DESCRIPTION
[Title of Invention]
IC CURRENT MEASURING APPARATUS AND IC CURRENT
MEASURING ADAPTER
[Technical Field]
[0001]
The present invention relates to an IC current measuring apparatus for
measuring current flowing through an integrated circuit (IC).
[Background Art]
[0002]
There has been known a technology for measuring current consumed by an
IC in operation.
[0003]
For example, Patent Literature 1 discloses a technology for measuring the
total amount of current consumed by an IC as follows. An adapter for separating an
IC power source and a substrate power source is inserted between an IC and a
substrate. An ammeter is connected between a positive testing terminal of the adapter
that is connected to the IC power source and a negative testing terminal of the
adapter that is connected to the substrate power source in order to measure the total
amount of current.
[Citation List]
[Patent Literature]
[0004]
[Patent Literature 1]
Japanese Unexamined Patent Application Publication No. H5-134002
1

[Summary of Invention]
[Technical Problem]
[0005]
However, the above conventional art can only measure the total amount of
current flowing through the IC with the connected ammeter, but cannot measure
current flowing through each of a plurality of terminals included in the IC.
[0006]
The present invention has been achieved in view of the above problem. An
aim thereof is to provide an IC current measuring apparatus that is provided between
an IC and a substrate in order to measure current flowing through the plurality of
terminals of the IC and that can individually measure current that flows through
each of the plurality of terminals of the IC.
[Solution to Problem]
[0007]
In order to solve the above problem, an IC current measuring apparatus
pertaining to the present invention for measuring current flowing through a plurality
of terminals of an IC while being connected between the IC and a substrate, the IC
current measuring apparatus comprises: a plurality of IC-facing terminals each to be
connected to a different one of the plurality of terminals of the IC; a plurality of
substrate-facing terminals each (i) to be connected to a different one of a plurality of
terminals of the substrate and (ii) electrically connected to a different one of the
plurality of IC-facing terminals; a first element to generate a voltage in accordance
with current flowing between a first IC-facing terminal and one of the plurality of
substrate-facing terminals that corresponds to the first IC-facing terminal, the first
IC-facing terminal being one of the plurality of IC-facing terminals; a second
element to generate a voltage in accordance with current flowing between a second

IC-facing terminal and one of the plurality of substrate-facing terminals that
corresponds to the second IC-facing terminal, the second IC-facing terminal being
one of the plurality of IC-facing terminals; a first lead-out terminal to output the
voltage generated by the first element to the outside; and a second lead-out terminal
to output the voltage generated by the second element to the outside.
[Advantageous Effects of Invention]
[0008]
The IC current measuring apparatus pertaining to the present invention with
the above structure can measure (i) current flowing between the first IC-facing
terminal and the substrate-facing terminal that corresponds to the first IC-facing
terminal by measuring a voltage that occurs at the first element with use of the first
lead-out terminal and (ii) current flowing between the second IC-facing terminal and
the substrate-facing terminal that corresponds to the second IC-facing terminal by
measuring a voltage that occurs at the second element with use of the second
lead-out terminal.
[0009]
Accordingly, the present invention offers an effect of individually
measuring current that flows through the first IC-facing terminal and current that
flows through the second IC-facing terminal.
[Brief Description of Drawings]
[0010]
Fig. 1 is a cross-sectional view of an IC current measuring apparatus 100.
Fig. 2 is a plan view of the IC current measuring apparatus 100, as viewed
from the above.
Fig. 3 is an enlarged plan view of a part of the plan view of the IC current
measuring apparatus 100.

Figs. 4A-4C show characteristics that are obtained when Fourier transform
is performed on measured current.
Fig. 5 is a cross-sectional view of a first-modified IC current measuring
apparatus 500.
Fig. 6 is a plan view of a second-modified IC current measuring apparatus
600, as viewed from the above.
Fig. 7 is a cross-sectional view of a third-modified IC current measuring
apparatus 700.
Fig. 8 is a cross-sectional view of a fourth-modified IC current measuring
apparatus 800.
Fig. 9 is a cross-sectional view of a fifth-modified IC current measuring
apparatus 900.
Fig. 10 is a perspective view of an electromagnetic-wave receiving element
that is formed in vicinity to a current path.
Fig. 11 is a cross-sectional view of a sixth-modified IC current measuring
apparatus 1100.
Fig. 12 is a cross-sectional view of a seventh-modified IC current measuring
apparatus 1200.
Fig. 13 is a cross-sectional view of a lifting substrate 1300.
Fig. 14 is a cross-sectional view of an IC current measuring apparatus 1400.
[Description of Embodiments]
[0011]
[First Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, the following describes an IC current measuring apparatus for
measuring current flowing through each of power source terminals of an IC that is
provided with a total of 5 x 5 = 25 terminals packaged in a Ball Grid Array (BGA)

package.
[0012]
By being provided between the IC and a substrate, the IC current measuring
apparatus electrically connects terminals of the IC to respective terminals of the
substrate. Especially, with regard to power source terminals, a resistance of 1 CI is
inserted into each of current paths between power source terminals of the IC and
respective power source terminals of the substrate.
[0013]
Furthermore, the IC current measuring apparatus is provided with terminals
each for measuring a voltage between both ends of each inserted resistance.
[0014]
Accordingly, a measurer who measures current flowing through the power
source terminals of the IC can measure the current flowing through each of the
power source terminals of the IC in operation by (i) providing the IC current
measuring apparatus between the IC that is targeted for measurement and the
substrate and (ii) measuring a voltage between both ends of an inserted resistance
that corresponds to each power source terminal through which the current that
he/she wishes to measure flows.
[0015]
A structure of an IC current measuring apparatus pertaining to a first
embodiment is described below with reference to the drawings.
[0016]

Fig. 1 is a cross-sectional view of an IC current measuring apparatus 100
that is provided between an IC 101 and a substrate 102.
[0017]
The IC 101 is provided with a total of 5 x 5 = 25 IC terminals packaged in a
BGA package and contains a circuit that operates at 667 MHz, for example. In the

cross section shown in Fig. 1, IC terminals 180-184 are provided to the IC 101.
[0018]
Among the IC terminals in the cross section shown in Fig. 1, the IC
terminals 181 and 183 are power source terminals, and the IC terminal 182 is a
ground terminal.
[0019]
When terminals unillustrated in Fig. 1 are included, among the 25 IC
terminals of the IC 101, 8 terminals are power source terminals and other 8
terminals are ground terminals.
[0020]
A substrate 102 is provided with 25 substrate terminals corresponding to the
respective IC terminals of the IC 101. In the cross section shown in Fig. 1, substrate
terminals 185-189 are provided to the substrate 102.
[0021]
With regard to relative positional relationships, relative positions of the
substrate terminals match relative positions of the respective IC terminals.
[0022]
Among the substrate terminals in the cross section shown in Fig. 1, the
substrate terminals 186 and 188 are power source terminals, and the substrate
terminal 187 is a ground terminal.
[0023]
When terminals unillustrated in Fig. 1 are included, among the 25 substrate
terminals of the substrate 102, 8 terminals are power source terminals and other 8
terminals are ground terminals.
[0024]
The substrate 102 is further provided with, in vicinity to the respective
power source terminals, by-pass capacitors that are each connected to a different one
of the power source terminals of the substrate 102. In the cross section shown in Fig.

1, in vicinity to the substrate terminal 186 that is a power source terminal, a by-pass
capacitor 148 connected to the substrate terminal 186 is provided, and in vicinity to
the substrate terminal 188 that is a power source terminal, a by-pass capacitor 149
connected to the substrate terminal 188 is provided.
[0025]
The IC current measuring apparatus 100 is composed of a layered substrate
formed by layering a wiring layer 120, a component-containing layer 110, and a
wiring layer 130. In the cross section shown in Fig. 1, the IC current measuring
apparatus 100 includes the IC-facing terminals 121-125 and lead-out terminals
126-129 on a main surface thereof facing the IC 101, and substrate-facing terminals
131-135 on a main surface thereof facing the substrate 102.
[0026]
When terminals unillustrated in Fig. 1 are included, the IC current
measuring apparatus 100 is provided with 25 IC-facing terminals and 16 lead-out
terminals on the main surface thereof facing the IC 101, and 25 substrate-facing
terminals on the main surface thereof facing the substrate 102.
[0027]
The component-containing layer 110 is a substrate made of a material such
as thermosetting resin and the width thereof is 0.6 mm, for example. The
component-containing layer 110 contains a plurality of conductive vias (for example,
made of copper) and a plurality of resistance elements of 1 Q, the vias and the
resistance elements piercing the component-containing layer 110 between the main
surface thereof facing the IC 101 and the main surface thereof facing the substrate
102. In the cross section shown in Fig. 1, a via 111, a via 112, a resistance element
113, a via 114, a resistance element 115, a via 116, and a via 117 are provided to the
component-containing layer 110.
[0028]
Each resistance element included in the component-containing layer 110 is a

chip resistance whose size is 0.6 mm x 0.3 mm x 0.3 mm, for example, which is
commercially available at a low price and easily accessible.
[0029]
The wiring layer 120 is formed by layering a first substrate 120a, a second
substrate 120b, and a third substrate 120c, and provided with metal wiring (for
example, made of copper) and conductive contact holes (for example, made of
copper). The wiring layer 120 electrically connects an IC-facing terminal or a
lead-out terminal to the upper end of a via included in the component-containing
layer 110 or the upper end of a resistance element included in the
component-containing layer 110. The width of the wiring layer 120 is 0.3 mm, for
example.
[0030]
A via and a contact hole are substantially the same. However, here, what are
included in the wiring layers 120 and the wiring layer 130 are called contact holes,
and what are included in the component-containing layer 110 are called vias.
[0031]
In addition, between the second substrate 120b and the third substrate 120c,
a first ground plane 140 made of a thin metal plate material (for example, made of
copper) is formed.
[0032]
With the first ground plane 140 between the second substrate 120b and the
third substrate 120c, wiring between the first substrate 120a and the second substrate
120b and the first ground plane become electrically capacitively coupled with each
other, and also, wiring of a bottom surface of the third substrate 120c and the first
ground plane become electrically capacitively coupled with each other.
[0033]
The wiring layer 130 is formed by layering a fourth substrate 130a, a fifth
substrate 130b, and a sixth substrate 130c, and provided with metal wiring (for

