FIELD OF INVENTION:
The present invention in general relates to electronic devices. The present
invention in particular relates to a hybrid cooling system for cooling computer
systems.
DESCRIPTION OF THE RELATED ART:
The most critical components for any computing device are its processing
components. These electronic sensors/processors/controllers are the condensed
form of huge circuitry which can span over millions of transistor/diodes and other
elements all laid out in a very small circuit pattern. Because of this immense
compression the heat generation due to the flow of electricity in the circuit
increases exponentially_ too: This results in increased heat efflux into the circuit
embodiment which, if not removed can lead to serious implications, like
computational errors, misinterpretation or even physical degradation of the
processor/sensor. The computing breakdown can occur when heat is not removed
properly and can result in the digital logic devices incorrectly registering the
logical zero or logical one. If the temperature rises over a particular threshold,
then physical degradation can result in breakdown of the processor which is
irreversible. It can be due to melting of connection leads in the circuitry or the
entire semiconductor structure.
There are many ways to eliminate this heat and the most common is to create a
cold room. But the old rooms are very costly to maintain and handle. Also cold
rooms cannot be worth the investment for personal computer users which use
mobile devices like laptops. Another way is to reduce the clock speed or the
operating limit of the processor. · This can be effective to reduce heat but it
seriously reduces the operating capabilities of the processor and can have serious
effects on performance of the system.
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The most used method for cooling the processor is cooling it via air flow. While,
this method is effective to a certain limit but, it is sometimes not enough to cool
the processor adequately. The cooling capabilities of this method depend on the
ambient air temperature and cannot be cooled below the air temperature. For
example, the processor cannot be cooled further than 45 degrees Celsius if the
ambient air temperature is not lower than 35 degrees because of the
thermodynamic heat transfer properties of elements involved.
US Patent No. 6,999,316 provides a liquid cooling system and apparatus including
a heat transfer unit and a heat exchange unit. The heat transfer unit is capablt: of
attachment to a processor and dissipates heat from the processor. The heat
exchange unit is in communication with the heat transfer unit and cools heated
liquid communicated from the heat transfer unit. The heat transfer unit is-directly
coupled to the heat exchange unit through a conduit without any additional
intermediate components.
Publication No. US5606341 (A) describes a system to passively cool a CPU, and
conducting the CPU-generated heat to the LCD, where the heat is dissipated and
used to warm the LCD permitting normal display function at low ambient
temperatures. The system includes a CPU-surrounding housing connected by
flexible tubes to a radiator-like honeycombed element adjacent the LCD, and a
coolant that circulates passively between the housing and the radiator.
Publication No. CN203433456 (U) provides a . water-cooling heat dissipation
device for a notebook computer. The water-cooling heat dissipation device
comprises a water pump, a pipeline, a mai.n board internal power source, a heat
sink, a foldable support frame and heat absorption devices, and is characterized in
that one heat absorption device is arranged on each of the central processing unit
. .
and the display card both of the notebook ·computer; heat dissipation liquid in the
heat sink is communicated with the heat absorption devices through the water
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pump and the pipeline, and then returns to the heat sink through the pipeline to
form a heat dissipation loop.
US Patent No. 9,010,141 provides a system and method to cool the CPU, the
server and the data center with liquid in an optimal manner, by cooling the CPU to
reduce leakage current, removing heat from the data center by means of the air
cooled portion of the CPU heat exchanger, and utilizing an outdoor evaporAtive
cooling system or dry cooler with part time evaporative cooling system that
eliminates the need for a chiller in the liquid cooling system.
US Patent No. 7,499,278 describes a method a system dissipate heat from an
electronic device to provide an efficient and universally applied thermal solution
for high heat generating electronic devices. The apparatus· comprises an
evaporator, a condenser, a heater and conduits. The evaporator, condenser, and
conduits define a closed system that has an interior volume which is partially
filled with a liquid coolant.
Some companies provide the liquid cooling for laptop and ali-in-one PCs for
improving acoustic and thermal performance in a notebook without increasing the
form factor. It allows better utilization of the thermal modules used to cool the
CPU and GPUs.
