Description
Title of Inventio~l
INFORMATION PROCESSING DEVICE AND COMMUNICATION DEVICE
5
Technical Field
[OOOl]
The present disclosure relates to information processing devices and
commi~~~iicatdioevni ces.
10
Background Art
[0002]
IC tags, \vl~chiu cludc an IC chip for performing contactless co~nmunication
with a nearby rcader/\vriter to perform a process such as authenticatiou or the likc,
15 havc been widespread. In particular, so-called passive IC tags, which do not havc a
power supply such as a battery or the likc and is activated by power that is
accun~ulated and stored in a capacitor or the like by receiving radio waves from a
readerlwriter, have been widespread because of their good usability.
[0003]
20 At1 IC tag. is constructed by mounting parts such as at1 IC chip for
performing a communication process and tlic likc on a circuit board on which an
antentla pattern for receiving radio waves from a rcader/\vriter is formed. The
antentla patter11 is in the shape of a coil and has a relatively large area on the circuit
board in or&;, to efficielitly receive radio waves from a rcaderlwriter. Typicall):
25 parts such as an IC chip, a capacitor, and tlic likc arc provided in a center portion
surrounded by the coil-shaped atlten~lap attern. When a11 authentication process is
performed using an IC tag, the IC tag perforlns a cornmunicatio~lp rocess on its o\v~l,
c.g., infor~natioa stored in a memory included in the IC chip is transmitted to a
reader/\vriter, and information transmitted fiom the reader/writcr is \vritten to the
30 memory of the IC chip.
[0004]
As described above, IC tags can wirclcssly co~nn~unicatew ith a
reader/wvritcr on their own. For example, card-shaped objects includi~lg a circuit
board imple~nented as an IC tag are widely used as electronic lnoney cards, tickets,
autl~enticationc ards, and the like. Also, various electronic devices such as mobile
5 telephone ternlinals and the like \vhich inclnde at1 IC tag are similarly nridely used.
[OOOS]
A plurality of standards for IC chips that perform contactless
comri~ut~icatioanre provided for different applications and the like. A technique has
been proposed that equips a single device with a plurality of IC chips for perfos~ning
10 contactless con~mu~licatioanc cording to different standards and thereby allo~vst he
single device to perform contactless cornrnunication using a plurality of
communication schenles (see, for example, Patent Literature I and the like).
Citation List
-
15 Patent Literahire
[0006]
Patent Literature 1 : JP 2002-83277A
Summary of Invention
20 Technical Problem
[0007]
If a plurality of IC chips for performing corltactless communication are
provided, power received fiotn the antenna needs to be appropriately supplied to the
IC chips according to co~nmutlicatio~chl aracteristics required for the respective IC
25 chips.
[0008]
With the above in mind, the present disclosure proposes a novel and
inlproved i~~formatiopnr ocessing device and con~n~unicatiodne vice that, when a
plurality of IC chips for perfor~ning contactless cornn~unication are connected to a
30 single coil antenna, can appropriately supply power to the IC chips according to
cornnlunication characteristics required for the respective IC chips.
Solution to Proble~n
[0009]
According to the present disclosure, there is provided an information
5 processing device including: a coil antenna configured to receive an external
lnagnetic field and thereby generate power; and a first IC chip and a second 1C chip
each connected in parallel to the coil antenna and configured to receive power
supplied from the coil antenna. Power received by the first IC chip fiom the coil
antenna is different from power received by the second IC chip from the coil antenna.
10 [OOlO]
According to the present disclosure, there is provided a communicatioti
device including: a coil antenna configured to receive an external ~nagneticfi eld and
thereby generate power; a first IC cliip and a second IC cliip each connected in
parallel to the coil antenna and configured to receive power supplied fiotn the coil
15 antenna; and an outer material configured to cover the coil antenna Gd the two or
more IC chips. Power received by the first IC chip from the coil antenna is
different fro111 power received by the second IC chip fro111 the coil antenna.
Advantageous Effects of Invention
20 [OOll]
As described above, according to the present disclosure, a novel and
improved information processing device and comn~u~~icatdieovni ce can be provided
that, wlien a plurality of IC chips for performing contactless communication are
connected to a single coil antenna, can appropriately supply power to the IC chips
25 according to co~nmunicationc haracteristics required for the respective IC chips.