example, made of copper) and conductive contact holes (for example, made of
copper). The wiring layer 130 electrically connects a substrate-facing terminal to the
lower end of a via included in the component-containing layer 110 or the lower end
of a resistance element included in the component-containing layer 110. The width
of the wiring layer 130 is 0.3 mm, for example.
[0034]
In addition, between the fourth substrate 130a and the fifth substrate 130b, a
second ground plane 141 made of a thin metal plate material (for example, made of
copper) is formed.
[0035]
With the second ground plane 141 between the fourth substrate 130a and
the fifth substrate 130b, wiring on a surface of the fourth substrate 130a and the
second ground plane become electrically capacitively coupled with each other. Also,
wiring between the fifth substrate 130b and the sixth substrate 130c and the second
ground plane become electrically capacitively coupled with each other.
[0036]
The IC-facing terminals 121-125 are provided on the main surface of the IC
current measuring apparatus 100 facing the IC 101. The IC-facing terminals 121-125
are each for being connected to a different one of the IC terminals 180-184. The
IC-facing terminals 121-125 are connected to the IC terminals 180-184 by pieces of
solder 190-194, respectively.
[0037]
The IC-facing terminals unillustrated in Fig. 1 are also provided on the main
surface of the IC current measuring apparatus 100 facing the IC 101, like the
IC-facing terminals 121-125. The unillustrated IC-facing terminals are each for
being connected to a different one of IC terminals. The unillustrated IC-facing
terminals are connected to the respective IC terminals by pieces of solder.
[0038]

Among the IC-facing terminals in the cross section shown in Fig. 1, the
IC-facing terminal 122 and the IC-facing terminal 124 are power source terminals,
and the IC-facing terminal 123 is a ground terminal.
[0039]
The substrate-facing terminals 131-135 are provided on the main surface of
the IC current measuring apparatus 100 facing the substrate 102. The
substrate-facing terminals 131-135 are each for being connected to a different one of
the substrate terminals 185-189. The substrate-facing terminals 131-135 are
connected to the substrate terminals 185-189 by pieces of solder 195-199,
respectively.
[0040]
The substrate-facing terminals unillustrated in Fig. 1 are also provided on
the main surface of the IC current measuring apparatus 100 facing the substrate 102,
like the substrate-facing terminals 131-135. The unillustrated substrate-facing
terminals are each for being connected to a different one of substrate terminals. The
unillustrated substrate-facing terminals are connected to the respective substrate
terminals by pieces of solder.
[0041]
In addition, each substrate-facing terminal is disposed at a position opposite
a different one of the IC-facing terminals.
[0042]
Among the substrate-facing terminals in the cross section shown in Fig. 1,
the substrate-facing terminals 132 and 134 are power source terminals, and the
substrate-facing terminal 133 is a ground terminal.
[0043]
The lead-out terminals 126 and 127 are disposed on the main surface of the
IC current measuring apparatus 100 facing the IC 101, and used to measure a
voltage between the upper end and lower end of the resistance element 113. The

lead-out terminals 128 and 129 are disposed on the main surface of the IC current
measuring apparatus 100 facing the IC 101, and used to measure a voltage between
the upper end and lower end of the resistance element 115.
[0044]
Lead-out terminals unillustrated in Fig. 1 are also disposed on the main
surface of the IC current measuring apparatus 100 facing the IC 101, like the
lead-out terminals 126-129, and each pair of the unillustrated lead-out terminals are
used to measure a voltage between the upper end and lower end of a resistance
element corresponding thereto.
[0045]
A pair of lead-out terminals correspond to one resistance element.
[0046]

Each of the IC-facing terminals that is neither a power source terminal nor a
ground terminal is connected to a different one of the substrate-facing terminals
through a contact hole of the first substrate 120a, a contact hole of the second
substrate 120b, a contact hole of the third substrate 120c, a via of the
component-containing layer 110, a contact hole of the fourth substrate 130a, a
contact hole of the fifth substrate 130b, and a contact hole of the sixth substrate 130c,
which are aligned as a straight line.
[0047]
For example, the IC-facing terminal 121 in the cross section shown in Fig. 1,
which is neither a power source terminal nor a ground terminal, is connected to the
upper end of the via 111 through a wiring path 165 formed by contact holes that are
vertically stacked as a straight line. The lower end of the via 111 is connected to the
substrate-facing terminal 131 through a wiring path 173 formed by contact holes that
are vertically stacked as a straight line.
[0048]

Each of the ground terminals among the IC-facing terminals is connected to
a different one of the ground terminals among the substrate-facing terminals through
a contact hole of the first substrate 120a, a contact hole of the second substrate 120b,
a contact hole of the third substrate 120c, a via of the component-containing layer
110, a contact hole of the fourth substrate 130a, a contact hole of the fifth substrate
130b, and a contact hole of the sixth substrate 130c, which are aligned as a straight
line. Each ground terminal among the IC-facing terminals is further connected to the
first ground plane 140 and the second ground plane 141.
[0049]
For example, the IC-facing terminal 123 in the cross section shown in Fig. 1,
which is a ground terminal, is connected to the first ground plane 140 and the upper
end of the via 114 through a wiring path 166 formed by contact holes that are
vertically stacked as a straight line. The lower end of the via 114 is connected to the
second ground plane 141 and the substrate-facing terminal 133, which is a ground
terminal, through a wiring path 174 formed by contact holes that are vertically
stocked as a straight line.
[0050]
The power source terminals among the IC-facing terminals are each
connected to a different one of the power source terminals among the
substrate-facing terminals through a contact hole of the first substrate 120a, a
contact hole of the second substrate 120b, a contact hole of the third substrate 120c,
a resistance element of the component-containing layer 110, a contact hole of the
fourth substrate 130a, a contact hole of the fifth substrate 130b, and a contact hole of
the sixth substrate 120c, which are aligned as a straight line.
[0051]
In addition, with regard to each power source terminal among the IC-facing
terminals, the upper end of each resistance element is connected to one of a
corresponding pair of lead-out terminals through a contact hole of the third substrate

120c, a contact hole of the second substrate 120b, wiring between the first substrate
120a and the second substrate 120b, and a contact hole of the first substrate 120a,
and the lower end of the resistance element is connected to the other of the pair of
lead-out terminals through wiring on a surface of the fourth substrate 130a, a via of
the component-containing layer 110, wiring on a bottom surface of the third
substrate 120c, a contact hole of the third substrate 120c, a contact hole of the
second substrate 120b, and a contact hole of the first substrate 120a.
[0052]
For example, in the cross section shown in Fig. 1, the IC-facing terminal
124, which is the power source terminal, is connected to the upper end of the
resistance element 115 and the lead-out terminal 128 through a wiring path 163
formed by contact holes and wiring. The lower end of the resistance element 115 is
connected to the lower end of the via 116 and the substrate-facing terminal 134
through a wiring path 172 formed by contact holes and wiring, and the upper end of
the via 116 is connected to the lead-out terminal 129 through a wiring path 164
formed by contact holes and wiring.
[0053]
Fig. 2 is a plan view of the IC current measuring apparatus 100, as viewed
from the above. A plane vertical to the main surface of the IC current measuring
apparatus 100 facing IC 101, which contains a line segment that connects a point A
and a point B shown in Fig. 2, is a cross section of the IC current measuring
apparatus 100 shown in Fig. 1.
[0054]
The main surface of the IC current measuring apparatus 100 facing the IC
101 is provided with a total of 25 IC-facing terminals, that is, the IC-facing
terminals 121-125 and IC-facing terminals 201-220, and a total of 16 lead-out
terminals, that is, the lead-out terminals 126-129 and lead-out terminals 231-242.
[0055]

Among the IC-facing terminals, the IC-facing terminals 201, 205, 207, 209,
122, 124, 216, and 220 are power source terminals, and the IC-facing terminals 202,
204, 208, 211, 215, 123, 216, and 220 are ground terminals.
[0056]
The lead-out terminals 126 and 127 are used to measure a voltage between
both ends of a resistance element connected to the IC-facing terminal 122, which is
a power source terminal. The lead-out terminals 128 and 129 are used to measure a
voltage between both ends of a resistance element connected to the IC-facing
terminal 124, which is a power source terminal. The lead-out terminals 231 and 232
are used to measure a voltage between both ends of a resistance element connected
to the IC-facing terminal 201, which is a power source terminal. The lead-out
terminals 233 and 234 are used to measure a voltage between both ends of a
resistance element connected to the IC-facing terminal 205, which is a power source
terminal. The lead-out terminals 235 and 236 are used to measure a voltage between
both ends of a resistance element connected to the IC-facing terminal 207, which is
a power source terminal. The lead-out terminals 237 and 238 are used to measure a
voltage between both ends of a resistance element connected to IC-facing terminal
209, which is a power source terminal. The lead-out terminals 239 and 240 are used
to measure a voltage between both ends of a resistance element connected to the
IC-facing terminal 216, which is a power source terminal. The lead-out terminals
241 and 242 are used to measure a voltage between both ends of a resistance
element connected to the IC-facing terminal 220, which is a power source terminal.
[0057]
A distance from each of sides of the IC current measuring apparatus 100 to
the corresponding one of sides of the IC 101 is 1.5 mm, when the IC 101 is being
attached.
[0058]
Fig. 3 is an enlarged plan view of an area 250 in Fig. 2.