The article entitled "Closed loop liquid cooling for high performance computer
systems" talks about the closed. loop liquid cooling for high performance
computer systems. It describes the design and ·attributes of an advanced liquid
cooling system that can cool single or multiple heat sources within the computer
system. The cooling system described use copper cold plates with meso scale
· channels to pick up heat from CPU and GPU type heat sources and highly
efficient liquid-to-air heat exchangers with flat copper tubes and plain fins to
transfer the heat to air by forced convection. A water based coolant is used for
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high thermal performance and additives are used to provide burst protection to the
cooling system at temperatures down to -40oC and corrosion protection to critical
components [Sukhvinder Kang, et. al.; Proceedings of IPACK2007 ASME Inter
PACK '07 July 8-12, 2007}.
In view of the prior art, there is a need for a system to dissipate processor heat and
can be deployed within the small space available in the case or housing of a
computing system, such as a laptop computer, standalone computer etc.
Therefore, in order to overcome the problems with existing computer and laptop
cooling device, the present invention provides a liquid cooling system which
sptificantly improves laptop cooling effect and overcomes the Jack of air-cooling
series or water cooling system .
OBJECTS OF THE INVENTION:
The principal object of the present invention is to provide a liquid cooling system
that works in conjunction with air cooling system housed internally within the
laptop or computer.
Another object of the present invention is to provide a laptop or computer cooling
system which provides high performance cooling under a variety of operating
conditions.
Yet another object of the present invention is to provide a laptop or computer
cooling system which is compact in size.
Still another object of the present invention is to provide a laptop or computer
cooling system which is leak-free and low in power consumption.
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Another object of the present invention is to provide a laptop or computer cooling
system which is inexpensive and light weight.
SUMMARY OF Tllli INVENTION:
The present invention provides a laptop or computer cooling system comprising a
liquid cooling system which works in conjunction with air cooling system housed
internally within the laptop or computer system to take heat away from the
processor and vent it to the surroundings. The system dissipates heat from main
processor (CPU) and Graphics processor unit (GPU), to the ambient surroundings
with the help of conductional and convectional heat transfer methods. The use of
liquid coolant helps in increasing the efficiency of the cooling procedure and
maintains the ability to over clock the processor without compromising the
physical conditions of the hardware. The liquid flows into a closed loop which
passes through a heat transfer unit clamped to the processor to facilitate the flow
of heat from processor to an atomizing chamber where it thermodynamically loses
some heat and changes to mist form (vapor-liquid). This mist is then transferred to
a radiator where it loses the remaining heat and the returns to a liquid state
· without the need of a condenser/evaporator. The liquid is stored temporarily in a
reservoir and then fed again in the loop.
In a preferred embodiment of the present invention, the system comprises a
heat transfer unit (HTU) capable of clamping on top of the processor/graphics
processor unit; a heat exchange unit for expulsing the heat from liquid coolant to
surroundings and an ultrasonic atomizing chamber, capable of changing liquid
coolant to mist state.
In another embodiment of the present invention, a thermal compound is used
in between the processor and HTU to enhance the heat transfer efficiency by
· removing microscopic air pockets between the two surfaces with the introduction
ofheat conducting material. TheHTU is then attached to a conduit which takes
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the heated liquid to a pump impeller which propels the liquid further to an
atomizing chamber and then to a radiator. The cooled liquid is then stored in a
reservoir to pump it further into a loop.
In yet another embodiment of the present invention, the radiator is placed
outside the laptop or computer by the means of a docking station while being
connected to the laptop or computer by a series of detachable connections placed
on the periphery of the body/housing of the laptop or computer.
In still another embodiment of the present invention, a dual closed loop cycle
runs from single reservoir to both CPU and GPU with individual radiating heat
expulsion units and separate atomizing chambers.
·In another embodiment of the present invention-, the atomizing chamber is
fitted on top of an external heat transfer unit located away from the laptop or
computer in form of a table top docking station with independent power supply
and connection terminals for laptop or computer.