[0012]
Note that the effects described above are not necessarily limited, and along
with or instead of the effects, any effect that is desired to be introduced in the present
specification or other effects that can be expected from the present specification may
30 be exhibited.
Brief Description of Drawings
[0013]
[FIG. 11 FIG. 1 is an illustrative diagram sho\ving a configuration cxa~nple of an
information processing device according to an embodiment of the present disclosure.
5 [FIG. 21 FIG. 2 is an illustrative diagram sho\ving a specific configuration example of
an infornlation processing device according to an c~nbodiment of the present
disclosure.
[FIG. 31 FIG. 3 is an illustrative diagram showing a specific configuration example of
an inforniatioa processing device according to an e~iiboditnet~otf the present
10 disclosure.
[FIG. 41 FIG. 4 is an illustrative diagram showing a configuratior~ example of an
informatiotl processing device.
[FIG. 51 FIG. 5 is an illustrative diagram showing a configuration example of at1
infol.niation processing device according to a comparative example.
- - -
15
Description of Embodiments
[00 141
Hereinaftel; (a) preferred embodiment(s) of the present disclosure will be
described in detail with reference to the appended drawings. I11 this specification
20 and the drawings, elements that have substantially the same function aud structure
are denoted with the same reference signs, aud repeated explanatiot~i s omitted.
[OOlS]
Note that description will be provided in the following order.
1. Embodiments of the Present Disclosure
25 1.1. Configuration Examples of Information Processing Device
1.2. Advantageous Effect Examples
1.3. Specific Structure Examples
2. Conclusion
[0016]
30
[1.1. Configuration Examples of Information Processing Device]
FIG. 4 is an illustrative diagram sho~vinga circuit configuration example of
an infornlation processing device 10 including a single IC chip for perfomtiag
contactless comnlunication. In the information processing device 10 sho\vn in FIG.
4, an IC chip 22 for performing contactless cotltmunication is connected to a coil
5 antenna 20 including a coil 21, and operates using supplied power that is generated in
the coil antenna 20 by electron~agneticin duction.
[0017]
When a plurality of IC chips for performing contactless co~nmunicationa re
provided instead of a single IC chip, then if the 1C chips are simply connected in
10 parallel to the coil-shaped coil antenna, power that is generated by the coil antenna
and snpplied to the respective IC chips, is uniquely determined according to
characteristics of operating circuits included in the respective IC chips. For
different IC chips for performing contactless communication, there are different
requirements in terms of a conmlunication characteristic such as a co~lltnunicatiotl
15 coverage distance, or the presence or absence and width of a cotllmunication dead
zone within a corntllunication coverage area. If IC chips are simply connected it1
parallel to the coil-shaped coil antelma, power supplied to the respective IC chips is
uniquely determined, so that, for sonle of the IC chips, the required con~munication
characteristic may not be satisfied.
20 [OOlS]
With the above in tnind, an itlfornlation processing device according to an
embodiment of the present disclosure described below has a feature that when a
plurality of IC chips are connected to a coil antenna instead of a single IC chip, an
adjust~nent is made to allow the IC chips to appropriately receive power supplied
25 from the coil antenna according to co~l~m~~nicacthiaornac teristics required by the
respective IC chips.
[00 191
Next, a configuration exanlple according to an embodinlent of the present
disclosure will be described. FIG. 1 is an illustrative diagram showing a
30 configuration exatilple of an information processing device according to an
enlbodinlent of the present disclosure. The configuration example of the
infomiation processing device 100 according to an embodiment of the present
disclosure will be described with reference to FIG. 1.
The information processing device 100 according to an embodiment of the
5 present disclosure sliown in FIG. 1 is incorporated into, for exan~plea, card having a
shape detern~itied according to a predetermined standard, or an electrotlic device
such as a mobile telephone, a smartphone, or the like. FIG. 1 sclien~aticallys hows a
circuit diagram of the infor~~iationp rocessing device 100 according to an
embodiment of the present disclosure. The infor~liation processing device 100
10 shown in FIG. 1 may be, for example, an inlet enclosed by an outer material such as a
plastic card or tlie like. The i~iformation processing device 100 according to an
embodiment of the present disclosure shown in FIG. 1 illcludes a coil antenna 110
and two IC chips 120a and 120b.