[0059]
Dashed lines in Fig. 3 show components such as wiring and a via that are
included inside the IC current measuring apparatus 100. For the sake of convenience,
the components are described as if they were seen from outside the IC current
measuring apparatus 100, but in practice, the components cannot be directly seen
from outside the IC current measuring apparatus 100.
[0060]
Wiring 301 is a piece of wiring formed between the first substrate 120a (see
Fig. 1) and the second substrate 120b (see Fig. 1) among a plurality of pieces of
wiring that connect the IC-facing terminal 124 and the lead-out terminal 128, and
avoids a contact hole located under the IC-facing terminal 125.
[0061]
Wiring 302 is a piece of wiring formed on a bottom surface of the third
substrate 120c (see Fig. 1) among a plurality of pieces of wiring that connects the
upper end of the via 116 and the lead-out terminal 129, and avoids a contact hole
located under the IC-facing terminal 125.
[0062]

When current flows through a resistance element, a voltage in accordance
with the current occurs between both ends of the resistance element.
[0063]
Here, since a resistance value of each resistance element inserted into the IC
current measuring apparatus 100 is 1 Q, a voltage v (V) between both ends of each
resistance element indicates current i (A) that flows through each resistance element
as-is.
[0064]
Accordingly, a measurer who measures current flowing through the power

source terminals of the IC 101 can measure current flowing through each of the
power source terminals of the IC 101 that are targeted for measurement by receiving
a voltage between both ends of a resistance element corresponding to each power
source terminal, that is, a voltage between a pair of lead-out terminals corresponding
to the resistance element, for example, by a spectrum analyzer with use of a
differential active probe and the like.
[0065]

Measured current contains various frequency components.
[0066]
By performing Fourier transform on the measured current, it becomes
possible to visually confirm the frequency components contained in the current.
[0067]
Some spectrum analyzers commercially available have a function to (i)
perform Fourier transform on current that has been measured for a predetermined
time period based on a frequency contained in the current and (ii) output the current
on which Fourier transform has been performed.
[0068]
Figs. 4A-4C show frequency characteristics of current fed to the power
source terminals of the IC. The frequency characteristics are obtained by performing
Fourier transform on current flowing through the power source terminals of the IC
101 that has been measured for a predetermined time period (for example, one
second) based on a frequency contained in the current, using the IC current
measuring apparatus 100.
[0069]
The current flowing through the power source terminals contains various
frequency components.

Fig. 4A shows a frequency characteristic of current flowing through an IC
terminal corresponding to the IC-facing terminal 122 (see Fig. 2) (hereinafter, IC
power source terminal A), which is a power source terminal, for example.
[0070]
As shown in Fig. 4A, the first peak 401 appears at a position where a
frequency component is 667 MHz, and the second peak 402 through the fifth peak
405 appear at positions whose frequency components are each equal to the integral
multiple of 667 MHz.
[0071]
According to this, it can be seen that current is fed through the IC power
source terminal A to a circuit that operates at 667 MHz inside the IC 101.
[0072]
Fig. 4B shows a frequency characteristic of current flowing through an IC
terminal corresponding to the IC-facing terminal 220 (see Fig. 2) (hereinafter, IC
power source terminal B), which is a power source terminal, for example.
[0073]
As shown in Fig. 4B, the first peak 411 appears at a position where a
frequency component is 667 MHz, and the second peak 412 through the fifth peak
415 appear at positions whose frequency components are each equal to the integral
multiple of 667 MHz.
[0074]
In addition, strengths of the first peak 411 through the fifth peak 415 in Fig.
4B become small, compared with strengths of the first peak 401 through the fifth
peak 405 in Fig. 4A, respectively.
[0075]
According to this, it can be seen that although current is fed through the IC
power source terminal B to the circuit that operates at 667 MHz inside the IC 101,
an amount of the fed current is small, compared with the IC power source terminal

A.
[0076]
Fig. 4C shows a frequency characteristic of current flowing through an IC
terminal corresponding to the IC-facing terminal 205 (see Fig. 2) (hereinafter, IC
power source terminal C), which is a power source terminal, for example.
[0077]
As shown in Fig. 4C, a peak does not appear at positions whose frequency
components are each equal to the integral multiple of 667 MHz.
[0078]
According to this, it can be seen that current is not fed through the IC power
source terminal C to the circuit that operates at 667 MHz inside the IC 101.
[0079]
According to the IC current measuring apparatus 100 described above, it is
possible to independently measure current flowing through each of the power source
terminals of the IC 101 in operation.
[Second Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a first-modified IC current measuring apparatus pertaining to a
second embodiment is described below. The first-modified IC current measuring
apparatus is formed by modifying a part of the IC current measuring apparatus 100
pertaining to the first embodiment.
[0080]
Each of the pairs of lead-out terminals of the IC current measuring
apparatus 100 are used to measure a voltage between the upper end of a resistance
element and the lower end of the resistance element. However, each pair of lead-out
terminals of the first-modified IC current measuring apparatus is used to measure a
difference between a potential of the upper end of a resistance element and a ground
potential.

[0081]
The following describes a structure of the first-modified IC current
measuring apparatus pertaining to the second embodiment with reference to the
drawing. The description centers on a difference from the IC current measuring
apparatus 100 pertaining to the first embodiment.
[0082]
Fig. 5 is a cross-sectional view of a first-modified IC current measuring
apparatus 500 that is provided between the IC 101 and the substrate 102.
[0083]
The IC current measuring apparatus 100 has been modified to the
first-modified IC current measuring apparatus 500 by changing the wiring layer 120
to a wiring layer 520, the component-containing layer 110 to a
component-containing layer 510, and the wiring layer 130 to a wiring layer 530 so
that a potential of one lead-out terminal of each pair of lead-out terminals that is
closer to the side surface of the first-modified IC current measuring apparatus 500
becomes a ground potential.
[0084]
The wiring layer 520 is formed by modifying a part of wiring paths of the
wiring layer 120. That is, one terminal of each pair of lead-out terminals that is
closer to the side surface of the first-modified IC current measuring apparatus 500
has been modified to be connected to the first ground plane 140.
[0085]
In the cross section shown in Fig. 5, a lead-out terminal 126 and the first
ground plane 140 are connected to each other, and a lead-out terminal 129 and the
first ground plane 140 are connected to each other.
[0086]
The component-containing layer 510 is formed by modifying a part of the
component-containing layer 110. That is, vias that each connect one end of a

resistance element facing the substrate 102 and a corresponding lead-out terminal
have been removed from the component-containing layer 110.
[0087]
In the cross section shown in Fig. 5, the via 112 (see Fig. 1) and the via 116
(see Fig. 1) has been removed from the component-containing layer 110.
[0088]
The wiring layer 530 is formed by modifying a part of wiring paths of the
wiring layer 130. That is, wiring paths that each electrically connect one end of a
resistance element facing the substrate 102 and a corresponding lead-out terminal
have been removed from the wiring layer 130.
[0089]
In the cross section shown in Fig. 5, the wiring that connects the lower end
of the via 112 (see Fig. 1) to the lower end of the resistance element 113 (see Fig. 1)
and the wiring that connects the lower end of the via 116 (see Fig. 1) to the lower
end of the resistance element 115 (see Fig. 1) have been removed from the wiring
layer 130.
[0090]
When the first-modified IC current measuring apparatus 500 is used, a
measurer who measures current flowing through each of the power source terminals
of the IC 101 can measure a voltage between the upper end of a resistance element
that corresponds to each power source terminal of the IC 101 targeted for
measurement and the ground plane 140. For example, the measurer can measure a
voltage by measuring a potential between a pair of power source terminals targeted
for measurement, which correspond to the resistance element with use of a
differential probe that can measure voltage between two terminals.
[0091]
A potential of the ground plane 140 is the same as the ground potential of
the substrate 102. Since a potential of the lower end of each resistance element is the

same as the power source potential of the substrate 102, a voltage between the upper
end and the lower end of each resistance element can be obtained by subtracting a
voltage between the power source potential and the ground potential from a voltage
between the upper end of each resistance element and the ground plane 140.
[0092]
Accordingly, a measurer who measures current flowing through the power
source terminals of the IC 101 can measure current flowing through each power
source terminal of the IC 101 targeted for measurement.
[0093]
According to the first-modified IC current measuring apparatus 500 as
described above, the number of vias inserted thereinto can be decreased, compared
with the IC current measuring apparatus 100 pertaining to the first embodiment.
[Third Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a second-modified IC current measuring apparatus pertaining to a
third embodiment is described below. The second-modified IC current measuring
apparatus is formed by modifying a part of the first-modified IC current measuring
apparatus 500 pertaining to the second embodiment.
[0094]
In the first-modified IC current measuring apparatus 500, one of each pair
of lead-out terminals that is closer to the side surface of the first-modified IC current
measuring apparatus 500 is a lead-out terminal for measuring the ground potential.
However, the second-modified IC current measuring apparatus has been modified to
be provided with straight electrodes for measuring the ground potential on the main
surface facing the IC 101 thereof, instead of the lead-out terminals for measuring the
ground potential.
[0095]
The following explains a structure of the second-modified IC current

measuring apparatus pertaining to the third embodiment with reference to the
drawing. The description centers on a difference from the first-modified IC current
measuring apparatus pertaining to the second embodiment.
[0096]
Fig. 6 is a plan view of a second-modified IC current measuring apparatus
600, as viewed from the above.
[0097]
The second-modified IC current measuring apparatus 600 has been
modified so that all of the lead-out terminals for measuring the ground potential are
removed from the first-modified IC current measuring apparatus 500, and instead, a
first electrode 610, a second electrode 620, the third electrode 630, and the fourth
electrode 640 each for measuring the ground potential are added.
[0098]
The first electrode 610 is a straight electrode that is connected to the first
ground plane 140 through contact holes 611-615. The second electrode 620 is a
straight electrode that is connected to the first ground plane 140 through contact
holes 621-625. The third electrode 630 is a straight electrode that is connected to the
first ground plane 140 through contact holes 631-635. The fourth electrode 640 is a
straight electrode that is connected to the first ground plane 140 through contact
holes 641-645.
[0099]
According to the above second-modified IC current measuring apparatus
600, since the electrodes for measuring the ground potential are straight, the degree
of freedom given to areas where a probe of an external measuring apparatus is
connected increases, compared with the first-modified IC current measuring
apparatus 500.
[0100]
[Fourth Embodiment]