In yet another embodiment of the present invention, in the closed cycle, the
coolant first starts from the reservoir and pumped using a pump to the first HTU
where it flows through the cavity and extracts heat from the processor making it
cooler in return. The heated liquid then goes to a heat exchange unit where forced
convection is used to reduce the temperature of the coolant. Ambient air is then
flowed through a thin-fin radiator which results in cooling of the liquid by means
of heat transfer by forced convection. The coolant then flows towards the GPU
arid the second HTU where it takes heat from the GPU and makes it cooler in the
process. The coolant then flows towards the Ultrasonic Transducer Atomizing
Chamber (UTAC) where rapid oscillation of the ultrasonic transducer affects the
liquid coolant physically and forces it to turn into a liquid-vapour state, called.
This results in rapid cooling of the coolant without any condenser. The mist then
IPO DELHI 10-12-2015 17:os
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flows towards the radiator unit and after condensing into fully liquid state it then
travels to the reservoir via efflux of the heat exchange unit.
In still another embodiment of the present invention, the pump comprises an
impeller connected to a spindle. The pump cavity is made from the conduit walls.
The pump cavity is made inside the piping system with a bearing joint built in to
base of the cavity. A high rotating motor is connected to the spindle by the
bearing joint.
In another embodiment of the present invention, the pump and driving motor
can be in a single composite casing or as a single unit instead of two detachable
units.
In yet another embodiment of the present invention, the coolant reservoir
comprises a reservoir cavity made of tubing wall. The liquid coolant coming from
heat exchange unit is stored temporarily in to reservoir before being transferred to
intake of the pump one. This temporary storage is essential to remove all/any
bubbles which may have arose after the atomizing chamber. Also it provides the
pump with adequate supply in case of any misbalance in loop.
In still another embodiment of the present invention, a pressure sensor is
attached inside the reservoir to detect any pressure drop relative to a leakage. In
case of leakage detection, it may override loop control and shut down all pumps.
Additionally, 'a solenoid valve is provided on either sides of the reservoir to block
access of fluid/leakage after pressure drop is detected.
In another embodiment of the present invention, the ultrasonic transducer
atomizing chamber includes an intake and an output. The ultrasonic transducer is
covered in a water proof enclosure to protect it from liquid coolant.
IPO DELHI 10-12 2015 17 OS
-9~
In yet another embodiment of the present invention, the ultrasonic transducer
atomizing chamber may be mounted on top of an external heat exchange unit
outside the laptop or computer inside a docking station which can be connected to
the laptop or computer mainframe.
BRIEF DESCRIPTION OF THE DRAWINGS:
It is to be noted, however, that the appended drawings lllush ate only typical
embodiments of this invention and are therefore not to be considered for
limiting of its scope, for the invention may admit to other equally effective
embodiments.
Figure 1 illustrates an overall cooling system composite which can be deployed
inside a laptop or computer housing;
Figure 2 illustrates the first heat transfer unit (HTU);
Figure 3 illustrates the side view of the first HTU;
Figure 4 illustrates the side view of the pump;
Figure 5 illustrates the top view of the pump;
Figure 6 illustrates the coolant reservoir used to create a buffer volume of the
liquid coolant;
Figure 7 illustrates the ultrasonic transducer atomizing chamber (UTAC);
Figure 8 illustrates the second heat exchange unit.
DESCRIPTION OF THE PREFERRED EMBODIMENTS:
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Accordingly, the present invention provides a compound single unit closed loop
system for cooling laptop or computers, comprising liquid coolant in conjunction
with air cooling system; a heat transfer unit (HTU) which is clamped on top of the
processor/graphics processor unit; a heat exchange unit for expulsing the heat
from liquid coolant to surroundings; and an ultrasonic atomizing chamber,
. capable of changing liquid coolant to mist (vapor-liquid) state.
According to preferred embodiment of the invention, a separate cooling conduit is
used for both GPU and CPU providing each with independent means of cooling
and circulating Jiquid coolant. The atomizing chamber is fitted on top of an
external heat transfer unit located away from the laptop or computer in form of a
table top docking station with independent power supply and connection terminals
for laptop.
