Claims:1. A frequency source system comprising:
an enclosure;
a reference crystal module mounted in the enclosure;
a printed circuit board (PCB) configured for fitment inside the reference crystal module, the printed circuit board being configured to support a reference crystal;
a pair of fed through configured to a wall of reference crystal module, the fed through being operatively coupled to the printed circuit board to supply power; and
a connector for configured to another wall of the reference crystal module for reference crystal frequency output which in use further by other modules of the frequency source system for generating high frequency signal, the connector being operatively coupled to the printed circuit board,
wherein the reference crystal is mounted at a center of gravity of the reference crystal module for experiencing least vibrational sensitivity.
2. The frequency source system as claimed in claim 1, wherein the pair of fed through and the connector are conned to the printed circuit board through wires, and wherein the wires are 75-micron enamel wire, wherein the 75-micron Enamel wire 45 in pair with the pair of fed through and the connector facilitates in arresting any amplification effect due to interconnection with printed circuit board.
3. The frequency source system as claimed in claim 1, the reference crystal module is a housing defined by a base, side walls coupled to the base, and wherein the enclosure is a metallic enclosure.
4. The frequency source system as claimed in claim 1, wherein the frequency source system comprises a set of vibration isolation arrangements configured with the reference crystal module, each of the set of vibration isolation arrangements comprises rubber isolator, threaded screws, spring washers, planar washers, and hexagonal nuts and holding arrangement comprising a metallic post structure on which the rubber isolators are mounted at its other end.
5. The frequency source system as claimed in claim 5, wherein the set of vibration isolation arrangements and the holding arrangements facilitate the reference crystal module hang in air.
6. The frequency source system as claimed in claim 5, wherein the reference crystal module is mounted in the metallic enclosure with assistance of the set of vibration isolation arrangements and the holding arrangements, and wherein the post structures are arranged around a center of gravity (CG) of the enclosure.
7. The frequency source system as claimed in claim 1, wherein the frequency source system comprises a power divider module connected between the reference crystal module and the other modules in a predefined manner for multiple frequency generation, and wherein the other modules and the power divider module are mounted on the enclosure through vibration dampers.
8. The frequency source system as claimed in claim 7, wherein the power divider module is connected between the reference crystal module and the other modules through flexible RF cables, and wherein the flexible RF cables are sufficient enough to arrest any noise performance degradation due to interconnectivity.
, Description:TECHNICAL FIELD
[0001] The present disclosure relates to techniques for reduction of vibration induced noise on a reference crystal oscillator based frequency source under vibration environment.

BACKGROUND
[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art
[0003] As is well known, a frequency source is one of the critical subsystems of a radar system. Requirements for radar system performance in terms of increased dynamic range, target detection sensitivity, and operational flexibility necessitate the achievement of improved spectral purity of carrier signal for transmitter and local oscillator signal for receiver. The performance of the frequency source must be maintained under all environmental stress conditions such as vibration, shock, acceleration, high and low temperature, thermal shock and humidity. Noise is defined as random phase modulation of fundamental system generated signal and random frequency pickup plays critical role in the noise performance of the system. In order to build a system with low vibration sensitivity, proper selection of essential components and electronic and mechanical stabilization techniques are preferred.
[0004] Efforts have been made in past to provide solutions. However, the existing system and/or techniques include complex and sophisticated feedback mechanisms based on electronic compensation methods which make the system and/technique not feasible for applications having size constraints. Therefore, there is a need of compact and non- complex techniques and methods for noise reduction in crystal based frequency source that is required in space constraint applications.

OBJECTS OF THE PRESENT DISCLOSURE
[0005] Some of the objects of the present disclosure, which at least one embodiment herein satisfies are as listed herein below.
[0006] It is an object of the present disclosure to provide a technique for reduction of vibration induced noise on a reference crystal oscillator based frequency source under vibration environment.
[0007] It is an object of the present disclosure to provide a compact and non-complex technique and method for noise reduction in a crystal based frequency source that can be used in space constraint applications.
[0008] It is an object of the present disclosure to provide an improved crystal based frequency source that can be used in space constraint applications.
[0009] It is an object of the present disclosure to provide a robust, improved and stable frequency source system which is suitable for electronic warfare and airborne applications and applications under acceleration or vibration environment.
[0010] It is an object of the present disclosure to provide a simple and cost-effective frequency source system for reduction of vibration induced noise through innovative techniques and methods of assembly.
[0011] These and other objects of the present invention will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings.