As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a third-modified IC current measuring apparatus pertaining to a
fourth embodiment is described below. The third-modified IC current measuring
apparatus is formed by modifying a part of the IC current measuring apparatus 100
pertaining to the first embodiment.
[0101]
In the IC current measuring apparatus 100, the pairs of lead-out terminals
each are used to measure a voltage between the upper end of a corresponding
resistance element and the lower end of the resistance element. However, in the
fourth-modified IC current measuring apparatus, the lower ends of all the resistance
elements are wired with one another, and accordingly potentials of the lower ends of
all the resistance elements become the same. As a result, pairs of lead-out terminals
each are used to measure a difference between a potential of the upper end of a
corresponding resistance element and the potential common to the lower ends of all
the resistance elements.
[0102]
The following describes a structure of the third-modified IC current
measuring apparatus pertaining to the fourth embodiment with reference to the
drawing. The description centers on a difference from the IC current measuring
apparatus 100 pertaining to first embodiment.
[0103]
Fig. 7 is a cross-sectional view of a third-modified IC current measuring
apparatus 700 that is provided between the IC 101 and the substrate 102.
[0104]
The IC current measuring apparatus 100 has been modified to the
third-modified IC current measuring apparatus 700 by changing the wiring layer 120
to a wiring layer 720, the component-containing layer 110 to a
component-containing layer 710, and the wiring layer 130 to a wiring layer 730 so

that one of each pair of lead-out terminals that is closer to the side surface of the
third-modified IC current measuring apparatus 700 has the potential common to the
lower ends of all the resistance elements.
[0105]
The wiring layer 730 is formed by modifying a part of the wiring paths of
the wiring layer 130. That is, all the power source terminals among the
substrate-facing terminals have been modified to be connected to one another.
[0106]
In the cross section shown in Fig. 7, a substrate-facing terminal 132 that is a
power source terminal and a substrate-facing terminal 134 that is a power source
terminal are connected with each other through wiring 703.
[0107]
The component-containing layer 710 is formed by modifying a part of the
component-containing layer 110. That is, the vias that each electrically connect one
end of a resistance element facing the substrate 102 and a corresponding lead-out
terminal have been removed, except for one via, from the component-containing
layer 110.
[0108]
In the cross section shown in Fig. 7, the via 116 (see Fig. 1) has been
removed.
[0109]
The wiring layer 720 is formed by modifying a part of the wiring paths of
the wiring layer 120. That is, one of each pair of lead-out terminals that is closer to
the side surface of the IC current measuring apparatus 100 has been modified to be
connected to the upper end of a via that is connected to one end of a corresponding
resistance element facing the substrate 102.
[0110]
In the cross section shown in Fig. 7, the lead-out terminal 126 and the upper

end of the via 112 are connected to each other through a wiring path 701, and the
lead-out terminal 129 and the upper end of the via 112 are connected to each other
through a wiring path 702.
[0111]
According to the third-modified IC current measuring apparatus 700 as
described above, the number of vias inserted thereinto can be decreased, compared
with the IC current measuring apparatus 100 pertaining to the first embodiment.
[Fifth Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a fourth-modified IC current measuring apparatus pertaining to a
fifth embodiment is described below. The fourth-modified IC current measuring
apparatus is formed by modifying a part of the IC current measuring apparatus 100
pertaining to the first embodiment.
[0112]
The fourth-modified IC current measuring apparatus is formed by
modifying the IC current measuring apparatus 100 to have a reflection inhibiting
resistance element inserted into (i) each wiring path connecting a lead-out terminal
and the upper end of a resistance element and (ii) each wiring path connecting a
lead-out terminal and the lower end of a resistance element.
[0113]
Each reflection inhibiting resistance element reduces a reflected wave that
occurs when an alternating-current component included in current targeted for
measurement is reflected by a lead-out terminal.
[0114]
The following describes a structure of the fourth-modified IC current
measuring apparatus pertaining to the fifth embodiment with reference to the
drawing. The description centers on a difference from the IC current measuring
apparatus 100 pertaining to first embodiment.

[0115]
Fig. 8 is a cross-sectional view of a fourth-modified IC current measuring
apparatus 800 that is provided between the IC 101 and the substrate 102.
[0116]
The IC current measuring apparatus 100 has been modified to the
fourth-modified IC current measuring apparatus 800 by changing the wiring layer
120 to a wiring layer 820, the component-containing layer 110 to a
component-containing layer 810, and the wiring layer 130 to a wiring layer 830 so
that the fourth-modified IC current measuring apparatus 800 has a reflection
inhibiting resistance element inserted into (i) each wiring path connecting a lead-out
terminal and the upper end of a resistance element and (ii) each wiring path
connecting a lead-out terminal and the lower end of the resistance element.
[0117]
The component-containing layer 810 is formed by modifying a part of the
component-containing layer 110. That is, a reflection inhibiting resistance element
located on each wiring path connecting a lead-out terminal and the upper end of a
resistance element and a reflection inhibiting resistance element located on each
wiring path connecting a lead-out terminal and the lower end of the resistance
element are added, and locations of some vias are changed.
[0118]
In the cross section shown in Fig. 8, reflection inhibiting resistance elements
821-824 are added, the via 112 (see Fig. 1) has been moved and changed to a via
811, and the via 116 (see Fig. 1) has been moved and changed to a via 812.
[0119]
Each of the reflection inhibiting resistance elements 821-824 is, for example,
a chip resistance whose resistance value is 100 Q and whose size is 0.6 mm * 0.3
mm x 0.3 mm, which is commercially available at a low price and easily accessible.
[0120]

The wiring layer 830 is formed by modifying a part of the wiring layer 130.
That is, a part of the wiring paths of the wiring layer 130 has been modified due to
the changes of locations of some vias, and the addition of (i) a reflection inhibiting
resistance element to each wiring path connecting the upper end of a resistance
element and a corresponding lead-out terminal and (ii) a reflection inhibiting
resistance element to each wiring path connecting the lower end of the resistance
element and a corresponding lead-out terminal.
[0121]
In the cross section shown in Fig. 8, a path connecting the lower end of the
resistance element 113 and the lower end of the reflection inhibiting resistance
element 821 has been added to a wiring path 171, a path connecting the lower end of
the resistance element 115 and the lower end of a reflection inhibiting resistance
element 823 has been added to the wiring path 172, a wiring path 871 connecting the
lower end of a reflection inhibiting resistance element 822 and the lower end of the
via 811 has been added, a wiring path 872 connecting the lower end of a reflection
inhibiting resistance element 824 and the lower end of the via 812 has been added, a
wiring path connecting the lower end of the resistance element 113 and the lower
end of the via 112 (see Fig. 1) has been removed, and a wiring path connecting the
lower end of the resistance element 115 and the lower end of the via 116 (see Fig. 1)
has been removed.
[0122]
The wiring layer 820 is formed by modifying a part of the wiring layer 120.
That is, a part of the wiring paths of the wiring layer 120 has been modified due to
the changes of locations of some vias, and the addition of (i) a reflection inhibiting
resistance element to each wiring path connecting the upper end of a resistance
element and a corresponding lead-out terminal and (ii) a reflection inhibiting
resistance element to each wiring path connecting the lower end of the resistance
element and a corresponding lead-out terminal.

[0123]
In the cross section shown in Fig. 8, a path connecting the upper end of the
resistance element 113 and the upper end of the reflection inhibiting resistance
element 822 has been added to a wiring path 162, a wiring path 861 connecting the
upper end of the via 811 and the lead-out terminal 126 has been added, a wiring path
862 connecting the upper end of the reflection inhibiting resistance element 821 and
the lead-out terminal 127 has been added, a path connecting the upper end of the
resistance element 115 and the upper end of the reflection inhibiting resistance
element 824 has been added to a wiring path 163, a wiring path 864 connecting the
upper end of the via 812 and the lead-out terminal 129 has been added, a wiring path
863 connecting the upper end of the reflection inhibiting resistance element 823 and
the lead-out terminal 128 has been added, a part of the wiring path 162 (see Fig. 1)
extending to the lead-out terminal 127 has been removed, the wiring path 161 (see
Fig. 1) connecting the upper end of the via 112 (see Fig. 1) and the lead-out terminal
126 has been removed, and a part of the wiring path 163 (see Fig. 1) extending to
the lead-out terminal 128 has been removed, and the wiring path 164 (see Fig. 1)
connecting the upper end of the via 116 (see Fig. 1) and the lead-out terminal 129
has been removed.
[0124]
The above fourth-modified IC current measuring apparatus 800 can reduce a
reflected wave occurring when an alternating-current component included in current
targeted for measurement is reflected by a lead-out terminal, compared with the IC
current measuring apparatus 100 pertaining to the first embodiment.
[Sixth Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a fifth-modified IC current measuring apparatus pertaining to a
sixth embodiment is described below. The fifth-modified IC current measuring
apparatus is formed by modifying a part of the IC current measuring apparatus 100