Referring to fig. 1-8, particularly fig. 1 which shows an overall system composite
deployed into a laptop or computer housing 100. The housing includes a
motherboard 101. The motherboard has connection terminals for various
components like CPU 102 and GPU 103. The motherboard implemented in this
invention may vary in size or dimension or both. The processor and GPU 103 are
· connected to a heat transfer unit 104 with the means of clamping devices 110 to
hold them into a locked position:, arresting any relative motion between processor
and HTU. Threaded nut-bolts are used at 112 and 211 to keep HTUs in place. The
HTU consists of a cavity 107 through which the liquid coolant flows to exchange
heat from processor.
The HTU 104 is manufactured from a material selected from metal or non~metal
or metal-non-metal composite, whichever can be used to conduct heat in best
possible way. It should also be appreciated that the size of the processor and the
HTU 104 cart be same or different. For example, the HTU 104 can be larger than .
IP.-0 DELH-I--ro -12-2015 17:05..-
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the processor top. Also the location of the processor can be different from the one
shown in this embodiment.
An input 109 is built into the HTU 104 along with an output denoted by 1 19. The
points109/1 19 leads to a detachable tubing system leading to exterior of the
housing 100. The output 119 is connected to the input 209 of the first heat
exchange unit 105A which uses forced cuiivt:l:tion to exchange heat. Now, from
theefflux 219 it goes to the intake ofthe second HTU 106 placed on top of the
GPU 103. From·here it goes through 219A [209A=input of 106, 219A=output of
106] to the intake 109D for the ultrasonic transducer atomizing chamber (UTAC)
415 from where, it exits via 119D to the second pump's 302B intake at 109B2 and
through 119B2 goes to radiator or the second HTU 105 at intake 109A. From the
efflux point 119A it then leads to intake 1 09C of the reservoir 222. Leaving from·
119C, it then goes to the firscpump 302 in the closed loop through 1 09B and then
to the intake 109 of the first HTU at the processor.
According to figure 12, the second HTU denoted by 106 is placed at GPU 103. It
consists of cavity 107 and input 209A and output 219A.
Now, in the closed cycle, the coolant first starts from the reservoir and is pumped
by the pump 302 to the first HTU. The coolant flows through the cavity 107 and
gains heat from the processor making it cooler in return. This heated liquid then
goes to a heat exchange unit IOSA where forced convection is used to reduce the
temperature of the coolant. Ambient air is flowed through a thin-fin radiator 105A
by the means of a high rotational speed centrifugal fan 330. This results in cooling
of the liquid by means of heat transfer by forced convection. From here, the
coolant exits from 219 and flows towards the GPU 103 and the second HTU 106.
Flowing into the cavity 107, it gains heat from the GPU and again makes it cooler
in the process. The coolant then exits from 219A and flows towards the UTAC
415 where rapid oscillation of the ultrasonic transducer affects the liquid coolant
400 physically and forces it to tum into a liquid-vapor state, also called
IPO D~LHI 10-12-2015 -
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mist. This is a thermodynamically endothermic process because of which the
temperature of the liquid-vapor drops by several degrees Celsius. This results in
rapid cooling of the coolant without any condenser. The mist 401 then flows
towards the radiator unit 105. From here, after condensing into fully liquid state it
then travels to the reservoir 222 via efflux of the heat exchange unit 119A.
Referring to fig. 2, the HTU 104 is secured in place with the clamp 110 which Is
held together with the help of nut and bolt at holes 112. The HTU 104 consists of
an intake 109 which is welded securely at point 201A to provide a leak proof
connection. Similarly, efflux 119 is welded securely at point 201B. The HTU is
used to transfer the heat from· processor top to the liquid coolant. It may be
appreciated that the HTU can be different in size or dimensions or both than the
one referred in this invention. Also, the HTU can be larger than the processor:-The·
primary role of the clamp 110 is to provide a firm contact between HTU and the
processor top plate so that heat can be conducted effectively.
