After the mold 80 is released from the coating frlm 142a on the base member 40, the coating film l42a is subjected to main baking, for example, il an oven 34, as depicted in Fig. 3(f. The hydroxyl group and the like contained in the coating film 142a is desorbed or eliminated by the main bakíng to further harden (solidifi) the coating film 142a. It is preferred that the main baking be performed at tempeÉtures of 200 to 1,200'C for about 5 minutes to about 6 hours. In such a manner, the coating film 142a is cured, and the concave-convex structure layer 142 havtng the concave-convex pattem 142p which coresponds to the concave-convex pattern ofthe mold 80 is obtained. In this situation, the coating film 142a is amorphous, crystalline, or in a mixture state of the amorphous and the crystalline, depending on the baking temperature and baking time. Fufiher, when a material, which generates an acid or alkali by iradiation with light such as ultraviolet rays, is added to the sol-gel material, a step of curing the coating fi'm 142a, in which the coating film 1 42a made of the sol-gel material is cured by irradiation with energy rays represented by ultraviolet rays such as excimer IIV light, may be included in tJre concave-convex pattem transfer process. [0095] After the coating film 142a is cured to form the concave-convex structure layer 142, the resist 20 and the concave-convex structure layer 142 on the resist 20 are stripped and removed as depicted in Fig. 3(g). The resist 20 is stripped by using any resist stripping liquid. As described above, the concave-convex structure layer 142 having a desired concave-convex pattem 142p is formed on the base member 40 by the liftoff method. [0096f Instead ofthe liftoff method, the concave-convex skucture layer 142 canbe formed on the base member 40 by the UV curing method. The UV curing method can be used when the concave-convex structüe layer is formed by using a ffV curable resin, a so1-gel material containing a photoacid generator or the like. In the following, the case in which the concave-convex struchrre layer is formed by using the IJV curable resin will be explained as an example witl reference to Fig. 4. Instead of the IIV curable resin, it is allowable to use, for example, the sol-gel material to which the photoacid ++ generator such as hexafluorophosphate aromatic sulfonium salt which generates acid by light is added; the sol-gel material to which B-diketone represented by acet¡rlacetone which forms chemical modifrcation (cheiation) which can be removed by being inadiated with light is added; and the like. Further, it is allowable that the concaveconvex struchne layer 142be formed of a resin which can be cured by an active energyray other than the UV light, and the resin be irradiated with the active energy ray other than the IfV üght, instead of being irradiated with the UV light. [0097] At first, as depicted in Fig. 4(a), the cleaned base member 40 is coated with a IJV curable resin 142b. It is allowable to perform a surface treatment or provide an easy-adhesion layer on the base member 40 in order to improve an adhesion property, and to provide a gas barrier layer in order to keep out moisture and gas such as oxygen. As a coating method of the UV curable resin, it is possible to use any coating method including, for example, a bar coating method, a spin coating method, a spray coating method, a dip coating method, a die coating method, ald an ink-jet method. The bar coating method, the die coating method, and the spin coating method are preferable, because the base member having a relatively large area can be coated uniformly with the IJV curable resin and the coating can be quickly completed. [0098] After the base member 40 is coated with the ffV curable ¡esin 142b, the mold 80 having the predetermined minute concave-convex pattern is pressed against the coating film 142b made ofthe UV curable resin, as depicted in Fig. ft). The pressing can be performed by the conventional pressing system or the rolling system using the pressing roll. As the mold 80, one similar to the mold explained in the liftoff method can be used. After the pressing with the mold 80, the coating fihn 142b made of the fry curable resin is partially irradiated with UV light using an exposure mask 501 for the concave-convex structue layer, as depicted in Fig. 4(c). Thus, the part, of the coating film 742b, exposed with the UV light is cured. A concave-convex pattern of the moid 80 is transferred to the cured coating fllm 142b. Arranging the exposwe mask 501 and the mold 80 v/ith a distance intervening therebetween during UV light irradiation allows the UV light to go around the lower side of lightshielding portions of the exposure mask 501, thereby making it possible to cure the IJV curable resin into a tapered shape. In this case, the outer periphery 142c of the cured coating filn remaining on the base member 40 after removal of an uncured coating film 142b as described later is fomed ÞY as the inclined surface, and thus the concave-convex structure layer 142, ofwhich oute¡ periphery 142c is formed as the inclined surface, can be obtained. [0099] A film-shaped mold, in which a fihn-shaped photomask is used as a supporting substrate, may be prepared, and the pressing and the exposure for the fIV curable resin 142b may be performed using this fikn-shaped mold. [0100] Subsequently, as depicted in Fig. 4(b), the mold 80 is released from the coating film l42b and the concave-convex structue layer 142. After releasing ofthe mold 80, the uncured coating film 142b is removed. The removal ofthe uncured coating film 142b can performed such that the uncured coating fi1m 142b is dissolved by a solvent, such as isopropyl alcohol (IPA). Removing the uncured coating film 142b in such a manner allows only the cured coating film 142b to remain on the base member as depicted in Fig. 4(e), thereby forming the concave-convex structure layer 142 having the concave-convex pattem 142p, which corresponds to the concave-convex pattern ofthe mold 80. [0101ì In the IIV curing method, the concave-convex pattern of the concave-convex structure layer is formed by using the mold, and the unnecessary part(s) or pofion(s) of the coating film made of the lfV curable malerial is(are) removed tbrough the curing by mask exposure and the dissolution. Instead ofusing the mold 80 depicted in Fig. 4(b), a mold 80a including concave portions corresponding to the shape ofthe concave-convex structure layer 142 as depicted in Fig. 5(b) may be used to form the concave-convex structure layer 142 without the exposure by use of the mask and the dissolution of uncured tIV curable resin. At first, as depicted in Fig. 5(a), the base member 40 is coated with the IJV curable resin 142b. Then, the mold 80a is pressed against the coating film 142b as depicted in Fig. 5(b). After the pressing with the mold 80a, the coating film l 42b is cured by being irradiated with IIV light. After curing of the coating ñlm 142b, the mold 80a is ¡eleased from the coating film 142b