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Light Emitting Diode Downlight Luminaire

Abstract: Described herein is a light-emitting diode (LED) downlight luminaire comprising of guiding grooves (301 Aa,301 Ab) formed inside a housing body (101) for holding a printed circuit board (PCB) driver (102), wherein the guiding grooves (301Aa,301Ab) are being formed longitudinally at diametrically opposite points aligned with an inner surface of the housing body (101). A metal core printed circuit board (MCPCB) with LEDs (104), having a rectangular shape with curved transverse sides is mounted on a top surface of a heat sink component (103) and a connection lock (501) is provided on the top surface of the MCPCB with LEDs (104), wherein the connection lock (501) is being provided for establishing a detachable electrical connection of the MCPCB with LEDs (104) with lockable connection pins (112) of the PCB driver (102) positioned beneath the heat sink component (103). The LED downlight luminaire 100 provides for the best output of light with an innovative design concept.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
10 September 2019
Publication Number
11/2021
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
dewan@rkdewanmail.com
Parent Application
Patent Number
Legal Status
Grant Date
2024-03-15
Renewal Date

Applicants

OVERDRIVE ELECTRONICS PVT. LTD
C-121 Hosiery Complex Phase-II Extension, Noida, G. B. Nagar 201305, U.P, India

Inventors

1. MOHIT MITTAL
A39, Sector 39, Noida, India.
2. MANISH PANDEY
C-121 Hosiery Complex Phase-II Extension, Noida, G. B. Nagar 201305, U.P, India.

Specification

TECHNICAL FIELD
[0001] The present disclosure, in general, relates to a luminaire and, in particular, relates to a luminaire that produces light using light-emitting diodes (LEDs).
BACKGROUND
[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] Light-emitting diode (LED) devices are more efficient than most forms of widely used lamps, for example, incandescent, high-intensity discharge (HID) light sources, and the like. One advantage of using LED devices is that LEDs are more efficacious than incandescent light and more efficacious than some fluorescent and low wattage HID light sources. Another advantage of LED device usage is that the LEDs may be configured as low voltage, low energy devices. Another advantage of the LED devices is that of the longer life when compared to other light forms.
[0004] Along with these advantages, one perceived disadvantage with the traditional LED devices is that the pricing of the LED devices is set in the premium range due to a high capital cost of production. Subsequently, the difficulty is encountered in the assembly of the individual components which further creates delays in mass production of such devices. In addition to the above, nowadays there is a large market demand for LED devices in the market due to the rising cost of expenses associated with the use of electrical devices. The traditional LED lights presently available in the market also do not have multiple mounting options. Therefore, one of the primary challenges in fully commercializing LED device is the optimization of the overall cost without

compromising the highest quality and design requirements and an increase in the operating efficiency of the LED luminaire in a cost-effective manner.
[0005] Therefore, there is a need for such a device or such an LED device which can overcome the above-described limitations and obtain maximum operating efficiency in a cost-effective manner which is unique in its design and exhibits prime quality.
OBJECTS OF THE DISCLOSURE
[0006] Some of the objects of the present disclosure, which at least one embodiment herein satisfy, are listed hereinbelow.
[0007] It is a general object of the present disclosure to ensure a cost-effective operation of a LED down-light luminaire.
[0008] It is another object of the present disclosure to provide for an enhanced light output which does not harm the eyes upon an exposure.
[0009] It is another object of the present disclosure to provide for multiple mounting options in a LED down-light luminaire.
[0010] It is another object of the present disclosure to provide for an expedited and reduced time involved in the mass production of a LED down-light luminaire.
[0011] It is another object of the present disclosure to provide for ease in assembly of the different components of a LED down-light luminaire.
[0012] These and other objects and advantages of the present invention will be apparent to those skilled in the art after a consideration of the following detailed description taken in conjunction with the accompanying drawings in which a preferred form of the present invention is illustrated.