SUMMARY
[0012] The present disclosure relates to techniques for reduction of vibration induced noise on a reference crystal oscillator based frequency source under vibration environment. In particular, it relates to an improved crystal oscillator based frequency source system for reduction of vibration induced noise. The vibration induced noise on the performance of the frequency source system is reduced by implementing innovative techniques, unique methods of assembly. This leads to realise a precise, stable frequency source capable of operating in dynamic vibration conditions with performance repeatability.
[0013] In an aspect, the present disclosure provides a frequency source system that includes an enclosure; a reference crystal module mounted in the enclosure; a printed circuit board (PCB) configured for fitment inside the reference crystal module, the printed circuit board being configured to support a reference crystal; a pair of fed through configured to a wall of reference crystal module, the fed through being operatively coupled to the printed circuit board to supply power to the PCB; and a connector for configured to another wall of the reference crystal module for reference crystal frequency output/ radio frequency (RF) signal interconnection which in use further by other modules of the frequency source system for generating high frequency signal. The connector is operatively coupled to the printed circuit board, wherein the reference crystal is mounted at a centre of gravity of the reference crystal module for experiencing least vibrational sensitivity.
[0014] In an embodiment, the pair of fed through and the connector are conned to the printed circuit board through wires, wherein the wires can be 75-micron enamel wire. The 75-micron Enamel wire 45 in pair with the pair of fed through and the connector facilitates in arresting any amplification effect due to interconnection with printed circuit board.
[0015] In an embodiment, the connector is a Sub Miniature Version A (SMA) connector.
[0016] In an embodiment, the reference crystal module can be a housing defined by base, side walls coupled to the base, and open from top to receive the PCB. The enclosure can be a metallic enclosure.
[0017] In an embodiment, the frequency source system can further include a set of vibration isolation arrangements configured with the reference crystal module, each of the set of vibration isolation arrangements can include a rubber isolator, threaded screws, spring washers, planar washers, and hexagonal nuts and holding arrangements that includes metallic post structure on which the rubber isolators are mounted at its other end. The set of vibration isolation arrangements and the holding arrangements facilitate the reference crystal module hang in air.
[0018] In an embodiment, the reference crystal module is mounted in the metallic enclosure with assistance of the set of vibration isolation arrangements and the holding arrangements, wherein the post structures are arranged around a centre of gravity (CG) of the metallic enclosure.
[0019] In an embodiment, the frequency source system can include flexible radio frequency (RF) cables for connecting output of the reference crystal module to the other modules of the frequency source system.
[0020] In an embodiment, the frequency source system can include a power divider module connected between the reference crystal module and the other modules in a predefined manner for multiple frequency generation.
[0021] In an embodiment, the other modules and the power divider module are mounted on the enclosure through vibration dampers at its base.
[0022] In an embodiment, the power divider module is connected between the reference crystal module and the other modules through flexible RF cables. The flexible RF cables are sufficient enough to arrest any noise performance degradation due to interconnectivity.
[0023] Various objects, features, aspects and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.

BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. The diagrams are for illustration only, which thus is not a limitation of the present disclosure.
[0025] FIG. 1A schematically illustrates a reference crystal PCB assembly in a reference crystal module of the proposed frequency source system, in accordance with embodiments of the present disclosure.
[0026] FIGs. 1B and 1C schematically illustrate assembly of feed through for power supply and SMA connector for frequency output respectively, in accordance with embodiments of the present disclosure.
[0027] FIG. 2 schematically illustrates an attachment process of the feed through with the reference crystal PCB and the SMA connector with reference crystal PCB making use of 75-micron enamel wires, in accordance with embodiments of the present disclosure.
[0028] FIG. 3 schematically illustrates mounting of a reference crystal of the proposed frequency source system at a center of gravity of the reference crystal module, in accordance with embodiments of the present disclosure.
[0029] FIGs. 4A to 4C schematically illustrate mounting of a vibration isolation arrangement with the reference crystal module, in accordance with embodiments of the present disclosure.
[0030] FIG. 5 schematically illustrates mounting of the reference crystal module at a center of gravity of an enclosure of the proposed frequency source system, in accordance with embodiments of the present disclosure.
[0031] FIG. 6 schematically illustrates a power distribution of the reference crystal module output to other module of the proposed frequency source system making use of RF flexible cable network, in accordance with embodiments of the present disclosure.
[0032] FIG. 7A is graphical representation of vibration profile and FIGs.7B, 7C, and 7D are graphs illustrating the improvement in noise performance of frequency source system due to reduction in vibration sensitivity, in accordance with present invention, in accordance with embodiments of the present disclosure.
[0033] Persons skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and may have not been drawn to scale. For example, the dimensions of some of the elements in the figure may be exaggerated relative to other elements to help to improve understanding of various exemplary embodiments of the present disclosure. Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures.