and thus the concaveconvex structure layer 142 havrtg a shape which corresponds to the shape of the mold 80a is formed as depicted in Fig. 5(c). In this case, when apart, of the mold 80a, coresponding to the outer periphery 142c ofthe concave-convex structure layer 142 is formed as an inclined surface, the outer periphery 142c ofthe concave-convex structure layer 142 is formed as the inclined surface. The material ofthe concave-convex shucture layer 142 is not limited to the IJV curabie material, and may be a thermosetting material such as a sol-gel material. When the sol-ge1 material is used for the concavel+ L I l i.:,1 t" convex structure I ayer 142, it is preferred that heating by use of a heater be performed instead of tIV light irradiation, and main baking be performed after the releasing of the mold 80a. [0102] After the concave-convex structure layer is forrned on the base member by the liftoff method or the IIV curing method, the base member and the concave-convex structüe layer are cleaned with a brush in order to remove foreign matters and the like adhered to the base member and the concave-convex struchlre layer, and then an organic matter and the like is removed with an organic solvent and an alkaline cleaning agent using an aqueous solvent. Next, as depicted in Fig. 1(b), the first eleckode 92 is stacked on the concave-convex structure layer 142 such that the concave-convex structure formed in the surface ofthe concave-convex shuchrre layer 142 is maintained on the first electrode 92 (see Fig. 1(b)). The flust electrode 92 having the concave-convex pattem is formed, accordingly. As a method for stacking the fust electrode 92, it is possible to appropriately use any known method including, for example, an evaporation method, a sputtering method, and a spin coating method. Among these methods, the sputtering method is preferably employed from the viewpoint of improvíng the adhesion property. Note that during the sputtering, the base membe¡ may be exposed to a high temperature of about 300'C. The first electrode 92 is coated with photoresist, and then the photoresist is exposed with a mask pattem for the first electrode, and developed by a developer. After that, the fi¡st electrode is etched with an etching solution, thereby obtaining the patterned first electro de 92 havrrg a predetermined pattem. It is preferred to clean the obtained first electrode 92 with the brush and to remove any organic matter and the like with the organic solvent and the alkaline clea.ning agent using the aqueous solvent, followed by performing a lfV ozone treaùrent. [0103] Next, the organic layer 94 is stacked on the first electrode 92 (see Fig. 1(b)). As a method for stacking the organic layer 94, it is possible to appropriately use any known method including, for example, an evaporation method, a sputtering method, a spin coating method, and a die coating method. The patteming of the organic layer 94 can be performed by any known method such as patteming by use of a mask. As depicted in Figs. 1(a) and 1(b), the organic layer 94 is forrned in a range or area narower than that ++ of the concave-convex structur€ layer 142 such that the outer periphery of the organic layer 94 and the outer periphery ofthe concave-convex structure layer 142 are positioned while being separated from each other by a predetermined distance. As a result, the concave-convex structure layer 142 is pafiaily exposed without being covered with the organic layer 94 and/or a part (outer circumference) of the first electrode 92 in which concavities and convexities of the concave-convex stmcture layer 142 are mainlained is exposed without being covered with the organic layer 94. [01041 Subsequently, the second electrode (metal electrode) 98 is stacked on the organic Iayer 94- The metal electrode 98 can be stacked by any known method such as an evaporation method and a sputtering method. It is preferred that the metal electrode 98 be fonned to cover the organic layer 94 entirely. The patterning of the metal electrode 98 can be performed by any known method such as patterning by use of a mask. [0105] Subsequently, the adhesive layer 103 is fo¡med and the sealing member 101 is attached the¡eto, thereby forming the sealed space 105 (see Figs. 1(a) and l(b)). At first, the adhesive layer 103 is formed to overlap the outer periphery 142c of the minute concave-convex layer I42. It is preferred that the adhesive layer 103 be formed to have a predetermined space D from the org anic layer 94 in a state that the adhesive layer 103 is not brought in contact r¡/ith the org anic layer 94. It is preferred that the distance D be, for example, 1 ¡rm or longer. The adhesive layer 103 can be formed at a predetennined position by applþg an adhesive by use of a scannable dispenser, a movable stage, and/or the like. Further, the adhesive layer i03 having a desired line width ca¡ be formed by controlling the scanning velocity ofthe dispenser and the discharge amount of the adhesive from the dispenser. Next, the sealing member 1 0 1 is disposed above the concave-convex structure layer 142, the first electrode 92, the organic layer 94, and the metal electrode 98 to face the base member 40 and then the sealing member 101 is allowed to being adhered (connected) to the base member 40 via the adhesive layer 103. Accordingly, the space 105 between the base member 40 and the sealing membe¡ 101 is sealed. Then the adhesive layer 103 is cured by being irradiated with energy rays when the adhesive layer 103 is made of a material which can be cured by being irradiated with energy rays. For example, when the adhesive layer 103 is made ofthe photocurable adhesive, the adhesive layer 103 is cured such that the light in a range from an lÈBultraviolet region to a visible region which is obtained by a high-pressure mercury vapor lamp or a halogen lamp is radiated from the side ofthe sealing member or the side ofthe base member. When the adhesive layer 103 is made of the thermosetting adhesive, the adhesive layer 103 is cured by heating, for example, at a temperature of 50 to 150'C. Accordingly, the base member 40 and the sealing menber 101 are fonned integrally and thus the light emitting element 100, in which the organic layer 94 is disposed in the sealed space 105, is formed. [0106] After formation of the organic layer 94, it is preferred that the organc layer 94 be sealed, for example, in a nitrogen atmosphere (e.g. by use of a glove box, the inside of which is replaced with high-purity nitrogen gas ofnot less than five-nnes (99 -999%o) purity) without any contact with atmospheric air. In the above-described sealing step, the sealing member 101 is aranged after the adhesive layer 103 is formed on the base member 40. The adhesive layer 103, however, may be formed as follows. Namely, the sealing member 101 is ananged to face the base member 40 with a space intervening therebetween, and then an adhesive is injected into the space to form tle adhesive layer 103. [0107] In the sol-gel material coatìng step, the base member 40 may be coated with a dispersion liquid of fine parlicles such as TiOz, ZnO, ZnS, ZrO,BeíliOz, or SrTiOz. Of the above materiais, TiOz is preferably used in view ofthe film formation perfonnance (coating property) and the refractive index. The coating film made of an inorganic material may be formed by a liquid phase deposition (LPD) or the 1ike. [0108] Altematively, the base member 40 may be coated with a polysilazane solution in the sol-gel material coating step. In this case, a concave-convex structure layer made of silica may be obtained by forming the coating filn made of the polysilazane solution into ceramic (silica reforming or modifrcation) in the main baking step. It is noted that "polysiiazane" is a polymer having a silicon-nitrogen bond, is an inorganic polymer comprising Si-N, Si-H, N-H, or the like, and is a precursor of a ceramics such as SiOz, Si:N+, or SiO.