SUMMARY
[0013] This summary is provided to introduce concepts related to downlight luminaire having light-emitting diodes. The concepts are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
[0014] In an embodiment, the present disclosure relates to a light-emitting diode (LED) downlight luminaire comprising of guiding grooves formed inside a housing body for holding a printed circuit board (PCB) driver, wherein the guiding grooves are being formed longitudinally at diametrically opposite points aligned with an inner surface of the housing body. Further, comprising of a metal core printed circuit board (MCPCB) with LEDs capable of emitting variable colors which have a rectangular shape with curved transverse sides and is mounted on atop surface of a heat sink component. Further, a connection lock (501) provided on the top surface of the MCPCB, wherein the connection lock (501) is being provided for establishing a detachable electrical connection of the MCPCB with lockable connection pins of the PCB driver positioned beneath the heat sink component.
[0015] In an aspect of the invention, a polyethylene terephthalate (PET) reflector sheet is fixed on the top surface of the MCPCB in such a way that the PET reflector sheet hides electrical circuits of the MCPCB while making the LEDs at the center of the MCPCB visible.
[0016] In another aspect of the invention, the PET reflector sheet has a truncated cone shape with two parallel open ends.
[0017] In another aspect of the invention, the housing body comprises a bottom circular base protruding perpendicular to form cylindrical walls up to an open-top surface.

[0018] In another aspect of the invention, the heat sink component comprises a guiding hole on the bottom surface so as to ensure proper alignment with a guiding stand formed on the bottom circular base of the housing body.
[0019] In another aspect of the invention, the MCPCB includes a guiding hole which is aligned with the guiding hole of the heat sink component, so that the heat sink component along with MCPCB is able to align with the guiding stand formed on the bottom circular base of the housing body.
[0020] In another aspect of the invention, the LED downlight luminaire as comprises a diffuser rigidly fixed on guiding slots provided in the open-top surface of the housing body.
[0021] In another aspect of the invention, the housing body is composed of polybutylene terephthalate (PBT) material.
[0022] In an aspect, the housing body is composed of an electrically insulated polybutylene terephthalate (PBT) material.
[0023] In an aspect, the PCB driver is a high power factor (HPF) driver, low power factor (LPF) driver and Device on Board (DOB) driver.
[0024] In another aspect of the invention, the diffuser is composed of polycarbonate (PC) material.
[0025] In another aspect of the invention, the MCPCB board comprises a color-changing lamp capable of emitting variable colors.
[0026] In an aspect, the LED downlight luminaire includes an electrical connector connecting power supplying insulated wires with the PCB driver.

[0027] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.
[0028] It is to be understood that the aspects and embodiments of the disclosure described above may be used in any combination with each other. Several of the aspects and embodiments may be combined to form a further embodiment of the disclosure.
[0029] The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The illustrated embodiments of the subject matter will be best understood by reference to the drawings, wherein like parts are designated by like numerals throughout. The following description is intended only by way of example, and simply illustrates certain selected embodiments of devices, systems, and methods that are consistent with the subject matter as claimed herein, wherein:
[0031] FIG. 1 illustrates an exploded view of the light-emitting diode (LED) downlight luminaire, in accordance with an exemplary embodiment of the present disclosure;
[0032] FIG. 2 illustrates an orthogonal view of a polybutylene terephthalate (PBT) housing body of the LED downlight luminaire, in accordance with an exemplary embodiment of the present disclosure

[0033] FIGS. 3A-3B illustrate an orthogonal view of narrow guiding grooves inside the PBT housing body, in accordance with an exemplary embodiment of the present disclosure;
[0034] FIG. 4 illustrates an orthogonal view of an aluminum insert of the LED downlight luminaire, in accordance with an exemplary embodiment of the present disclosure;
[0035] FIG. 5 illustrates an orthogonal view of a metal core printed circuit board of the LED downlight luminaire, in accordance with an exemplary embodiment of the present disclosure;
[0036] FIG. 6 illustrates an orthogonal view of a polyethylene terephthalate (PET) reflector of the LED downlight luminaire, in accordance with the present disclosure;
[0037] FIG. 7 illustrates an orthogonal view of a polyethylene terephthalate (PET) reflector of the LED downlight luminaire, in accordance with an embodiment of the present disclosure;
[0038] FIG. 8 illustrates an orthogonal view of a polycarbonate diffuser, in accordance with an embodiment of the present disclosure;
[0039] FIG. 9A-9B schematically illustrate a process of assembling different components of the LED luminaire, in accordance with an exemplary embodiment of the present disclosure;
DETAILED DESCRIPTION
[0040] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover

all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
[0041] As used in the description herein and throughout the claims that follow, the meaning of "a," "an," and "the" includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of "in" includes "in" and "on" unless the context clearly dictates otherwise.
[0042] The present disclosure aims to solve a technical problem of improving the assembly convenience of a light-emitting diode (LED) downlight luminaire or device or the like designed in such a way that it comprises of multiple mounting options and increases the operating efficiency in a cost-effective manner.
[0043] For heat management in LED devices, most of the manufacturers have used aluminum core circuit boards onto which LEDs are surface mount soldered. However, such aluminum core boards have limited surface area to dissipate heat. Also, the LED devices cannot be easily interchanged to either replace defective units or to change the product colour.
[0044] In order to reduce the effect of this detrimental energy, heat sinks are attached to the LED devices. The heat sinks provide a means for removing the energy from the LED device through convection and radiation of the heat energy away from the LED device. Accordingly, the energy loss from a heat sink occurs through natural convection, forced convection, or radiation. The effectiveness of the heat sink in pulling energy away from the LED device is dependent on the ability to spread or dissipate the heat generated from what is often a small source over a larger area so that it can be removed through the flow of air over the surface or by radiation to the environment.
[0045] In effect, as long as the heat generated by the LED devices to be cooled can be effectively spread over a larger surface, the effectiveness of the heat sink is primarily dependent on the amount of available surface area. Whether the material is a conductor

throughout its body or just on the surface does not affect its ability to transfer heat to the environment.
[0046] Heat management in the LED devices that are becoming smaller, lighter, and more compact is an ever-increasing challenge. Historically, the heat sinks used to dissipate the energy have been made of metals such as zinc, aluminum, or copper, and can be either machined, cast or extruded. Because the heat sinks are made of metal, the heat sinks are often heavy. As the LED devices become smaller and the need to reduce part weight and cost increases, alternative methods to control heat must be found. Furthermore, since the LED devices are electrical conductors, the attachment of heat sinks to the LED devices requires modifications to the heat sink so that electrical circuitry providing either signals or power can be provided without shorting such electrical circuitry to the metal heat sink.
[0047] Further, along with heat management, it becomes necessary that the device is cost-effective, easy to assemble and capable of mass production in order to meet the large market demands as compared to the conventional LED luminaire devices available in the market.
[0048] To address this, the present disclosure provides an LED downlight luminaire 100 as shown in FIG. 1, in accordance with an exemplary embodiment. The LED luminaire 100 can be easily converted to a conventional utility fixture using Incand.
[0049] FIG. 1 provides a perspective view of the complete set of assembly of a LED downlight luminaire 100 with an insight into the interconnection between the components of the LED downlight luminaire 100 thereby providing clarity and understanding.
[0050] As shown in FIGS.1& 2, the LED downlight luminaire 100 comprises of an electrically insulated polybutylene terephthalate (PBT) housing body (101, 200), having a lower conductivity up to 2w/m-k with complete electrical insulation properties, formed

into a cylindrical shape comprising of a bottom circular base protruding perpendicular to form cylindrical walls up to an open-top surface.
[0051] On the bottom circular base as shown in FIG. 3 A a pair of guiding grooves 301Aa, 301Ab are formed inside a housing body 101 for holding a printed circuit board (PCB) driver 102, wherein the guiding grooves 301a,301b are being formed longitudinally at diametrically opposite points aligned with an inner surface of the housing body 101.
[0052] Further, as can be seen in FIG. 1 a guiding stand 110 is formed adjacent to the guiding groove on the bottom circular base of the housing body 101 for an efficient assembly of the components of the LED downlight luminaire 100. This arrangement is to protect a printed circuit board (PCB) driver 102 from getting damaged and is suitable for a connector based design which thereby reduces the overall time associated with the assembling of the LED downlight luminaire 100.
[0053] FIG. 3B illustrates the details of the top open surface 301Ba of the housing body 101 wherein the top open surface 301Ba is curved to match with the consol depending upon its location of usage. This curved shape surface 301Ba also provides the complete device LED downlight luminaire 100 a fascinating look which is not yet present in the LED luminaires currently available in the market. Further, ribs are formed on the curved surface so as to provide strength to the top open surface 301Ba of the LED downlight luminaire.
[0054] FIG.4 shows an orthogonal view of a heat sink component 103 which is composed of aluminum comprising of a hole 401 at the center and a guiding hole 402 on the bottom surface so as to ensure proper alignment with the guiding stand 110 formed on the bottom circular base of the housing body 101.
[0055] The heat sink component 103 as shown in FIG.l is insert molded inside the
cylindrical housing body 101. The aluminum heat sink component 103 has a cylindrical