DETAILED DESCRIPTION
[0034] In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present invention. It will be apparent to one skilled in the art that embodiments of the present invention may be practiced without some of these specific details.
[0035] Various methods described herein may be practiced by combining one or more machine-readable storage media containing the code according to the present invention with appropriate standard computer hardware to execute the code contained therein. An apparatus for practicing various embodiments of the present invention may involve one or more computers (or one or more processors within a single computer) and storage systems containing or having network access to computer program(s) coded in accordance with various methods described herein, and the method steps of the invention could be accomplished by engine s, routines, subroutines, or subparts of a computer program product.
[0036] If the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0037] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0038] The recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range. Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g. “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.
[0039] Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations. Each group member can be referred to and claimed individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in, or deleted from, a group for reasons of convenience and/or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified thus fulfilling the written description of all groups used in the appended claims.
[0040] Exemplary embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those of ordinary skill in the art. Moreover, all statements herein reciting embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future (i.e., any elements developed that perform the same function, regardless of structure).
[0041] Embodiments explained herein relate to techniques for reduction of vibration induced noise on a reference crystal oscillator based frequency source under vibration environment. In particular, it relates to an improved crystal oscillator based frequency source system for reduction of vibration induced noise. In an embodiment, the present disclosure relates to stabilization techniques for improved noise performance. Stabilization approaches are verified experimentally to get better noise performance under different vibration conditions. This leads to design of a robust, improved and stable frequency source system that makes it suitable for electronic warfare and airborne applications and applications where the effects of acceleration or vibration affect the purity of output signal.
[0042] As noise of any frequency synthesizer system is direct dependent on noise performance of frequency source module. Use of such system in electronic warfare environment is limited by phase noise performance degradation under random vibration experienced. Hence for stabilizing the noise performance of frequency source module which is a part of frequency synthesizer system important for reduction of its g-sensitivity nature. The g-sensitivity reduction may be achieved in two phases in present disclosure. It is very much dependent on its spatial location as well as stabilization techniques. The finest spatial location i.e. center of gravity for mounting position of noise source is to find out by using structural analysis method. Performance stabilization is achieved by two different techniques i.e. mechanical and electrical. Unlike the existing conventional sound generation source, the realization of module is suggested with unique techniques and less complex circuitry and it is easy for production.
[0043] In an aspect, the present disclosure provides a frequency source system that includes an enclosure; a reference crystal module mounted in the enclosure; a printed circuit board (PCB) configured for fitment inside the reference crystal module, the printed circuit board being configured to support a reference crystal; a pair of fed through configured to a wall of reference crystal module, the fed through being operatively coupled to the printed circuit board to supply power to the PCB; and a connector for configured to another wall of the reference crystal module for reference crystal frequency output/ radio frequency (RF) signal interconnection which in use further by other modules of the frequency source system for generating high frequency signal. The connector is operatively coupled to the printed circuit board, wherein the reference crystal is mounted at a centre of gravity of the reference crystal module for experiencing least vibrational sensitivity.
[0044] In an embodiment, the pair of fed through and the connector are conned to the printed circuit board through wires, wherein the wires can be 75-micron enamel wire. The 75-micron Enamel wire 45 in pair with the pair of fed through and the connector facilitates in arresting any amplification effect due to interconnection with printed circuit board.
[0045] In an embodiment, the connector is a Sub Miniature Version A (SMA) connector.
[0046] In an embodiment, the reference crystal module can be a housing defined by base, side walls coupled to the base, and open from top to receive the PCB. The enclosure can be a metallic enclosure.
[0047] In an embodiment, the frequency source system can further include a set of vibration isolation arrangements configured with the reference crystal module, each of the set of vibration isolation arrangements can include a rubber isolator, threaded screws, spring washers, planar washers, and hexagonal nuts and holding arrangement that includes metallic post structure on which the rubber isolators are mounted at its other end. The set of vibration isolation arrangements and the holding arrangements facilitate the reference crystal module hang in air.
[0048] In an embodiment, the reference crystal module is mounted in the metallic enclosure with assistance of the set of vibration isolation arrangements and the holding arrangements, wherein the post structures are arranged around a centre of gravity (CG) of the metallic enclosure.
[0049] In an embodiment, the frequency source system can include flexible radio frequency (RF) cables for connecting output of the reference crystal module to the other modules of the frequency source system.
[0050] In an embodiment, the frequency source system can include a power divider module connected between the reference crystal module and the other modules in a predefined manner for multiple frequency generation.