pertaining to the first embodiment.
[0125]
The IC current measuring apparatus 100 measures current flowing through a
current path including a terminal targeted for measurement by measuring a voltage
between the upper end and the lower end of a resistance element located on the
current path. However, the fifth-modified IC current measuring apparatus does not
have a resistance element inserted into a current path. Instead, in vicinity to the
current path, an electromagnetic wave receiving element is formed to receive an
electromagnetic wave that occurs due to fluctuation of current flowing through the
current path, and the current flowing through the current path is measured by
measuring potentials of both ends of the electromagnetic wave receiving element.
[0126]
The following describes a structure of the fifth-modified IC current
measuring apparatus pertaining to the sixth embodiment with reference to the
drawings. The description centers on a difference from the IC current measuring
apparatus 100 pertaining to first embodiment.
[0127]
Fig. 9 is a cross-sectional view of a fifth-modified IC current measuring
apparatus 900 that is provided between the IC 101 and the substrate 102.
[0128]
The IC current measuring apparatus 100 has been modified to the
fifth-modified IC current measuring apparatus 900 by modifying the wiring layer
120 to a wiring layer 920, the component-containing layer 110 to a
component-containing layer 910, and the wiring layer 130 to a wiring layer 930 so
that the power source terminals among the IC-facing terminals are each directly
connected to a corresponding one of power source terminals among the
substrate-facing terminals without resistance elements, and each pair of lead-out
terminals measure a voltage between both ends of a coil formed in vicinity to a

current path targeted for measurement.
[0129]
The component-containing layer 910 is formed by modifying a part of the
component-containing layer 110. That is, the resistance elements have been replaced
with vias, and the vias each connecting the lower end of a resistance element and a
corresponding lead-out terminal have been removed from the component-containing
layer 110. Also, electromagnetic wave receiving elements each have been formed in
vicinity to a via included in a current path targeted for measurement.
[0130]
Fig. 10 is a perspective view showing a structure of an electromagnetic
wave receiving element that is formed in vicinity to a current path.
[0131]
A current path 1000 is a path of current targeted for measurement, and is
formed by a via, contact holes, and the like.
[0132]
As shown in Fig. 10, a coil, which is an electromagnetic wave receiving
element, is formed by vias 1001-1006, wiring 1012 and wiring 1013, and wiring
1021-1023. The wiring 1012 and wiring 1013 are formed on the bottom surface of
the wiring layer 920, and the wiring 1021-1023 are formed on a surface of the
wiring layer 930.
[0133]
For example, a distance between the via 1002 and the current path 1000 is
0.3 mm, a distance between the via 1004 and the current path 1000 is 0.3 mm, a
distance between the via 1006 and the current path 1000 is 0.3 mm, a distance
between the via 1001 and the current path 1000 is 0.6 mm, a distance between the
via 1003 and the current path 1000 is 0.6 mm, and a distance between the via 1005
and the current path 1000 is 0.6 mm.
[0134]

When current flowing through the current path 1000 changes, fluctuation of
a magnetic field 1010 occurs and a voltage occurs between both ends of the coil in
accordance with the fluctuation.
[0135]
To return to Fig. 9 again, the description of the component-containing layer
910 will be continued.
[0136]
In the cross section shown in Fig. 9, electromagnetic wave receiving
elements 901 and 902 have been added, the resistance element 113 (see Fig. 1) has
been changed to a via 923, the resistance element 115 (see Fig. 1) has been changed
to a via 925, and the via 112 (see Fig. 1) and the via 116 (see Fig. 1) have been
removed.
[0137]
The wiring layer 920 is formed by modifying a part of the wiring paths of
the wiring layer 120. That is, the lead-out terminals are modified to be connected to
terminals of electromagnetic wave receiving elements.
[0138]
In the cross section shown in Fig. 9, a wiring path 911 connecting one
terminal of the electromagnetic wave receiving element 901 and the lead-out
terminal 126 has been added, a wiring path 912 connecting the other terminal of the
electromagnetic wave receiving element 901 and the lead-out terminal 127 has been
added, a wiring path 914 connecting one terminal of the electromagnetic wave
receiving element 902 and the lead-out terminal 128 has been added, a wiring path
913 connecting the other terminal of the electromagnetic wave receiving element
902 and the lead-out terminal 129 has been added, the wiring path 161 (see Fig. 1)
connecting the lead-out terminal 126 and the upper end of the via 112 (see Fig. 1)
has been removed, a part of the wiring path 162 (see Fig. 1) extending to the
lead-out terminal 127 has been removed, the wiring path 164 (see Fig. 1) connecting

the lead-out terminal 129 and the upper end of the via 116 (see Fig. 1) has been
removed, and a part of the wiring path 163 (see Fig. 1) extending to the lead-out
terminal 129 has been removed.
[0139]
The wiring layer 930 is formed by modifying a part of the wiring layer 130.
That is, a part of wiring paths has been removed due to the removal of the wiring
paths each connecting the lower end of a resistance element and a corresponding one
of the lead-out terminals.
[0140]
In the cross section shown in Fig. 9, a part of the wiring path 171 (see Fig.
1) extending to the lower end of the via 112 (see Fig. 1) has been removed, and a
part of the wiring path 172 (see Fig. 1) extending to the lower end of the via 116
(see Fig. 1) has been removed.
[0141]
The above fifth-modified IC current measuring apparatus can measure
current by measuring a voltage occurring at an electromagnetic wave receiving
element that is not physically in contact with a path of current targeted for
measurement.
[Seventh Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a sixth-modified IC current measuring apparatus pertaining to a
seventh embodiment is described below. The sixth-modified IC current measuring
apparatus is formed by modifying a part of the IC current measuring apparatus 100
pertaining to the first embodiment.
[0142]
The IC current measuring apparatus 100 has been modified to the
sixth-modified IC current measuring apparatus to have reflection inhibiting
resistance elements each inserted into a wiring path connecting a lead-out terminal

and the upper end of a corresponding resistance element and a wiring path
connecting a lead-out terminal and the lower end of the corresponding resistance
element, in the same way as the fourth IC current measuring apparatus 800
pertaining to the fifth embodiment.
[0143]
The fourth-modified IC current measuring apparatus 800 pertaining to the
fifth embodiment pertains to an example where the reflection inhibiting resistance
elements are realized by the resistance elements included in the
component-containing layer 810 (see Fig. 8). However, the sixth-modified IC
current measuring apparatus pertaining to the seventh embodiment describes an
example where reflection inhibiting resistance elements are realized by resistances
formed within the wiring layer.
[0144]
The following describes a structure of the sixth-modified IC current
measuring apparatus pertaining to the seventh embodiment with reference to the
drawing. The description centers on a difference from the IC current measuring
apparatus 100 pertaining to first embodiment.
[0145]
Fig. 12 is a cross-sectional view of a sixth-modified IC current measuring
apparatus 1200 that is provided between the IC 101 and the substrate 102.
[0146]
The IC current measuring apparatus 100 has been modified to the
sixth-modified IC current measuring apparatus 1200 by changing the wiring layer
120 to a wiring layer 320, the component-containing layer 110 to a
component-containing layer 310, and the wiring layer 130 to a wiring layer 330 so
that the sixth-modified IC current measuring apparatus 1200 has reflection inhibiting
resistance elements each inserted into (i) a wiring path connecting a corresponding
lead-out terminal and the upper end of a resistance element and (ii) a wiring path

connecting a lead-out terminal and the lower end of the corresponding resistance
element.
[0147]
The component-containing layer 310 is formed by modifying a part of the
component-containing layer 110 by changing locations of some vias.
[0148]
In the cross section shown in Fig. 12, the via 112 (see Fig. 1) has been
moved and changed to a via 1212, and the via 116 (see Fig. 1) has been moved and
changed to a via 1216.
[0149]
The wiring layer 320 is formed by modifying a part of the wiring layer 120.
That is, a part of the wiring paths of the wiring layer 120 has been modified due to
the addition of the reflection inhibiting resistance elements each to a wiring path
connecting the upper end of a resistance element and a lead-out terminal and the
changes of locations of some vias.
[0150]
In the cross section shown in Fig. 12, a reflection inhibiting resistance
element 1230 has been added to a wiring path connecting the upper end of the
resistance element 113 and the lead-out terminal 127, and a reflection inhibiting
resistance element 1210 has been added to a wiring path connecting the upper end of
the resistance element 115 and the lead-out terminal 128.
[0151]
The reflection inhibiting resistance elements 1210 and 1230 are each a
resistance made of copper wiring, and formed by being trimmed by a laser trimming
method, for example, and a resistance value thereof is 100 £1, for example.
[0152]
The wiring layer 330 is formed by modifying a part of the wiring layer 130.
That is, a part of the wiring paths of the wiring layer 130 has been modified due to

the addition of the reflection inhibiting resistance elements each to a wiring path
connecting the lower end of a resistance element and a corresponding lead-out
terminal and the changes of locations of some vias.
[0153]
In the cross section shown in Fig. 12, a reflection inhibiting resistance
element 1240 has been added to a wiring path connecting the lower end of the
resistance element 113 and the lead-out terminal 126, and a reflection inhibiting
resistance element 1220 has been added to a wiring path connecting the lower end of
the resistance element 115 and the lead-out terminal 129.
[0154]
The reflection inhibiting resistance elements 1220 and 1240 are each a
resistance made of copper wiring, which has been trimmed using a laser trimming
method, for example, and a resistance value thereof is 100 £1, for example.
[0155]
Compared with the IC current measuring apparatus 100 pertaining to the
first embodiment, the above sixth-modified IC current measuring apparatus 1200
can reduce a reflected wave occurring when an alternating-current component
included in current targeted for measurement is reflected by a lead-out terminal in
the same manner as the fourth-modified IC current measuring apparatus 800
pertaining to the fifth embodiment, even though the component-containing layer 310
does not include a reflection inhibiting resistance element.
[Eighth Embodiment]
As an embodiment of the IC current measuring apparatus pertaining to the
present invention, a lifting substrate attached to the main surface of the IC current
measuring apparatus 100 facing the substrate 102 (see Fig. 1) pertaining to the first
embodiment is described below.
[0156]
The main surface of the lifting substrate has a rectangular shape that is the

