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Mechanism To Build A Reconfigurable Microwave Rf Pcb

Abstract: Abstract: Mechanism to build a reconfigurable Microwave RF PCB to faeilifafe the accommodation of additional RF functionality features without hindering the technical characteristics of the Microwave PCB. A main carrier PCB (401) designed comprises of RF processing circuitry and RF switch' circuitry (200). The additional functionality feature or the test feature is incorporated on an Add-on PCB (300). The add-on PCB is then plugged on to the standard carrier PCB through RF press fit connectors. The PCB Layouts are designed, to mitigate crosstalk, thermal management and probable interferences & reflections to maintain the RF signal power requirement of the RF signals.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
23 March 2023
Publication Number
39/2024
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application

Applicants

HINDUSTAN AERONAUTICS LIMITED
15/1, CUBBON ROAD, BANGALORE - 560 001, KARNATAKA.

Inventors

1. V. PANDURANGA RAO
DEPURTY GENERAL MANAGER (DESIGN), SLRDC HINDUSTAN AERONAUTICS LIMITED, HYDERABAB-500042, TELANGANA, INDIA.
2. SHRIKANTH MAHAJAN
CHEIF MANAGER (DESIGN), SLRDC HINDUSTAN AERONAUTICS LIMITED, HYDERABAB-500042, TELANGANA, INDIA.
3. CHETANA JAGDALE
SENIOR MANAGER (DESIGN), SLRDC HINDUSTAN AERONAUTICS LIMITED, HYDERABAB-500042, TELANGANA, INDIA.
4. S.JAGANNATHAM
SENIOR MANAGER (DESIGN), SLRDC HINDUSTAN AERONAUTICS LIMITED, HYDERABAB-500042, TELANGANA, INDIA.

Specification

We claim:
1. A Reconfigurable microwave RF PCB (400) comprises of:
-a main carrier PCB(401) that comprises of basic RF circuit
functionality that features open architecture hardware
- a microwave RF switch circuitry (200) with bias tee concept
to switch from the main stream RF circuitry as per the
requirement and
an Add on RGB (300) that comprises of passive/active RF
circuitry either for additional feature requirement or for test
feature requirement.
2. The open architecture hardware as claimed in claim (1) characterizes the design layout to facilitate the incorporation of said add-on PCB(300) on the said main carrier PCB(401) and built with a transversal mechanism to carry signal power between the said PCBs by means of switch circuitry(200).
3. The design layout as claimed in claim (2) shall encompass RF signals to achieve the RF impedance requirement of 50±2 ohms, for return losses of utmost 12dB, insertion loss of maximum of 0.5 dB and mitigate the crosstalk<90dB.

Documents

Application Documents

# Name Date
1 202341020342-Form5_As Filed_23-03-2023.pdf 2023-03-23
2 202341020342-Form3_As Filed_23-03-2023.pdf 2023-03-23
3 202341020342-Form2 Title Page_Complete_23-03-2023.pdf 2023-03-23
4 202341020342-Form1_As Filed_23-03-2023.pdf 2023-03-23
5 202341020342-Drawings_As Filed_23-03-2023.pdf 2023-03-23
6 202341020342-Description Complete_As Filed_23-03-2023.pdf 2023-03-23
7 202341020342-Correspondence_As Filed_23-03-2023.pdf 2023-03-23
8 202341020342-Claims_As Filed_23-03-2023.pdf 2023-03-23
9 202341020342-Authorisation Certificate_As Filed_23-03-2023.pdf 2023-03-23
10 202341020342-Abstract_As Filed_23-03-2023.pdf 2023-03-23
11 202341020342-FORM 18 [17-06-2025(online)].pdf 2025-06-17