Referring to fig. 3, the first HTU 104 comprises a cavity I 07 through which the
liquid coolant flows. The cross section of the cavity 1 07 is slightly ( ~5%) larger
than the intake 109 and output 119, to reduce the flow velocity of the liquid
coolant by a very small factor so that it gets more time to exchange heat to the
processor. The HTU 104 is made of the conductive material walls 113. It may be
appreciated here that the material used to make the heat transfer block can be any
material of substantial heat conduction properties without any or very low loss in
transmission/conduction. The HTU 104 is placed directly on the processor 102
with the help of the clamp 110. A thermal compound is used to cover the
microscopic air pockets which arise between the HTU 104 and the processor's top
plate. Since, air is a bad conductor of heat; the thermal compound helps to transfer
the heat from the processor to the HTU 104 effectively without creating insulating
air pockets.
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Referring to fig. 4 & 5, the pump one consists of an impeller 310 which is
connected to the spindle 308. The pump cavity 302 is made from the conduit
walls 313. The pump cavity is made inside the piping system with a bearing joint
309 built in to base of the cavity 302. A high rotating motor 300 is connected to
the spindle 308 by the bearing joint 309. When the motor rotates, it rotates the
spindle 308 which in turn spins the impeller 310. Due to this rotation of the
impe1ler, the fluid flows from 109M to llYM. The cross section of the condull
enlarges from 109M to cavity 302 and then further reduces to 119M. This
provides an enlarge space in to which an impeller can be placed. The impeller 310
is connected at spindle 308 which rotates the impeller to move the fluid from
109M to 119M. It may be appreciated that the pump displayed here in the
invention can have a different form also for example, instead of in-line pump as
shown here, a detachable pump can also be used which can be connected-at point
109M and 119M-(This is intake/outtake of first pump, now shown in drawing]. In
one embodiment, the pump and driving motor may be in a single composite
casing or as a single unit instead oftwo detachable units as shown in the figure.
Also, fig. 10 shows details of second pump 302B placed between the UT AC and
the second radiator 105. It consists of intake point 109B2 and output point 119B2.
FIG. 6 illustrates the coolant reservoir 222 which is used to create a buffer volume
of the liquid coolant. It is made by securely welding input 1 09C and 119C at the
· points 201 to create a leak proof seal. The reservoir 222 consists of a reservoir
cavity 220 made by the tubing wall 225. The liquid coolant coming from heat
exchange unit 105 is stored temporarily in reservoir 222 before being transferred
to intake of the pump one 109M. This temporary storage is essential to remove
all/any bubbles which may have arose after the atomizing chamber. Also it
provides the pump with adequate supply in case of any misbalance in loop. A
pressure sensor is attached to the inside of the reservoir to detect any pressure
drop relative to a leakage. In case of any leakage it may override loop control and
shut down all pumps. Additionally, a solenoid valve is provided on either sides of
IPO DELHI 10-12-2015 17 :·a-s-
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the reservoir to block access of fluid/leakage after pressure drop detection. The
exterior of the reservoir 222 is coated with an anti-condensation coating. The
body of the reservoir 222 is made from the same material used in the conduit.
Referring to fig. 7, the ultrasonic transducer atomizing chamber (UTAC) 415
comprises an intake 109D and output 1 l9D. The mist chamber 420 is made from
the same material used in the conduit. The exterior of the chamber 420 is wvered
with an anti- condensation coating 419 and a thin layer of insulation. Inside the
chamber 420, there is an ultrasonic transducer 405 which is covered in a water
proof enclosure 407 which protects the transducer from liquid coolant. The
electrical connections 410 exit the chamber 420 from the bottom and run along to
the sid:_ of_ UTAC. This UTAC can be mounted on top of an external heat
exchange unit outside the laptop inside a docking station which can beconnected
to the laptop mainframe.
The ultrasonic transducer 405 is an electrical device which vibrates a diaphragm
plate attached to it at frequency of over 20000 Hertz when provided with
electricity. When liquid coolant 400 flows over the diaphragm, its molecules
undergo rapid oscillation of 20000 Hertz which causes change in the physical
form of the· liquid and changes it from incompressible liquid to liquid-vapor
(mist). The particles of the mist are microscopic liquid droplets of the order 0.5
. microns in diameter. This change in the physical state of the coolant produces an
endothermic reaction which rapidly cools the coolant in process. This process
eliminates the need of a compressor which requires more energy and more space.