\ which is an intennediate solid solution of them. A compound, which is ceramized at relatively low t€mperatue and is modifred into silica, is more preferred. For example, a compound, which is represented by the following formula (1) described in Japanese Patent Application Laid-open No. H8-1728'79, is more preferable. [0109] Formuia (1): -Si (Rl) (R2)-N (R3)- +q lr. t, In the fonnuÌa (1), R1, R2, and R3 each represent a hydrogen atom, an alþl group, an alkenyl group, a cycloalkyl group, a:l aryl group, an aþlsilyl group, an alkyiamino group, or an alkoxy group. [0110] Of the compounds represented by the formula (1), perhydropolysilazane (referred to also as PHPS) in which all ofRl, R2, and R3 are hydrogen atoms and organopolysilazane in which a part of the hydrogen bonded to Si thereof is substituted by, for example, an alþl group are particularly prefer¡ed. [0111f Other examples of the polysilazane ceramized at low temperature include: silicon alkoxide-added polysilazane obtained by reacting polysilazane with silicon alkoxide (for example, Japanese Patent Laid-Open No. 5-238827); glycidol-added polysilazane obtained by reaction with gþidol (for example, Japanese Patent Laid-open No. 6-122852); alcohol-added polysilazane obtained by reaction with alcohol (for example, Japanese Patent Laid-open No. 6-240208); metal carboxylate-added polysilazane obtained by reaction with metal carboxylate (for example, Japanese Patent Laid-Open No. 6-299118); acetylacetonato complex-added polysilazane obtained by reaction with an acetylacetonato complex containing a metal (for example, Japanese Patent Laid-Open No. 6-306329); metallic fine parricles-added polysìlazane obtained by adding metallic fine particles (for example, Japanese Patent Laid-Open No. 1-196986), and the like. [0112] As a solvent of the polysilazane solution, it is possible to use hydrocarbon solvents such as aliphatic hydrocarbons, alicyclic hydrocarbons, and aromatic hydrocarbons; halogenated hydrocarbon solvents; and ethers such as aliphatic ethers and alicyclic ethers. Amine or a metal catalyst may be added in order to promote the modification into a silicon oxide compound. [0113] The curing ofpolysilazane may be facilitated by heating or by irradiation with energy rays such as excimer. [0114] The coating layer may be fomred on the concave-convex structure layer 142. The coating layer can be formed by any of the methods which can be used to forrn tle concave-convex sfucture layer 142. For example, the above-described sol-gel method, a method by use of a dispersion liquid of fine particles of an inorganic material, the liquid phase deposition (LPD), and a method of curing polysilazane may be used. When the silane coupling agent is used as the material of the coating layer, the coating layer 9o may be formed as foilows. Namely, the coatìng material is applied by any of various coating methods including, for example, a spin coating method, a spray coating method, a dip coating method, a dropping method, a grawre printing method, a screen printing method, a relief printing method, a die coating method, a cufain coating method, an ink-jet method, and a sputtering method. Then, the applied coating material is dried and cured under a proper condition suitable to the material used. For example, the coating material may be heat-dried at temperatures of 100'C to 150"C for 15 to 90 minutes. Examples [0115] In the following description, the present invention will be specifrcally explained with Examples and Comparative Examples. The present invention, however, is not limited to Examples. In each of Examples and Comparative Examples, a light emitting element was manufactured and then the evaluation of adhesion property of an adhesive layer of the light emitting element and the evaluation of deterioration under high humidþ environment were performed. [0l16l [Example 1] A mold having a concave-convex surface was manufactured as follows. At fi¡st, there was prepared a block copollmer produced by Pollmer Source Inc., which was made ofpolystyrene (hereinafter referred to as "PS" in an abbreviated manner as appropriate) and pol)'rnethyl methacrylate (hereinafter ¡efer¡ed to as "PMMA" in an abbreviated ma¡ner as appropriate) as described below. Mn ofPS segment : 868,000 Mn of PMMA segment : 857,000 Ma of block copolymer: i,725,000 Voiume ratio between PS segment and PMMA segment (PS:PMMA):53:47 Molecular weight distribution (Mw/Mr) : 1.30 Tg ofPS segment : 96oC Tg of PMMA segnent: 110"C [0117] The volume ratio between the first pol¡'rner segment and the second pollmer segment (the first polymer segment: the second poll.rner segment) in the block copolymer was calculated on the assumption that the density of polystyrene was 1.05 g/cm3 and the density of polymethyl methacrylate was 1.19 {ar}. The number average molecular weights (Mn) and the weight average molecular weights (Mw) of polyrner lì tr l: L::.. ):. l l I 1 :::l segments or pol)¿rners were measured by using a gel pemeation chromatography (Model No. "GPC-8020" manufactured by TOSOH CORPORATION, in which TSKgel SuperH1000, SuperH2000, SuperH3000, and SuperH4O00 were connected in series). The glass transition temperahües (Tg) ofthe polyrner segments were measured by using a differential scanning calorimeter (manufactured by PERKIN-ELMER, INC. under the product name of "DSC7"), while the temperature was raised at a rate of ternperature rise of 2o'Clmin over a temperature range of 0 to 200'C. The solubility parameters of polystyrene and pol¡.rnethyl methacrylate were 9.0 and 9.3 respectively (see "Kagaku Binran Ouyou Hen" (Handbook of Chemistry, Applied Chemistry), 2nd edition). [0118] Toluene was added to 150 mg of the block copollaner and 38 mg of Poþthylene Glycol 4000 manufactured by Toþo Chemical Lrdustry Co., Ltd. (Mw: 3000, Mw,Mn: 1.10) as polyethylene oxide so that the total amount thereof was 10g, followed by dissolving them. Then, the solution was filtrated or filtered through a membrane filter having a pore diameter of 0.5 pm to obtain a block copollnner solution. The obtained block copoll.rner solution was applied, on a polyphenylene sulfrde filn (TORELINA manufactured by TORAY INDUSTRIRES, INC.) as a base member to form a thin film having a thickness of 200 to 250 nm, by spin coatìng. The spin coating was performed at a spin speed of500 rpm for 10 seconds and then a spin speed of800 rpm for 30 seconds. The thin film formed by the spin coating was left at room temperature fo¡ 10 minutes until the +hin filrn was dried. [0119] Then, the base member on which the thin film was formed was subjected to a solvent annealing process by being stationarily placed in a desiccator filled with chloroform vapor in advance at room temperature for 24 hours. Inside the desiccator (volume: 5 L), a screw-type container charged with 100 g of chloroform was placed, and the atmosphere inside the desiccator was filled with chloroform at the saturated vapor pressure. Concavities and convexities were observed in the surface of the thin film afte¡ the solvent annealing process, and it was found that the block copolyrner forming the thin film underwent the micro phase separation. [0120] About 20 nm of a thin nickel layer was fo¡med as a current seed layer by performing the sputtering on the surface ofthe thin fikn processed to have the wave-like shape by the solvent annealing p¡ocess as described above. Subsequently, the base member equipped with the thin film was immersed in a nickel sulfamate bath and S2- subjected to an electroforming process (maximum current densit¡r: 0.05 A"/cm2) at a temperature of 50"C so as to precipitate nickel until the thickness became 250 pm. The base member equipped with the tbin film was mechanically peeled off or released from the nickel electroforming body obtained as described above. Subsequently, the nickel electroforming body was immersed in a tetrahydrofura¡ solvent for 2 hours, and then the nickel electroforming body was coated with an acrylic-based UV curable resin, followed by being cured and peeled off. This process was repeated three times, and thus pollmer component(s) adhered to a part of the sur{ace of the electroforming body was (were) removed. After that, the nickel electroforming body was inrmersed in Chemisol 2303 manufactured by THE JAPAN CEE-BEE CHEMICAL CO., LTD., and was cleaned or washed while being stirred or agitated for 2 hours at 50oC. Thereafter, the LfV ozone treatment'lras applied to the nickel electroforming body for 10 minutes. [0121] Subsequently, the nickel electroforming body was immersed in OPTOOL HD- 2100TH manufactured by DAIKIN INDUSTRIES, ltd. for about 1 minute and was dried, and then stationarily placed overnight. The next day, the nickel electroforming body was immersed in OPTOOL HD-TH manufactured by DAIKIN INDUSTRIES, ltd. and was subjected to an ultrasonic cleaning (washing) process for about I minute. In such a manner, a nickel mold (nickel substrate) for which a mold-release treatment had been performed was obtained. [0122] Subsequently, a PET subsrrate (COSMOSHINE A-4100, easy adhesion PET film manufactured by TOYOBO CO., LTD.) was coated with a fluorine-based IIV curable resin. The fluorine-based lfV curable resin was cured by irradiation with ultraviolet light at 600 mJlcm2 while the nickel mold was pressed thereagainst. After curing ofthe resin, the nickel mold was exfoliated orpeeled off from the cured resin. Accordingly, a diffraction grating mold, which r¡/as composed of the PET subshate with the ¡esin film to which the surface profile (surface shape) of the nickel mold was transfered, was obtained. [0123] The light emitting element was manufactured by usilg the mold thus obtained. As the base member of the light emitting element, an alkali-free glass of 30 mm x 30 mm x 0.07 (thickness) mm (produced by Nippon Electric Glass Co., Ltd.) was prepared. The base member was scrubbed and cleaned by using a cleanser (RBS-25, produced by Junsei Chemical Co., Ltd.) and a sponge sufficientl¡ and then a concave-convex Á:>'Q l structure layer was fonned thereon by the liftoff method as follows. Namely, the base member was coated with a positive resist (OFPR-800, produced by TOKYO OHKA KOGYO Co., LTD.) by spin coating such that the positive resist had a thickness of about I pm, and then predrying was performed at a temperature of 80oC for 30 minutes. Exposure was performed with UV light (I: 365 nm) for 16 seconds by using the mask 501 as depicted in Fig. 6(a). In Fig. 6(a), the white portion is a light transmissive portion, the mask 501 is marked with scales, and respective lengths are represented in numbers to show sizes thereof. Subsequently, the positive resist on the base member was developed by using an organic developer (MFCD-26, produced by Shipley Co. Llc.) and was washed with running water for 3 minutes. Then, drying was performed at a temperature of 100'C for 10 minutes. A resist ¡emained on a porfion, on the base member, corresponding to a light-shielding portion (black portion) of the mask 501. [0124] Subsequently, a sol-gel material to be used as the material of the concave-convex structure layer was prepared as follows. Namely, 2.5 g of tetraethoxysilane (TEOS) and 2.1 g of methyltriethoxysilane (MTES) were added dropwise to a mixture solution of 24.3 g ofethanol,2.16 gof waß4 and 0.0094 g of concentrated hydroclrloric acid, followed by being stirred or agitated for 2 hours at a temperature of 23'C and a humidity of 45Yo. [01251 The surface, on the tra¡sparent sùbstmte, formed with the pattemed resist was coated with the sol-gel materiai by spin coating. The spin coating was performed for 8 seconds at rotation speed of 500 rpm, and then for 3 seconds wíth rotation speed of 1000 rpm. [0126] After the elapse of 60 seconds from the spin coating of the sol-gel material, the mold obtained as described above was pressed against the coating film made of the solgel material on the base member by use of the pressing ro11 heated to 80'C while the pressing ro11 was moved and rotated. Then, the surface, of the mold, on which the minute concave-convex pattern had been formed was pressed against the coating film on the base member while the pressing roll at 80'C was being rotated from one end to the other end of the base membe¡. After the pressing with the mold, the mold was manually released or peeled offfrom the one end to the other end ofthe base member such that the angle (pee1 angle) of the mold with respect to the base member was about 30". As the pressing roll, it was used a roll which included a heate¡ therein and had the outer E+ circumference covered vr'ith heat-resistant silicon of a thickness of 4 mm, the roll having a diameter (rp) of50 mm and a length of 350 mm in a¡ axial direction of the shaft. [01271 Subsequently, the concave-convex skucture layer was subjected to the main baking by being heated for 60 minutes in an oven of 300"C. [0128] Subsequently, the resist was stripped or peeled offby using a resist stripping liquid (Resist Strip N-320, produced by Nagase Sangyo K.K.). The resist and the solgel film on the resist were removed, and the sol-gel film remained on a portion corresponding to the white portion (light