[0021]
15 The coil antenna 110, which is constructed by, for exa~iiplew, inding a bandshaped
conductive film into a helix receives a magnetic field generated by a
readerl~vriter (not shown) using a coil 11 1 to generate power by electromagnetic
induction. Although not shown in FIG. 1, interconnects, and internal circuits of the
IC chips 120a and 120b, in the information processing device 100, have capacitances.
20 These capacitances and the inductatlce of the coil 111 determine the resonant
frequency of the itlfor~ilationp rocessing device 100. It is assumed that the resonant
frequency of the information processing device 100 is set to, for example, 13.56
MHz. Power generated by tlie coil 111 is supplied to the IC chips 120a and 120b,
and is used to operate the IC chips 120a and 120b.
25 [0022]
The IC chips 120a and 120b are a communication circuit including a circuit
for perforllling a contactless wireless corntnunication process with a readerlwriter
(not shoxv~l). As shown in FIG. 1, in tlie information processing device 100
according to this embodinle~it, tlie two clups 120a and 120b are connected to the
30 single coil antenna 110.
[0023]
The IC chips 120a and 120b each include a circuit suited to a
cotllnlunication characteristic that should be satisfied for a corresponding contactless
comm~utiications cheme (e.g., Type A, Type B, or Type F). In this et~ibodiment,t he
term "con~munication characteristic" refers to an aspect of an IC chip \v11icl1 is
5 specified according to a corresponding contactless con~munication scheme or
applicable service, during contactless \+ireless con~t~~unicatwiointh a readerlwriter,
such as a col~ununicatio~cio verage distance, the presence or absence of a
communication dead zone within a co~lu~lunicatiocnov erage area, and the width of a
commuuication dead zone if any. For example, IC chips that are incorporated into
10 IC cards for transport systems, such as IC tickets and the like, are typically designed
to have a longer cotumut~icationc overage distance for reception of radio waves from
a readerlwiter than that of IC chips that are incorporated into IC cards for payment
systettls for paying ttloney for goods or service.
[0024]
15 For example, it is assumed that the 1C chip 120a is the former IC chip that is
incorporated into IC cards for trat~sports ystems, such as IC tickets and the like, and
the IC chip 120b is the latter IC chip that is incorporated into IC cards for payment
systems for paying motiejr for goods or senlice. The IC cliips 120a and 120b, when
receiving po\ver that is generated by the coil 111 receiving radio waves from a
20 readerlwritel; sends informatioti back to the readerlwriter in response to information
tratlstnitted froom the readerlwriter.
[0025]
As described above, there are standards for IC chips that specify
communication characteristics required according to corresponding contactless
25 comtnunicatiot~ schemes or applicable se~~rices. Anlong important aspects of
standards for commu~~icatiocnh atacteristics is a comnlunication coverage distance.
The co~~~tnunicaticootvi erage distance of au IC chip mainly depends on the amount
of power received from the coil. When a plurality of IC chips atid a coil antentla
are cotiriected so that ponrer is equally supplied to the IC chips, then if the amount of
30 power is adjusted so that IC chips for which a shorter communication coverage
distance is required call receive an appropriate amount of po\+Ier, IC chips for which
a longer co~~~~~~utliccoavteiroagne distance is required fail to satis@ the
communication coverage distance. Conversely, if the atnonnt of po\t7er is adjusted
so that IC chips for which a longer comtnunication coverage distance is reqt~iredc an
receive an appropriate amount of power, IC chips for which a shorter communication
5 coverage distance is required receive an excessive amount of power.
[0026]
Arnong techniques of supplying appropriate power to a plurality of IC chips
is to provide the IC chips with respective coil antennas separately. Specifically,
when two IC chips are incorporated, t\vo coil antennas are incorporated. Ho\vever,
10 it is considerably difficult to incorporate a plurality of coil antennas into a device
having a limited circuit area such as an electronic money card, a credit card, or the
like.
[0027]
With the above in mind, in the information processing device 100 according
-
15 to an embodiment of the present disclosure, the two IC chips 120a and 120b are
connected to the single coil antenna 110 as shown it1 FIG. 1. In the information
processit~gd evice 100 according to an enlbodinlent of the present disclosure, the IC
chip 120a is connected to the opposite ends of the coil 111, and the IC chip 120b is
connected to one end of the coil 11 1 and a predetermined point between the opposite
20 ends of the coil 111, as shown in FIG. 1. In other words, the IC chip 120a is
connected to the coil 11 1 so that the IC chip 120a receives all power generated by the
coil 11 1. Meanwvhile, the IC chip 120b is connected to the coil 111 so that the IC
chip 120b receives a portion of the power generated by the coil 11 1.