same as the main surface of the IC 101. That is, the width and height of the main
surface of the lifting substrate are substantially the same as the width and height of
the main surface of the IC 101. The appearance of the lifting substrate is a
substantially rectangular cuboid and the thickness thereof is approximately 2 mm.
The lifting substrate is connected to the substrate 102 and used while being attached
to the main surface of the IC current measuring apparatus 100 facing the substrate
102. By this, a gap of approximately 2 mm is formed between the IC current
measuring apparatus 100 and the substrate 102, for example.
[0157]
Fig. 13 is a cross-sectional view of a lifting substrate 1300 attached to the
main surface of the IC current measuring apparatus 100 facing the substrate 102, and
connected to the substrate 102.
[0158]
In the cross section shown in Fig. 13, the lifting substrate 1300 is provided
with top-surface terminals 395-399 on the main surface thereof facing the IC current
measuring apparatuslOO, and bottom-surface terminals 385-389 on the main surface
thereof facing the substrate 102.
[0159]
When terminals unillustrated in Fig. 13 are included, the lifting substrate
1300 is provided with 25 top-surface terminals on the main surface thereof facing
the IC current measuring apparatus 100, and 25 bottom-surface terminals on the
main surface thereof facing the substrate 102.
[0160]
Each of the 25 top-surface terminals is electrically connected to a different
one of the bottom-surface terminals through a contact hole made of copper, for
example.
[0161]
In the cross section shown in Fig. 13, the top-surface terminals 395-399 are

connected to the substrate-facing terminals 131-135 via pieces of solder 195-199,
respectively, and the bottom-surface terminals 385-389 are connected to the
substrate terminals 185-189 via pieces of solder 375-379, respectively.
[0162]
Top-surface terminals not illustrated in Fig. 13 are each also connected to a
different one of the substrate-facing terminals via pieces of solder, and
bottom-surface terminals not illustrated in Fig. 13 are each also connected to a
different one of the substrate terminals via pieces of solder.
[0163]
When the above lifting substrate 1300 is connected to the substrate 102
while being attached to the main surface of the IC current measuring apparatus 100
facing the substrate 102, a gap is formed between the IC current measuring
apparatus 100 and the substrate 102. By this, even when the IC current measuring
apparatus 100 cannot be directly connected to the substrate 102 since some
electronic component exists on the main surface of the substrate 102, the IC current
measuring apparatus 100 can be connected to the substrate 102 through the lifting
substrate 1300, by providing the lifting substrate 1300 between the IC current
measuring apparatus 100 and the substrate 102.
Supplementary Explanations>
As described above, the first embodiment through the seventh embodiment
have been described as embodiments of the IC current measuring apparatus
pertaining to the present invention, based on the seven examples of the IC current
measuring apparatus. However, it is possible to modify the IC current measuring
apparatus as below, and the present invention is of course not limited to the IC
current measuring apparatus shown by the above described embodiments.
(1) The first embodiment has described that the IC current measuring
apparatus 100 measures current flowing through terminals of the IC 101 that is
provided with a total of 5 * 5 = 25 IC terminals packaged in the BGA package.

However, the terminals of the IC targeted for measurement are not limited to be
packaged in the BGA package, and may be packaged in a method different from the
BGA package, such as a Quad Flat Package (QFP). Also, the IC is not limited to be
provided with a total of 5 x 5 = 25 IC terminals, and may be provided with a total of
20 x 10 = 100 IC terminals, for example.
(2) In the first embodiment, it has been described that the IC current
measuring apparatus 100 measures current flowing through each of the power
source terminals of the IC 101. However, each terminal targeted for measurement is
not limited to a power source terminal, and may be different from a power source
terminal, such as a ground terminal, a digital signal output terminal, a digital signal
input terminal, an analogue signal input terminal, and an analogue signal output
terminal.
(3) The first embodiment has described that the resistance elements
included in the component-containing layer 110 are each a chip resistance whose
resistance value is 1 Q. and whose size is 0.6 mm x 0.3 mm x 0.3 mm. However, a
resistance value of each resistance element is not limited to 1 Q,, the size thereof is
not limited to 0.6 mm x 0.3 mm x 0.3 mm, and each resistance element is not
limited to a chip resistance.
[0164]
As a resistance element, for example, a commercially available chip
resistance of 4 Q, whose size is 0.4 mm x 0.2 mm x 0.2mm, such as metal wiring
made of nichrome wiring, for example, having a high resistance value, can be
expected.
(4) The first embodiment has described that each resistance element
included in the component-containing layer 110 pierces the component-containing
layer 110 between the main surface thereof facing the IC 101 and the main surface
thereof facing the substrate 102. However, each resistance element may not
necessarily pierce the component-containing layer 110 between the main surface

thereof facing the IC 101 and the main surface thereof facing the substrate 102, if
each resistance element is located on a wiring path of a terminal targeted for
measurement.
[0165]
Fig. 11 is a cross-sectional view of the sixth-modified IC current measuring
apparatus 1100 formed by modifying a part of the IC current measuring apparatus
100 such that resistance elements included in a component-containing layer are
positioned in a direction perpendicular to a line segment that connects an IC-facing
terminal and a corresponding substrate-facing terminal.
[0166]
In Fig. 11, a resistance element 11 is positioned to lie in a direction
perpendicular to a line segment that connects the IC-facing terminal 122 and the
substrate-facing terminal 132, and a resistance element 17 is positioned to lie in a
direction perpendicular to a line segment that connects the IC-facing terminal 124
and the substrate-facing terminal 134.
[0167]
The IC-facing terminal 122 and the substrate-facing terminal 132 are
connected to each other through a wiring path 62, a via 13, a wiring path 71, the
resistance element 11, and a wiring path 171. The IC-facing terminal 124 and the
substrate-facing terminal 134 are connected to each other through a wiring path 63, a
via 15, a wiring path 72, the resistance element 17, and the wiring path 172.
(5) The first embodiment has described that the IC current measuring
apparatus 100 is connected to the IC 101 by solder. However, if each of the
IC-facing terminals are each electrically connected to a different one of the terminals
of the IC 101, the IC current measuring apparatus 100 may not be necessarily
connected to the IC 101 by solder.
[0168]
For example, an example using a socket through which the IC-facing

terminals are each electrically connected to a different one of the terminals of the IC
101 can be expected.
[0169]
Similarly, the first embodiment has described that the IC current measuring
apparatus 100 is connected to the substrate 102 by solder. However, if the
substrate-facing terminals are each electrically connected to a different one of the
terminals of the substrate 102, the IC current measuring apparatus 100 may not be
necessarily connected to the substrate 102 by solder.
[0170]
For example, an example using a socket through which the substrate-facing
terminals are each electrically connected to a different one of the terminals of the
substrate 102 can be expected.
(6) In the fifth embodiment, it has been described that a resistance value of
each of the reflection inhibiting resistance elements included in the
component-containing layer 810 is 100 Q. However, the resistance value of each
reflection inhibiting resistance element is not necessarily limited to 100 Q, if the
resistance value is sufficient (i) to reduce a reflected wave from corresponding
lead-out terminals when each of the lead-out terminals is a release end or (ii) to
reduce a reflected wave from a corresponding terminal targeted for measurement or
from an external measuring apparatus that is connected to the lead-out terminals.
[0171]
As a resistance element, a commercially available chip resistance whose
size is 0.4 mm * 0.2 mm x 0.2mm, such as wiring made of metal such as nichrome,
having a high resistance value, can be expected.
(7) The fifth embodiment has described that the reflection inhibiting
resistance elements included in the component-containing layer 810 are chip
resistance whose size is 0.6 mm x 0.3 mm x 0.3 mm. However, each of the
reflection inhibiting resistance elements is not limited to a resistance whose size is

0.6 mm x 0.3 mm x 0.3 mm, and not negessarily limited to a chip resistance.
(8) The sixth embodiment has described an example where each
electromagnetic wave receiving element is a coil. However, each electromagnetic
wave receiving element is not necessarily a coil, if each electromagnetic wave
receiving element (i) has mutual inductance with a current path targeted for
measurement, and (ii) generates a measurable voltage in accordance with fluctuation
of a magnetic field that occurs when current flowing through a current path targeted
for measurement changes, for example, metal wiring (for example, made of copper)
located parallel to the current path in vicinity to the current path targeted for
measurement (for example, 0.3 mm) may be used.
(9) The seventh embodiment has described that each reflection inhibiting
resistance element included in the wiring layer is a resistance made of copper wiring
and formed by being trimmed by the laser trimming method. However, if each
reflection inhibiting resistance element is made of processed wiring, each reflection
inhibiting resistance element is not necessarily a resistance formed by being
trimmed by the laser trimming method. For example, a resistance may be formed by
replacing copper wiring with a high resistance metal such as tungsten.
(10) The following further describes a structure of an IC current measuring
apparatus pertaining to the embodiment of the present invention, and its
modification and its effect.
[0172]
(a) The IC current measuring apparatus pertaining to the embodiment of the
present invention is an IC current measuring apparatus for measuring current
flowing through a plurality of terminals of an IC while being connected between the
IC and a substrate, the IC current measuring apparatus comprising: a plurality of
IC-facing terminals each to be connected to a different one of the plurality of
terminals of the IC; a plurality of substrate-facing terminals each (i) to be connected
to a different one of a plurality of terminals of the substrate and (ii) electrically

connected to a different one of the plurality of IC-facing terminals; a first element to
generate a voltage in accordance with current flowing between a first IC-facing
terminal and one of the plurality of substrate-facing terminals that corresponds to the
first IC-facing terminal, the first IC-facing terminal being one of the plurality of
IC-facing terminals; a second element to generate a voltage in accordance with
current flowing between a second IC-facing terminal and one of the plurality of
substrate-facing terminals that corresponds to the second IC-facing terminal, the
second IC-facing terminal being one of the plurality of IC-facing terminals; a first
lead-out terminal to output the voltage generated by the first element to the outside;
and a second lead-out terminal to output the voltage generated by the second
element to the outside.
[0173]
The IC current measuring apparatus with the above structure can measure
(i) current flowing between the first IC-facing terminal and the substrate-facing
terminal that corresponds to the first IC-facing terminal by measuring a voltage that
occurs at the first element with use of the first lead-out terminal and (ii) current that
flows between the second IC-facing terminal and the substrate-facing terminal that
corresponds to the second IC-facing terminal by measuring a voltage that occurs at
the second element with use of the second lead-out terminal.
[0174]
Accordingly, the above structure offers the advantageous effect of
individually measuring current that flows through the first IC-facing terminal and
current that flows through the second IC-facing terminal.
[0175]
Fig. 14 is a cross-sectional view of an IC current measuring apparatus 1400
in the above modification.
[0176]
In the cross section shown in Fig. 14, the IC current measuring apparatus

