This application claims priority from U.S. Provisional Patent Application No. 62/669,321, filed May 9, 2018, the entire contents of which are hereby incorporated by reference. Any and all applications for which a foreign or domestic priority claim is identified in the Application Data Sheet as filed with the present application are hereby incorporated by reference under 37 CFR 1.57.

BACKGROUND

Field

[0002] This disclosure relates generally to components suitable for medical use and more specifically to components that are suitable for providing humidified gases to and/or removing humidified gases from a patient.

Description of the Related Art

[0003] In medical circuits, various components transport naturally or artificially humidified gases to and from patients. For example, a respiratory system can include a respiratory device that can humidify and heat gases passing through the respiratory device to improve patient comfort and/or improve the prognosis of the patient’s respiratory illness. Some respiratory devices can include a water reservoir and a heating element for heating the water in the reservoir. As the water heats up, water vapor is formed that can join the stream of gases passing through the respiratory device. Some respiratory devices can include a liquid flow controller for providing a controlled flow of liquid, and a heating system including a heating surface configured to be located in a gases passage way and provide humidification to gases passing through the passage way.

SUMMARY

[0004] Some embodiments provide a molded member with a robust substrate molding material interface, which can prevent or delay delamination of the molding material from the substrates under elevated humidity and/or elevated temperature environment.

[0005] Some embodiments disclosed herein pertain to a humidification apparatus (e.g., for respiratory humidification, insufflation, etc.). In some embodiments, the humidification apparatus comprises a gas flow passage. The gas flow passage may have an internal area and an inlet configured to receive gases into the internal area. The gas flow passage may have an outlet configured to allow the passage of gases out of the internal area of the gas flow passage. In some embodiments, the apparatus comprises a heater having a heating surface. The heater may be disposed between the inlet and the outlet of the gas flow passage. In some implementations, the heater is configured to heat a humidification liquid received by the heating surface to humidify gases flowing through the gas flow passage. In certain embodiments, the heater comprises a printed circuit board (PCB). The PCB may have heating tracks. The PCB may have at least one electrical contact. In some embodiments, the electrical contact is configured to receive and/or send an electrical signal (e.g., from an electricity source, etc.). In some embodiments, the electrical contact is configured to receive electricity from an electricity source (e.g., through an electrical conduit connected to the electrical contact) and to provide power to the PCB. In some embodiments, the electrical contact is in electrical communication with the heating tracks. In some implementations, the heater comprises a molding material disposed over at least a portion of the PCB. The molding material and a portion of the PCB may be adhered by a bonding layer comprising a silicon-containing linker. In some embodiments, the bonding layer couples at least a portion of the molding material to the PCB. In some implementations, the respiratory apparatus is configured to provide to humidified gases to a patient.

[0006] In some embodiments, the PCB may span a portion of the gas flow passage from the internal area to an area that is external to the gas flow passage. A portion of the PCB may be exposed to the external area of the gas flow passage while a different portion of the PCB may be in thermal communication with the internal area of the gas flow passage. In some embodiments, the PCB is in thermal communication with the gas flow passage. For

example, in some embodiments, the PCB can receive temperature information from the gas flow passage (e.g., from gases in the gas flow chamber), transmit thermal energy to gas flow passage (e.g., to heat the gas(es) in the gas flow passage), or both.

[0007] In certain implementations, the PCB comprises one or more electrical components configured to receive, transmit, and/or process information about conditions of the internal area of the respiratory apparatus. For example, in some embodiments, the PCB may receive, transmit, and/or process information (e.g. temperature, pressure, and humidity data) regarding one or more gases in the apparatus. In certain implementations, the PCB comprises one or more electrical components configured to receive, transmit, and/or process information about conditions of the internal area of the gas flow passage. The PCB may comprise one or more sensors. In some embodiments, the PCB may comprise one or more temperature sensors in thermal communication with the internal area of the gas flow passage. The PCB may comprise two or more temperature sensors, wherein at least one of the temperature sensors is configured to measure a temperature of the heating surface. The PCB may comprise two or more temperature sensors, wherein at least one of the temperature sensors is configured to measure a surface temperature of the molding material. In some embodiments, the PCB comprises a temperature sensor configured to detect whether the heating surface is wetted by the humidification liquid in at least one region. The temperature sensor or sensors may be located at, on, adjacent, or proximal to the heating surface. The temperature sensor or sensors may be located at, on, adjacent, or proximal to the molding material. In some embodiments, the PCB comprise one or more of a pressure sensor, a flow sensor, a humidity sensor, and/or a fluid level sensor.

[0008] In certain embodiments, the heating tracks of the PCB are in thermal communication with the internal area of the gas flow passage. The heating tracks of the PCB may be covered by the molding material and at the same time in thermal communication with the internal area of the gas flow passage through the molding material. For instance, the heating surface may comprises a portion of the molding material that is covering the heating tracks. In other embodiments, the heating surface comprises the heating tracks and the heating tracks (or a portion thereof) are directly exposed to the internal area of the gas flow passage.

[0009] In some embodiments, the molding material covers one or more of the electrical components and/or sensors of the PCB. The molding material may separate the one or more of the electrical components and/or sensors from direct contact to the internal area of the gas flow passage way (e.g., through the molding material). The molding material may be configured to allow monitoring of the internal area of the gas passage way (e.g., the temperature of the gas(es) inside, pressure, humidity, the relative ratios of different gases where more than one is present, etc.) by the electrical components and/or sensors of the PCB through the molding material.

[0010] In some embodiments, the humidification apparatus comprises a humidification liquid inlet for delivering the humidification liquid from a reservoir to the heater. In some embodiments, the humidification apparatus comprises a humidification liquid inlet for delivering the humidification liquid from a reservoir to a heating surface of the heater. In some embodiments, the inlet is configured to drip a humidification liquid (e.g., water) on the heating surface. In some embodiments, the inlet is configured to deliver a humidification liquid on to a surface of the apparatus (e.g., a wall of the apparatus, a trough, a ramp, etc.) that guides the humidification liquid to the heating surface. In some embodiments, the humidification apparatus comprises a humidification liquid pre-heater. In some embodiments, the respiratory humidification apparatus comprises a humidification liquid flow controller. In some embodiments, the liquid flow controller comprises a metering system and/or a pump. In some embodiments, the humidification apparatus comprises a gas pre-heater.

[0011] In certain implementations, the molding material comprises a thermoplastic material and/or a thermosetting material. In certain implementations, the molding material comprises a thermoplastic material. In certain implementations, the molding material comprises a thermosetting material. In some embodiments, the molding material comprises an injection molded thermoplastic material. In some embodiments, the molding material comprises an overmolded thermoplastic material. In some embodiments, the heater is formed by overmolding the thermoplastic material around the PCB. In some embodiments, the heater is formed by injection molding the thermoplastic material around the PCB. In some embodiments, the heater is formed by insert molding the thermoplastic

material around the PCB. In some embodiments, the thermoplastic material is selected from the group consisting of ethylene/methacrylic acid copolymer, propylene/methacrylic acid copolymer, ethylene/methacrylic acid/acrylate terpolymer, propylene/methacrylic acid/acrylate terpolymer, ethylene/acrylate copolymer, propylene/acrylate copolymer, succinic anhydride grafted polypropylene, succinic anhydride grafted polyethylene, polyurethane, polyamide, ethylene/butyl acrylate/glycidyl methacrylate terpolymer, propylene/butyl acrylate/glycidyl methacrylate terpolymer, ethylene/glycidyl methacrylate copolymer, propylene/glycidyl methacrylate copolymer, crosslinkable polyethylene, crosslinkable polypropylene, crosslinkable polyolefin, and combinations thereof. In some embodiments, the molding material comprises a thermosetting material. In some embodiments, the thermosetting material comprises one or more of silicone rubber, epoxy, and polyurethane.

