Description:FIELD OF INVENTION
[0001] The present invention is generally related to a cooling system for instrumental clusters, and more particularly to an instrument cluster to provide essential information to the rider while maintaining structural integrity and thermal management.
BACKGROUND OF INVENTION
[0002] Instrument clusters, also known as odometers, are crucial components in vehicles. They serve as the primary interface between the rider and the vehicle, displaying critical information like speed, distance traveled, fuel level, and indicator lights (turn signals, high beams). This real-time data is essential for rider awareness and safety.
[0003] However, the effectiveness of instrument clusters hinges on their clarity and visibility under various environmental conditions. A major challenge is overheating, particularly during hot weather and prolonged use. This overheating can lead to the formation of dark, degraded areas (black heat spots) on the Thin-Film Transistor (TFT) display, significantly impairing visibility and user experience.
[0004] Several factors contribute to instrument cluster overheating: 1) Increasing ambient temperatures: Climate change leads to higher overall temperatures, creating a challenging environment for electronics. 2) Internal heat generation: The instrument cluster itself generates heat. This internal heat contributes to the overall temperature rise within the cluster. 1) Direct sunlight: During peak sunlight hours, the heat from direct sun exposure adds to the internal heat generation, further raising the temperature within the cluster.
[0005] As a result of these factors, black heat spots can form on the TFT display, especially during prolonged use in hot conditions. These heat spots hinder visibility and can cause the display to appear dark and unclear, significantly reducing its functionality. This problem was identified through testing, highlighting the need for improved thermal management to ensure optimal TFT display visibility throughout the instrument cluster's lifespan.
[0006] The present specification recognizes the limitations of conventional instrument clusters and addresses the challenge of black heat spots. It proposes a novel cooling system integrated within the instrument cluster to maintain optimal operating temperatures and prevent the formation of these display-degrading heat spots.
[0007] Thus, in view of the above, there is a long-felt need in the industry to address the aforementioned deficiencies and inadequacies.

SUMMARY OF THE INVENTION
[0008] An instrument cluster to provide essential information to the rider while maintaining structural integrity and thermal management is provided substantially, as shown in and/or described in connection with at least one of the figures.
[0009] An aspect of the present disclosure relates to an instrument cluster for use with a vehicle. The instrument cluster includes a display panel; a top housing; a top panel; a plurality of photodiodes; a plurality of light guides; a printed circuit board (PCB); an inner heat sink plate; a bottom housing; a thermal pad; and an outer heat sink plate. The display panel is configured to emit readings and indications. The top panel is mounted on the top housing. The top panel is configured to protect the display panel from a plurality of external elements while allowing readings and indications to be visible to a rider. The photodiodes are configured to sense the intensity of light and adjust the brightness of the display panel as per ambient lighting brightness. The light guides are configured to direct an external light to the photodiodes. The printed circuit board (PCB) is located beneath the display panel and includes various hardware components to compute the readings and enable the display panel to emit the readings in real time. The display panel is configured to generate heat during the display of the reading and indications. The PCB generates heat during computations of the readings. The inner heat sink plate is configured to be placed between the display panel and the PCB. The bottom housing encloses the hardware components located below the PCB. The outer heat sink plate is connected to the inner heat sink plate through the thermal pad. The thermal pad transmits the heat to the outer heat sink plate. The inner heat sink plate and the outer heat sink plate are configured to dissipate heat generated by the display panel and the PCB to the surrounding environment, ensuring optimal temperature regulation.
[0010] In an aspect, the inner heat sink plate and the outer heat sink plate are constructed from aluminum.
[0011] In an aspect, the thermal pad/paste is present between the inner heat sink plate and the outer heat sink plate.
[0012] In an aspect, the thermal pad is compressed against the inner heat sink plate and the outer heat sink plate.
[0013] In an aspect, the top panel is transparent glass.
[0014] In an aspect, the display panel is a thin-film transistor (TFT) display.
[0015] In an aspect, the top housing is made of plastic.
[0016] In an aspect, the light guide is installed by creating a passage between the top panel and the top housing.
[0017] In an aspect, the readings comprise odometer readings, and indications comprise status of indicators, headlight status, and alarm indications.
[0018] In an aspect, the bottom housing includes an aperture in the bottom housing, which allows contact between the inner heat sink plate and the outer heat sink plate through an interface of the thermal pad.
[0019] One key advantage of this invention is its improved thermal management system. By utilizing heat sink plates constructed from aluminum and incorporating thermal pads, the invention facilitates efficient heat dissipation from the instrument cluster. This enhanced heat transfer reduces the risk of overheating and safeguards the lifespan of the delicate electronic components housed within the cluster.
[0020] Effective heat dissipation is crucial for ensuring the overall reliability and performance of electronic devices. This invention addresses this need by providing a robust thermal management solution. By preventing excessive heat buildup, the invention minimizes the risk of malfunctions or complete failures within the instrument cluster, leading to a more reliable user experience.
[0021] The optimized thermal management system offered by this invention contributes to improved energy efficiency. By maintaining optimal operating temperatures within the instrument cluster, the invention potentially reduces the overall energy consumption required for its operation. This translates to a more environmentally friendly design and potentially longer battery life for the vehicle.
[0022] These features and advantages of the present disclosure may be appreciated by reviewing the following description of the present disclosure, along with the accompanying figures wherein reference numerals refer to like parts.

BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings illustrate the embodiment of devices, systems, methods, and other aspects of the disclosure. Any person with ordinary skills in the art will appreciate that the illustrated element boundaries (e.g., boxes, groups of boxes, or other shapes) in the figures represent an example of the boundaries. In some examples, one element may be designed as multiple elements, or multiple elements may be designed as one element. In some examples, an element shown as an internal component of one element may be implemented as an external component in another and vice versa. Furthermore, the elements may not be drawn to scale.
[0024] Various embodiments will hereinafter be described in accordance with the appended drawings, which are provided to illustrate, not limit, the scope, wherein similar designations denote similar elements, and in which:
[0025] FIG. 1 illustrates an exploded view of an instrument cluster, in accordance with at least one embodiment.
[0026] FIG. 2 illustrates a perspective view of an inner heat sink plate, in accordance with at least one embodiment.
[0027] FIG. 3 illustrates a perspective view of an outer heat sink plate, in accordance with at least one embodiment.
[0028] FIG. 4 illustrates a perspective view of a highlighted area of the inner heat sink plate that is in contact with the display panel and conducts heat from a heat source of the display panel, in accordance with at least one embodiment.
[0029] FIG. 5 illustrates a perspective view of a highlighted area of the heat conducted by the inner heat sink plate that is further transferred to an endpoint that is in contact with the outer heat sink plate, in accordance with at least one embodiment.
[0030] FIG. 6 illustrates a perspective view of a heat flow in the inner heat sink plate and the outer heat sink plate, in accordance with at least one embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS HEREIN
[0031] The present disclosure is best understood with reference to the detailed figures and description set forth herein. Various embodiments have been discussed with reference to the figures. However, those skilled in the art will readily appreciate that the detailed descriptions provided herein with respect to the figures are merely for explanatory purposes, as the methods and systems may extend beyond the described embodiments. For instance, the teachings presented and the needs of a particular application may yield multiple alternative and suitable approaches to implement the functionality of any detail described herein. Therefore, any approach may extend beyond certain implementation choices in the following embodiments.
[0032] References to “one embodiment,” “at least one embodiment,” “an embodiment,” “one example,” “an example,” “for example,” and so on indicate that the embodiment(s) or example(s) may include a particular feature, structure, characteristic, property, element, or limitation but that not every embodiment or example necessarily includes that particular feature, structure, characteristic, property, element, or limitation. Further, repeated use of the phrase “in an embodiment” does not necessarily refer to the same embodiment.
[0033] The present invention aims to address the critical issue of black heat spots appearing on the Thin-Film Transistor (TFT) display of instrument clusters in two-wheeler vehicles. These black spots can significantly compromise rider safety and comfort by hindering the visibility of crucial information displayed on the cluster. The problem of instrument cluster overheating stems from a confluence of factors. Firstly, rising ambient temperatures due to climate change and other factors create a challenging thermal environment for the delicate electronic components housed within the cluster. Secondly, the instrument cluster itself generates heat to power its various functions. This internal heat dissipation contributes significantly to the overall temperature rise within the enclosed space of the cluster. Finally, during peak sunlight hours, especially in hot weather, direct sun exposure adds another layer of thermal stress. This additional heat source further exacerbates the temperature rise within the cluster, ultimately leading to the formation of detrimental black heat spots on the TFT display.
[0034] The formation of black heat spots on the TFT display is a consequence of these factors. These degraded areas significantly impair the display's clarity and readability, making it difficult for riders to access critical information like speed, fuel level, and warning lights. This lack of clear visibility can pose safety risks and hinder a rider's ability to make informed decisions while navigating the road.
[0035] Therefore, the objective of this invention is to develop a solution that effectively prevents the formation of black heat spots on the TFT display. By ensuring optimal thermal management within the instrument cluster under varying environmental conditions, this invention aims to guarantee clear and consistent display visibility. This will significantly enhance the user experience for riders by promoting safety, comfort, and improved situational awareness on the road.
[0036] FIG. 1 illustrates an exploded view of an instrument cluster (100) for use with a vehicle, in accordance with at least one embodiment. Examples of the vehicle include but are not limited to a two-wheeler electric vehicle and two-wheeler vehicle. The instrument cluster (100) includes a display panel (102); a top housing (104); a top panel (106); a plurality of photodiodes (108); a plurality of light guides (118); a printed circuit board (PCB) (110); an inner heat sink plate (112); a bottom housing (114); a thermal pad (120); and an outer heat sink plate (116). The display panel (102) is configured to emit readings and indications. In an embodiment, the readings include but are not limited to odometer readings, and indications include the status of the left indicator and right indicator, headlight status, and alarm indications. In an embodiment, the display panel (102) is a thin-film transistor (TFT) display. However, examples of the display panel (102) include but are not limited to displays based on LCD, and LED to visually present information such as speed, fuel level, engine temperature, odometer reading, turn signals, and warning indicators.
[0037] The top panel (106) is mounted on the top housing (104). In an embodiment, the top panel (106) is a transparent glass. In an embodiment, the top housing (104) is made of plastic. According to an embodiment herein, the top housing (104) is configured to provide structural support and enclose the instrument cluster (100) from the top side of the instrument cluster (100).
