DESC:
FIELD OF INVENTION
[001] The field of invention generally relates to the field of metal cards. More specifically, the field of invention relates to a method of manufacture of metal cards comprising multiple layers of materials.

BACKGROUND
[002] In the new era of faster and cashless transactions, it has been found that it is easier to carry a single transaction card than to carry cash. Users prefer transaction cards as transaction cards are more efficient and easier to carry with themselves. Transaction cards are more efficient and are available in various types such as tap-and-pay and swipe cards. Either type of card enables fast transactions and consequently, less hassle of handling money in cash.
[003] Currently, existing transaction cards are more commonly found to be made of plastic. Major shortcomings of transaction cards made of plastic are that cards made of plastic are not durable and are hence not long-lasting. Cards made of plastic are also easier to break by accidental snapping. Moreover, since transaction cards store sensitive information such as details of a user’s bank accounts, funds in the bank accounts, user identity, etc., it is important that the transaction cards are sturdy and reliable.
[004] Other existing systems have tried to address this problem. However, the scope of these systems has been limited to the production of metal cards that are either too heavy or too thick. Heavy or thick metal cards are also not convenient as they are a hassle to carry or fit into a purse slot dedicated to transaction cards.
[005] Alternatively, access control cards such as biometric cards, etc., that are commonly made of plastic can also be eliminated and replaced with metal cards. This results in an increased lifetime of the cards and further helps in reducing recurring contamination of the environment due to plastic.
[006] Thus, in light of the above discussion, it is implied that there is a need for a method of manufacture of metal cards that is reliable and does not suffer from the problems discussed above.
OBJECT OF INVENTION
[007] The principal object of this invention is to provide a method of manufacturing metal cards.
[008] A further object of the invention is to provide a method of manufacturing metal cards comprising layers of different materials.
[009] Another object of the invention is to provide a method of manufacturing dual interface metal cards comprising a chip and an antenna.
[0010] Another object of the invention is to provide a metal card and its method of manufacture, where the metal card comprises a hollow slot with an adhesive-covered step-down lip to securely affixing the chip onto the metal card.

BRIEF DESCRIPTION OF FIGURES
[0011] This invention is illustrated in the accompanying drawings, throughout which, like reference letters indicate corresponding parts in the various figures.
[0012] The embodiments herein will be better understood from the following description with reference to the drawings, in which:
[0013] Figure 1a depicts a front view of a metal card, in accordance with an embodiment of the invention;
[0014] Figure 1b depicts/illustrates a back view of the metal card, in accordance with an embodiment of the invention;
[0015] Figure 2a depicts/illustrates various layers comprised in the metal card, in accordance with an embodiment of the invention;
[0016] Figure 2b depicts/illustrates deposition of the various layers and manufacture of the metal card, in accordance with an embodiment of the invention;
[0017] Figure 3 depicts/illustrates an antenna connected with a chip comprised in the metal card, in accordance with an embodiment of the invention;
[0018] Figure 4 elaborately illustrates a method for manufacturing metal cards, in accordance with an embodiment of the invention.

STATEMENT OF INVENTION
[0019] The present invention discloses, by way of an illustrative embodiment, a method of manufacturing metal cards. In this method, metal cards, such as transaction cards or access control cards, are manufactured in a way that the thickness of said card does not exceed a certain range. The metal cards manufactured in this process are more durable than common transaction cards. The metal component present in said card aids in improving life period of the cards.
[0020] In this invention, thin layers of various materials are deposited on an overlay layer, thus resulting in a metal card that may be further used for multiple or specific purposes. The manufacturing process disclosed in the invention results in the manufacture of a metal card that is easy to use and carry.
[0021] The metal cards manufactured in said process comprise inlay and overlay layers, and an insulation layer to avoid an antenna or the inlay layer present in the disclosed metal card from being in contact with a metal sheet present on the top layer of said card. The metal card comprises a chip deposited on the external metal sheet.