profile matching with the internal profile of the housing body 101. The heat sink component 103 has an open end 404a towards the first open end 301Aa of the housing body 101 and a closed-end 302
[0056] resting on the internal rib 110 above the bottom circular base of the plastic housing body 101.
[0057] With such configuration of the housing body 101 and the aluminum heat sink component 103, good heat transfer occurs from LED luminaire 100 to the outer surface for further heat dissipation to the ambient. Also, on the surface of the closed 404b of the aluminum heat sink component 103, internal holes 403a,403b are formed at the diametrical opposite ends to match with connecting points of a metal core printed control board (MCPCB) 104 illustrated in FIG. 5. Such internal holes provide ease of assembly of an MCPCB with LEDs 104 within the heat sink component 103. In an example, the housing body 101 has a cutout diameter of 3 inches.
[0058] Further, as illustrated in FIG. 5 the MCPCB with LEDs 104/500 includes a rectangular-shaped plate having curved transverse sides, mounted on a top surface of a heat sink component 103 and locking a PCB driver 102 with an interior surface of the closed end 404b of the aluminum heat sink component 103. The rectangular-shaped plate of an MCPCB with LEDs 104 further comprises of a connection lock 501 provided on the top surface of the MCPCB with LEDs 104 for the purpose of establishing a detachable electrical connection of the MCPCB with LEDs 104 with lockable connection pins 112 of the PCB driver 102 positioned beneath the heat sink component 103. In an example, the material used for the composition of the MCPCB with LEDs 104 is a special grade aluminum with thermal conductivity of 2W/m-k.
[0059] The PCB driver 102 held by the MCPCB with LEDs 104 is connected to a power supply source (not shown in figures) with an input cable wire 901a. In an

alternative example, the input cable wire 901a may be connected to a CFL or bulb for receiving power supply through a conventional utility fixture.
[0060] Further as illustrated in FIGS. 1, 4 & 5, on an interior surface of the closed end, 404b of the aluminum heat sink 103, a metal core printed circuit board (MCPCB) with LEDs 104 for mounting of LEDs are mounted and connected to the PCB driver 102 for receiving driving current from the power supply source.
[0061] Once the MCPCB with LEDs 104 is mounted over and connected to the PCB driver 102 it is locked inside the aluminium insert component 103 through a connection lock 501 provided on the top surface of the MCPCB with LEDs 104 for establishing a detachable electrical connection of the MCPCB with LEDs 104 with lockable connection pins 112 of the PCB driver 102 positioned beneath the heat sink component 103. The MCPCB with LEDs 104 is fixed on the open end 404a of the heat sink component 103 with the further tightening of screws as illustrated in FIG. 1 and FIG. 9b.
[0062] Further, as illustrated in FIG. 1 along with FIGS.6 & 7, a polyethylene terephthalate (PET) reflector sheet 105 is fixed on the top surface of the MCPCB 104 in such a way that the PET reflector sheet 105 hides electrical circuits of the MCPCB with LEDs 104 while making the LEDs at the center of the MCPCB with LEDs 104 visible. The PET reflector sheet 105 has a truncated cone shape with two parallel open ends such that the lumen is enhanced by reducing reflection losses and thus contributing to an increase in the operating efficiency of the LED downlight luminaire 100. The composite material of the PET reflector sheet 105 is polyethylene terephthalate which is a plastic suitable for high temperatures. However, in another embodiment, any other similar plastic material sheet suitable at high temperatures can be used for the composition of the reflector sheet 105.
[0063] Once the PET reflector sheet 105 is fixed inside the housing body 101, a diffuser 106, as illustrated in FIG. 1 and FIG. 8, is mechanically locked and rigidly fixed