[0028]
25 Thus, in the infornlation processing device 100 according to an enlbodiment
of the present disclosure, the IC chips 120a and 120b connected in parallel to the coil
antenna 110 receive different amoltnts of power from the coil 111. Tl~us,th e IC
chips 120a and 120b receive different amounts of power fron~ the coil 111, and
therefore, appropriate power can 'be supplied fsom the coil 111 according to
30 colnn~~tnicatiochna racteristics required for the respective IC chips 120a and 120b.
[0029]
Although, in thc cxa~llples hown in FIG. 1, the IC chip 120a is colulccted to
the opposite ends of the coil 11 1, and the IC chip 120b is co~lrlected to one end of the
coil 111 and a predeterllli~icd point between the opposite ends of the coil 111, the
prcsent disclosure is not limited to such an exanlple.
5 [0030]
r1.2. Advantageous Effect Examples]
For exanlple, assuming that the coil 111 is a thee-turn coil \vl~ere the
number of tunis is three, a case where the IC chips 120a and 120b are both connected
to the third turn of the coil 11 1 as sho\v~iln FIG. 5, and a case where the IC chip 120a
10 is connected to the third tun1 of the coil 111 while the 1C chip 120b is connected to
the second tur~l of the coil 111, are cotnpared to show that, in the i~lforlnatio~l
processing device 100 accordiag to an embodiment of the present disclosure,
appropriate power can be supplied fiom the coil 111 to the IC chips 120a and 120b
according to comtnut~icationc haracteristics required for the respective IC chips 120a
-
15 and 120b.
[003 11
Table 1 shows an exanlple in \vI~ich a case (case 1) where the IC chips 120a
and 120b are both connected to the third tul-11 of the coil 11 1 as show~iln FIG. 5, and
a case (case 2) \vl~eret he IC chip 120a is connected to the third turll of the coil 111
20 while the IC chip 120b is connected to the second turn of the coil 111 as showv~l in
FIG. 1, are co~nparedin ternis of a co~mllunicationc overage distance, in the presence
of the same nearby readerlwriter.
25 (Table 1: Co~nparisoo~fl communication coverage distance)
[Table 11
As s1101vn in Table 1, when the IC chips 120a and 120b are both connected
Case 1
Case 2
to the third turn of the coil 111 as shown in FIG. 5, the IC chip 120b has a
comtnunication coverage distance of 50 mm, aud the IC chip 120a has a
IC chip 120a
39 rmn
47 mm
IC chip 120b
50 lnln
47 tnnl
co~ll~ilut~icatciov~elr age distance of 37 mm. The difference in communication
coverage distance is caused by a difference it1 characteristics between the operating
circuits included in the IC chips 120a and 120b. Therefore, when the IC chips 120a
and 120b arc both connected to the third turn of the coil 111 as shown in FIG. 5,
5 power cannot be supplied to the IC chips 120a and 120b according to c o l ~ ~ ~ ~ ~ u ~ i i c a t i o ~ ~
charactcristics required for the respective IC chips 120a aud 120b. The reason why
power cannot be supplied to the IC chips 120a and 120b according to col~~n~u~~ication
characteristics required for the respective IC chips 120a and 120b, is that power
received by the IC chips 120a and 120b is uniquely deternii~ledb y characteristics of
10 the operatit~gc ircuits included in the IC chips 120a and 120b.
[0034]
Meanwhile, as shown in Table 1, when the IC chip 120a is connected to the
third turn of the coil 11 1 while the IC chip 120b is connected to the second turn of
the coil 111 as shown in FIG. 1, the IC chips 120a and 120b can both have a
-- -
15 communication coverage distance of 47 mm. In other words, in the information
processi~~dgev ice 100 according to an embodiment of the present disclosure, if the
IC chips 120a and 120b are connected to different poit~tso f the coil 11 1, power can
be appropriately supplied to the IC chips 120a and 120b accordit~gto cotnmunication
characteristics required for the respective IC chips 120a and 120b. Also, it1 the
20 information processing device 100 according to an embodiment of the present
disclosure, power can be appropriately supplied to the IC chips 120a and 120b
according to communication characteristics required for the respective IC chips 120a
and 120b, so that the comn~unication characteristics required for the respective IC
chips 120a and 120b connected to the coil antenna 110 can be satisfied.