DETAILED DESCRIPTION
[0023] The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and/or detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
[0024] The present invention discloses, by way of an illustrative embodiment, a method of manufacturing metal cards. In this method, metal cards, such as transaction cards or access control cards, are manufactured in a way that the thickness of said card does not exceed a certain range. The metal cards manufactured in this process are more durable than common transaction cards. The metal component present in said card aids in improving life period of the cards.
[0025] In this invention, thin layers of various materials are deposited on an overlay layer, thus resulting in a metal card that may be further used for multiple or specific purposes. The manufacturing process disclosed in the invention results in the manufacture of a metal card that is easy to use and carry.
[0026] Throughout the description, a method for manufacturing metal cards comprising more than one thin layer of different materials has been described. This embodiment should not be read as a limitation of this invention and the scope of this description covers other embodiments where metal cards or a method of manufacturing metal cards may be utilized.
[0027] Further, in the present invention, metal cards have been described without describing functions of the metal cards. In various embodiments of the invention, metal cards manufactured using the disclosed process may be used as transaction cards or may be used as access control cards or identification cards, amongst other purposes. However, for the purpose of the present invention, the metal cards are transaction cards in a preferred embodiment.
[0028] In the context of the present invention, a transaction card may be understood as any transaction card having a rectangular shape and specific dimensions as found in prior arts. Said transaction card may comprise a magnetic stripe or a microchip, or a combination of both.
[0029] In a further context of the present invention, an access control card may be a biometric card or an identification card comprising a magnetic stripe or a biometric sensor, or any sensor as required for the access control card.
[0030] In an embodiment, the transaction enabled by the metal card 102 is not restricted to financial transactions. The metal card 102 may be used for financial or non-financial transactions, comprising one or more of purchasing, credit cards, debit cards, reward cards, access cards, identity cards, and biometric entry cards, among others.
[0031] Accordingly, in an embodiment, the metal card 102 is enabled to communicate with one or more external transaction systems, security systems, banking systems, and identity verification systems, among others, based on the type of card application mentioned above.
[0032] In the present invention, a general manufacturing system commonly known in the art for manufacturing cards may be used. The manufacturing system may comprise the commonly known manufacturing components such as manufacturing plates, an assembly line, and the like.
[0033] Referring now to the drawings, where similar reference characters denote corresponding features consistently throughout the figures, there are shown preferred embodiments.
[0034] Figure 1a depicts/illustrates a front view of a metal card 102, in accordance with an embodiment of the invention.
[0035] In a preferred embodiment, the metal card 102 is any general transaction card in terms of structure and front surface dimensions.
[0036] In a preferred embodiment, the metal card 102 comprises details of respective users on an upper surface of the metal card 102. The details of a user may comprise personal and financial data pertaining to the user such as, but not limited to the name of the user, name of a financial institution issuing the metal card 102, type of card, year of expiry of the metal card 102, as well as more sensitive information such as card number, account number, etc.
[0037] Figure 1b depicts a second view of the metal card 102, in accordance with an embodiment of the invention. The second view is a back view of the metal card 102.
[0038] A back surface of the metal card 102 comprises space for more components such as, but not limited to, a magnetic strip, a space for signature of the user, and sensitive information such as secure codes related to the metal card 102.
[0039] In an overview of the metal card 102 disclosed in the invention, the metal card 102 looks like a general transaction card based upon its structure and the type of details on the upper surface of the metal card 102.