on guiding slots 111 provided on the open top surface of the housing body 101. The diffuser 106 is composed of a special grade polycarbonate (PC) material such that the LED downlight luminaire 100 doesn't pose any harm upon direct exposure to the eyes and comprises of a locking profile which provides for a tight locking assembly.
[0064] As shown in FIG. 1, a pair of metal springs with plastic cover 107,108 are provided for facilitating the multiple mounting options in the LED downlight luminaire 100.
[0065] In another embodiment, a LED downlight luminaire comprises of a PCB driver-based MCPCB with LEDs 104 with a power capacity of 5-12W.
[0066] In another embodiment, a LED downlight luminaire comprises of an inbuilt PCB driver-based MCPCB with LEDs 104 with a power capacity of 5-9W.
[0067] Although the construction of the LED luminaire 100 is described above in detail, assembling of the LED luminaire 100 as illustrated in FIG.9A and 9B initiates with the inserting of an input cable wire 901a into a hole 310 protruding from the base surface of the housing body 101.
[0068] PCB driver 102 is inserted into the guiding grooves 301 Aa, 301Ab in a vertical position followed by the mounding of a heat sink component 103 over a guiding stand 110 within the housing body 101.
[0069] Thereafter, a metal core printed circuit board (MCPCB) with LEDs 104 is connected and locked with the PCB driver 102 by mounting on the interior surface of open end of the heat sink component 103 through a connection lock 501 provided on the top surface of the MCPCB with LEDs 104.
[0070] Thereafter, fixing a reflector sheet 105 as shown in FIG. 9B is connected and fixed inside the housing body 101 and on the top surface of the MCPCB with LED 104.

The fixing of the reflector sheet 105 is then followed by locking of the top open surface 201a of the housing body 101 by fixing a diffuser 106 in the guiding slots 111 provided at the four diametrical opposite ends along the surface of the top edge of the cylindrical wall of the housing body 101.
[0071] The LED downlight luminaire 100 is more advanced & more cost-effective, easy to assemble, easy to mass-produce to meet large market requirements, and easy to mount on LED-based lamps with multiple mounting options and fixtures in comparison to the conventional type of LED devices & fixtures.
[0072] The special-shaped heat sink component 103 would be able to transfer the heat more effectively. This is possible due to the combination of highly conductive aluminum (Al) or similar metal having conductivity above 205 w/m-K and an electrically insulated housing made of plastic material like polybutylene terephthalate (PBT) having a lower conductivity up to 2W/m-k but with complete electrical insulation properties. The combination of the two parts, i.e., metal and plastic, molded or assembled together is so designed to optimize the material's cost, manufacturing costs, thermal management, application, meeting ANSI dimensional requirements, and manufacturing process, based on various materials and designs of the heat sink.
[0073] The LED downlight luminaire 100 provides for best output of light with an innovative design concept on the basis of high grade composite material, shape and new design concept and has the main advantages of ease of assembly,multiple driver mounting options, availability of standard material used in its composition of the components and availability in Alternate Current (AC)/Direct Current (DC) and Device of Board (DOB) configurations.
[0074] The LED luminaire 100 of the present disclosure has applications in agriculture lighting, commercial & industrial lighting, animal confinement, tunnels,

corridor, walkways, refrigerators, freezers, kitchen hoods and the area where vapor-tight are required.
[0075] Further, it will be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its scope.
[0076] Furthermore, all examples recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor(s) to furthering the art and are to be construed as being without limitation to such specifically recited examples and conditions. Also, the various embodiments described herein are not necessarily mutually exclusive, as some embodiments can be combined with one or more other embodiments to form new embodiments.
[0077] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.
Reference Numerals

Reference Numeral Description
100 LED Downlight luminaire

101 Housing Body
102 PCB Driver
103 Heat sink component
104 MCPCB with LEDs
105 Reflector sheet
106 Diffuser
107 Metal spring with plastic cover
108 Metal spring with plastic cover
109 Metal Screws
110 Guiding stand
111 Guiding slots
112 Connection Pins
200 Housing Body
201a Top open surface
301a Guiding groove
301b Guiding groove
302,902a Electrical connector

310 A hole for input cable wire
400 Heat sink component
401 Central Hole
402 Guiding hole
403a, 403b Internal holes
500 MCPCB
501 Connection Lock
600 Reflector sheet (after inserting in heat sink)
700 Reflector sheet (before inserting in heat sink)
800 Diffuser
901a Input cable wire