[0012] In some embodiments, the molding material encapsulates at least a portion of the PCB. In some embodiments, the portion of the PCB encapsulated by the molding material comprises a portion of the heating tracks. In some embodiments, the PCB is encapsulated so that the PCB is not exposed to the internal area of the gas flow passage. In some embodiments, the molding material physically insulates the PCB from the internal area of the gas flow passage while allowing the PCB to collect and/or distribute information regarding the internal area of the passage (temperature, humidity, flow rate of gas, etc.). In some embodiments, the encapsulated PCB has a portion that is not covered by the molding material (e.g., the portion of the PCB that is external to the gas flow passage) so that contact may be made with the PCB (e.g., with electrical wires/conduits, etc.). In some embodiments, the molding material provides a barrier between the PCB and the gas flow passage. In some embodiments, the molding material provides complete separation of the PCB from the internal area of the gas flow passage. In some embodiments, at least one electrical contact of the PCB is not encapsulated and/or covered by the molding material.

[0013] In some embodiments, a portion of the molding material comprises micro channels and/or surface structures. In some embodiments, the micro-channels and/or surface structures are configured to receive, distribute, and/or hold the humidification liquid so it can be heated by the heating tracks. In some embodiments, a portion of the molding material is

configured to receive the humidification liquid and retain it so that it can be heated by the heating tracks. In some embodiments, the portion of molding material that is configured to receive the humidification liquid is coupled to the PCB by the bonding layer. In some embodiments, the molding material is hydrophilic or hydrophobic.

[0014] In some embodiments, the bonding layer chemically couples the molding material to the portion of the substrate (e.g., a portion of the substrate that is a part of a PCB). In some embodiments, the bonding layer chemically couples the thermoplastic to a portion of the heater. In some embodiments, the bonding layer comprises one or more of a covalent bond, hydrogen bond, van der waals forces and ionic bond linking the molding material to a portion of the PCB. In some embodiments, the bonding layer comprises covalent bonds between substituents on the molding material and substituents on the PCB. In some embodiments, the bonding layer is formed at least in part through a reaction of one or more of an epoxy ring, amine, succinic anhydride, methoxyl and/or an ethoxyl moiety with one or more of a carboxyl, amine, epoxy ring, succinic anhydride and/or reactive silanol moiety. In some embodiments, the bonding layer is formed at least in part through a reaction between a succinic anhydride moiety and an amine moiety. In some embodiments, the bonding layer is formed at least in part through a reaction between a succinic anhydride moiety and a secondary amine moiety.

[0015] In some embodiments, the silicon-containing linker is a silane coupling linker represented by:

or a polymerized silane coupling linker thereof; wherein ** is a point of attachment to the molding material; each R’ is independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy,
, wherein * is a point of attachment to the PCB, and at least one of the R’ is
; Y is a single bond, C1-C8

alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and

N; and L— is selected from the group consisting of:

the group consisting of:

[0016] In some embodiments, the silicon-containing linker is a silicon alkoxide linker represented by:

or a polymerized silicon alkoxide linker thereof; wherein R” is independently hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxyl, or u— , wherein * is a point of

attachment to the substrate, ** is a point of attachment to the thermoplastic material, and at least one of the R” is
and at least one of the R” is u— ; and Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene, wherein the C1-C8 heteroalkylene contains one or more heteroatoms selected from O and N.

[0017] In some embodiments, the silicon-containing linker is a siloxane linker selected from the group consisting of:

'

and a polymerized siloxane linker thereof; wherein each Z is independently hydroxyl or u— , wherein * is a point of attachment to the substrate; each Z’ is selected from the

** group consisting of epoxy, primary and secondary amine, succinic anhydride, and L— ,

**

wherein ** is a point of attachment to the thermoplastic material; L— is selected from the group consisting of:

Z” is hydrogen or
wherein is selected from the group consisting of:

point of attachment to the thermoplastic material; at least one of the Z is u— , and at least one of the Z’ is L— or at least one of the Z” is ; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N; Z’” is independently hydroxyl, u— or
, wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic materials, at least one of the Z’” is u— , and at least one of the Z’” is u— ; m is an integer greater than 1 ; and n is an integer greater than 1.

[0018] In some embodiments, the humidification liquid comprises water.

[0019] Some embodiments pertain to a respiratory system. In some embodiments, the respiratory system comprises a gas (e.g., air, oxygen, etc.) flow source. In some embodiments, the respiratory system comprises the humidification apparatus as disclosed above or elsewhere herein. In some embodiments, the respiratory system comprises an inspiratory tube. In some embodiments, the respiratory system comprises a patient interface. In some embodiments, the gas flow source is configured to provide high flow therapy. In some embodiments, the system provides flow rates in a range from about 2 L/min to about 150 L/min, or other flow rates as disclosed elsewhere herein.

[0020] Some embodiments pertain to a component for use in a respiratory system or medical insufflation system. In some embodiments, the component comprises an electronic component comprising conductive tracks and a substrate, wherein the conductive tracks are located on the substrate. In some embodiments, the component comprises a molding material that is molded over at least a portion of the electronic component. In some embodiments, the component comprises a bonding layer that couples the molding material with the at least a portion of the electronic component. In some embodiments, the bonding layer comprises a silicon-containing linker.

[0021] In some embodiments, the bonding layer is a separate layer from the molding material and the electronic component. In some embodiments, the bonding layer comprises pendant groups that are covalently bonded to the molding material and coinciding pendant groups that are covalently bonded to the electronic component. In some embodiments, the pendant groups may from the substrate (e.g., electrical component) may or may not be covalently linked to the pendant groups of the molding material. In some embodiments, the bonding layer chemically couples the molding material to the portion of the electronic component. In some embodiments, the bonding layer comprises one or more of covalent bonds, hydrogen bonds, van der Waals forces, and/or ionic bond linking the molding material to the portion of the electronic component. In some embodiments, the bonding layer physically couples the molding material and the substrate (e.g., the electronic component).

[0022] In some embodiments, the bonding layer is formed through a reaction of one or more of an epoxy ring, amine, succinic anhydride, methoxyl or ethoxyl moiety with one or more of a carboxyl, amine, epoxy ring, succinic anhydride or reactive silanol moiety. In some embodiments, the bonding layer is formed through a reaction between a succinic anhydride moiety and an amine moiety. In some embodiments, the succinic anhydride moiety is provided by the electronic component and the amine moiety is provided by the molding material. In some embodiments, the electronic component and the succinic anhydride moiety is provided by the molding material. In some embodiments, the bonding layer is formed from a reaction between a succinic anhydride moiety and a secondary amine moiety. In some embodiments, the succinic anhydride moiety is provided by the electronic component and the secondary amine moiety is provided by the molding material. In some embodiments, the

secondary amine moiety is provided by the electronic component and the succinic anhydride moiety is provided by the molding material.