[0040] In a preferred embodiment of the invention, the metal card 102 comprises various layers of different materials that together form the metal card 102. The various layers comprised in the metal card 102 are depicted at 200/1 in Figure 2a.
[0041] Initially, an overlay layer 202 is deposited as a first layer. The overlay layer 202 forms a base layer on which other layer of the metal card 102 (as depicted in Figure 1a) are constructed. In a preferred embodiment of the invention, the overlay layer 202 may be made of any material such as, but not limited to, plastic or metal, or a polymer layer.
[0042] In certain embodiments of the invention, if the overlay layer 202 is made of plastic, the plastic used may be biodegradable plastic.
[0043] In an embodiment of the invention, thickness of the overlay layer 202 may be of any dimension. In another embodiment of the invention, the thickness of the overlay layer 202 may be approximately 50- 70 microns, and in particular, approximately 60 microns.
[0044] Further, once an overlay layer 202 has been deposited, a printing core layer 204 is deposited on the overlay layer 202.
[0045] In a preferred embodiment of the invention, components essential for an efficient functioning of the metal card 102 may be deposited or printed on the printing core layer 204.
[0046] The printing core layer 204 may also further aid in providing a hue to the metal card 102. Additionally, the printing core layer 204 may provide a solid base for the construction of the metal card 102.
[0047] The printing core layer 204, in one embodiment of the invention, may be made of PVC (polyvinyl chloride). Alternatively, the printing core layer 204 may also be made of other materials such as a polymer, etc.
[0048] In an embodiment of the invention, the thickness of the printing core layer 204 may be approximately 150 microns. In other embodiments of the invention, the thickness of the printing core layer 204 may be approximately 100 microns to 200 microns.
[0049] Further, in the present invention, an inlay layer 206 is deposited on the printing core layer 204.
[0050] In a preferred embodiment of the invention, the inlay layer 206 may be an antenna constructed on the printing core layer 204 in order to aid wireless communication in the metal card 102.
[0051] In an embodiment of the invention, the inlay layer 206 may be made from a conducting material such as a metal, for example, thin copper wires, or wires made of any conducting material.
[0052] In a preferred embodiment of the invention, thickness of the antenna or the inlay layer 206 may be approximately 120 microns. This thickness may also be in a range from approximately 100 to 140 microns.
[0053] Once an antenna has been constructed, or an inlay layer 206 has been deposited on the printing core layer 204, an insulation layer 208 is deposited on the inlay layer 206.
[0054]
[0055] In a preferred embodiment of the invention, thickness of the insulation layer 208 may be approximately 110 microns. The insulation layer 208 may be a ferrite insulation material and may be deposited on the inlay layer 206 using an adhesive material.
[0056] In a preferred embodiment of the invention, the adhesive may be any general adhesive commonly known in the art used in the process of manufacturing transaction cards.
[0057] Alternatively, the insulation layer 208 may be made of an insulating material such as fiber, plastic or ceramic, etc. In another embodiment, the insulation layer 208 may also be made of other insulating materials such as ceramic material or asbestos and the like.
[0058] The insulation layer 208 prevents the antenna or the inlay layer 206 from coming in contact with a further layer of a metal sheet 210 deposited on the insulation layer 208.
[0059] Finally, a metal sheet 210 is created / printed / deposited on the insulation layer 208. The metal sheet 210 in the present invention may be made of any metal such as stainless steel or polished aluminum. Alternatively, the metal sheet 210 may also be made of gold, silver, or platinum, and the like.
[0060] In a preferred embodiment of the invention, the metal sheet 210 may be approximately 400 microns thick. In other embodiments of the invention, thickness of the metal sheet 210 may vary from 350 to 450 microns, or as per requirements.
[0061] Further, in a preferred embodiment, metal sheet 210 may comprise a hollow slot for accommodating a chip 212. The hollow slot may be approximately 0.2 mm thick. In other embodiments of the invention, the thickness of the hollow slot for holding the chip 212 may vary and may between 0.1 mm and 0.3mm, as per the size of the chip 212.