[0051] In an embodiment, the other modules and the power divider module are mounted on the enclosure through vibration dampers at its base.
[0052] In an embodiment, the power divider module is connected between the reference crystal module and the other modules through flexible RF cables. The flexible RF cables are sufficient enough to arrest any noise performance degradation due to interconnectivity.
[0053] Referring to FIG. 1A, where an assembly process a reference crystal PCB assembly in a reference crystal module 115. The printed circuit board (PCB) (hereinafter, also referred to as reference crystal PCB) 10 is configured on which a reference crystal resides inside metallic housing of the reference crystal module 15. In FIG. 1A reference numerals 20, 25 and 30 identify a threaded screw, spring washer and planar washer respectively that can be used in mounting the reference crystal PCB 10 in a defined sequence as indicated. The reference crystal module 15 can be specially manufactured block meant for enclosing the reference crystal circuitry which is most sensitive to any vibrational disturbance and governs overall noise performance of the frequency source system. The reference crystal module 15 can be defined by a base and side walls coupled to the base.
[0054] Referring to FIG. 1B, feed through 35 are configured with a wall of the reference crystal module 15 for DC supply connection with hole provision provided in the reference crystal module 15 for fixing to the reference crystal module 15. A SMA connector 40, referring FIG 1C, is configured with another wall of the reference crystal module 15. The SMA connector 40 can be used for reference crystal output which in use further by other modules (Shown in FIGs. 5 and 6) of the frequency source system for generating high frequency signal.
[0055] FIG. 2 illustrates an attachment process of the feed through with the reference crystal PCB and the SMA connector with reference crystal PCB by using 75-micron enamel wires 45, in accordance with embodiments of the present disclosure. The 75-micron enamel wires 45 in combination with the feed through 35 is most efficient technique for power supply connection to the reference crystal PCB 10.
[0056] For taking out reference crystal output for further use by the other modules, the SMA connector 40 and reference crystal PCB 10 are connected with the 75-micron Enamel wire 45. Use of the 75-micron enamel wire 45 in pair with feed through 35 and SMA connector 40 is an efficient approach for arresting any amplification effect due to interconnection with the PBC 10.
[0057] FIG. 3 schematically illustrates mounting of a reference crystal of the proposed frequency source system at a center of gravity of the reference crystal module, in accordance with embodiments of the present disclosure. Mounting position of the reference crystal 50 is shown indicating at centre of gravity of the reference crystal module 15. Axial indicators AXIS 1, AXIS 2 and AXIS 3 are representations of defined coordinate system for the proposed frequency source system. With reference to FIG. 3, measure of vibrational sensitivity is least at centre of gravity (CG) of reference crystal module 15 which is most preferred position for mounting of any piezoelectric material based frequency determining component such as crystals.
[0058] Phase Noise performance degradation happens in case any shift of reference crystal from CG position of the reference crystal module 15 due to their directional dependent nature. The overall vibrational sensitivity vector is expressed as follows:
= + +

where , and represents vibrational sensitivity in AXIS1, AXIS2, and AXIS3, in accordance with present axial system of representation.
[0059] FIGs. 4A to 4C illustrate sequential representation of mounting of the reference crystal module 15 for isolating it from rest of the system for reduced effect of vibration on it leading to improved noise performance of the frequency source system, in accordance with embodiments of the present disclosure. In an embodiment, the proposed frequency source system can include a set of vibration isolation arrangements configured with the reference crystal module 115. Each of the set of vibration isolation arrangements can include a rubber isolator 55 that is made of silicone, threaded screws 20, spring washers 25, planar washers 30, and hexagonal nuts 60 and holding arrangement that includes metallic post structure 65.
[0060] Shown assembly arrangement in FIG. 4A is for connecting the reference crystal module 15 with the silicone rubber isolator 55 a specially manufactured class of rubber threaded in combination with the screw 20, spring washer 25, planar washer 30, and hexagonal nut 60. FIG. 4B shows the silicone rubber isolator 55 on other end is mounted on the metallic post structures 65 in combination with the threaded screw 20, spring washer 25, planar washer 30 and making the reference crystal module 15 hang in air. Figure 4C is a representation of arrangement of present disclosure for effective reduction of intense vibration. Arrangement of present disclosure is found effective in reducing level up to double fold of applied disturbance.