[0023] In some embodiments, the silicon-containing linker is a silane coupling linker represented by:

or a polymerized silane coupling linker thereof; wherein ** is a point of attachment to the molding material; each R’ is independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy,
, wherein * is a point of attachment to the PCB, and at least one of the R’ is
; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and

N; and L— is selected from the group consisting of:
is selected from the group consisting of:

[0024] In some embodiments, the silicon-containing linker is a silicon alkoxide linker represented by:

or a polymerized silicon alkoxide linker thereof; wherein R” is independently hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxyl, u— or u— , wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic material, and at least one of the R” is
and at least one of the R” is u— ; and Y is a single bond,

C1-C8 alkylene, or C1-C8 heteroalkylene, wherein the C1-C8 heteroalkylene contains one or more heteroatoms selected from O and N.

[0025] In some embodiments, the silicon-containing linker is a siloxane linker selected from the group consisting of:

polymerized siloxane linker thereof; wherein each Z is independently hydroxyl or u— , wherein * is a point of attachment to the substrate; each Z’ is selected from the group

** consisting of epoxy, primary and secondary amine, succinic anhydride, and L— ,

**

wherein ** is a point of attachment to the thermoplastic material; L— is selected from the group consisting of:

Z” is hydrogen or
wherein
is selected from the group consisting of:

point of attachment
to the thermoplastic material; at least one of the Z is u— , and at least one of the Z’ is

L— or at least one of the Z” is
; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N; Z’” is independently hydroxyl, u— or
, wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic materials, at least one of the Z’” is u— , and at least one of the Z’” is u— ; m is an integer greater than 1; and n is an integer greater than 1.

[0026] In some embodiments, the electronic component is a printed circuit board (PCB). In some embodiments, the PCB is rigid or flexible.

[0027] In some embodiments, the electronic component comprises silicone rubber, ceramic, metal, glass fiber, fiberglass, sized fiberglass, etched foil, a filled polymer, epoxy resin, phenol formaldehyde resin, paper or polyester resin, a polyester, a polyetherimide, a polyimide, an epoxy, a polyethylene, copper, an ink, or combinations thereof..

[0028] In some embodiments, the portion of the electronic component provided with the molding material is exposed to heat and humidity in a respiratory system.

[0029] In some embodiments, the molding material comprises a thermoplastic material or a thermosetting material. In some embodiments, a thermoplastic material is used. In some embodiments, the thermoplastic material is selected from the group consisting of ethylene/methacrylic acid copolymer, propylene/methacrylic acid copolymer, ethylene/methacrylic acid/acrylate terpolymer, propylene/methacrylic acid/acrylate terpolymer, ethylene/acrylate copolymer, propylene/acrylate copolymer, succinic anhydride grafted polypropylene, succinic anhydride grafted polyethylene, polyurethane, polyamide, ethylene/butyl acrylate/glycidyl methacrylate terpolymer, propylene/butyl acrylate/glycidyl methacrylate terpolymer, ethylene/glycidyl methacrylate copolymer, propylene/glycidyl methacrylate copolymer, crosslinkable polyethylene, crosslinkable polypropylene, crosslinkable polyolefin, and combinations thereof. In some embodiments, the thermoplastic material comprises an overmolded thermoplastic material. In some embodiments, the component is formed by injection molding the thermoplastic material around the electronic component. In some embodiments, the component is formed by overmolding the thermoplastic material around the electronic component. In some embodiments, the component is formed by insert molding the thermoplastic material around the electronic component. In some embodiments, a thermosetting material is used. In some embodiments, the molding material comprises a thermosetting polymer. In some embodiments, the thermosetting material one or more of silicone rubber, epoxy, and polyurethane.

[0030] In some embodiments, the molding material comprises micro-channels and/or structural features on a surface. In some embodiments, the micro-channels and/or structural features are configured to receive, distribute, and/or hold a humidification liquid. In some embodiments, the molding material is hydrophilic or hydrophobic.

[0031] In some embodiments, the electronic component comprises one or more sensors. In some embodiments, the one or more sensors comprises one or more of a temperature sensor, a pressure sensor, a flow sensor, a humidity sensor, and/or a fluid level sensor. In some embodiments, the one or more sensors comprises one or more of a temperature sensor, a pressure sensor, a flow sensor, and/or a humidity sensor, wherein the one or more of a pressure sensor, a flow sensor, and/or a humidity sensor are configured to detect parameters of a gas in the gas flow passage. In some embodiments, the PCB comprises a fluid level sensor and/or a liquid sensor. In some embodiments, the molding material covers the sensor(s).

[0032] In some embodiments, the component is part of a respiratory system that further comprises one or more of a housing for a filter, a gas conduit, a chamber, an inspiratory tube, a tube connector, a tube joint, a tube elbow, a heating element, a water dosing component, and/or a patient interface component. In some embodiments, the electronic component comprises an electrical contact. In some embodiments, the component is exposed to a higher temperature and/or humidity in a gas flow path when in use relative to an ambient environment. In some embodiments, the component further comprises a humidification chamber.

[0033] Some embodiments pertain to a respiratory or medical insufflation apparatus comprising the component. In some embodiments, the respiratory or medical insufflation apparatus further comprises a humidification chamber.

[0034] Some embodiments pertain heater for a humidification chamber. In some embodiments, the heater comprises a heating component comprising heating tracks and a substrate, the heating tracks being provided on the substrate. In some embodiments, the heater comprises a molding material disposed on at least a portion of the heating component. In some embodiments, the heater comprises a bonding layer coupling at least a portion of the molding material to the heating component. In some embodiments, the heater comprises a bonding layer coupling the molding material to the heating component at a location where the molding material is disposed on the heating component. In some embodiments, the bonding layer comprises a silicon-containing linker.

[0035] In some embodiments, the bonding layer is a separate layer from the molding material and the heating component. In some embodiments, the bonding layer comprises pendant groups that are covalently bonded to the molding material and coinciding pendant groups that are covalently bonded to the electronic component. In some embodiments, the bonding layer chemically couples the molding material to the portion of the heating component. In some embodiments, the bonding layer comprises one or more of covalent bonds, hydrogen bonds, van der Waals forces, and/or ionic bond linking the molding material to the portion of the heating component. In some embodiments, the bonding layer is formed through a reaction between one or more of an epoxy ring, amine, succinic anhydride, methoxyl or ethoxyl moiety and one or more of a carboxyl, amine, epoxy ring, succinic anhydride or reactive silanol moiety. In some embodiments, the bonding layer is formed at least in part through a reaction between a succinic anhydride moiety with an amine moiety. In some embodiments, the bonding layer is formed at least in part through a reaction between a succinic anhydride moiety and a secondary amine moiety.