With the use ofUTAC there are no moving parts in the chamber which may cause
vibration and noise and hence, require further anti-vibrational mountings. The
mist 401 now exits through 119D and goes to second heat exchange unit 105.
Fig. 8 shows the second heat exchange unit 105 which is similar to the heat
exchange unit 1 05A and differs only in the location of the unit. It comprises
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surrounding the thin fins 515 of the radiator from top and bottom while
making a loop around it. A high speed centrifugal fan 330 is used to force the
ambient air 508 through the fins 515 to cool the fins by forced convection. The
resulting hot air 528 flows outside the housing 100 of the laptop. The fins are
soldered to the conduit to increase the heat transfer. lt may be noted here that the
size of the fins or the dimensions or both may be different from the representation
dependmg upon the factors llkt! ht::at tn:llt~fer coefficient or ambient air
temperature or the positioning of the fan of the laptop.
In one embodiment of the present invention, this heat exchange unit can be
installed in an external housing in the form of docking station. The heat exchange
unit can be connected to the laptop or computer via the docking station with the
help of detachable coupling located in the conduit. In heafexchange unit 105, the
liquid-vapor coolant comes from the UTAC by intake 1 09A .. While flowing
through the conduit, the heat is transferred from the liquid to the fins via the
conduit from where it gets transferred to the ambient air. During this process the
coolant gets further cooled and changes back to liquid form due to the absence of
the ultrasonic vibration. The cooled liquid is then transferred to the reservoir 222
via the efflux 119A. From the reservoir 222, the liquid coolant is further pumped
in to a closed loop to cool the system.
Numerous modifications and adaptations of the system of the present
invention will be apparent to those skilled in the art, and thus it is intended
by the appended claims to cover all such modifications and adaptations
which fall within the true spirit and scope of this invention.
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WE CLAIM:
1. A liquid cooling system for cooling laptop or computer system comprises
liquid coolant; a heat transfer unit (HTU) 104 clamped on top of the processor
(CPU)/graphics processor unit (GPU); one or more heat exchange unit for
expulsing the heat from liquid coolant to surroundings; an ultrasonic
atomizing chamber disposed on top of heat exchange unit and away from any
possible fluid contact, capable of changing liquid ~.:uulant to mi3t :Jtatei a
reservoir for creating a buffer volume of the coolant; one or more fluid
conduits for transporting the fluid through the heat transfer units to both CPU
and GPU; and one or more pumps to transfer the fluid within the closed loop
system.
2. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein the heat transfer unit and the heat exchange unit are deployed
in a single unit within the system.
3. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein a thermal compound is used in between the processor and
HTU 104 to enhance the heat transfer efficiency by removing microscopic air
pockets between the two surfaces with the introduction of heat conducting
material.
· 4. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein a radiatods placed outside the laptop or computer by the
means of a docking station while being connected to the laptop or computer
by a series of detachable connections placed on the periphery of the
body/housing of the laptop or computer.
5. The liquid cooling system for cooling laptop or computer s~tase clamim ~d in
· claim 1, wherein the pump cavity is made from the conduit
. ~·
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walls and comprises an impeller connected to a spindle which m turn is
connected to a rotating motor by the bearing joint.
6. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein the pump and driving motor can be in a single composite
casing or as a single unit instead of two detachable units.
7. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein the reservoir includes a pressure sensor to detect any
pressure drop relative to a leakage and a solenoid valve on either sides ofthe
reservoir to block access of fluid/leakage after pressure drop is detected.
8. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein one or more cooling fans are disposed in the system housing
to circulate ambient air.
9. The liquid cooling system for cooling laptop or computer system as claimed in
claim 1, wherein the heat exchange unit 105 includes thin fins to dissipate heat
in to surrounding by forced convection.
10. A liquid cooling system as set forth in claim 11 wherein liquid coolant is
.selected from the group comprising pure distilled water; di-isopropyl alcohol
base; and ethylene glycol base