1400 is provided with (i) IC-facing terminals 1421-1425, a first lead-out terminal
1401, and a second lead-out terminal 1402 on a main surface thereof facing the IC,
(ii) substrate-facing terminals 1431-1435 on a main surface thereof facing the
substrate, and (iii) a first element 1413 and a second element 1415 inside.
[0177]
The IC-facing terminals 1421-1425 are each for being connected to a
different one of a plurality of terminals of the IC. The IC-facing terminals
1421-1425 are realized as the IC-facing terminals 121-125 in the first embodiment
(see Fig. 1), respectively, as an example.
[0178]
The substrate-facing terminals 1431-1435 are each for being connected to a
different one of a plurality of terminals of the substrate, and the substrate-facing
terminals 1431-1435 are electrically connected to the IC-facing terminals 1421-1425,
respectively. The substrate terminals 1431-1435 are realized as the substrate-facing
terminals 131-135 in the first embodiment (see Fig. 1), respectively, as an example.
[0179]
The first element 1413 generates a voltage in accordance with current
flowing between the IC-facing terminal 1422 and the substrate-facing terminal 1432,
and is realized as the resistance element 113 in the first embodiment (see Fig. 1), as
an example.
[0180]
The second element 1415 generates a voltage in accordance with current
flowing between the IC-facing terminal 1424 and the substrate-facing terminal 1434,
and is realized as the resistance element 115 in the first embodiment (see Fig. 1), as
an example.
[0181]
The first lead-out terminal 1401 is for outputting the voltage generated by
the first element 1413, and is realized as the lead-out terminal 127 in the first

embodiment (see Fig. 1), as an example.
[0182]
The second lead-out terminal 1402 is for outputting the voltage generated
by the second element 1415, and is realized as the lead-out terminal 128 in the first
embodiment (see Fig. 1), as an example.
[0183]
(b) Also, the first element is a resistance element connected between the
first IC-facing terminal and the substrate-facing terminal that corresponds to the first
IC-facing terminal, the second element is a resistance element connected between
the second IC-facing terminal and the substrate-facing terminal that corresponds to
the second IC-facing terminal, the first lead-out terminal is connected to one end of
the first element connected to the first IC-facing terminal, and the second lead-out
terminal is connected to one end of the second element connected to the second
IC-facing terminal.
[0184]
Such a structure yields the advantageous effect of making each of the first
element and the second element as a resistance element that is easily available at a
relatively low price.
[0185]
(c) Also, a body of the IC current measuring apparatus has a first main
surface and a second main surface that is parallel to the first main surface, and the IC
current measuring apparatus further comprises: a third lead-out terminal connected,
through wiring, to the other end of the first element connected to the substrate-facing
terminal that corresponds to the first IC-facing terminal; and a fourth lead-out
terminal connected, through wiring, to the other end of the second element
connected to the substrate-facing terminal that corresponds to the second IC-facing
terminal, wherein the plurality of IC-facing terminals are placed on the first main
surface, the plurality of substrate-facing terminals are placed on the second main

surface in opposition to the respective IC-facing terminals, the first element is
embedded between the first IC-facing terminal and the substrate-facing terminal that
corresponds to the first IC-facing terminal, the second element is embedded between
the second IC-facing terminal and the substrate-facing terminal that corresponds to
the second IC-facing terminal, the first lead-out terminal and the one end of the first
element are connected to each other through wiring, and the second lead-out
terminal and the one end of the second element are connected to each other through
wiring.
[0186]
With such a structure, a current path between the first IC-facing terminal
and the substrate-facing terminal that corresponds to the first IC-facing terminal
becomes the shortest path connecting the first IC-facing terminal and the
substrate-facing terminal that corresponds to the first IC-facing terminal, and a
current path between the second IC-facing terminal and the substrate-facing terminal
that corresponds to the second IC-facing terminal becomes the shortest path
connecting the second IC-facing terminal and the substrate-facing terminal that
corresponds to the second IC-facing terminal.
[0187]
Accordingly, the above structure offers the advantageous effect of reducing
effects to high-frequency current and stabling system operation by preventing
increase of parasitic resistance and parasitic inductance in a current path targeted for
measurement.
[0188]
(d) Also, when the body is connected to the IC, the first lead-out terminal,
the second lead-out terminal, the third lead-out terminal and the fourth lead-out
terminal are placed on areas of the first main surface that are not covered with the
IC.
[0189]

With such a structure, the first lead-out terminal, the second lead-out
terminal, the third lead-out terminal, and the fourth lead-out terminal are placed at
positions easily visually recognized. Therefore, the above structure offers the
advantageous effect in which a measurer who measures potentials of the above
terminals using a measuring instrument can easily connect a probe of the measuring
instrument to the above terminals.
[0190]
(e) Also, the IC current measuring apparatus comprises a third element that
is a resistance element; and a fourth element that is a resistance element, wherein the
first lead-out terminal and the one end of the first element are connected to each
other through the third element and wiring, and the second lead-out terminal and the
one end of the second element are connected to each other through the fourth
element and wiring.
[0191]
The above structure offers the advantageous effect of reducing a reflected
wave that occurs when a part of an alternating-current component included in
current flowing through the first element is reflected by the first lead-out terminal,
and a reflected wave that occurs when a part of an alternating-current component
included in current flowing through the second element is reflected by the second
lead-out terminal.
[0192]
(f) Also, the third element and the fourth element are made of wiring that
has been processed to be resistive.
[0193]
The above structure offers the advantageous effect of providing the third
element and the fourth element in an area of a wiring layer where wiring exists.
[0194]
(g) Also, a body of the IC current measuring apparatus has a main surface,

wherein one of the plurality of substrate-facing terminals is a substrate-facing
ground terminal to be connected to ground wiring of the substrate, one or more of
the plurality of IC-facing terminals are one or more IC-facing ground terminals
electrically connected to the substrate-facing ground terminal, at least one of the
IC-facing ground terminals, the plurality of IC-facing terminals, the first lead-out
terminal and the second lead-out terminal are placed on the main surface, a distance
between the at least one IC-facing ground terminal and the first lead-out terminal is
equal to or less than 1.5 mm, and a distance between the at least one IC-facing
ground terminal and the second lead-out terminal is equal to or less than 1.5 mm.
[0195]
With such a structure, a distance between the first lead-out terminal and the
at least one IC-facing ground terminal is equal to or less than 1.5 mm, and
accordingly the above structure offers the advantageous effect of making
measurement of a difference between a potential of the first lead-out terminal and
the ground potential relatively easy with use of a device such as a differentiate probe
and a probe of a spectrum analyzer that are the commercially available.
[0196]
Similarly, a distance between the second lead-out terminal and the at least
one IC-facing ground terminal is equal to or less than 1.5 mm, and accordingly the
above structure offers the advantageous effect of making measurement of a
difference between a potential of the second lead-out terminal and the ground
potential relatively easy with use of a differentiate probe and a probe of a spectrum
analyzer that are the commercially available.
[0197]
(h) Also, the IC current measuring apparatus further comprises a third
lead-out terminal, wherein the first IC-facing terminal is to be connected to a first
power source terminal of the IC, the first power source terminal being one of the
plurality of terminals of the IC, the second IC-facing terminal is to be connected to a

second power source terminal of the IC, the second power source terminal being one
of the plurality of terminals of the IC, and the third lead-out terminal is electrically
connected to (i) the other end of the first element connected to the substrate-facing
terminal that corresponds to the first IC-facing terminal and (ii) the other end of the
second element connected to the substrate-facing terminal that corresponds to the
second IC-facing terminal.
[0198]
With such a structure, the third lead-out terminal is used as (i) a terminal for
measuring a potential of one side of the first element facing the corresponding
substrate-facing terminal, and (ii) a terminal for measuring a potential of one side of
the second element facing the substrate-facing terminal at the same time.
Accordingly, the above structure offers the advantageous effect of reducing the
number of terminals, compared with a structure providing two terminals that are
different from each other without using one terminal as the two terminals.
[0199]
(i) Also, the first element is an electromagnetic wave receiving element to
receive an electromagnetic wave generated by the current flowing between the first
IC-facing terminal and the substrate-facing terminal that corresponds to the first
IC-facing terminal, and the second element is an electromagnetic wave receiving
element to receive an electromagnetic wave generated by the current flowing
between the second IC-facing terminal and the substrate-facing terminal that
corresponds to the second IC-facing terminal.
[0200]
With such a structure, a current path between the first IC-facing terminal
and the substrate-facing terminal that corresponds to the first IC-facing terminal and
the first element are not physically in contact with each other, and a current path
between the second IC-facing terminal and the substrate-facing terminal that
corresponds to the second IC-facing terminal and the second element are not

physically in contact with each other.
[0201]
Accordingly, the above structure has the advantageous effect of reducing an
effect to current paths that results from physical contact between an element
generating a voltage in accordance with current and a current path, compared with a
structure according to which the element generating a voltage in accordance with
current and a current path are physically in contact with each other.
[0202]
(j) Also, the IC current measuring apparatus, further comprises: a third
lead-out terminal; and a fourth lead-out terminal, wherein the first element is a coil
connected between the first lead-out terminal and the third lead-out terminal, a
distance from the first element to a current path between the first IC-facing terminal
and the substrate-facing terminal that corresponds to the first IC-facing terminal is
equal to or less than a predetermined distance, the predetermined distance being
suitable for the first element to receive the electromagnetic wave generated by the
current flowing between the first IC-facing terminal and the substrate-facing
terminal that corresponds to the first IC-facing terminal, the second element is a coil
connected between the second lead-out terminal and the fourth lead-out terminal,
and a distance from the second element to a current path between the second
IC-facing terminal and the substrate-facing terminal that corresponds to the second
IC-facing terminal is equal to or less than a predetermined distance, the
predetermined distance being suitable for the second element to receive the
electromagnetic wave generated by the current flowing between the second
IC-facing terminal and the substrate-facing terminal that corresponds to the second
IC-facing terminal.
[0203]
Here, a predetermined distance means a distance suitable for the first
element or the second element to have mutual inductance with a current path