[0036] In some embodiments, the silicon-containing linker is a silane coupling linker represented by:

or a polymerized silane coupling linker thereof; wherein ** is a point of attachment to the molding material; each R’ is independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy, and u— , wherein * is a point of attachment to the PCB, and at least one of the R’ is
; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and
is selected from the group consisting of:

is selected from the group consisting of:

[0037] In some embodiments, the silicon-containing linker is a silicon alkoxide linker represented by:

or a polymerized silicon alkoxide linker thereof; wherein R” is independently hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxyl, u— or u— , wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic material, and at least one of the R” is
and at least one of the R” is u— ; and Y is a single bond,

C1-C8 alkylene, or C1-C8 heteroalkylene, wherein the C1-C8 heteroalkylene contains one or more heteroatoms selected from O and N.

[0038] In some embodiments, the silicon-containing linker is a siloxane linker selected from the group consisting of:

'

polymerized siloxane linker thereof; wherein each Z is independently hydroxyl or — o— wherein * is a point of attachment to the substrate; each Z’ is selected from the group

** consisting of epoxy, primary and secondary amine, succinic anhydride, and L— ,

**

wherein ** is a point of attachment to the thermoplastic material; L— is selected from the group consisting of:

Z” is hydrogen or
, wherein is selected from the group consisting of:

point of attachment to the thermoplastic material; at least one of the Z is u— , and at least one of the Z’ is L— or at least one of the Z” is ; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N; Z’” is independently hydroxyl, u— or
, wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic materials, at least one of the Z’” is u— , and at least one of the Z’” is u— ; m is an integer greater than 1; and n is an integer greater than 1.

[0039] In some embodiments, the heating component is a printed circuit board (PCB). In some embodiments, the PCB is rigid or flexible. In some embodiments, the substrate comprises silicone rubber, ceramic, metal, glass fiber, fiberglass, sized fiberglass, etched foil, a filled polymer, or combinations thereof. In some embodiments, the molding material comprises a thermoplastic material or a thermosetting material. In some embodiments, the thermoplastic material is selected from the group consisting of ethylene/methacrylic acid copolymer, propylene/methacrylic acid copolymer, ethylene/methacrylic acid/acrylate terpolymer, propylene/methacrylic acid/acrylate terpolymer, ethylene/acrylate copolymer, propylene/acrylate copolymer, succinic anhydride grafted polypropylene, succinic anhydride grafted polyethylene, polyurethane, polyamide, ethylene/butyl acrylate/glycidyl methacrylate terpolymer, propylene/butyl acrylate/glycidyl methacrylate terpolymer, ethylene/glycidyl methacrylate copolymer, propylene/glycidyl methacrylate copolymer, crosslinkable polyethylene, crosslinkable polypropylene, crosslinkable polyolefin, and combinations thereof. In some embodiments, the thermoplastic material comprises an injection molded thermoplastic material (e.g., an overmolded thermoplastic material, an insert molded thermoplastic material, etc.). In some embodiments, the heater is formed by injection molding the thermoplastic material around the heating component. In some embodiments, the heater is formed by overmolding the thermoplastic

material around the heating component. In some embodiments, the heater is formed by insert molding the thermoplastic material around the heating component. In some embodiments, the thermosetting material comprises one or more of silicone rubber, epoxy, and polyurethane.

[0040] In some embodiments, the molding material comprises micro-channels and/or structural features. In some embodiments, the micro-channels or structures are configured to hold a humidification liquid. In some embodiments, the molding material is hydrophilic or hydrophobic.

[0041] In some embodiments, the heating tracks are configured to heat the humidification liquid when in thermal communication with the heating component and to evaporate the humidification liquid into a gas flow path. In some embodiments, the heating component comprises an electrical connector.

[0042] Some embodiments pertain to a heater for a humidification chamber. In some embodiments, the heater comprises a heating component comprising heating tracks provided on a substrate. In some embodiments, the heater comprises a molding material encapsulating the heating component such that the heating component is separated from an internal area of the humidification chamber by the molding material. In some embodiments, the heater comprises a bonding layer coupling the molding material to the heating component.

[0043] In some embodiments, the bonding layer is a separate layer from the molding material and the heating component. In some embodiments, the bonding layer comprises pendant groups that are covalently bonded to the molding material and coinciding pendant groups that are covalently bonded to the electronic component. In some embodiments, the bonding layer comprises a silicon-containing linker layer. In some embodiments, the bonding layer chemically couples the molding material to the electronic component. In some embodiments, the bonding layer comprises one or more of covalent bonds, hydrogen bonds, van der Waals forces, and/or ionic bond linking the molding material and the portion of the heating component. In some embodiments, the bonding layer is formed at least in part through a reaction between one or more of an epoxy ring, amine, succinic anhydride, methoxyl or ethoxyl moiety with one or more of a carboxyl, amine, epoxy ring, succinic anhydride or reactive silanol moiety. An epoxy would be reactive with, at least, an amine or carboxyl. Succinic anhydride would be reactive with, at least, an amine. An amine would be reactive with, at least, a carboxyl, epoxy ring, and succinic anhydride. Ethoxyl and methoxyl would be reactive with a silanol. In some embodiments, the bonding layer is formed at least in part through a reaction between a succinic anhydride moiety and an amine moiety. In some embodiments, the bonding layer is formed at least in part through from a reaction between a succinic anhydride moiety and a secondary amine moiety.

[0044] In some embodiments, the silicon-containing linker is a silane coupling linker represented by:

or a polymerized silane coupling linker thereof; wherein ** is a point of attachment to the molding material; each R’ is independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy, and u— , wherein * is a point of attachment to the PCB, and at least one of the R’ is
; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and

**

N; and L— is selected from the group consisting of:

[0045] In some embodiments, the silicon-containing linker is a silicon alkoxide linker represented by:

or a polymerized silicon alkoxide linker thereof; wherein R” is independently hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxyl,
or u— , wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic material, and at least one of the R” is
and at least one of the R” is u— ; and Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene, wherein the C1-C8 heteroalkylene contains one or more heteroatoms selected from O and N.

[0046] In some embodiments, the silicon-containing linker is a siloxane linker selected from the group consisting of:

'

(L7), (L8), and a polymerized siloxane linker thereof; wherein each Z is independently hydroxyl or u— , wherein * is a point of attachment to the substrate; each Z’ is selected from the group

** consisting of epoxy, primary and secondary amine, succinic anhydride, and L— , wherein ** is a point of attachment to the thermoplastic material; L— is selected from the group consisting of:

Z” is hydrogen or
, wherein
is selected from the group consisting of:

point of attachment to the thermoplastic material; at least one of the Z is u— , and at least one of the Z’ is L— or at least one of the Z” is ; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N; Z’” is independently hydroxyl, u— or
, wherein * is a point of attachment to the substrate, ** is a point of attachment to the thermoplastic materials, at least one of the Z’” is u— , and at least one of the Z’” is u— ; m is an integer greater than 1; and n is an integer greater than 1.