[0062] Further, in a preferred embodiment, metal sheet 210 may comprise a cavity for allowing RF(Radio Frequency) signal flow between chip 212 and antenna /Inlay. The cavity may be approximately 0.1 mm thick. In other embodiments of the invention, the dimensions of the cavity may change proportionally when using different size of chip.
[0063] In an embodiment. the hollow slot may comprise an upper level and a lower level. The hollow slot may comprise a step-down lip, which is equivalent to the lower level in the hollow slot. The step-down lip may comprise a cavity of a smaller size than the upper level of the hollow slot.
[0064] In an embodiment, the step-down lip may be circular, square or any other preferred shape. The periphery of the step-down lip, i.e., the lower level may comprise an adhesive such that when the chip 212 is placed in the hollow slot, the chip 212 rests on the adhesive in the periphery of the step-down lip. Thus, advantageously, the step-down lip aids in securely affixing the chip 212 onto the metal sheet 210 in the metal card 102.
[0065] Further, in the invention, a lower surface of the chip 212 may rest on the insulation layer 208 and an upper surface of the chip 212 may be on a same level as an upper and external surface of the metal sheet 210, i.e., the constructed metal card 102, thus resulting in a smooth upper surface of the metal card 102.
[0066] In an embodiment of the invention, the chip 212 may be made of a conducting material such as copper, etc.
[0067] Figure 2b depicts/illustrates a process 200/2 of compressing the various layers of materials into a metal card 102.
[0068] In a preferred embodiment of the invention, every layer comprised in the metal card 102 may be exposed to a separate compression technique during manufacture.
[0069] The insulation layer 208 may be deposited on the inlay layer 206 using lamination techniques, whereas the inlay layer 206 may be deposited or constructed on the printing core layer 204 using embedding techniques.
[0070] Once a metal card 102 is manufactured using the aforementioned techniques, a magnetic stripe 214 is deposited on a back side of the metal card 102. In the present invention, said magnetic stripe 214 may be approximately 60 microns thick. This thickness may also be between 50 – 70 microns, as per requirements. In other embodiments of the invention, the thickness of the magnetic stripe 214 may vary.
[0071] In a preferred embodiment of the invention, a HiCo magnetic stripe may be used to store sensitive user information. Any person skilled in the art will realize a HiCo stripe is also known as high coercivity stripe that is generally known to be durable and more secure as compared to other commonly known magnetic stripes.
[0072] Figure 3 depicts an illustration 300 showing an electrical connection between a chip 212 and an antenna or an inlay layer 206.
[0073] As aforementioned, the inlay layer 206 is deposited or the antenna is constructed on the printing core layer 204.
[0074] The chip 212 present on the metal sheet 210 is connected to the antenna or the inlay layer 206 using electrical connections. The inlay layer 206 or the antenna aids in wireless communication in the metal card 212. Information may be wirelessly communicated to transaction systems for authorizing or completing transactions. In certain embodiments of the invention, the metal card 102 may also allow a user to authorize or complete a transaction after verifying identity of the user.
[0075] The electrical connections between the chip 212 and the inlay layer 206 may be constructed through the insulation layer 208.
[0076] In an alternate embodiment of the invention, the hollow slot for holding the chip 212 may allow the lower surface of the chip 212 to be directly connected to the inlay layer 206 spanning vertically through the insulation layer 208.
[0077] Figure 4 illustrates a method 400 for manufacturing metal cards, in accordance with an embodiment of the invention.
[0078] A manufacturing cycle is initiated in the system for manufacturing cards, as depicted at 402. Further, on a manufacturing plate present in the manufacturing system, a layer of an overlay is deposited as a base layer for the metal card as depicted at 404.
[0079] Once an overlay has been created/deposited, at step 406, a printing core layer is created/deposited on the base layer. This layer may be beneficial in providing a foundation for constructing the metal card and its components. Further, at step 408, an inlay layer is created/deposited on the printing core layer. As aforementioned, an antenna may be constructed on the inlay layer, further connecting it to a chip present in the metal card.
