Description:RELATED APPLICATION
[0001] The present application claims priority to U.S. Non-Provisional Patent Application No. 17/482,056 filed on 22 September 2021 and titled “INTEGRATED MEMS RESONATOR AND METHOD” the entire disclosure of which is hereby incorporated by reference.

Technical Field
[0002] Embodiments described herein generally relate resonators for timing in electronic devices such as computing systems.

Background
[0003] Commonly, resonators are used in timing circuits that work in conjunction with processors and other semiconductor dies in electronic devices. However, resonators are typically coupled to a circuit board adjacent to an associated semiconductor die. It is desired to have smaller and less expensive resonators.

Brief Description of the Drawings
[0004] FIG. 1 shows an electronic device having a resonator die in accordance with some example embodiments.
[0005] FIG. 2 shows another electronic device having a resonator die in accordance with some example embodiments.
[0006] FIG. 3 shows a flow diagram of a method of manufacture of a resonator in accordance with some example embodiments.
[0007] FIG. 4A-4C show intermediate steps of a method of manufacture of a resonator in accordance with some example embodiments.
[0008] FIG. 5A-5B show intermediate steps of a method of manufacture of a resonator in accordance with some example embodiments.
[0009] FIG. 6A-6C show intermediate steps of a method of manufacture of a resonator in accordance with some example embodiments.
[0010] FIG. 7 shows a system that may incorporate an electronic device having a resonator die and methods, in accordance with some example embodiments.

Description of Embodiments
[0011] The following description and the drawings sufficiently illustrate specific embodiments to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. Portions and features of some embodiments may be included in, or substituted for, those of other embodiments. Embodiments set forth in the claims encompass all available equivalents of those claims.
, Claims:1. An electronic device, comprising:
a processor die coupled to a substrate;
a microelectromechanical systems (MEMS) resonator die located within the substrate, and below the processor die; and
one or more vias coupled between the processor die and the MEMS resonator die, the one or more vias passing through a portion of the substrate.