[0047] In some embodiments, the heating component comprises a printed circuit board (PCB). In some embodiments, the PCB and/or the substrate of the PCB is rigid or flexible. In some embodiments, the PCB and/or the substrate of the PCB comprises silicone rubber, ceramic, metal, glass fiber, fiberglass, sized fiberglass, etched foil, a filled polymer, epoxy resin, phenol formaldehyde resin, paper or polyester resin, a polyester, a polyetherimide, a polyimide, an epoxy, a polyethylene, copper, an ink, or combinations thereof.

[0048] In some embodiments, the molding material comprises a thermoplastic material or a thermosetting material. In some embodiments, the thermoplastic material is selected from the group consisting of ethylene/methacrylic acid copolymer, propylene/methacrylic acid copolymer, ethylene/methacrylic acid/acrylate terpolymer, propylene/methacrylic acid/acrylate terpolymer, ethylene/acrylate copolymer, propylene/acrylate copolymer, succinic anhydride grafted polypropylene, succinic anhydride grafted polyethylene, polyurethane, polyamide, ethylene/butyl acrylate/glycidyl methacrylate terpolymer, propylene/butyl acrylate/glycidyl methacrylate terpolymer, ethylene/glycidyl methacrylate copolymer, propylene/glycidyl methacrylate copolymer, crosslinkable polyethylene, crosslinkable polypropylene, crosslinkable polyolefin, and combinations thereof.

[0049] In some embodiments, the heater is formed by injection molding the thermoplastic material around the heating component. In some embodiments, the heater is formed by overmolding the thermoplastic material around the heating component. In some embodiments, the heater is formed by insert molding the thermoplastic material around the heating component. In some embodiments, the thermosetting material comprises one or more of silicone rubber, epoxy, and polyurethane. In some embodiments, the molding material comprises micro-channels and/or structural features. In some embodiments, the micro channels or structures are configured to hold a humidification liquid. In some embodiments, the molding material is hydrophilic or hydrophobic.

[0050] In some embodiments, the heating tracks are configured to heat the humidification liquid when in thermal communication with the heating component and to evaporate the humidification liquid into a gas flow path. In some embodiments, the heating component comprises an electrical connector.

[0051] Some embodiments pertain to a humidification chamber comprising an inlet to receive gas from a gas source and an outlet to deliver gases to a patient, wherein the inlet and outlet define a gas flow path. In some embodiments, the humidification chamber includes the heater disclosed above or elsewhere herein. In some embodiments, the heater is configured to heat and humidify the gas when in the gas flow path. In some embodiments, the chamber is configured for use in a respiratory system or medical insufflation system.

[0052] Some embodiments pertain to a molded member. In some embodiments, the molded member comprises a thermoplastic material and a substrate. In some embodiments, at least a portion of the substrate is coupled to the thermoplastic material via a silicon-containing linker. In some embodiments, the silicon-containing linker is formed at least in part through a reaction between a succinic anhydride moiety and an amine moiety.

[0053] Some embodiments pertain to a method for coupling a thermoplastic material to a substrate. In some embodiments, the method comprises providing a substrate with at least one attached silicon-containing linking agent on the surface. In some embodiments, the method comprises contacting the thermoplastic material to the attached silicon-containing linking agent to form a bond between the thermoplastic material and the substrate. In some embodiments, the bond comprises a reaction product from a reaction

between a succinic anhydride moiety and an amine moiety. In some embodiments, the succinic anhydride moiety is provided on the silicon-containing linker. In some embodiments, the amine moiety is provided on the thermoplastic. In some embodiments, the amine moiety is provided on the silicon-containing linker. In some embodiments, the succinic anhydride moiety is provided on the thermoplastic. In some embodiments, the amine moiety comprises a secondary amine moiety. In some embodiments, providing the substrate with at least one attached silicon-containing linking agent on the surface comprises providing the substrate comprising hydroxyl and/or carboxyl on the surface, and reacting a silicon-containing linking agent with the hydroxyl and/or carboxyl on a surface of the substrate. In some embodiments, the reacting the silicon-containing linking agent with the hydroxyl and/or carboxyl on the substrate comprises hydrolyzing the silicon-containing linking agent to form a reactive silanol, and contacting reactive silanol with the hydroxyl and/or carboxyl on the substrate. In some embodiments, the reacting the silicon-containing linking agent with the hydroxyl and/or carboxyl on the substrate comprises plasma enhanced chemical vapor deposition (PECVD). In some embodiments, the providing the substrate comprising hydroxyl and/or carboxyl on the surface further comprises activating the substrate surface by plasma treatment, corona discharge, ozone treatment, chemical treatment, or flame treatment.

[0054] In some embodiments, the silicon-containing linking agent is a silane coupling agent. In some embodiments, the silane coupling agent is represented by the following formula:

wherein Ri, R2, R3, Rt, Rs, and Re are each independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, and C1-C8 alkoxy; at least one of Ri, R2, and R3 in (Al) or at least one of Ri, R2, R3, Rt, Rs, and R6 in (A2) is hydroxyl or C1-C8 alkoxy; Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; and X is selected from the group consisting of primary and secondary amine, and succinic anhydride.

[0055] In some embodiments, the silane coupling agent is selected from the group consisting of 3 -aminopropyl trimethoxysilane (APTMS), 3 -aminopropyl triethoxysilane (APTES), (3-triethoxysilyl)propylsuccinic anhydride (TEPSA), and bis(3-trimethoxysilylpropyl)amine. In some embodiments, the silicon-containing linking agent is a siloxane.

WHAT IS CLAIMED IS:

1. A respiratory humidification apparatus comprising:

a gas flow passage having an internal area, the gas flow passage having an inlet configured to receive gases into the internal area of the gas flow passage and an outlet configured to allow the passage of gases out of the internal area of the gas flow passage;

a heater having a heating surface, the heater disposed between the inlet and the outlet of the gas flow passage and configured to heat a humidification liquid received by the heating surface to humidify gases flowing through the gas flow passage, the heater comprising:

a printed circuit board (PCB) with heating tracks, the PCB having at least one electrical contact;

a molding material disposed over at least a portion of the PCB; and a bonding layer comprising a silicon-containing linker, the bonding layer coupling at least a portion of the molding material to the PCB;

wherein the respiratory humidification apparatus is configured to provide humidified gases to a patient.

2. The respiratory humidification apparatus of claim 1, wherein the PCB spans a portion of the gas flow passage from the internal area to an area that is external to the gas flow passage; wherein a portion of the PCB is exposed in the external area; and wherein a portion of the PCB is in thermal communication with the internal area of the gas flow passage.

3. The respiratory humidification apparatus of claim 1 or 2, wherein the PCB comprises one or more electrical components configured to receive, transmit, and/or process information about conditions of the respiratory humidification apparatus and/or gas flow passage.

4. The respiratory humidification apparatus of any one of claims 1 to 3, wherein the PCB comprises one or more temperature sensors in thermal communication with the internal area of the gas flow passage.

5. The respiratory humidification apparatus of any one of claims 1 to 4, wherein the PCB comprises two or more temperature sensors and wherein at least one of the temperature sensors is configured to measure a temperature of the heating surface.