[0061] FIG. 5 schematically illustrates mounting of the reference crystal module at a center of gravity of an enclosure of the proposed frequency source system, in accordance with embodiments of the present disclosure. In an embodiment, the frequency source system can include an enclosure 75 which can be a metallic enclosure. The reference crystal module 15 is mounted in the metallic enclosure 75 with assistance of the set of vibration isolation arrangements and the holding arrangements. The reference crystal module 15 is mounted with post structures, for example four post structures, arranged around a centre of gravity (CG) of the frequency source/synthesizer metallic enclosure 75. This arrangement of the reference crystal module 15 along with other module 70 is an efficient technique of vibrational sensitivity reduction.
[0062] FIG. 6 schematically illustrates a power distribution of the reference crystal module output to other module of the proposed frequency source system making use of RF flexible cable network, in accordance with embodiments of the present disclosure. In an embodiment, the frequency source system can include flexible radio frequency (RF) cables 80 for routing output of the reference crystal module 15 to the other modules 70 of the frequency source system. A power divider module 85 can be mounted on vibration dampers 90 in specified/predefined manner used for multiple frequency generation placed inside the metallic enclosure 75 along with the reference crystal module 15 and other modules 70. The flexible RF cables 80 routing is sufficient enough to arrest any noise performance degradation due to interconnectivity. The power divider module 85 is connected between the reference crystal module 15 and the other modules 70 in a predefined manner/ specified for multiple frequency generation. In an embodiment, the other modules 70 and the power divider module 85 are mounted on the enclosure 75 through vibration dampers 90 at its base. The power divider module 85 is connected between the reference crystal module 75 and the other modules 70 through flexible RF cables 80.
[0063] FIG. 7A is the graph of Power spectral density (PSD) with respect to frequency span ranging from 20Hz to 2000Hz defines amplitude of vibration. FIGs. 7B, 7C and 7D are graphs indicating improvement in noise performance as result of reduction in vibration sensitivity. In FIG. 7B illustrates, phase noise performance of the reference crystal module 15 is monitored at three different offsets 100Hz, 1KHz and 10KHz. In Fig. 7C noise performance degradation pattern during random vibration test running with FIG. 7A profile without implementing present inventions. In FIG. 7D illustrates 40dB improvement in nose performance in accordance with the present invention. The amount of improvement in reduction in vibration sensitivity depends upon mechanical fabrication quality and workmanship.
[0064] Thus, it will be appreciated by those of ordinary skill in the art that the diagrams, schematics, illustrations, and the like represent conceptual views or processes illustrating systems and methods embodying this invention. The functions of the various elements shown in the figures may be provided through the use of dedicated hardware as well as hardware capable of executing associated software. Similarly, any switches shown in the figures are conceptual only. Their function may be carried out through the operation of program logic, through dedicated logic, through the interaction of program control and dedicated logic, or even manually, the particular technique being selectable by the entity implementing this invention. Those of ordinary skill in the art further understand that the exemplary hardware, software, processes, methods, and/or operating systems described herein are for illustrative purposes and, thus, are not intended to be limited to any particular named.
[0065] While embodiments of the present invention have been illustrated and described, it will be clear that the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the spirit and scope of the invention, as described in the claim.
[0066] In the foregoing description, numerous details are set forth. It will be apparent, however, to one of ordinary skill in the art having the benefit of this disclosure, that the present invention may be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form, rather than in detail, to avoid obscuring the present invention.
[0067] As used herein, and unless the context dictates otherwise, the term "coupled to" is intended to include both direct coupling (in which two elements that are coupled to each other contact each other)and indirect coupling (in which at least one additional element is located between the two elements). Therefore, the terms "coupled to" and "coupled with" are used synonymously. Within the context of this document terms "coupled to" and "coupled with" are also used euphemistically to mean “communicatively coupled with” over a network, where two or more devices are able to exchange data with each other over the network, possibly via one or more intermediary device.
[0068] It should be apparent to those skilled in the art that many more modifications besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms “comprises” and “comprising” should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced. Where the specification claims refers to at least one of something selected from the group consisting of A, B, C …. N, the text should be interpreted as requiring only one element from the group, not A plus N, or B plus N, etc.
[0069] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.

ADVANTAGES OF THE PRESENT DISCLOSURE
[0070] The present disclosure provides a technique for reduction of vibration induced noise on a reference crystal oscillator based frequency source under vibration environment.
[0071] The present disclosure provides a compact and non-complex technique and method for noise reduction in a crystal based frequency source that can be used in space constraint applications.
[0072] The present disclosure provides an improved crystal based frequency source that can be used in space constraint applications.
[0073] The present disclosure provides a robust, improved and stable frequency source system which is suitable for electronic warfare and airborne applications and applications under acceleration or vibration environment.
[0074] The present disclosure provides a simple and cost-effective frequency source system for reduction of vibration induced noise through innovative techniques and methods of assembly.