transmissive portion) ofthe mask 501 depicted in Fig. 6(a). Namely, the concave-convex sûlÌcture layer made of the sol-gel material was formed in an area inside a rectangle of 22 mmx20 mm, which was apart from two sides, ofthe base member, facing each other (hereinafter referred to as "left and right sides" as appropriate) by a distance of4 mm, apart from one of remaining two sides (hereinafter referred to as "upper side" as appropriate) by a distance of 3 mm, and apart from the remaining one side (hereinafter referred to as "lower side" as appropriate) by a distance of 7 mm. [01291 The base member with the pattern made ofthe concave-convex struch]re layer obtained as described above was cleaned with a brush to remove foreign matter and the like adhered thereto, then organic matter and the like was removed by an alkaline clea¡er and an organic solvent. On the base member cleaned as described above, an ITO film havíng a thickness of 120 nm was formed at a temperah[e of 300'C by a sputtering method. Photoresist was applied on the ITO filrn and exposure was performed with a mask pattem for a transparent electrode (first electrode), and then the resist was developed with a developer and ITO was etched with an etching solution. Accordingly, a transparent electrode having a pattem as depicted in the schematic top view of Fig. 7 was obtained. The obtained transparent electrode was cleaned with a brush, and organic matter and the like was removed by an alkaline cleaner and an organic solvent. Then, the transparent electrode was subjected to a tlV-ozone process. On the transparent electrode processed as described above, a hole transporting layer (4,4',4" tis(9-carbazole)triphenylamine, thickness: 35 nm), an organic layer (tris(2- phenylpyridinato)iridium(Itr) complex-doped 4,4' ,4" tris(9-carbazole)triphenylamine, tlickness: 15 nm; tris(2-phenylpgidinato)iridium0lD complex-doped 1,3,5-tris(Nphenylbenzimidazole- 2-y1)benzene, thickness: lJ nm), an electron transporting layer (1,3,5{ris(N-phenylberzimidazole-2-yþenzene, thickness: 65 nm), and a lithium -ç5 1., I i=ì l l t. fluoride layer (thickness: 1.5 nm) were each stacked by a vapor deposition method, and further a metal electrode (second electrode) (aluminum, thickness: 50 nm) was formed by the vapor deposition method. [0130] The base member, in which the concave-convex structure layer, the transparent electrode, the organic layer, and the metai electrode were formed, was moved fiorn a vacuum apparatus into a glove box under Nz atmosphere and adhesive (UV RESIN XNR 55162, produced by Nagase ChemteX Corporation) was applied on the base member. The adhesive layer was formed by using a dispenser robot (SHOTMASTER3O0, produced by Musashi Engineering Inc.) while the applying position of the adhesive, scanning velociry ofthe dispenser robot, and the amount ofthe applied adhesive were controlled. The adhesive layer was formed to have a belt or band shape having 4 mm in width and extending along the circumference of the rectangle of 22mmx20 nmas the center (center line), the circumference of the rectangle being apart from the lefi and right sides of the base member by a distance of 4 mm, apart from the upper side by a distance of 3 mm, and apart fiom the lower side by a distance of 7 mm. (That is, the adhesive layer was formed to have a 4 mm-wide belt or band shape extending along the outer periphery ofthe concave-convex structure layer as the center line.) [01311 An engraved glass (alkali-free glass, produced by NSG Precision Co., Ltd.) of 26 mm x 30 mm which had a concave portion of 18 mm x 16 mm was processed with UVO¡ for 3 minutes. The engraved glass was piaced on the base member such that the concave podion of the engraved glass faced the base membe¡ and the center (center line) of the width of the convex portion ofthe engraved glass overlapped the applied adhesive line. The base member was pressed against the engraved glass by using a clip (small binder clip, produced by Lion Corporation) sandwiching them, and then the clip was ¡emoved. The adhesive layer was cured by being irradiated with IIV light at a totalized light quantity of 600 mJlcm2 by use of a IJV radiation light source (LIGHTNING CURE LC8, produced by Hamamatsu Photonics K.K.). The engraved glass was designed to include protrurling part extending beyond the upper side of the base member by 5 mm when being placed on the base member in the above-described manner. [0132] The sealed light emitting element was obtained through the above procedure. Figs. 1(a) and 1(b) schematically depict a planer structure and a cross-sectional structure of the manufactured light emitting element, respectively. s¿ t, I [0133] [Example 2] In Example 1, the resist pattern was formed to perfomr the patteming of the concave-convex structure layer by means of photolithography using the positive resist. In Example 2, the method for forming the resist pattern was changed as described below, and along with this, the method fo¡ stripping the resist was also changed. A light emitting element was manufactured in a similar marurer to Example 1 except for the above. Fig. 2 schematically depicts a cross-sectional structure of the light emitting element manufactured in Example 2. [0134] A negative resist prepared as described below was used as the resist. Namely, 1 00 parts of methacrylic acid-methyl methacrylate copolymer in which the composition ratio (molar ratio) of methacrylic acid and methyl methacrylate was 20:80 and the weight average molecular weight thereof was 30,000; 6 parts ofpentaerlthritol tetraacrylic ester; 2 parts of Michler's Ketone; and 2 parts of4-(4- dirnethylaminophenylazo)-phenol were dissolved in 330 pa¡ts ofa mixed solvent in which ethyl cellosolve acetate/ethyl cellosolve was 60/40. Then, the obtained solution was filtrated or filtered through a membra¡e filter of 0.22 pm. The base member was coated with the negative resist by spi¡ s6¿1ing such that the negative resist had a thickness of about 1 pm, and then predrying was performed at a temperature of90'C for 60 seconds. Exposure was performed by using a mask 503 depicted in Fig. 6(b) and a contact exposure apparatus (PLA501F, produced by Canon Inc.) in which the illumination ratio of gJine/i-line was 7/5 (mVr'/cm2) at an intensity of 130 mJ/cm2. In Fig. 6(b), the white portion is a light transmissive portion, the mask 503 is marked with scales, and respective lengths are represented in numbe¡s to show sizes thereof. Subsequently, paddle development with 0.5% NaOH solution was performed for 60 seconds. Further, the resist pattem was baked and hardened by being irradiated with tIV light(wavelength:21finm,illuminance:1.2mWcm2)byuseofahigh-pressuremercury vapor lamp for 200 seconds. The resist formed in the part, in which light was blocked by the mask 503, was removed. [0135] After performing the preparation of the sol-gel material to be used for the concave-convex structure layer, coating, the pressing with the mold, and main baking in a similar manner to Example 1, the resist pattem