25 [0035]
r1.3. Specific Structure Examples]
Next, a specific circuit structure example will be described it1 which the
information processing device 100 according to an embodirne~~otf the present
disclosure is incorporated into a card having a shape specified by a predeter~nined
30 standard.
[0036]
FIG. 2 is an illustrative diagram showing a specific circuit structure esa~ilplc
of tlie infortitation processing device 100 according to an embodiment of the present
disclosure. FIG. 2 sliows a circuit structure esaniple of the information pmcessing
device 100 in which the coil 11 1 that is a three-turn coil \vl~ereth e tlu~nbero f turns is
5 three is formed by etching. An IC card is formed by coveri~ig the iinfor~ilation
processing device 100 sl~owi~n lF IG. 2 with an outer material, such as a plastic card.
Alter~iatively, .the outer material may be the housings of other com~liunication
devices such as a nlobile telephone and a smartphone, in addition to a card.
[0037]
10 In the circuit example showv~il n FIG. 2, it is shown that the IC chip 120a is
connected to the third turn of the coil 111, and tlie IC chip 120b is connected to the
second turn of the coil 111. In other words, it can be seen that the itiforniation
processing device 100 can be implemented so that the IC chip 120a and tlie IC chip
120b are connected to different points of the coil 111, and the IC chips 120a and
--
15 120b connected in parallel to the coil antenna 110 receive different amoutits of power
from the coil 11 1.
[0038]
As to manufacture of IC cards including an IC chip, the position of the IC
chip is typically specified by a standard. For example, in tlie circuit example shown
20 in FIG. 2, the position of the IC chip 120b may be previously specified by a standard.
Even when the position of an IC chip is tlius previonsly determined, tlie inforn~ation
processitig device 100 can be implemented so that a plurality of IC chips are
connected to the coil antenna 110, and the IC chips 120a and 120b connected in
parallel to tlie coil antenna 1 10 receive different amounts of power from the coil 1 1 1.
25 [0039]
Also, when the coil 111 is formed by etching as sl~om~iini FIG. 2, then if
embossing is performed in order to print cliaracters on the IC card, tlie embossing
can be perfornied \vith the characters overlying the' coil portion. In particular, when
it is, for example, required that four rows of characters are printed by enlbossing in a
30 region 2 specified by JIS X 6302, such a requirement can be satisfied by the
inforniation processing device 100 having the circuit layout sho\vn in FIG. 2.
[0040]
Note that the circuit layout in which the coil 111 that is a three-tun1 coil
where the nuniber of turns is three is fornned by etching, is not linlited to that shown
in FIG. 2. Howevel; for cxanlple, if the coil 111 having the pattern shown in FIG. 2
5 is formed, only two crimping points 131 and 132 are required. Typically, an
increase in the number of crinlping points leads to a decrease in reliability of an
infortnation processing device that is incorporated into an IC card. However, the
infor~nationp rocessing device 100 shown in FIG. 2 can be i~nplc~nentesdo that the
IC chips 120a and 12013 connected in parallel to the coil antenna 110 receive different
10 amounts of power fionl the coil 11 1 without a decrease in reliability wvhich is caused
due to an increase in the nutnber of crimping points.
[0041]
Another specific circuit structure example of the information processing
device 100 according to an embodiment of the present disclosure will be described.
15 FIG. 3 is an illustrative diagram showing a specific circuit structure example of the
info~matio~plr ocessing device 100 according to an embodiment of the present
disclosure. FIG. 3 shows a circuit structure exatnple of the infor~nationp rocessing
device 100 in ~vhichth e coil 11 1 that is a three-turn coil where the number of turns is
three is provided it1 the form of a wire antenna.
20 [0042]
In the circuit example sho\vn in FIG. 3, the IC chip 120a is connected to the
third turn of the coil 11 1, and the IC chip 120b is connected to the second turn of the
coil 111. In other words, it can be seen that the infornlation processing device 100
can be implemented so that the IC chip 120a and the IC chip 120b are connected to
25 different points of the coil 11 1, and the IC chips 120a and 120b comiectcd in parallel
to the coil antenna 11 0 receive different amounts of power from the coil 11 1.