[0080] Once an antenna has been created/constructed on the inlay layer, a layer of insulation is deposited on the inlay layer, as depicted in step 410. The insulation layer prevents the antenna from coming in contact with a metal sheet in the metal card which is deposited on the insulation layer at step 412.
[0081] Once a metal layer has been created/deposited on the insulation layer, a chip is deposited on top of the metal layer, at step 414, in a space dedicated to holding the chip.
[0082] Finally, once a front side of the metal card has been constructed, a magstripe tape or a magnetic stripe tape comprising user information is deposited on a back side of the metal card, as shown at step 416.
[0083] In an embodiment, creating each layer of the metal 120 card may comprise depositing the layers one by one to form the metal card 120. Further, creating each layer of the metal 120 card may also comprise attaching pre-constructed layers together to form the metal card 120.
[0084] In a preferred embodiment of the invention, a HiCo magstripe tape is used to store user information. Advantages of the HiCo magstripe include more security of the stored information and fewer chances of the information being erased due to exposure to a strong magnetic field.
[0085] In an embodiment of the invention where the described process is used for the manufacture of access control cards, the method of construction of the metal card using deposition of layers of various materials remains the same. However, for the manufacture of access control cards, the system may be configured to embed a biometric sensor or any other identity sensor instead of a chip in the final metal sheet layer.
[0086] Similarly, for manufacturing any metal cards other than transaction cards, the disclosed system may be configured differently to accommodate different materials or components of the particular card manufacturing process.
[0087] Advantages of the current invention include a high durability card. The method of using multiple layers of various materials aids in improving the durability of the card, thus preventing the card from breaking due to accidental snapping.
[0088] An additional advantage of the metal card is the addition of the insulation layer between the meta l sheet and the antenna constructed on the inlay layer. This prevents the antenna from becoming non-functional due to interception of waves during wireless communication.
[0089] A further advantage of the metal cards disclosed in the present invention is that, since the cards are dual interface cards comprising a chip and an antenna in the construction of the cards, the disclosed metal cards are more convenient for usage and, additionally, are more secure.
[0090] The proposed method for manufacturing metal cards can be further extended and altered to manufacture other multipurpose cards whose structure may be similar to the transaction cards or the access control cards as disclosed in the present invention.
[0091] The method discussed in the present disclosure may also be used to manufacture any card comprising an identification factor or may be used to further manufacture cards for gaming arcades, licenses, and the kind.
[0092] Another advantage of the present method of manufacture of metal cards is the reduced usage of plastic required in the manufacturing process, thereby reducing carbon footprints of users. Minimalized usage of plastic in the manufacture of the metal cards also ensures less plastic and plastic-related contaminants being dumped into the environment.
[0093] Metal cards are also more cost-efficient as compared to plastic cards. Since metal cards are more durable, metal cards last much longer than plastic cards. Accidental breakage of plastic cards, or wearing off of an upper surface of the plastic card results in the users having to repeatedly replace said cards. The problem of wiping off, fading or wearing out of user information from the upper surface of the metal card is eliminated, since the required information can be engraved onto the metal sheet.
[0094] The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the scope of the embodiments as described here.
,CLAIMS:We claim:
1. A metal card (102) comprising:
a printing core layer (204) created on an overlay layer (202);
at least one inlay layer (206) created on the printing core layer (204);
an insulation layer (208) created on the inlay layer (206);
a metal sheet (210) created on the insulation layer (208); and
a chip (212) fixed on the metal sheet (210).