6. The respiratory humidification apparatus of any one of claims 1 to 5, wherein the PCB comprises a temperature sensor configured to detect whether the heating surface is wetted by the humidification liquid in at least one region.

7. The respiratory humidification apparatus of any one of claims 4 to 6, wherein at least one temperature sensor is located at, on, adjacent, or proximal to the heating surface.

8. The respiratory humidification apparatus of any one of claims 1 to 7, wherein the PCB comprises one or more of a pressure sensor, a flow sensor, and/or a humidity sensor, wherein the one or more of a pressure sensor, a flow sensor, and/or a humidity sensor are configured to detect parameters of a gas in the gas flow passage.

9. The respiratory humidification apparatus of any one of claims 1 to 8, wherein the PCB comprises a fluid level sensor and/or a liquid sensor.

10. The respiratory humidification apparatus of any one of claims 1 to 9, wherein the heating tracks of the PCB are in thermal communication with the internal area of the gas flow passage.

11. The respiratory humidification apparatus of claim 10, wherein the heating tracks of the PCB are covered by the molding material and are in thermal communication with the internal area of the gas flow passage through the molding material.

12. The respiratory humidification apparatus of claim 10 or 11, wherein the heating surface comprises a portion of the molding material covering the heating tracks.

13. The respiratory humidification apparatus of any one of claims 3 to 12, wherein the molding material covers one or more of the electrical components and/or sensors of the PCB; and wherein the molding material separates the one or more of the electrical components and/or sensors from direct contact to the internal area of the gas flow passageway.

14. The respiratory humidification apparatus of claim 13, wherein molding material is configured to allow monitoring of the internal area of the gas flow passageway by the electrical components and/or sensors of the PCB through the molding material.

15. The respiratory humidification apparatus of any one of claims 1 to 14, wherein the respiratory humidification apparatus comprises a humidification liquid inlet for delivering the humidification liquid from a reservoir to the heater.

16. The respiratory humidification apparatus of any one of claims 1 to 15, wherein the respiratory humidification apparatus comprises a humidification liquid pre-heater.

17. The respiratory humidification apparatus of any one of claims 1 to 16, wherein the respiratory humidification apparatus comprises a humidification liquid flow controller.

18. The respiratory humidification apparatus of claim 17, wherein liquid flow controller comprises a metering system and/or a pump.

19. The respiratory humidification apparatus of any one of claims 1 to 18, wherein respiratory humidification apparatus comprises a gas pre-heater.

20. The respiratory humidification apparatus of any one of claims 1 to 19, wherein the molding material comprises a thermoplastic material.

21. The respiratory humidification apparatus of any one to claims 1 to 19, wherein the molding material comprises a thermosetting material.

22. The respiratory humidification apparatus of any one of claims 1 to 21, wherein the molding material encapsulates at least a portion of the PCB.

23. The respiratory humidification apparatus of claim 22, wherein the portion of the PCB encapsulated by the molding material comprises a portion of the heating tracks.

24. The respiratory humidification apparatus of claim 22 or 23, wherein the molding material provides a barrier between the PCB and the gas flow passage.

25. The respiratory humidification apparatus of any one of claims 1 to 24, wherein the at least one electrical contact of the PCB is not encapsulated and/or covered by the molding material.

26. The respiratory humidification apparatus of any one of claims 1 to 25, wherein a portion of the molding material comprises micro-channels and/or surface structures.

27. The respiratory humidification apparatus of claim 26, wherein the micro channels and/or surface structures are configured to receive, distribute, and/or hold the humidification liquid so it can be heated by the heating tracks.

28. The respiratory humidification apparatus of any one of claims 1 to 27, wherein a portion of the molding material is configured to receive the humidification liquid and retain it so that it can be heated by the heating tracks.

29. The respiratory humidification apparatus of claim 28, wherein the portion of molding material that is configured to receive the humidification liquid is coupled to the PCB by the bonding layer.

30. The respiratory humidification apparatus of any one of claims 1 to 29, wherein the molding material is hydrophilic or hydrophobic.

31. The respiratory humidification apparatus of any one of claims 1 to 30, wherein the bonding layer chemically couples the molding material to the portion of the PCB.

32. A heater for a humidification chamber comprising:

a heating component comprising heating tracks and a substrate, the heating tracks being provided on the substrate;

a molding material disposed on at least a portion of the heating component; a bonding layer coupling at least a portion of the molding material to the heating component; and

wherein bonding layer comprises a silicon-containing linker.

33. The heater of claim 32, wherein the bonding layer is a separate layer from the molding material and the heating component

34. The heater of any one of claims 32 to 33, wherein the bonding layer chemically couples the molding material to the portion of the heating component.

35. The heater of any one of claims 32 to 34, wherein the bonding layer comprises one or more of covalent bonds, hydrogen bonds, van der Waals forces, and/or ionic bond linking the molding material to the portion of the heating component.

36. The heater of any one of claims 32 to 35, wherein the bonding layer is formed through a reaction between one or more of an epoxy ring, amine, succinic anhydride, methoxyl or ethoxyl moiety and one or more of a carboxyl, amine, epoxy ring, succinic anhydride or reactive silanol moiety.

37. The heater of any one of claims 32 to 36, wherein bonding layer is formed at least in part through a reaction between a succinic anhydride moiety with an amine moiety.

38. The heater of any one of claims 32 to 36, wherein bonding layer is formed at least in part through a reaction between a succinic anhydride moiety and a secondary amine moiety.

39. The heater of any one of claims 32 to 38, wherein the silicon-containing linker is a silane coupling linker represented by:

or a polymerized silane coupling linker thereof;

wherein ** is a point of attachment to the molding material;

each R’ is independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy, and u— , wherein * is a point of attachment to the heating component, and at least one of the R’ is ;

Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; and

is selected from the group consisting of:

p consisting of:

40. The heater of any one of claims 32 to 35, wherein the silicon-containing linker on alkoxide linker represented by:

R" R" R"

R"_ i_R" R"_ i_Y_ i_R"

RM R" D'l

(L3), K K (L4),

or a polymerized silicon alkoxide linker thereof;

wherein R” is independently hydrogen, halogen, hydroxyl, C1-C8 alkyl, Cl-C8 alkoxyl, u— or u— , wherein * is a point of attachment to the heating component, ** is a point of attachment to the molding material, and at least one of the
Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene, wherein the Cl-C8 heteroalkylene contains one or more heteroatoms selected from O and N.

41. The heater of any one of claims 32 to 38, wherein the silicon-containing linker xane linker selected from the group consisting of:

polymerized siloxane linker thereof;

wherein each Z is independently hydroxyl or u— , wherein * is a point of attachment to the heating component;

each Z’ is selected from the group consisting of epoxy, primary and secondary

*

amine, succinic anhydride, and L— , wherein ** is a point of attachment to the molding material;

*

L— is selected from the group consisting of:

Z” is hydrogen or , wherein is selected from the group consisting of:

point of attachment to the molding material;

at least one of the Z is u— , and at least one of the Z’ is L— or at least one of the
Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N;

Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N;

Z’” is independently hydroxyl, u— or u— , wherein * is a point of attachment to the heating component, ** is a point of attachment to the molding material, at least one of the Z’” is u— , and at least one of the Z’” is u— ; m is an integer greater than 1 ; and

n is an integer greater than 1.