We Claim:
1.A light-emitting diode (LED) downlight luminaire (100) comprising:
guiding grooves (301 Aa,301 Ab) formed inside a housing body (101) for holding a printed circuit board (PCB) driver (102), wherein the guiding grooves (301Aa,301Ab) are being formed longitudinally at diametrically opposite points aligned with an inner surface of the housing body (101);
a metal core printed circuit board (MCPCB) (104) with LEDs, having a rectangular shape with curved transverse sides, mounted on a top surface of a heat sink component (103); and
a connection lock provided on the top surface of the MCPCB (104), wherein the connection lock (501) is being provided for establishing a detachable electrical connection of the MCPCB (104) with lockable connection pins (112) of the PCB driver (102) positioned beneath the heat sink component (103).
2. The LED downlight luminaire (100) as claimed in claim 1, further comprising a polyethylene terephthalate (PET) reflector sheet (105) fixed on the top surface of the MCPCB (104) in such a way that the PET reflector sheet (105) hides electrical circuits of the MCPCB (104) while making the LEDs at the center of the MCPCB (104) visible.
3. The LED downlight luminaire (100) as claimed in claim 2, wherein the PET reflector sheet (105) has a truncated cone shape with two parallel open ends.
4. The LED downlight luminaire (100) as claimed in claim 1, wherein the housing body (101) comprises a bottom circular base protruding perpendicular to form cylindrical walls up to an open-top surface.

5. The LED downlight luminaire (100) as claimed in claim 4, wherein the heat sink component (103) comprises guiding hole (402) on a bottom surface so as to ensure proper alignment with a guiding stand (110 ) formed on the bottom circular base of the housing body (101).
6. The LED downlight luminaire (100) as claimed in claim 5, wherein the MCPCB (104) includes a guiding hole (402) which is aligned with the guiding hole (402) of the heat sink component (103), so that the heat sink component (103) along with MCPCB (104) is able to align with the guiding stand (110) formed on the bottom circular base of the housing body (102).
7. The LED downlight luminaire (100) as claimed in claim 6, further comprises a diffuser (106) rigidly fixed on guiding slots (111) provided in the open-top surface of the housing body (101).
8. The LED luminaire (100) as claimed in claim 1, wherein the LED downlight luminaire (100) comprises an electrical connector (302) connecting power supplying insulated wires (901a) with the PCB driver (102).
9. The LED downlight luminaire (100) as claimed in claim 1, wherein the housing body (102) is composed of an electrically insulated polybutylene terephthalate (PBT) material.
10. The LED downlight luminaire (100) as claimed in claim 6, wherein the PCB driver (102) is a high power factor (HPF) driver, low power factor (LPF) driver and Device on Board (DOB) driver.
11. The LED downlight luminaire (100) as claimed in claim 1, wherein the diffuser (106) is composed of polycarbonate (PC) material.

12. The LED downlight luminaire (100) as claimed in claim 1, wherein the
MCPCB (104) board comprises of a color-changing lamp emitting variable colours.