[0038] The top panel (106) is configured to protect the display panel (102) from a plurality of external elements (such as dust, dirt, physical impacts, chemicals, moisture, and liquids) while allowing readings and indications to be visible to a rider. The photodiodes (108) are configured to sense the intensity of light and adjust the brightness of the display panel (102) as per ambient lighting brightness. In an embodiment, the photodiodes (108) are light sensors that are placed on the PCB (110). The light guides (118) are configured to direct an external light to the photodiodes (108). In an embodiment, the light guide (118) is installed by creating a passage between the top panel (106) and the top housing (104). According to an embodiment herein, the light guides (118) are configured to direct an external light to a plurality of photodiodes (108), enabling the instrument cluster (100) to understand ambient lighting conditions for automatic brightness adjustment. Thus, the light guide (118) is crucial for guiding external light to the photodiode (108), which enables the cluster to understand the ambient lighting conditions for automatic brightness control and adjustment. The light guide (118) is installed by creating a passage between the top glass and the top housing.
[0039] The printed circuit board (PCB) (110) is located beneath the display panel (102) and includes various hardware components to compute the readings and enable the display panel (102) to emit the readings in real time. According to an embodiment herein, the PCB (110) contains all the necessary hardware components required for the functionality of the instrument cluster (100). In an embodiment, the PCB (110) is a physical platform that holds and interconnects all hardware components. The PCB (110) provides mechanical support and the necessary electrical pathways for signals and power. Examples of the hardware components include but are not limited to a microcontroller unit (MCU), sensors, power supply units, communication interfaces, and memory. These hardware components work together to ensure that the instrument cluster provides accurate, real-time information to the rider to enhance both safety and convenience. In an embodiment, the MCU processes input signals from sensors and controls the display of information. The MCU executes the software algorithms that interpret sensor data and manage the outputs. Examples of the sensors include but are not limited to a speed sensor, a fuel level sensor, and a temperature sensor. These sensors collect real-time data from various parts of the vehicle. For example, the speed sensor measures the speed of the vehicle, and the fuel level sensor monitors the amount of fuel in the tank. In an embodiment, the power supply units provide stable and regulated power to all the hardware components on the PCB. The power supply unit may convert the vehicle’s battery voltage to the required levels for different hardware components. In an embodiment, the communication interface facilitates communication between the instrument cluster and other electronic control units (ECUs) in the vehicle, such as the engine control unit or body control module. Examples of memory include but are not limited to flash memory, and EEPROM. In an embodiment, the memory stores the firmware that runs on the microcontroller and retains important data such as trip meters and odometer readings.
[0040] Heat generation in the display panel (102) and PCB (110) arises from several factors. The MCU processes data and controls various functions, consuming electrical power that is partially dissipated as heat. Power supply units, including voltage regulators and DC-DC converters, experience heat generation due to efficiency losses during power conversion. TFT displays generate heat primarily from the backlighting system and the TFT driver electronics. Drivers for high-current components, communication interfaces like CAN and LIN buses, passive components such as resistors and capacitors, TFT backlight, PCB traces, connectors, and inductive components like coils and transformers, all contribute to heat generation through power consumption and inefficiencies.
[0041] Thus, the display panel (102) is configured to generate heat during the display of the reading and indications and the PCB (110) generates heat during computations of the readings. The inner heat sink plate (112) is configured to be placed between the display panel (102) and the PCB (110). The bottom housing (114) encloses the hardware components located below the PCB (110). In an embodiment, the bottom housing (114) includes an aperture such as a small window in the bottom housing (114), which allows contact between the inner heat sink plate (112) and the outer heat sink plate (116) through an interface of the thermal pad (120). According to an embodiment herein, the bottom housing (114) protects the instrument cluster (100) from the bottom side of the instrument cluster (100).
[0042] The outer heat sink plate (116) is connected to the inner heat sink plate (112) through the thermal pad. In an embodiment, the thermal pad (120) is present between the inner heat sink plate (112) and the outer heat sink plate (116). In an embodiment, the thermal pad (120) is compressed against the inner heat sink plate (112) and the outer heat sink plate (116). The thermal pad (120) transmits the heat to the outer heat sink plate (116). The inner heat sink plate (112) and the outer heat sink plate (116) are configured to dissipate heat generated by the display panel (102) and the PCB (110) to the surrounding environment, and ensuring optimal temperature regulation. In an embodiment, the inner heat sink plate (112) and the outer heat sink plate (116) are constructed from aluminum. The use of aluminum leverages its excellent heat transfer properties to efficiently dissipate heat. Aluminum’s high thermal conductivity enables it to rapidly conduct and distribute heat away from the display panel (102). By incorporating the aluminum heat sink plate, heat generated by the instrument cluster is effectively absorbed and dissipated, preventing the formation of black heat spots on the display panel (102). Usage of the aluminum in the inner heat sink plate (112) and the outer heat sink plate (116) ensures optimal operating temperatures, enhancing visibility and performance for the rider.
[0043] FIG. 2 illustrates a perspective view of the inner heat sink plate (112), in accordance with at least one embodiment. FIG. 2 is explained in conjunction with FIG. 1. The inner heat sink plate (112) is mounted on the top housing (104) using four screws. The display panel (102) fits between the top housing (104) and the inner heat sink plate (112), eliminating the need for separate mountings previously required. The PCB (110) is then placed between the inner heat sink plate (112) and the bottom housing (114). In an embodiment, the PCB (110) has four mountings provision on the top housing (104).