targeted for measurement and generate a measurable voltage in accordance with
fluctuation of a magnetic field that occurs when current flowing through the current
path that is targeted for measurement changes.
[0204]
With such a structure, the first element and the second element can
effectively receive fluctuation of a magnetic field generated by current targeted for
measurement, and accordingly the above structure offers the advantageous effect of
making the IC current measuring apparatus small.
[0205]
(k) Also, the second main surface has a rectangular shape.
[0206]
The above structure offers the advantageous effect of realizing formation of
the second main surface with a relatively simple method.
[0207]
(1) An IC current measuring adapter pertaining to the embodiment of the
present invention connected between the IC current measuring apparatus and the
substrate, connecting the plurality of substrate-facing terminals of the IC current
measuring apparatus and the respective terminals of the substrate, wherein the IC
current measuring adapter is a substantially rectangular cuboid having a third main
surface and a fourth main surface that is parallel to the third main surface, a plurality
of first adapter terminals each to be connected to a different one of the plurality of
the substrate-facing terminals are placed on the third main surface and a plurality of
second adapter terminals each (i) to be connected to a different one of the terminals
of the substrate and (ii) connected to a different one of the respective first adapter
terminals are placed on the fourth main surface, and a width and height of the third
main surface are each smaller than a width and height of the second main surface.
[0208]
When the IC current measuring adapter with the above structure is provided

between the IC current measuring apparatus and the substrate, a gap is formed
between the IC current measuring apparatus and the substrate. By this, even when
the IC current measuring apparatus cannot be directly connected to the substrate
since some electronic component exists on the main surface of the substrate, by
providing the IC current measuring adapter between the IC current measuring
apparatus and the substrate, the IC current measuring apparatus can be connected to
the substrate through the IC current measuring adapter.
[Industrial Applicability]
[0209]
The present invention is useful in measuring current flowing through
terminals of the IC.
[Reference Signs List]
[0210]
100 IC current measuring apparatus
101 IC
102 substrate
110 component-containing layer
111,112,114,116,117 via
113, 115 resistance element
120 wiring layer
121-125 IC-facing terminal
126-129 lead-out terminal
130 wiring layer
131-135 substrate-facing terminal
140 first ground plane
141 second ground plane

148, 149 by-pass capacitor
158, 159 wiring path within substrate
161-167,171-175 wiring path
180-184 terminal of IC 101
185-189 terminal of substrate 102
190-199 solder

We Claim:
1. An IC current measuring apparatus for measuring current flowing through a
plurality of terminals of an IC while being connected between the IC and a substrate,
the IC current measuring apparatus comprising:
a plurality of IC-facing terminals each to be connected to a different one of
the plurality of terminals of the IC;
a plurality of substrate-facing terminals each (i) to be connected to a
different one of a plurality of terminals of the substrate and (ii) electrically
connected to a different one of the plurality of IC-facing terminals;
a first element to generate a voltage in accordance with current flowing
between a first IC-facing terminal and one of the plurality of substrate-facing
terminals that corresponds to the first IC-facing terminal, the first IC-facing terminal
being one of the plurality of IC-facing terminals;
a second element to generate a voltage in accordance with current flowing
between a second IC-facing terminal and one of the plurality of substrate-facing
terminals that corresponds to the second IC-facing terminal, the second IC-facing
terminal being one of me plurality of IC-facing terminals;
a first lead-out terminal to output the voltage generated by the first element
to the outside; and
a second lead-out terminal to output the voltage generated by the second
element to the outside.
2. The IC current measuring apparatus of Claim 1, wherein
the first element is a resistance element connected between the first
IC-facing terminal and the substrate-facing terminal that corresponds to the first
IC-facing terminal,
the second element is a resistance element connected between the second
IC-facing terminal and the substrate-facing terminal that corresponds to the second

IC-facing terminal,
the first lead-out terminal is connected to one end of the first element
connected to the first IC-facing terminal, and
the second lead-out terminal is connected to one end of the second element
connected to the second IC-facing terminal.
3. The IC current measuring apparatus of Claim 2, a body thereof having a first main .
surface and a second main surface that is parallel to the first main surface, the IC
current measuring apparatus further comprising:
a third lead-out terminal connected, through wiring, to the other end of the
first element connected to the substrate-facing terminal that corresponds to the first
IC-facing terminal; and
a fourth lead-out terminal connected, through wiring, to the other end of the
second element connected to the substrate-facing terminal that corresponds to the
second IC-facing terminal, wherein
the plurality of IC-facing terminals are placed on the first main surface,
the plurality of substrate-facing terminals are placed on the second main
surface in opposition to the respective IC-facing terminals,
the first element is embedded between the first IC-facing terminal and the
substrate-facing terminal that corresponds to the first IC-facing terminal,
the second element is embedded between the second IC-facing terminal and
the substrate-facing terminal that corresponds to the second IC-facing terminal,
the first lead-out terminal and the one end of the first element are connected
to each other through wiring, and
the second lead-out terminal and the one end of the second element are
connected to each other through wiring.
4. The IC current measuring apparatus of Claim 3, wherein

when the body is connected to the IC, the first lead-out terminal, the second
lead-out terminal, the third lead-out terminal and the fourth lead-out terminal are
placed on areas of the first main surface that are not covered with the IC.
5. The IC current measuring apparatus of Claim 2, further comprising:
a third element that is a resistance element; and
a fourth element that is a resistance element, wherein
the first lead-out terminal and the one end of the first element are connected
to each other through the third element and wiring, and
the second lead-out terminal and the one end of the second element are
connected to each other through the fourth element and wiring.
6. The IC current measuring apparatus of Claim 5, wherein
the third element and the fourth element are made of wiring that has been
processed to be resistive.
7. The IC current measuring apparatus of Claim 2, a body thereof having a main
surface, wherein
one of the plurality of substrate-facing terminals is a substrate-facing
ground terminal to be connected to ground wiring of the substrate,
one or more of the plurality of IC-facing terminals are one or more
IC-facing ground terminals electrically connected to the substrate-facing ground
terminal,
at least one of the IC-facing ground terminals, the plurality of IC-facing
terminals, the first lead-out terminal and the second lead-out terminal are placed on
the main surface,
a distance between the at least one IC-facing ground terminal and the first
lead-out terminal is equal to or less than 1.5 mm, and

a distance between the at least one IC-facing ground terminal and the
second lead-out terminal is equal to or less than 1.5 mm.
8. The IC current measuring apparatus of Claim 2, further comprising
a third lead-out terminal, wherein
the first IC-facing terminal is to be connected to a first power source
terminal of the IC, the first power source terminal being one of the plurality of
terminals of the IC,
the second IC-facing terminal is to be connected to a second power source
terminal of the IC, the second power source terminal being one of the plurality of
terminals of the IC, and
the third lead-out terminal is electrically connected to (i) the other end of the
first element connected to the substrate-facing terminal that corresponds to the first
IC-facing terminal and (ii) the other end of the second element connected to the
substrate-facing terminal that corresponds to the second IC-facing terminal.
9. The IC current measuring apparatus of Claim 1, wherein
the first element is an electromagnetic wave receiving element to receive an
electromagnetic wave generated by the current flowing between the first IC-facing
terminal and the substrate-facing terminal that corresponds to the first IC-facing
terminal, and
the second element is an electromagnetic wave receiving element to receive
an electromagnetic wave generated by the current flowing between the second
IC-facing terminal and the substrate-facing terminal that corresponds to the second
IC-facing terminal.
10. The IC current measuring apparatus of Claim 9, further comprising:
a third lead-out terminal; and

a fourth lead-out terminal, wherein
the first element is a coil connected between the first lead-out terminal and
the third lead-out terminal,
a distance from the first element to a current path between the first
IC-facing terminal and the substrate-facing terminal that corresponds to the first
IC-facing terminal is equal to or less than a predetermined distance, the
predetermined distance being suitable for the first element to receive the
electromagnetic wave generated by the current flowing between the first IC-facing
terminal and the substrate-facing terminal that corresponds to the first IC-facing
terminal,
the second element is a coil connected between the second lead-out terminal
and the fourth lead-out terminal, and
a distance from the second element to a current path between the second
IC-facing terminal and the substrate-facing terminal that corresponds to the second
IC-facing terminal is equal to or less than a predetermined distance, the
predetermined distance being suitable for the second element to receive the
electromagnetic wave generated by the current flowing between the second
IC-facing terminal and the substrate-facing terminal that corresponds to the second
IC-facing terminal.
11. The IC current measuring apparatus of Claim 3, wherein
the second main surface has a rectangular shape.

ABSTRACT

Provided is an IC current measuring apparatus provided between an IC and
a substrate. The IC current measuring apparatus electrically connects each of a
plurality of IC-facing terminals and a different one of a plurality of substrate-facing
terminals. Especially, resistances are each inserted into a path between an IC
terminal targeted for measurement and a substrate terminal corresponding thereto.
Furthermore, the IC current measuring apparatus is provided with terminals each
used to measure a voltage between both ends of an inserted resistance corresponding
thereto. Accordingly, a measurer who measures current flowing through an
IC-facing terminal can measure the current flowing through the IC-facing terminal
by providing the IC current measuring apparatus between the IC targeted for
measurement and the substrate and measuring a voltage between both ends of an
inserted resistance corresponding to the IC terminal through which current he/she
wishes to measure flows.