Description:FIELD OF THE INVENTION
Embodiments of a present disclosure relate to power distribution and protection units, and more particularly to a battery management system (BMS) board.

BACKGROUND OF THE INVENTION
In the current scientific world, the demand for efficient vehicles is increasing. The demand for usage of electrically powered vehicles has made the lithium-ion batteries indispensable. The battery pack includes several modules that are connected to a Battery Management System (BMS) and a cooling system which regulate and control the battery pack's temperature, voltage, and other factors. BMS is a technology designed to monitor battery packs of an electric vehicle and contains tools for measuring voltage, temperature, voltage limit, and current limit. However, to protect these cells, safe connection is necessary between the cell stack in the battery pack and the BMS board. The BMS includes bus bars that are connected with semiconductor devices called metal oxide semiconductor field effect transistor (MOSFET).

An electric vehicle requires high power to run, thus needing a large number of battery cells. The battery management system consists of MOSFETS and each MOSFET includes pins which assist in the flow of current from the battery pack to a load, control pin which disconnects the battery pack from transferring current to load in case any fault is detected and pads that support the MOSFET pins. It is important to maintain uniform distribution of current through the MOSFETS and sometimes the pads that support the MOSFET pins could block the flow of current. In such a case where current is being blocked, it could lead to overloading and failing of MOSFET. Therefore, it is important to maintain uniform distribution of current through MOSFETS.

PROBLEM TO BE SOLVED BY INVENTION
The current architecture of the BMS board does not allow for uniform flow of current through the MOSFETS thereby resulting in poor performance.
Hence, it is a primary objective of the current invention to provide improved current distribution on a BMS board.

When there are high voltage conditions with extreme temperature, the non-uniform flow of current or the current being blocked at certain region leads to overheating of the BMS board making the architecture more vulnerable.

Thus, it is another objective of the current invention to avoid overheating of the BMS board by improving the current flow through the BMS board.

The above-mentioned shortcomings, disadvantages and problems are addressed herein, and which will be understood by reading and studying the following specification.

SUMMARY OF THE INVENTION
Various embodiments herein describe a system to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB). A first bus bar receives current from a source. One or more MOSFETS receive current from the first bus bar, where each MOSFET includes a drain pin, one or more source pins, a gate control pin and a gate control pin PCB pad, further the one or more MOSFETS receive current through the one or more source pins and the gate control pin controls the connection or disconnection of the drain pin with the one or more source pins of the one or more MOSFETS. A second bus bar receives current from the one or more MOSFETS. A load receives current from the second bus bar, characterized in that, the gate control pin PCB pad length of each MOSFET is reduced to provide additional path for flow of current to the one or more MOSFETS through the one or more source pins from the first bus bar thereby ensuring improved current distribution among the one or more MOSFETS.

As per another embodiment of the current invention, a system to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) is disclosed. A second bus bar receives current from a source. One or more MOSFETS receive current from the second bus bar, where each MOSFET includes a drain pin, one or more source pins, a gate control pin and a gate control pin PCB pad, further the one or more MOSFETS receive current through the one or more source pins and the gate control pin controls the connection or disconnection of the drain pin with the one or more source pins of the one or more MOSFETS. A first bus bar receives current from the one or more MOSFETS. A load receives current from the first bus bar, characterized in that, the gate control pin PCB pad length of each MOSFET is reduced to provide additional path for flow of current to the one or more MOSFETS through the one or more source pins from the second bus bar thereby ensuring improved current distribution among the one or more MOSFETS.

As per yet another embodiment of the current invention, a method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) is disclosed. Receiving current from a source by a first bus bar. Receiving current from the first bus bar by one or more MOSFETS, where each MOSFET includes a drain pin, one or more source pins, a gate control pin and a gate control pin PCB pad, further the one or more MOSFETS receive current through the one or more source pins and the gate control pin controls the connection or disconnection of the drain pin with the one or more source pins of the one or more MOSFETS. Receiving current from the one or more MOSFETS by a second bus bar. Receiving current from the second bus bar by a load, characterized in that, reducing the gate control pin PCB pad length of each MOSFET to provide additional path for flow of current to the one or more MOSFETS through the one or more source pins from the first bus bar thereby ensuring improved current distribution among the one or more MOSFETS.