was stripped by swinging the base member in a resist stripping liquid which was dimethylsulfoxide warrned or heated to 50"C, cleaning the base member with isopropyl alcohol, and drying the base member. çT Further, the base member was washed with nurning water a:rd dried. The resist and the sol-gel fihn on the resist were removed, so that the concave-convex struchrre layer made of the so1-gel material was formed only on the pofion corresponding to the black portion (1ight shielding poÍion) of the mask 503 depicted in Fig. 6(b). The base member having the concave-convex structue layer rras observed by SEM (SU1510 manufactured by HITACHI High-Technologies Corporation). As a result, an angle 0, which was formed by the surface of the base member and the outer periphery (side surface) ofthe minute concave-convex structue layer, was 70" (see Fig. 2). [0136] fExample 3] A light emitting element was manufactured in a similar manner to Example 1 except that the concave-convex structure layer was fonned as described below by the UV curing method using a IIV curable resin instead of the 1ift-off method. Figs. 1(a) and 1(b) schematically depict a planer sûucture and a cross-sectional structure ofthe manufactured light emitting element, respectively. [0137] 1 g of silane coupling agent (KBM-5103 produced by SHIN-ETSU CHEMICAL, CO., LTD.) was added dropwise to a mixture of 1 g of water, 19 g of IPA, and 0.1 ml of acetic acid while the mixture was being stirred. After that, this mixture s'olutiotr *as stirred for another hour, thereby preparing a solution of the silane coupling agent. The base member was cleaned in a similar ma:rner to Example 1, and then moisture on a su¡face of the base member was removed by drying using spin coater. The surface of the base member after the drying was coated with the solution of the silane coupling agent by spin coating. The spin coating was performed at a spin speed of 1000 rpm for 30 seconds. After that, the base member was baked in an oven of 130"C for 15 minutes. The base member to which the easy-adhesion treaûnent had been performed was obtained, accordingly. The easy-adhesion treahnent sudace of the base member to which the easy-adhesion treatrnent had been performed was coated with a (fV curable resin (PAK-02 produced by Toyo Gosei CO., Ltd.) by spin coating. The spin coating was performed at a spin speed of i000 rpm for 30 seconds. A diffiaction g¡ating mold, rühich was similar to that used in Example 1, was pressed against the coated lfV curable resin using a hand roller. Further, the mask 501 depicted in Fig. 6(a) was superposed on the mold, and the UV curable resin positioned in the light transmissive porlion of the mask 50 1 was cured by being inadiated with tIV light at 600 mJ/cm2 from the side of the mask. After the mask and mold were released from the base s8 1:,: I .: I member, uncured resin was cleaned ol washed with IPA and the base merrber was dried by means of a nihogen blow. Accordingly, the concave-convex structure layer made of the IJV curable resin which had a similar structure as that of the concave-convex shxcture layer made of the sol-gel material in Example I was fomred. [0138] lExample 4] A light emitting element was manufactured in a similar manner to Example 1 except that a gas barrier filrrr was used as the base member and the concave-convex structure layer was fo¡med as described below by the fIV curing method using a UV curable resin instead ofthe lift-offmethod. Figs. 1(a) and 1(b) schematically depict a planer struchrre and a cross-sectional structure ofthe manufachrred light emitting element, respectively. [01391 1 g of silane coupling agent (KBM-5103 produced by SHIN-ETSU CI{EMICAL, CO., LTD.) was added dropwise to a mixh¡re of 1 g of water, 19 g of IPA, and 0 . 1 mL of acetic acid while the mixture was being stirred. After that this mixture solution was stirred for another hour, thereby preparing a solution ofthe silane coupling agent. As the base member, the gas barrier filn obtained in tle following manner was used. Namely, a SiOxNy (x, y: 0 to 2) film, which was made of an organic-inorganic hybrid material composed ofan organic constítuent and an inorganic constituent, was formed as a barrier film on a PEN base member (TeonexQ65F produced by Teijin DuPont FiLns Japan Limited) having a film thickness of 200 pm. The water vapor transmission mte of this gas barrier film was not more tha¡ 1 x l0-3 !Ñ/day. lhe barrier film of the gas barrier fihn was coated with the solution of the silane coupling agent by spin coating. The spin coating was performed at a spin speed of 1000 rpm for 30 seconds. After that, the base member was baked in an oven of 130"C for 15 minutes. The base member with the gas barrier film to which the easy-adhesion treatunent had been performed was obtained, accordingly. The easy-adhesion treatment surface of the gas barrier filn to which the easy-adhesion treatnent had been performed was coated with a fIV curable resin (PAK-02 produced by Toyo Gosei Co., Ltd.) by spin coating. The spin coating was performed at a spin speed of 1000 rpm for 30 seconds. A diffraction grating mold, which was similar to that used in Example 1, was pressed against the coated IJV curable resin using a hand roller. Fufher, the mask 501 depicted in Fig. 6(a) was superposed on the mold, and the UV curable resin positioned in the light transmissive portion of the mask 501 was cured by being irradiated with UV light I li ; i' i- S1 at 600 mJ/cmz from the side of the mask. After the mask a¡rd mold were released from the base member, uncured resin was cleaned or washed with IPA and the base member was dried by means of a nitrogen blow. Accordingly, the concave-convex structure layer made ofthe fIV curable resin which had a similar structure as that of the concaveconvex structure layer made of the sol-gel material in Example 1 was formed on the base member with the gas barrier film. l0l40l fComparative Example I I In Example 1, the patteming of the concave-convex structure layer was performed by photolithography using the positive resist. kr Comparative Example 1, a light emitting element was manufachJred in a similar manner to Example 1 except that the photolithography using the positive resist was not performed. As for the light emitting element manufactured in Comparative Example 1, the concave-convex structure layer was formed on the entire su¡face on the base member, and thus ä structure in which the concave-convex structue layer was exposed to the outside ofthe adhesive layer was obtained. Fig. 8 schematically depicts its cross-sectional structure. [0141] [Comparative Example 2] In Example 1, the patteming of the concave-convex structure layer was performed by photolithography using the mask 501 depicted in Fig. 6(a). ln Comparative Example 2, photolithography was performed by using a mask 505 depicted in Fig. 6(c) instead of the mask 501. In Fig. 6(c), the white portion is a light transmissive portion, the mask 505 is marked with scales, and respective lengths are represented in