[0044] To enhance heat dissipation and maintain optimal operating temperatures, the design incorporates both vertical and horizontal fins on the heat sink plates. Vertically oriented fins, or vertical ribs (202), are positioned at the bottom of the inner heat sink plate (112). These fins facilitate efficient heat transfer towards the thermal pad interface, ensuring that heat is effectively conducted to the outer heat sink plate (116) located between them. The thermal pad (120) serves as a highly conductive medium, transferring heat from the inner to the outer heat sink plate.
[0045] FIG. 3 illustrates a perspective view of an outer heat sink plate (116), in accordance with at least one embodiment. FIG. 3 is explained in conjunction with FIGS. 1-2. The bottom housing (114) is placed between the PCB (110) and the outer heat sink plate (116). The outer heat sink plate (116) also has four mounting provisions on the top housing (104). The outer heat sink plate (116) is mounted on the outer side of the bottom housing (114). There is a small window in the bottom housing (114), which allows contact between the inner heat sink plate (112) and the outer heat sink plate (116) through the thermal pad interface.
[0046] On the outer heat sink plate (116), horizontal fins, or horizontal ribs (302), are strategically placed to aid in dispersing heat across the bottom surface of the bottom housing (114). This configuration allows for efficient heat spread over a larger area. Subsequently, the heat is carried away by the airflow from the environment, promoting effective cooling and maintaining the device's optimal operating temperatures. This combination of vertical and horizontal fins ensures comprehensive thermal management, enhancing the overall efficiency and longevity of the system.
[0047] FIG. 4 illustrates a perspective view of the first highlighted area (402) of the inner heat sink plate (112) that is in contact with the display panel (102) and conducts heat from a heat source of the display panel (102), in accordance with at least one embodiment. FIG. 5 illustrates a perspective view of a second highlighted area (502) of the heat conducted by the inner heat sink plate (112) that is further transferred to an endpoint that is in contact with the outer heat sink plate (116), in accordance with at least one embodiment. FIGS. 4-5 are explained in conjunction with FIG. 1. In operation, heat generated by both the PCB (110) and display panel (102) transfers to the inner heat sink plate (112) made of aluminum, a material known for its excellent thermal conductivity. The inner heat sink plate (112), in direct contact with the display panel (102), conducts heat from both sources: via conduction from the display panel (102) and convection from the PCB (110).
[0048] FIG. 6 illustrates a perspective view of a heat flow (602) in the inner heat sink plate (112) and the outer heat sink plate (116), in accordance with at least one embodiment. FIG. 6 is explained in conjunction with FIGS. 2-3. Vertically oriented fins or vertical ribs (202) are provided at the bottom of the inner heat sink plate (112) to promote heat movement toward the thermal pad interface. The thermal pad efficiently conducts heat to the outer heat sink plate (116) positioned between them. Horizontal fins or horizontal ribs (302) are provided on the outer heat sink plate (116) to facilitate heat dispersion across the bottom surface of the bottom housing (114). Finally, airflow from the environment carries away the heat, promoting cooling and maintaining optimal operating temperatures.
[0049] As used herein, and unless the context dictates otherwise, the term “configured to” or “coupled to” is intended to include both direct coupling (in which two elements that are coupled to each other contact each other) and indirect coupling (in which at least one additional element is located between the two elements). Therefore, the terms “configured to”, “configured with”, “coupled to” and “coupled with” are used synonymously. Within the context of this document terms “configured to”, “coupled to” and “coupled with” are also used euphemistically to mean “communicatively coupled with” over a network, where two or more devices can exchange data with each other over the network, possibly via one or more intermediary device.
[0050] In one embodiment, the present invention provides a cooling system for an instrument cluster. The key features of the invention are related to the design of the light guide: the utilization of aluminum as an effective heat transfer medium, the design of two heat sink plates to efficiently dissipate heat, a mounting arrangement to ensure proper contact between the inner heat sink plate, PCB, and TFT display, fins on the inner heat sink plate for enhanced heat conduction towards the bottom, implementation of a thermal pad between the inner and outer heat sink plates for effective heat transfer, horizontal fins on the outer heat sink plate to distribute heat uniformly, and integration of atmospheric airflow to aid in heat dissipation and cooling.
[0051] The commercial applications and advantages of the present invention include improved thermal management through the use of aluminum Heat Sink Plates and a Thermal Pad, which enhances heat dissipation and reduces the risk of overheating. This contributes to the overall reliability and performance of electronic devices, minimizing malfunctions or failures due to excessive heat buildup. Additionally, the optimized thermal management helps maintain optimal operating temperatures, potentially reducing energy consumption and improving overall efficiency. The versatility of the heat sink plate design makes it suitable for various industries, while the potential cost savings associated with mitigating heat-related damage or component failure make it appealing to companies across different sectors. Motorcycle and automobile manufacturers, as well as companies specializing in automotive electronics and display technologies, could significantly benefit from this innovative technology.
[0052] It should be apparent to those skilled in the art that many more modifications besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the scope of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms “comprises” and “comprising” should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, utilized, or combined with other elements, components, or steps that are not expressly referenced.
[0053] No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.
[0054] It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the scope of the invention. There is no intention to limit the invention to the specific form or forms enclosed. On the contrary, the intention is to cover all modifications, alternative constructions, and equivalents falling within the scope of the invention, as defined in the appended claims. Thus, it is intended that the present invention cover the modifications and variations of this invention, provided they are within the scope of the appended claims and their equivalents.
, Claims:I/We claim:

1. An instrument cluster (100), comprising:
a display panel (102) configured to emit a plurality of readings and a plurality of indications;
a top housing (104);
a top panel (106) mounted on the top housing (104), wherein the top panel (106) is configured to protect the display panel (102) from a plurality of external elements while allowing the readings and the indications to be visible to a rider;
a plurality of light guides (118) configured to direct an external light to a plurality of photodiodes (108), wherein the photodiodes (108) are configured to sense the intensity of light and adjust the brightness of the display panel (102) according to ambient lighting brightness;
a printed circuit board (PCB) (110) located beneath the display panel (102) comprises a plurality of hardware components to compute the readings and enables the display panel (102) to emit the readings in real-time, wherein the display panel (102) is configured to generate heat during display of the reading and indications, wherein the PCB (110) generates heat during computations of the readings;
an inner heat sink plate (112) configured to be placed between the display panel (102) and the PCB (110);
a bottom housing (114) to enclose the hardware components located below the PCB (110);
a thermal pad (120);
an outer heat sink plate (116) connected to the inner heat sink plate (112) through the thermal pad, wherein the thermal pad (120) transmits the heat to the outer heat sink plate (116), wherein the inner heat sink plate (112) and the outer heat sink plate (116) are configured to dissipate heat generated by the display panel (102) and the PCB (110) to the surrounding environment, and ensuring optimal temperature regulation.

