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Mems Devices Utilizing A Thick Metal Layer Of An Interconnect Metal Film Stack
Abstract: A MEMS device such as an accelerometer or gyroscope fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer but also lacking the thick metal layer. In further embodiments the frame is released and includes regions with the thick metal layer to better match film stress induced static deflection of the proof mass.
Notices, Deadlines & Correspondence
Patent Information
Applicants
INTEL CORPORATION
Inventors
1. MAHAMEED Rashed
2. DORSEY Kristen L.
3. M M ABDELMEJEED Mamdouh O.
4. ABDELMONEUM Mohamed A.
Specification
SOFT COPY ATTACHED IN PDF
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | Drawing [24-12-2015(online)].pdf | 2015-12-24 |
| 2 | Description(Complete) [24-12-2015(online)].pdf | 2015-12-24 |
| 3 | 7966-CHENP-2015.pdf | 2016-01-01 |
| 4 | Form 13 [14-03-2016(online)].pdf | 2016-03-14 |
| 5 | 7966-CHENP-2015-POWER OF ATTORNEY-220116.pdf | 2016-06-24 |
| 6 | 7966-CHENP-2015-CORRESPONDENCE-PA-220116.pdf | 2016-06-24 |
| 7 | 7966-CHENP-2015-OTHERS-180416.pdf | 2016-07-08 |
| 8 | 7966-CHENP-2015-FER.pdf | 2019-05-24 |
| 9 | 7966-CHENP-2015-FORM 3 [08-11-2019(online)].pdf | 2019-11-08 |
| 10 | 7966-CHENP-2015-Information under section 8(2) (MANDATORY) [14-11-2019(online)].pdf | 2019-11-14 |
| 11 | 7966-CHENP-2015-OTHERS [20-11-2019(online)].pdf | 2019-11-20 |
| 12 | 7966-CHENP-2015-FER_SER_REPLY [20-11-2019(online)].pdf | 2019-11-20 |
| 13 | 7966-CHENP-2015-CLAIMS [20-11-2019(online)].pdf | 2019-11-20 |
| 14 | 7966-CHENP-2015-ABSTRACT [20-11-2019(online)].pdf | 2019-11-20 |
| 15 | 7966-CHENP-2015-US(14)-HearingNotice-(HearingDate-19-09-2022).pdf | 2022-08-24 |
| 16 | 7966-CHENP-2015-Correspondence to notify the Controller [15-09-2022(online)].pdf | 2022-09-15 |
| 17 | 7966-CHENP-2015-Written submissions and relevant documents [28-09-2022(online)].pdf | 2022-09-28 |
| 18 | 7966-CHENP-2015-PatentCertificate31-10-2022.pdf | 2022-10-31 |
| 19 | 7966-CHENP-2015-IntimationOfGrant31-10-2022.pdf | 2022-10-31 |
| 20 | 7966-CHENP-2015-FORM-27 [28-09-2024(online)].pdf | 2024-09-28 |
Search Strategy
| 1 | searchstrategy_24-09-2018.pdf |