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Low Profile Microelectronic Package, Method Of Manufacturing Same, And Electronic Assembly Containing Same
Abstract: A low profile microelectronic package includes a die (110) (having a first surface (111) and a second surface (112)) and a package substrate (120). The substrate includes an electrically insulating layer (121) that forms a first side (126) of the substrate an electrically conductive layer (122) connected to the die and a protective layer (123) over the conductive layer that forms a second side (127) of the substrate. The first surface of the die is located at the first side of the substrate. The insulating layer has a plurality of pads (130) formed therein. The package further includes an array of interconnect structures (140) located at the first side of the substrate. Each interconnect structure in the array of interconnect structures has a first end (141) and a second end (142) and the first end is connected to one of the pads.
Notices, Deadlines & Correspondence
Patent Information
Applicants
INTEL CORPORATION
Inventors
1. MANUSHAROW Mathew J.
2. NALLA Ravi
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 3805-CHENP-2013.pdf | 2013-05-15 |
| 2 | IPO Drawings INTL-355-IN.pdf | 2013-05-16 |
| 3 | FORM 2 for e-filing INTL-355-IN.pdf | 2013-05-16 |
| 4 | 3805-CHENP-2013 POWER OF ATTORNEY 14-06-2013.pdf | 2013-06-14 |
| 5 | 3805-CHENP-2013 CORRESPONDENCE OTHERS 14-06-2013.pdf | 2013-06-14 |
| 6 | 3805-CHENP-2013 CORRESPONDENCE OTHERS 22-08-2013.pdf | 2013-08-22 |
| 7 | 3805-CHENP-2013 ASSIGNMENT 22-08-2013.pdf | 2013-08-22 |
| 8 | abstract3805-CHENP-2013.jpg | 2014-07-23 |
| 9 | 3805-CHENP-2013-FER.pdf | 2018-04-27 |
| 10 | 3805-CHENP-2013-FORM 3 [08-08-2018(online)].pdf | 2018-08-08 |
| 11 | 3805-CHENP-2013-PETITION UNDER RULE 137 [04-09-2018(online)].pdf | 2018-09-04 |
| 12 | 3805-CHENP-2013-Information under section 8(2) (MANDATORY) [04-09-2018(online)].pdf | 2018-09-04 |
| 13 | 3805-CHENP-2013-OTHERS [05-09-2018(online)].pdf | 2018-09-05 |
| 14 | 3805-CHENP-2013-FER_SER_REPLY [05-09-2018(online)].pdf | 2018-09-05 |
| 15 | 3805-CHENP-2013-CLAIMS [05-09-2018(online)].pdf | 2018-09-05 |
| 16 | 3805-CHENP-2013-ABSTRACT [05-09-2018(online)].pdf | 2018-09-05 |
| 17 | 3805-CHENP-2013-PatentCertificate01-10-2020.pdf | 2020-10-01 |
| 18 | 3805-CHENP-2013-Marked up Claims_Granted 348476_01-10-2020.pdf | 2020-10-01 |
| 19 | 3805-CHENP-2013-IntimationOfGrant01-10-2020.pdf | 2020-10-01 |
| 20 | 3805-CHENP-2013-Drawings_Granted 348476_01-10-2020.pdf | 2020-10-01 |
| 21 | 3805-CHENP-2013-Description_Granted 348476_01-10-2020.pdf | 2020-10-01 |
| 22 | 3805-CHENP-2013-Claims_Granted 348476_01-10-2020.pdf | 2020-10-01 |
| 23 | 3805-CHENP-2013-Abstract_Granted 348476_01-10-2020.pdf | 2020-10-01 |
| 24 | 3805-CHENP-2013-RELEVANT DOCUMENTS [24-09-2022(online)].pdf | 2022-09-24 |
| 25 | 3805-CHENP-2013-RELEVANT DOCUMENTS [15-09-2023(online)].pdf | 2023-09-15 |
| 26 | 3805-CHENP-2013-FORM-27 [28-09-2024(online)].pdf | 2024-09-28 |
Search Strategy
| 1 | 3805_CHENP_2013_15-02-2018.pdf |