As per yet another embodiment of the current invention, a method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) is disclosed. Receiving current from a source by a second bus bar. Receiving current from the second bus bar by one or more MOSFETS, where each MOSFET includes a drain pin, one or more source pins, a gate control pin and a gate control pin PCB pad, further the one or more MOSFETS receive current through the one or more source pins and the gate control pin controls the connection or disconnection of the drain pin with the one or more source pins of the one or more MOSFETS. Receiving current from the one or more MOSFETS by a first bus bar. Receiving current from the first bus bar by a load, characterized in that, reducing the gate control pin PCB pad length of each MOSFET to provide additional path for flow of current to the one or more MOSFETS through the one or more source pins from the second bus bar thereby ensuring improved current distribution among the one or more MOSFETS.

As per first embodiment of the current invention, the MOSFETS include one or more source pins PCB pads.

As per second embodiment of the current invention, the one or more MOSFETS may be charging MOSFETS and discharging MOSFETS.

As per third embodiment of the current invention, the fault may be over voltage, under voltage, over current and over temperature.

As per forth embodiment of the current invention, the source may be a battery pack, power supply, super capacitor, etc.

As per fifth embodiment of the current invention, the load may be a motor control unit (MCU), a motor, etc.

The foregoing has outlined, in general, the various aspects of the invention and serves as an aid to better understanding the more complete detailed description which is to follow. In reference to such, there is to be a clear understanding that the present invention is not limited to the method or application of use described and illustrated herein. It is intended that any other advantages and objects of the present invention that become apparent or obvious from the detailed description or illustrations contained herein are within the scope of the present invention.

BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS
The other objects, features and advantages will occur to those skilled-in-the-art from the following description of the preferred embodiments and the accompanying drawings in which:

Figure 1 is a schematic block diagram illustrating an improved current distribution on a power distribution unit (PDU) printed circuit board (PCB), according to an embodiment of the present invention.

Figure 2 is a schematic diagram representing a power distribution unit (PDU) printed circuit board (PCB), according to an embodiment of the present invention.

Further, those skilled-in-the-art will appreciate that elements in the figures are illustrated for simplicity and may not have necessarily been drawn to scale. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the figures by conventional symbols, and the figures may show only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the figures with details that will be readily apparent to those skilled in the art having the benefit of the description herein.

DETAILED DESCRIPTION OF THE INVENTION
The present invention provides a system and method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101). In the following detailed description of the embodiments of the invention, reference is made to the accompanying drawings that form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled-in-the-art to practice the invention, and it is to be understood that other embodiments may be utilized and that changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims.

The specification may refer to “an”, “one” or “some” embodiment(s) in several locations. This does not necessarily imply that each such reference is to the same embodiment(s), or that the feature only applies to a single embodiment. Single features of different embodiments may also be combined to provide other embodiments.

As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless expressly stated otherwise. It will be further understood that the terms “includes”, “comprises”, “including” and/or “comprising” when used in this specification, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations and arrangements of one or more of the associated listed items.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Embodiments of the present invention will be described below in detail with reference to the accompanying figures.

According to Figure 1 and Figure 2, a system to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101) is disclosed. A first bus bar (102) receives current from a source (110). One or more MOSFETS (103) receive current from the first bus bar (102), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103). A second bus bar (109) receives current from the one or more MOSFETS (103). A load (111) receives current from the second bus bar (109), characterized in that, the gate control pin PCB pad (107) length of each MOSFET (103) is reduced to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the first bus bar (102) thereby ensuring improved current distribution among the one or more MOSFETS (103).

As per another embodiment of the current invention, a system to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101) is disclosed. A second bus bar (109) receives current from a source (110). One or more MOSFETS (103) receive current from the second bus bar (109), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103). A first bus bar (102) receives current from the one or more MOSFETS (103). A load (111) receives current from the first bus bar (102), characterized in that, the gate control pin PCB pad (107) length of each MOSFET (103) is reduced to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the second bus bar (109) thereby ensuring improved current distribution among the one or more MOSFETS (103).

As per yet another embodiment of the current invention, a method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101) is disclosed. Receiving current from a source (110) by a first bus bar (102). Receiving current from the first bus bar (102) by one or more MOSFETS (103), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103). Receiving current from the one or more MOSFETS (103) by a second bus bar (109). Receiving current from the second bus bar (109) by a load (111), characterized in that, reducing the gate control pin PCB pad (107) length of each MOSFET (103) to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the first bus bar (102) thereby ensuring improved current distribution among the one or more MOSFETS (103).

As per yet another embodiment of the current invention, a method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101) is disclosed. Receiving current from a source (110) by a second bus bar (109). Receiving current from the second bus bar (109) by one or more MOSFETS (103), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103). Receiving current from the one or more MOSFETS (103) by a first bus bar (102). Receiving current from the first bus bar (102) by a load (111), characterized in that, reducing the gate control pin PCB pad (107) length of each MOSFET (103) to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the second bus bar (109) thereby ensuring improved current distribution among the one or more MOSFETS (103).

