Injection Molded Heat Dissipation Device

Abstract: Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.

Patent Information

Application #

Filing Date

10 July 2003

Publication Number

16/2007

Publication Type

INA

Invention Field

NO SUBJECT

Status

Email

Parent Application

Applicants

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA 95052,

Inventors

1. JOSEPH A. BENEFIELD

9603 REGENCY LOOP SE, OLYMPIA, WASHINGTON 98513,

Specification

Documents

Application Documents

#	Name	Date
1	695-MUMNP-2003-FORM 19(10-11-2003).pdf	2003-11-10
2	695-MUMNP-2003-FORM 3(14-11-2003).pdf	2003-11-14
3	695-MUMNP-2003-CORRESPONDENCE(14-11-2003).pdf	2003-11-14
4	abstract1.jpg	2018-08-08
5	695-MUMNP-2003-WO INTERNATIONAL PUBLICATION REPORT(10-7-2003).pdf	2018-08-08
6	695-MUMNP-2003-GENERAL POWER OF AUTHORITY(10-7-2003).pdf	2018-08-08
7	695-MUMNP-2003-FORM 5(10-7-2003).pdf	2018-08-08
8	695-MUMNP-2003-FORM 3(10-7-2003).pdf	2018-08-08
9	695-MUMNP-2003-FORM 2(TITLE PAGE)-(10-7-2003).pdf	2018-08-08
10	695-MUMNP-2003-FORM 2(COMPLETE)-(10-7-2003).pdf	2018-08-08
11	695-MUMNP-2003-FORM 2(10-7-2003).pdf	2018-08-08
12	695-MUMNP-2003-FORM 1(10-7-2003).pdf	2018-08-08
13	695-MUMNP-2003-DRAWING(10-7-2003).pdf	2018-08-08
14	695-MUMNP-2003-DESCRIPTION(COMPLETE)-(10-7-2003).pdf	2018-08-08
15	695-MUMNP-2003-CORRESPONDENCE(IPO)-(31-8-2009).pdf	2018-08-08
16	695-MUMNP-2003-CLAIMS(10-7-2003).pdf	2018-08-08
17	695-MUMNP-2003-ASSIGNMENT(10-7-2003).pdf	2018-08-08
18	695-MUMNP-2003-AFFIDAVIT(28-7-2003).pdf	2018-08-08