2. The metal card (102) as claimed in claim 1, wherein the inlay layer (206) comprises an antenna to enable wireless communication in the metal card (102).

3. The metal card (102) as claimed in claim 1, wherein the metal sheet (210) comprises a hollow slot for accommodating the chip (212).

4. The metal card (102) as claimed in claim 3, wherein the hollow slot comprises a step-down lip comprising an adhesive material on a periphery of the step-down lip, wherein the chip (212) is fixed onto the hollow slot such that the chip (212) rests on the adhesive material.

5. The metal card (102) as claimed in claim 1, wherein the insulation layer (208) comprises one or more of a ferrite insulation material, fiber, plastic, ceramic, and asbestos.

6. The metal card (102) as claimed in claim 1, wherein layers comprised in the metal card (102) are created using at least one of compression techniques, lamination techniques, and embedding techniques.

7. The metal card (102) as claimed in claim 1, wherein a magnetic stripe (214) is created on a back side of the metal card (102).

8. The metal card (102) as claimed in claim 1, wherein the metal sheet (210) comprises at least one of stainless steel, polished aluminum, gold, silver, and platinum.

9. The metal card (102) as claimed in claim 1, comprising:
the overlay layer (202) with a thickness range of approximately 50-70 microns;
the printing core layer (204) with a thickness range of approximately 100-200 microns;
the inlay layer (206) or antenna with a thickness range of approximately 100-140 microns;
the insulation layer (202) with a thickness of approximately 110 microns; and
the metal sheet (210) with a thickness range of approximately 350-450 microns.

10. A method of manufacturing a metal card (102), wherein the method comprises:
creating at least one overlay layer (202) on a manufacturing plate;
creating a printing core layer (204) on the least one overlay layer (202);
creating an inlay layer (206) on the printing core layer (204);
creating an insulation layer (208) on the inlay layer (206);
creating a metal sheet (210) on the insulation layer (208);
creating a chip (212) on the metal sheet (210).

11. The method of manufacture of the metal card (102) as claimed in claim 10, wherein creating the inlay layer (206) comprises constructing an antenna to enable wireless communication in the metal card (102).

12. The method of manufacture of the metal card (102) as claimed in claim 10, comprising creating a hollow slot in the metal sheet (210) for accommodating the chip (212).

13. The method of manufacture of the metal card (102) as claimed in claim 12, comprising:
creating a step-down lip in the hollow slot;
adding an adhesive material onto a periphery of the step-down lip; and
accommodating the chip (212) onto the adhesive material on the periphery of the step-down lip in the hollow slot.

14. The method of manufacture of the metal card (102) as claimed in claim 10, wherein the insulation layer (208) comprises one or more of a ferrite insulation material, fiber, plastic, ceramic, and asbestos.

15. The method of manufacture of the metal card (102) as claimed in claim 10, comprising creating layers in the metal card (102) by using one or more compression techniques comprising lamination techniques and embedding techniques.

16. The method of manufacture of the metal card (102) as claimed in claim 10, comprising creating a magnetic stripe (214) on a back side of the metal card (102).

17. The method of manufacture of the metal card (102) as claimed in claim 10, wherein the metal sheet layer (210) comprises at least one of stainless steel, polished aluminum, gold, silver, and platinum.

18. The method of manufacture of the metal card (102) as claimed in claim 10, comprising:
creating the overlay layer (202) with a thickness of approximately 50-70 microns;
creating the printing core layer (204) with a thickness of approximately 100-200 microns;
creating the inlay layer (206) or antenna with a thickness of approximately 100-140 microns;
creating the insulation layer (202) with a thickness of approximately 110 microns; and
creating the metal sheet (210) with a thickness of approximately 350-450 microns.

19. A method of enabling transactions using a metal card (102), the method comprising:
accommodating a chip (212) onto an adhesive material on a periphery of a step-down lip in a hollow slot of a metal sheet layer (210) of the metal card (102);
creating a connection between the chip (212) and an antenna or inlay layer (206) by using electrical connections;
storing one or more user details comprising one or more financial data and sensitive information in the metal card (102);
initiating wireless communication by using the antenna or inlay layer (206); and
communicating information wirelessly to one or more transaction systems for authorizing or completing at least one transaction.

20. The method of enabling transactions using a metal card (102) as claimed in claim 20, comprising allowing a user to authorize or complete the transaction by using the metal card (102) for verifying identity of the user.