numbers to show sizes thereof. A light emitting element was manufactured in a similar manner to Example 1 except for the above. As for the manufactured light emitting element, the outer periphery of the concave-convex structure layer '',¡/as positioned inside the iffier circumference of the adhesive layer. Fig. 9 schematically depicts its cross-sectional structu¡e. [0142] [Comparative Example 3] In Example 4, inadiation with UV light by use of the mask 501 depicted in Fig 6(a) was performed. In Comparative Example 3, irradiation with UV light was performed without the mask 501. Further, in Example 4, uncured resin was clea¡ed with IPA and the base member was dried by means of the nitrogen blow after the irradiation with tIV light. In Comparative Example 3, however, those performed after the irradiation with IJV light in Example 4 were not pedomed. A light emitting $o i t.. element was manufactured in a similar manner to Example 4 except for the above. As for the light emitting element manufactured in Comparative Example 3, the concaveconvex structure layer was fo¡med on the entire surface on the base member, and thus a structure in which the concave-convex structure layer was exposed to the outside ofthe adhesive layer was obtained. Fig. 8 schernatically depicts its cross-sectional structure. [0143] [Evaluation of adhesion property] Regarding the light emitting element ma¡ufachr¡ed i¡ each of Examples 1 to 3 and Comparative Examples I and 2, the adhesion property of the adhesion layer was evaluated as follows. Namely, as depicted in Fig. 10, the light emitting element was fixed to a stand (base) 500 and a plate-like L-shape tool 560 (20 mm in depth), of which cross section was L-shape (a short side 560a having a length of 7 mm, a long side 560b having a length of 15 mm), was inserted unde¡ a protruding part 101a of an engraved glass 1 0 i . Then, the protruding part 1 0 1 a of the engraved glass 1 0 1 was pushed up by pushing the long side 560b of the L-shape tool downward in the direction indicated by the anow in Fig. 10 with the comer of the Lshape tool 560 as the point of action of a lever. When the engraved glass 101 together with the adhesive layer 103 was separated from or peeled offfrom the upper surface of the base member 40, the light emitting element was evaluated to be unsatisfactory or defective; and when the engraved glass 101 was broken and the adhesive layer 103 remained adherìng to the upper surface of the base member 40, the light emitting element was evaluated to be satisfactory. The test was performed for ten light emitting elements manufactured in each ofExamples 1 to 3 and Comparative Examples 1 and 2. The number of defective light emitting elements is indicated in the table of Fig. 1 1 . Regarding Examples 1 to 3 and Comparative Example 1, allof the ten light emitting elements were evaluated as satisfactory. In Comparative Example 2, five light emitting elements, of the ten light emitting elements tested, were evaluated as unsatisfactory. From these results, the light emittiñg element manufactured in each of Examples 1 to 3 and Comparative Example 1 had a better adhesion property of the lower surface of the adhesive layer thân that of the light emitting element manufactured in Comparative Example 2. The reason thereof is considered as follows. Namely, the lower surface of the adhesive layer in Comparative Example 2 was in contact only with the flat surface, but in Examples 1 to 3 and Comparative Example 1, the lower surface of the adhesive layer was in contact with the concave-convex surface. Thus, "catching" and the like obtained by concavities and êl convexities made mechanical releasing (mechanical exfoliation) more difficult, and concavities and convexities increased an interface area. Such effects strengthened the adhesive force. [0144] [Deterioration evaluation] A deterioration test was performed for the light emitting element manufachrred in.each of Examples 1 to 4 and Comparative Examples 1 to 3 under high humidity environment as described below. A voltage of 4 V was applied to the light emitting element in an initial state, and the number ofdark spots in a light emitting area of 14 mm x 14 mm was counted. Next, the light emitting element was kept in a thermohygrostat with a temperature of 40'C and a humidity of 90%. 10 days and 20 days after the putting ofthe light emitting element in the thermohygrostat, a voltage of4 V was applied to the light emitting element and the number of dark spots in the light emitting area of 14 mm x 14 mm was counted. Each of the results is shown in the table of Fig. 1 1 . Regarding ExamFles 1 to 4 and Comparative Example 2, the number of dark spots did not increase, that is, the number thereofwas zero. Regarding Comparative Example 1, the number of dark spots increased to 3 in 10 days and increased to 15 in 20 days. Regarding Comparative Example 3, the number of dark spots increased to 5 in 10 days and increased to 20 in 20 days. Frorn these results, it has been revealed that the light emitting elements mar factured in Examples 1 to 4 and Comparative Example 2 were less likely to deteriorate than the light emitting elements manufactured in Comparative Examples 1 and 3. The reason the¡eof is considered as follows. Namely, the concave-convex structue layer of the light emitting element manufactured in each of Comparative Examples 1 and 3 was exposed to the outside (atmospheric air) ofthe adhesive layer, and thus moisture ând oxygen entered the sealed space via the concaveconvex structure layer. The concave-convex structure layer of the light emitting element manufactured in each of Examples 1 to 4 and Compamtive Example 2 was not exposed to the outside (atmospheric air) ofthe adhesive layer, and thus moisture and oxygen were prevented from penetrating through the concave-convex Structure layer and entering the sealed space. [0145] Although the present invention has been explained as above with the embodiment Examples, and Comparative Examples, the light emitting element and the method for producing the light emitting element of the present invention are not lirnited to the above-described embodiment etc., and may be appropriately modifred or changed )o ZI lt: l:'., l ì wifhiri the range of the technical ideas described in the following claims. For example, although the transparent electrode (first electrode) is formed to approximately or substantially cover the concave-convex structu¡e layer in the embodiment and Examples, the arrangement and shape of the first electrode are not limited to this. The adhesive layer may adhere to a part ofthe concave-convex struchrre layer instead ofa part of fhe first electrode, or the adhesive layer may adhere to both ofa part ofthe first electrode and a part ofthe concave-convex structure layer such that the adhesive layer extend thereacross. In any case, since the adhesive layer adheres to the concave-convex st¡ucture of the concave-convex struchrre layer or the concave-convex surface ofthe first electrode which reflects or shows the