[0043]
Although FIGS. 2 and 3 sliow exanlples in which the infortnation
processing device 100 according to an embodi~nent of the present disclosure is
30 incorporated into a card having a shape specified by a predetermined standard, the
present disclosurc is not linlitcd to such an example. For example, when the
infomiation processing device 100 including a plurality of IC chips having a
contactless comtiiunication fit~ictiotii s incorporated into an electronic device such as
a ~iiobilete leplionc, a smartphone, or the like, the coil antenna 11 0 that is an antcnlla
fornled by etching as shown in FIG. 2 or FIG. 3, or a wire antenna, cat1 be employed.
5 [0044]
<2. Conclusion>
As described above, according to an etnbodi~nento f the present disclosure,
the information processing device 100 is provided in which a plurality of IC chips
having a contactless co~nniunicatio~fuin ction are colniected to a single coil antenna,
10 and the IC chips receive different anioutits of power from the coil of the coil antenna.
111 the inforniation processing device 100 according to an etnbodi~nento f the present
disclosure, power is appropriately supplied by the single coil antenna to each of the
plurality of IC chips. Specifically, in tlie infonnation processing device 100
according to an embodiment of the present disclosure, the different IC chips receive
15 different amounts of power generated by the coil as shown in FIG. 1.
[0045]
In the information processing device 100 accorditig to an embodime~lot f the
presetit disclosure, in order to allow the different IC cliips to receive different
amoutits of pourer generated by the coil, for example, the IC chip 120a is connected
20 to the opposite ends of the coil 11 1, and the IC chip 120b is connected to one end of
the coil 111 and a predetermined point between the opposite ends of the coil 11 1.
[0046]
In the information processi~igd evice 100 according to an enibodinient of the
present disclosure, the different IC cliips receive different atiiounts of power
25 generated by the coil, arid therefore, appropriate power can be supplied from tlie coil
to tlie IC chips accorditig to cotnniutiication characteristics required for the
respective IC chips. Also, a single coil antenna call be used to supply appropriate
power fro111 the coil to tlie IC cliips according to co~iiniunication characteristics
required for the respective IC cliips, and therefore, the inforniation processing device
30 100 according to an embodinlent of tlie present disclosure can be incorporated into a
stiiall-size device in which the circuit area is severely limited, such as a card or the
like.
[0047]
The infosnlation processing device 100 according to at1 enlbodi~ncnto f the
present disclosure can be produced by, for example, using the coil antenna 110
5 including the coil 11 1 which is a three-turn coil where the number of turns is three,
that is formed by etching, as shown in FIG. 2. If the coil antenna 110 is formed by
, etching as shown in FIG. 2, a plurality of IC chips can be incorporated into a device
into which the information processing device 100 according to an embodiment of the
present disclosure is incorporated, such as an IC card, without impairing the
10 flexibility of layout design.
[0048]
Similarly, the information processing device 100 according to an
embodiment of the present disclosure can be produced by, for exanlple, using the coil
antenna 110 including the coil 11 1 which is a three-turn coil where the number of
-
15 turns is thee, that is provided in the fo~mof a wire antenna, as shown in FIG. 3.
100491
The preferred embodiment(s) of the present disclosure hashave been
described above with reference to the accon~panying drawings, whilst the present
disclosure is not lin~itedto the above examples. A person skilled in the art may find
20 various alterations and nlodifications within the scope of the appended claims, and it
should be understood that they will naturally come under the technical scope of the
present disclosure.
[OOSO]
For exanlple, in the above embodiments, the IC chips 120a and 120b are
25 both connected to the sanle one end of the coil antenna 110. The present disclosure
is not limited to this example, if the different IC chips receive different amounts of
power generated by the coil. For example, one IC chip may be connected to the
opposite ends of the coil, and another IC chip may be connected to points in the
middle of turns of the coil instead of the opposite ends.
30 [0051]
In addition, the effects described in the present specification are merely
illustrativc and demonstrative, and not limitative. In other words, the technology
according to the present disclosure can exhibit otl~cre ffects that are evident to those
skilled in the art along wit11 or instead of the effects based on the present
specification.
5 [00521
Additionally, the present technology may also be configured as below.
(1)
An information processing device including:
a coil antenna configured to receive an external magnetic field and thereby
10 generate power; and
a first IC chip and a second IC chip each colinected it1 parallel to the coil
antenna at~dc onfigured to receive power supplied from tlie coil antetma,
wherein power received by the first IC cliip from the coil antetma is
different from power received by the second IC chip fiom the coil antemia.