2. The instrument cluster (100) as claimed in claim 1, wherein the inner heat sink plate (112) and the outer heat sink plate (116) are constructed from aluminum.

3. The instrument cluster (100) as claimed in claim 1, wherein the thermal pad (120) is present between the inner heat sink plate (112) and the outer heat sink plate (116).

4. The instrument cluster (100) as claimed in claim 1, wherein the thermal pad (120) is compressed against the inner heat sink plate (112) and the outer heat sink plate (116).

5. The instrument cluster (100) as claimed in claim 1, wherein the top panel (106) is a transparent glass.

6. The instrument cluster (100) as claimed in claim 1, wherein the display panel (102) is a thin-film transistor (TFT) display.

7. The instrument cluster (100) as claimed in claim 1, wherein the top housing (104) is made of plastic.

8. The instrument cluster (100) as claimed in claim 1, wherein the light guides (118) are installed by creating a passage between the top panel (106) and the top housing (104).

9. The instrument cluster (100) as claimed in claim 1, wherein the readings comprise odometer readings, and indications comprise status of indicators, headlight status, and alarm indications.

10. The instrument cluster (100) as claimed in claim 1, wherein the bottom housing (114) comprises an aperture in the bottom housing (114), which allows contact between the inner heat sink plate (112) and the outer heat sink plate (116) through an interface of the thermal pad (120).