42. The heater of any one of claims 32 to 41, wherein heating component is a printed circuit board (PCB).

43. The heater of any one of claims 32 to 42, wherein the molding material comprises a thermoplastic material.

44. The heater of claim 43, wherein thermoplastic material comprises an overmolded thermoplastic material.

45. The heater of any one to claims 32 to 36 and 42, wherein the molding material comprises a thermosetting material

46. The heater of claim 45, wherein the thermosetting material comprises one or more of silicone rubber, epoxy, and polyurethane.

47. The heater of any one of claims 32 to 46, wherein the molding material comprises micro-channels and/or structural features.

48. The heater of any one of claims 32 to 47, wherein the molding material is hydrophilic or hydrophobic.

49. The heater of any one of claims 32 to 48, wherein the heating tracks are configured to heat a humidification liquid when in thermal communication with the heating component and to evaporate the humidification liquid into a gas flow path.

50. A heater for a humidification chamber comprising:

a heating component comprising heating tracks provided on a substrate;

a molding material encapsulating a portion of the heating component such that the portion of the heating component is separated from an internal area of the humidification chamber by the molding material; and

a bonding layer coupling a portion of the molding material to a portion of the heating component.

51. The heater of claim 50, wherein the bonding layer is a separate layer from the molding material and the heating component.

52. The heater of any one of claims 50 to 51, wherein bonding layer comprises a silicon-containing linker layer.

53. The heater of any one of claims 50 to 52, wherein the bonding layer chemically couples the molding material to the heating component.

54. The heater of any one of claims 50 to 53, wherein the bonding layer comprises one or more of covalent bonds, hydrogen bonds, van der Waals forces, and/or ionic bond linking the molding material and the portion of the heating component.

55. The heater of any one of claims 50 to 54, wherein the bonding layer is formed at least in part through a reaction between one or more of an epoxy ring, amine, succinic anhydride, methoxyl or ethoxyl moiety with one or more of a carboxyl, amine, epoxy ring, succinic anhydride or reactive silanol moiety.

56. The heater of any one of claims 50 to 55, wherein bonding layer is formed at least in part through a reaction between a succinic anhydride moiety and an amine moiety.

57. The heater of any one of claims 50 to 55, wherein bonding layer is formed at least in part through from a reaction between a succinic anhydride moiety and a secondary amine moiety.

58. The heater of any one of claims 52 to 57, wherein the silicon-containing linker ne coupling linker represented by:

R'_ i_R' R'— Ji— Y— ill— Y— Ji— R'

· (Ll), R R (L2), or a polymerized silane coupling linker thereof;

wherein ** is a point of attachment to the molding material;

each R’ is independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy, and u— , wherein * is a point of attachment to the heating component, and at least one of the R’ is
;

Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; and

m the group consisting of:

is selected from the group consisting of:

59. The heater of any one of claims 50 to 54, wherein the silicon-containing linker on alkoxide linker represented by:

R" R" R"

R"_ i_R" R"_ i_y_ i_R"

(L3), K K (L4),

or a polymerized silicon alkoxide linker thereof;

wherein R” is independently hydrogen, halogen, hydroxyl, C1 -C8 alkyl, Cl-C8 alkoxyl,
or * , wherein * is a point of attachment to the heating component, ** is a point of attachment to the molding material, and at least one of the R” is u— and at least one of the
Y is a single bond, C1-C8 alkylene, or C1 -C8 heteroalkylene, wherein the Cl-C8 heteroalkylene contains one or more heteroatoms selected from O and N.

60. The heater of any one of claims 50 to 57, wherein the silicon-containing linker xane linker selected from the group consisting of:

polymerized siloxane linker thereof;

wherein each Z is independently hydroxyl or u— , wherein * is a point of attachment to the heating component;

each Z’ is selected from the group consisting of epoxy, primary and secondary amine, succinic anhydride, and L— , wherein ** is a point of attachment to the molding material;

m the group consisting of:

Z” is hydrogen or , wherein is selected from the group consisting of:

point of attachment to the molding material;

at least one of the Z is u— , and at least one of the Z’ is L— or at least one of the
Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N;

Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N;

Z’” is independently hydroxyl, u— or u— , wherein * is a point of attachment to the heating component, ** is a point of attachment to the molding material, at least one of the Z’” is u— , and at least one of the Z’” is u— ; m is an integer greater than 1 ; and

n is an integer greater than 1.

61. The heater of any one of claims 50 to 60, wherein heating component comprises a printed circuit board (PCB).

62. The heater of any one of claims 50 to 61, wherein the substrate comprises silicone rubber, ceramic, metal, glass fiber, fiberglass, sized fiberglass, etched foil, a filled polymer, epoxy resin, phenol formaldehyde resin, paper or polyester resin, a polyester, a polyetherimide, a polyimide, an epoxy, a polyethylene, an ink, or combinations thereof.

63. The heater of any one of claims 50 to 62, wherein the molding material comprises a thermoplastic material.

64. The heater of any one to claims 50 to 55 or 61 or 62, wherein the molding material comprises a thermosetting material.

65. The heater of claim 64, wherein the thermosetting material comprises one or more of silicone rubber, epoxy, and polyurethane.

66. The heater of any one of claims 50 to 65, wherein the molding material comprises micro-channels and/or structural features.

67. The heater of any one of claims 50 to 66, wherein the molding material is hydrophilic or hydrophobic.

68. The heater of any one of claims 50 to 67, wherein the heating tracks are configured to heat the humidification liquid when in thermal communication with the heating component and to evaporate the humidification liquid into a gas flow path.

69. A humidification chamber comprising:

an inlet to receive gas from a gas source and an outlet to deliver gases to a patient, wherein the inlet and outlet define a gas flow path;

the heater of any one of claims 32 to 68 configured to heat and humidify the gas when in the gas flow path.

70. A molded member comprising:

a thermoplastic material and a substrate;

wherein at least a portion of the substrate is coupled to the thermoplastic material via a silicon-containing linker;

wherein the silicon-containing linker is formed at least in part through a reaction between a succinic anhydride moiety and an amine moiety.

71. A method for coupling a thermoplastic material to a substrate comprising: providing the substrate with at least one attached silicon-containing linking agent on the surface; and

contacting the thermoplastic material to the attached silicon-containing linking agent to form a bond between the thermoplastic material and the substrate;

wherein the bond comprises a reaction product from a reaction between a succinic anhydride moiety and an amine moiety.

72. The molded member of claim 70 or the method of claim 71, wherein the succinic anhydride moiety is provided on the silicon-containing linker.

73. The molded member of claim 70 or 72 or the method of claim 71 or 72, wherein the amine moiety is provided on the thermoplastic.

74. The molded member of claim 70 or the method of claim 71, wherein the amine moiety is provided on the silicon-containing linker.

75. The molded member of claim 70 or 74 or the method of claim 71 or 74, wherein the succinic anhydride moiety is provided on the thermoplastic.

76. The molded member of claim 70 or any one of claims 72 to 75 or the method of any one of claims 71 to 75, wherein the amine moiety comprises a secondary amine moiety.