Documents

Application Documents

# Name Date
1 201911036267-IntimationOfGrant15-03-2024.pdf 2024-03-15
1 201911036267-STATEMENT OF UNDERTAKING (FORM 3) [10-09-2019(online)].pdf 2019-09-10
2 201911036267-FORM FOR SMALL ENTITY(FORM-28) [10-09-2019(online)].pdf 2019-09-10
2 201911036267-PatentCertificate15-03-2024.pdf 2024-03-15
3 201911036267-FORM FOR SMALL ENTITY [10-09-2019(online)].pdf 2019-09-10
3 201911036267-AMENDED DOCUMENTS [08-11-2022(online)].pdf 2022-11-08
4 201911036267-FORM 18 [10-09-2019(online)].pdf 2019-09-10
4 201911036267-FORM 13 [08-11-2022(online)].pdf 2022-11-08
5 201911036267-MARKED COPIES OF AMENDEMENTS [08-11-2022(online)].pdf 2022-11-08
5 201911036267-FORM 1 [10-09-2019(online)].pdf 2019-09-10
6 201911036267-POA [08-11-2022(online)].pdf 2022-11-08
6 201911036267-FIGURE OF ABSTRACT [10-09-2019(online)].jpg 2019-09-10
7 201911036267-RELEVANT DOCUMENTS [08-11-2022(online)].pdf 2022-11-08
7 201911036267-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [10-09-2019(online)].pdf 2019-09-10
8 201911036267-FORM 13 [02-08-2022(online)].pdf 2022-08-02
8 201911036267-EVIDENCE FOR REGISTRATION UNDER SSI [10-09-2019(online)].pdf 2019-09-10
9 201911036267-DRAWINGS [10-09-2019(online)].pdf 2019-09-10
9 201911036267-POA [02-08-2022(online)].pdf 2022-08-02
10 201911036267-DECLARATION OF INVENTORSHIP (FORM 5) [10-09-2019(online)].pdf 2019-09-10
10 201911036267-RELEVANT DOCUMENTS [02-08-2022(online)].pdf 2022-08-02
11 201911036267-COMPLETE SPECIFICATION [10-09-2019(online)].pdf 2019-09-10
11 201911036267-FER.pdf 2021-10-18
12 201911036267-FER_SER_REPLY [06-09-2021(online)].pdf 2021-09-06
12 abstract.jpg 2019-09-21
13 201911036267-FORM 3 [06-09-2021(online)].pdf 2021-09-06
13 201911036267-Proof of Right (MANDATORY) [04-10-2019(online)].pdf 2019-10-04
14 201911036267-FORM-26 [04-10-2019(online)].pdf 2019-10-04
14 201911036267-OTHERS [06-09-2021(online)].pdf 2021-09-06
15 201911036267-Correspondence-091019.pdf 2019-10-12
15 201911036267-Power of Attorney-091019.pdf 2019-10-12
16 201911036267-OTHERS-091019.pdf 2019-10-12
17 201911036267-Power of Attorney-091019.pdf 2019-10-12
17 201911036267-Correspondence-091019.pdf 2019-10-12
18 201911036267-OTHERS [06-09-2021(online)].pdf 2021-09-06
18 201911036267-FORM-26 [04-10-2019(online)].pdf 2019-10-04
19 201911036267-FORM 3 [06-09-2021(online)].pdf 2021-09-06
19 201911036267-Proof of Right (MANDATORY) [04-10-2019(online)].pdf 2019-10-04
20 201911036267-FER_SER_REPLY [06-09-2021(online)].pdf 2021-09-06
20 abstract.jpg 2019-09-21
21 201911036267-COMPLETE SPECIFICATION [10-09-2019(online)].pdf 2019-09-10
21 201911036267-FER.pdf 2021-10-18
22 201911036267-DECLARATION OF INVENTORSHIP (FORM 5) [10-09-2019(online)].pdf 2019-09-10
22 201911036267-RELEVANT DOCUMENTS [02-08-2022(online)].pdf 2022-08-02
23 201911036267-DRAWINGS [10-09-2019(online)].pdf 2019-09-10
23 201911036267-POA [02-08-2022(online)].pdf 2022-08-02
24 201911036267-FORM 13 [02-08-2022(online)].pdf 2022-08-02
24 201911036267-EVIDENCE FOR REGISTRATION UNDER SSI [10-09-2019(online)].pdf 2019-09-10
25 201911036267-RELEVANT DOCUMENTS [08-11-2022(online)].pdf 2022-11-08
25 201911036267-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [10-09-2019(online)].pdf 2019-09-10
26 201911036267-POA [08-11-2022(online)].pdf 2022-11-08
26 201911036267-FIGURE OF ABSTRACT [10-09-2019(online)].jpg 2019-09-10
27 201911036267-MARKED COPIES OF AMENDEMENTS [08-11-2022(online)].pdf 2022-11-08
27 201911036267-FORM 1 [10-09-2019(online)].pdf 2019-09-10
28 201911036267-FORM 18 [10-09-2019(online)].pdf 2019-09-10
28 201911036267-FORM 13 [08-11-2022(online)].pdf 2022-11-08
29 201911036267-FORM FOR SMALL ENTITY [10-09-2019(online)].pdf 2019-09-10
29 201911036267-AMENDED DOCUMENTS [08-11-2022(online)].pdf 2022-11-08
30 201911036267-PatentCertificate15-03-2024.pdf 2024-03-15
30 201911036267-FORM FOR SMALL ENTITY(FORM-28) [10-09-2019(online)].pdf 2019-09-10
31 201911036267-IntimationOfGrant15-03-2024.pdf 2024-03-15
31 201911036267-STATEMENT OF UNDERTAKING (FORM 3) [10-09-2019(online)].pdf 2019-09-10

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