~~ - -~
15 (2)
The information processing device according to (I),
wherein the first IC cliip receives power from a wl~oleo f the coil atltentia,
and the second IC chip receives power from a portion of the coil antenna.
(3)
20 The information processing device according to (2),
wherein tlie first IC chip is comlected to the coil antenna so that the number
of turns of the coil antenna for the first IC chip is greater than the number of tunis of
the coil antenna for the second IC chip.
(4)
The information processing device according to any of (1) to (3),
wherein the coil antelma is an etched antenna formed by etching.
(5)
The infomiation processing device accordi~igto (4),
wherein one of the first IC chip and the second IC chip is comlected to an
30 i~l~~ernipoosrtti on of the etched antenna.
(6)
Thc inforillatio~pl roccssi~lgd cvicc according to ally of (1) to (3),
\vherein the coil antemla is fornled of a wire.
(7)
The infornlation processing device accordi~lgto any of (I) to (6),
wherein a com~llunicationc haracteristic of the first IC chip is different fiotn
a co~ilnlunicationc haracteristic of thc second IC chip.
(8)
The information processing device according to (7),
wherein the comm~uiication characteristic is a distance \\ithi11 wliicli
10 co~umunicationis allo\ved when power is received from the coil antenna.
(9)
The information processing device according to any of (1) to (8),
wherein a connection point at one end of the coil antelma is cornnlon to the
first IC chip and the second IC chip.
A conunu~licationd evice including:
a coil antenna configured to receive an external magnetic field and thereby
generate power;
a first IC chip and a second IC chip each connected in parallel to the coil
20 atitemla and configured to receive power supplied from the coil antelma; and
an outer material configured to cover the coil antemla and the two or more
IC chips,
wherein power received by the first 1C chip from the coil antemla is
different from po~vcre ceived by the second IC chip from the coil antenna.
25
Reference Signs List
[0053]
100 information processing device
110 coil antelma
30 111 coil
120a, 120b IC chip

CLAIMS
Claim 1
An infor~llatiop~rlo cessit~gd evice comprising:
a coil antenna configured to receive an external ~nag~letfiice ld and thereby
5 generate power; and
a first IC chip and a second IC chip each connected in parallel to the coil
antenna and configured to receive power supplied from the coil antenna,
wherein power received by the first IC chip from the coil antenna is
different from power received by the seco~ldIC chip from the coil antenna.
10
Claim 2
The information processing device according to claim 1,
wherein the first IC chip receives power fiom a wvl~ole of the coil antenna,
and the second IC chip receives power fi-on1 a portion of the coil antenna.
Claim 3
The information processing device accordit~gto claim 2,
wherein the first IC chip is connected to the coil antenna so that the number
of turns of the coil antenna for the first IC chip is greater than the number of turns of
20 the coil antenna for the second IC chip.
Claim 4
The information processing device accordi~lgto claim 1,
wherein the coil antenna is an etched antenna formed by etching.
25
Claim 5
The information processing device according to claim 4,
wherein one of the first IC chip and the second IC chip is connected to at1
innermost portion of the etched antenna.
30
Claim 6
The inforn~ationp rocessing device according to claim 1,
wherein the coil antenna is formed of a wire.
Clai~i7l
5 The infor~llationp rocessing device accordi~lgto claim 1,
wherein a communication characteristic of the first IC chip is different fro111
a colii~ilunicationc haracteristic of the second 1C chip.
Clainl 8
10 The infornlation processing device according to clai1117,
wherein the comrnr~nication c11a1-acteristic is a distance witlun \vlvllic2l
conm~~~nicatiiso anl lon~ed\v 11en power is received fiorn tlie coil antelu~a.
Clain19
15 The.information processing device according to clai~nI ,
wherein a connection point at one end of the coil antenna is comlnon to the
first IC chip and the second IC chip.
20 A comm~~nicatiodne vice conll~rising:
a coil antenna configured to receive an external tnagnetic field and thereby
generate power;
a first IC chip and a second IC chi11 each colluected in parallel to the coil
antemla and carfigured to receive power sr~~~plfireomd the coil antenna; and
25 an outer material configured to cover the coil antenna and the two or more
1C chips,
~vl~ereipno wer received by the first IC chip fiotn the coil antenna is
different from power received by tlie seco~ldIC chip fionl the coil antenna.