77. The method of any one of claims 71 to 76, wherein providing the substrate with at least one attached silicon-containing linking agent on the surface comprises providing the substrate comprising hydroxyl and/or carboxyl on the surface, and reacting a silicon-containing linking agent with the hydroxyl and/or carboxyl on a surface of the substrate.

78. The method of claim 77, wherein the reacting the silicon-containing linking agent with the hydroxyl and/or carboxyl on the substrate comprises hydrolyzing the silicon-containing linking agent to form a reactive silanol, and contacting reactive silanol with the hydroxyl and/or carboxyl on the substrate.

79. The method of claim 77, wherein the reacting the silicon-containing linking agent with the hydroxyl and/or carboxyl on the substrate comprises plasma enhanced chemical vapor deposition (PECVD).

80. The method of any one of claims 77 to 79, wherein the providing the substrate comprising hydroxyl and/or carboxyl on the surface further comprises activating the substrate surface by plasma treatment, corona discharge, ozone treatment, chemical treatment, or flame treatment.

81. The molded member of claim 70 or any one of claims of 72 to 80 or the method of any one of claims 71 to 80, wherein the silicon-containing linking agent is a silane coupling agent.

82. The molded member or method of claim 81, wherein the silane coupling agent is represented by the following formula:

wherein Ri, R2, R3, Rt, R5, and R6 are each independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, and C1-C8 alkoxy; at least one of Ri, R2, and R3 in (Al) or at least one of Ri, R2, R3, Rt, Rs, and R5 in (A2) is hydroxyl or C1-C8 alkoxy;

Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N; and

X is selected from the group consisting of primary and secondary amine, and succinic anhydride.

83. The molded member or method of claim 82, wherein the silane coupling agent is selected from the group consisting of 3-aminopropyl trimethoxysilane (APTMS), 3-

aminopropyl triethoxysilane (APTES), (3-triethoxysilyl)propylsuccinic anhydride (TEPSA), and bis(3-trimethoxysilylpropyl)amine.

84. The molded member of claim 70 or any one of 72 to 80 or the method any one of claims 71 to 80, wherein the silicon-containing linking agent is a siloxane.

85. The molded member or method of claim 84, wherein the silane coupling agent is represented by the following formula:

wherein Ri, R2, R3, Rt, R5, and R6 are each independently selected from the group consisting of hydrogen, halogen, hydroxyl, C1-C8 alkyl, and C1-C8 alkoxy; at least one of Ri, R2, R3, R4, and R5 in (A5), at least one of Ri, R2, R3, R4, Rs, and R6 in (A6) and (A7), and at least two of Ri and R2 in (A8) are independently hydroxyl or C1-C8 alkoxy;

Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N;

Y’ is C1-C8 alkyl or C1-C8 heteroalkyl containing one or more heteroatoms selected from O and N;

X is selected from the group consisting of primary amine, secondary amine, and succinic anhydride;

m is an integer 1 or greater; and

n is an integer 1 or greater.

86. The molded member or method of claim 84 or 85, wherein the siloxane is selected from the group consisting of aminopropyl silsesquioxane, aminoethyl aminopropyl silsesquioxane, aminopropylsilsesquioxane-methylsilsequioxane, and non-functional siloxane.

87. The molded member of claim 70 or any one of claims 72 to 86 or the method of any one of claims 71 to 86, wherein the substrate is a portion of a printed circuit board (PCB).

88. The molded member or method of claim 87, wherein the PCB is rigid.

89. The molded member or method of claim 87, wherein the PCB is flexible.

90. The molded member or method of any one of claims 87 to 89, wherein the PCB comprises one or more sensor.

91. The molded member or method of claim 90, wherein the one or more sensor is selected from the group consisting of temperature sensor, flow sensor, pressure sensor, humidity sensor, and fluid level sensor.

92. The molded member or method of any one of claims 87 to 91, wherein the PCB comprises a heating element.

93. The molded member or method of any one of claims 87 to 92, wherein the PCB comprises an electrical connector.

94. A respiratory apparatus comprising:

a molded member comprising a thermosetting material and a substrate;

wherein at least a portion of the substrate is coupled to the thermosetting material via a silicon-containing linker.

95. The respiratory apparatus of claim 94, wherein the silicon-containing linker is represented by the following formula:

polymerized silicon- containing linker thereof;

wherein ** is a point of attachment to the thermosetting material;

each R’ is independently hydrogen, halogen, hydroxyl, C1-C8 alkyl, C1-C8 alkoxy, or u— , wherein * is a point of attachment to the substrate, wherein at least one of the R’ is u— ;

Y is a single bond, C1-C8 alkylene, or C1-C8 heteroalkylene containing one or more heteroatoms selected from O and N.

96. The respiratory apparatus of claim 94 or 95, wherein the thermosetting material comprises a -Si-H moiety.

97. The respiratory apparatus of any one of claims 94 to 96, wherein the thermosetting material is a silicone rubber, epoxy or polyurethane.

98. The respiratory apparatus of any one of claims 94 to 97, wherein the molded member is a housing for a filter, a gas conduit, a chamber, an inspiratory tube, a tube connector, a tube joint, a tube elbow, a heating element, or a patient interface component.

99. The respiratory apparatus of any one of claims 94 to 98, wherein the thermosetting material is a molding material on the substrate.

100. The respiratory apparatus of any one of claims 94 to 99, wherein the molded member is formed by injection molding the molding material around the substrate.

101. The respiratory apparatus of any one of claims 94 to 99, wherein the molded member is formed by insert molding the molding material around the substrate.

102. The respiratory apparatus of any one of claims 94 to 99, wherein the molded member is formed by overmolding the molding material around the substrate.

103. The respiratory apparatus of any one of claims 94 to 102, wherein the molding material comprises micro-channels or structures on a surface.

104. The respiratory apparatus of any one of claims 94 to 103, wherein the substrate comprises a material that can be activated to form hydroxyl groups on the surface.

105. The respiratory apparatus of any one of claims 94 to 104, wherein the substrate is silicone rubber, ceramic, metal, glass fiber, fiberglass, sized fiberglass, etched foil, a filled polymer, epoxy resin, phenol formaldehyde resin, paper or polyester resin, a polyester, a polyetherimide, a polyimide, an epoxy, a polyethylene, copper, an ink, or combinations thereof.

106. The respiratory apparatus of any one of claims 94 to 105, wherein the substrate is a portion of a printed circuit board (PCB).

107. The respiratory apparatus of claim 106, wherein the PCB is rigid.

108. The respiratory apparatus of claim 106, wherein the PCB is flexible.

109. The respiratory apparatus of any one of claims 106 to 108, wherein the PCB comprises one or more sensor.

110. The respiratory apparatus of claim 109, wherein the one or more sensors comprises a temperature sensor, pressure sensor, flow sensor, humidity sensor, fluid level sensor, or combinations thereof.

111. The respiratory apparatus of any one of claims 106 to 110, wherein the PCB comprises a heating element.

112. The respiratory apparatus of any one of claims 106 to 111, wherein the PCB comprises an electrical connector.