a wire wound resistor (WWR) embedded on the surface of the child PCB.
5. The hybrid driver (200) as claimed claim 1, wherein AC components are embedded on the child PCB.
6. The hybrid driver (200) as claimed claim 1, wherein the MCPCB (400) comprises a dielectric layer for transmission of heat.