As per first embodiment of the current invention, the MOSFETS (103) include one or more source pins PCB pads (108).

As per second embodiment of the current invention, the one or more MOSFETS (103) may be charging MOSFETS (103) and discharging MOSFETS (103).

As per third embodiment of the current invention, the fault may be over voltage, under voltage, over current and over temperature.

As per forth embodiment of the current invention, the source (110) may be a battery pack, power supply, super capacitor, etc.

As per fifth embodiment of the current invention, the load (111) may be a motor control unit (MCU), a motor, etc.

FURTHER ADVANTAGES OF THE INVENTION
The current architecture of the BMS board allows for uniform flow of current through the MOSFETS thereby resulting in better performance. When there are high voltage conditions with extreme temperature, the uniform flow of current avoids overheating of the BMS board.

Although the embodiments herein are described with various specific embodiments, it will be obvious for a person skilled in the art to practice the invention with modifications. However, all such modifications are deemed to be within the scope of the claims. It is also to be understood that the following claims are intended to cover all the generic and specific features of the embodiments described herein and all the statements of the scope of the embodiments which as a matter of language might be said to fall there between.

REFERENCE TABLE

S.No. Name Numbering
1. a power distribution unit (PDU) printed circuit board (PCB) 101
2. a first bus bar 102
3. one or more MOSFETS 103
4. a drain pin 104
5. one or more source pins 105
6. a gate control pin 106
7. a gate control pin PCB pad 107
8. one or more source pins PCB pads 108
9. a second bus bar 109
10. a source 110
11. a load 111

, Claims:CLAIMS
We claim:

1. A system to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101), the system comprising of:
a first bus bar (102) receives current from a source (110);
one or more MOSFETS (103) receive current from the first bus bar (102), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103);
a second bus bar (109) receives current from the one or more MOSFETS (103);
a load (111) receives current from the second bus bar (109),
characterized in that,
the gate control pin PCB pad (107) length of each MOSFET (103) is reduced to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the first bus bar (102) thereby ensuring improved current distribution among the one or more MOSFETS (103).

2. A system to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101), the system comprising of:
a second bus bar (109) receives current from a source (110);
one or more MOSFETS (103) receive current from the second bus bar (109), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103);
a first bus bar (102) receives current from the one or more MOSFETS (103);
a load (111) receives current from the first bus bar (102),
characterized in that,
the gate control pin PCB pad (107) length of each MOSFET (103) is reduced to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the second bus bar (109) thereby ensuring improved current distribution among the one or more MOSFETS (103).

3. The system as claimed in claim 1, wherein the MOSFETS (103) include one or more source pins PCB pads (108).

4. The system as claimed in claim 1, wherein the one or more MOSFETS (103) may be charging MOSFETS (103) and discharging MOSFETS (103).

5. The system as claimed in claim 1, wherein the fault may be over voltage, under voltage, over current and over temperature.

6. The system as claimed in claim 1, wherein the source (110) may be a battery pack, a power supply or a super capacitor.

7. The system as claimed in claim 1, wherein the load (111) may be a motor control unit (MCU) or a motor.

8. A method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101), the method comprising of:
receiving current from a source (110) by a first bus bar (102);
receiving current from the first bus bar (102) by one or more MOSFETS (103), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103);
receiving current from the one or more MOSFETS (103) by a second bus bar (109);
receiving current from the second bus bar (109) by a load (111),
characterized in that,
reducing the gate control pin PCB pad (107) length of each MOSFET (103) to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the first bus bar (102) thereby ensuring improved current distribution among the one or more MOSFETS (103).

9. A method to ensure improved current distribution on a power distribution unit (PDU) printed circuit board (PCB) (101), the method comprising of:
receiving current from a source (110) by a second bus bar (109);
receiving current from the second bus bar (109) by one or more MOSFETS (103), where each MOSFET (103) includes a drain pin (104), one or more source pins (105), a gate control pin (106) and a gate control pin PCB pad (107), further the one or more MOSFETS (103) receive current through the one or more source pins (105) and the gate control pin (106) controls the connection or disconnection of the drain pin (104) with the one or more source pins (105) of the one or more MOSFETS (103);
receiving current from the one or more MOSFETS (103) by a first bus bar (102);
receiving current from the first bus bar (102) by a load (111),
characterized in that,
reducing the gate control pin PCB pad (107) length of each MOSFET (103) to provide additional path for flow of current to the one or more MOSFETS (103) through the one or more source pins (105) from the second bus bar (109) thereby ensuring improved current distribution among the one or more MOSFETS (103).