concave-convex structure ofthe concaveconvex struchlre layer, the adhesive force between the adhesive layer and the base member improves. Industrial Applicability [01461 The light emitting element of the present invention includes the concave-convex structue layer functionìng ¿s the diffraction grating, and thus light-emitting property thereof is excellent. Fufher, the light emitting part is sealed by the frame sealing having sufficient sealing performance. Thus, the deterioration of the light emitting part due to invading moisture and oxygen is prevented, the occurrence of any defect such as da¡k spots is reduced, and the light emitting element has a long sewice life. Therefore, the light emitting element of the present invention is very useful in various light-emitting devices. Reference Signs List: l0l47l 20: resist, 40: base membe¡ 80: mold, 92: first electrode,94'. organic layer,98: second electrode, 100: light emitting element, 101: sealing member, 103: adhesive layer, 105: sealed space, 742: cottcàve-convex structure layer,242: frst concave-convex structue layet 342: second concave-convex stucture layer b^95 We claim: 1. A light emitting element comprising: a base member; a sealing member disposed to face the base member; a concave-convex sùuchlre layer; a first electrode; an organic layer; a second electrode; and an adhesive layer. wherein the concave-convex structure layer, the first electrode, the organic layer, a¡d the second electrode are formed on the base member in that order; the adhesive layer is positioned between the base member and the sealing member; and an outer periphery of the concave-convex shucture layer is positioned between an inner periphery of the adhesive layer and an outer periphery of the adhesive 1ayer. 2. The light emitting element according to claim 1, wherein at least one of the fust electrode and the second electrode includes an overlapping part overlapping both ofthe concave-convex structure layer and the adhesive layer; the overlapping pa¡t has a concave-convex surface reflecting or showíng concavities and convexities of the concâve-convex sû'ucture layer; and the inner periphery of the adhesive layer adheres to the concave-convex skucture layer or the concave-convex surface reflecting or showing the concavities and convexities of the concave-convex structure layer. 3. The light emilting element according to claim 1 or 2, wherein the organic layer is positioned such that a predetermined space is provided between the adhesive layer and the organic layer. 4. The light emitting element according to any one of claims 1 to 3, wherein 6+ i:ì. l'ì , Tjj the outer periphery ofthe concave-convex structure layer is formed as an inclined surface, and an angle between the outer periphery ofthe concave-convex stmcture layer and a surface of the base member is not more than 80o. 5. The light emitting element according to any one of claims 1 to 4, whereir a space, which is sealed by the base member, the sealing member disposed to face the base member, and the adhesive layer, is filled with infilling. 6. The light emitting element according to any one of claims 1 to 5, wherein the outer periphery of the concave-convex structure layer is positioned roughly halfiray between the outer periphery and the inner periphery of the adhesive layer sealing the space. 7. The light emitting element according to any one of claims 1 to 6, wherein the concave-convex structue layer is made ofa sol-gel material. 8. The light emitting element according to any one of claims 1 to 7, whe¡ein a concave-convex pattem, ofthe concave-convex structüe layet which is positioned on a lower side ofthe organic layer is different from a concave-convex pattern, of the concave-convex struchlre layer, which is positioned on a lower side ofthe adhesive layer. 9 steps of: A method for manufacturing a light emitting element, comprising the forming a concave-convex struchtre layer on a base member; forrning a first electrode on the concave-convex structue layer; forming an organic layer on the first electrode; forming a second electrode on the organic layer; and disposing a sealing member to face the base member such that the concave-convex structure laye¡ the first electrode, the organic layer, and the second electrode, those of which are formed on the base member, are positioned between the base member and the sealing member; and forming an adhesive layer between the base member and the sealing member, (.5 wherein the adhesive layer is formed such that an outer periphery ofthe concave-convex skucture layer is positioned between an inner periphery ofthe adhesive layer and an outer periphery of the adhesive layer. 10. The method for manufacturing the light emitting element according to claim 9, wherein the adhesive layer is formed in a position in which the adhesive layer has no contact with the organic layer. 11. The method for manufacturing the light emitting element according to claim 9 or 10, wherein the concave-convex structure layer is formed such that an angle between the outer periphery of the concave-convex shucture layer and a surface of the base member is not more than 80o. 12. A light emitting element comprising: a base member; a sealing member disposed to face the base member; a first concave-convex stnrcttrre layer having a first concave-convex pattem; a second concave-convex structure layer having a second concaveconvex pattern; a first electrode; an organic layer; a second electrode; and an adhesive layer, wherein the f,rrst concave-convex structure layer ând the second concaveconvex structure layer, which is positioned with a predetermined distance from the fust concave-convex structure layer, are formed on the base member; a stacked body of the fi¡st electrode, the organic layer, and the second electrode is formed on the first concave-convex pattem; the adhesive layer is formed between the base member and the sealing member to suround the stacked body; and the second concave-convex structure layer is disposed not to penetrate the adhesive layer. LL I' /:: i. 1 i:' ^.-**''.'-,i I i, I I I i.;, 13. The light emitting element according to claim 12, wherein the second concave-convex pattern is different from the first concave-convex pattem. 14. The light emitting element according to claim 12, wherein the second concave-convex pattern is identical to the first concave-convex pattern. 15. The light emitting element according to any one of claims 12 to 14, wherein a side surface of the second concave-convex stnrchne layer is formed as an inclined surface, and an angle between the side surface of the second concave-convex structure layer and a surface of the base member is not more than 80o. 16. The light emitting element according to any one of claims 12 to 15, wherein an outer periphery ofthe first concave-convex structure layer is formed as an inclined surface, and an angle between the outer periphery ofthe first concave-convex structure layer and a surface ofthe base member is not more than 80o. Dated this 23'd day of February,2016.