Title of the invention: Metal plate, method for manufacturing a metal plate, method for manufacturing a molded product of a metal plate, and a molded product of a metal plate. Technical field [0001] 　The present disclosure relates to a metal plate, a method for manufacturing a metal plate, a method for manufacturing a molded product of a metal plate, and a molded product of a metal plate. Background technology [0002] 　In recent years, in the fields of automobiles, aircraft, ships, building materials, home appliances, etc., design has been emphasized in order to meet the needs of users. Therefore, in particular, the shape of the exterior member tends to be complicated. In order to mold a molded product having a complicated shape from a metal plate, it is necessary to give a large strain to the metal plate. However, there is a problem that fine irregularities are likely to occur on the surface of the molded product as the strain (hereinafter, also referred to as the amount of processing) increases, and the surface becomes rough and the appearance is spoiled. [0003] 　For example, Patent Document 1 discloses that an uneven striped pattern appears (rigging) in parallel with the rolling direction. Specifically, Patent Document 1 discloses the following. An aluminum alloy rolled plate for forming with excellent rigging resistance can be obtained by controlling the average Taylor factor when the forming process is regarded as a plane strain tensile deformation having the rolling width direction as the main strain direction. The average Taylor factor calculated from all crystal orientations present in the texture is largely related to rigging resistance. By controlling the texture so that the value of the average Taylor factor satisfies a specific condition, the rigging resistance can be reliably and stably improved. [0004] 　Further, Patent Document 2 describes the surface integral of crystal grains having a bcc structure and having a crystal orientation within 15 ° from the {001} plane parallel to the surface of the metal plate (a) on the surface of the metal plate. Is 0.20 or more and 0.35 or less. ”Or (b)“ The surface integral of the crystal grains having a crystal orientation within 15 ° from the {001} plane parallel to the surface of the metal plate is 0.45 or less. , And the average crystal grain size is 15 μm or less ”, plane strain tensile deformation and biaxial tensile deformation occur, and at least a part of the metal plate has a plate thickness reduction rate of 10%. A method for producing a molded product by performing a molding process of 30% or more to produce a molded product is disclosed. [0005] Patent Document 1: Japanese Patent No. 5683193 Patent Document 2: Japanese Patent No. 6156613 Outline of the invention Problems to be solved by the invention [0006] 　However, Patent Document 1 only shows that rigging is suppressed in the molding process of a metal plate in which uniaxial tensile deformation occurs with the rolling width direction as the main strain direction. Further, no consideration is given to the forming process of the metal plate in which plane strain tensile deformation and biaxial tensile deformation occur, such as deep drawing forming and overhang forming. [0007] 　On the other hand, even in the molding process of a metal plate in which plane strain tensile deformation and biaxial tensile deformation occur, such as deep drawing molding and overhang molding, it is required to manufacture a molded product having a complicated shape in recent years. However, when a metal plate is molded with a large processing amount (a processing amount at which the plate thickness reduction rate of the metal plate is 10% or more), unevenness develops on the surface of the molded product, and the surface becomes rough and the appearance is spoiled. The problem arises. Similarly, the same problem occurs in the molding process of a metal plate in which only plane strain and tensile deformation occur. 　For the above reasons, for example, conventional automobile outer panel products are produced by limiting the amount of strain applied to the product surface to a processing amount such that the plate thickness reduction rate of the metal plate is less than 10%. That is, there are restrictions on the processing conditions in order to avoid the occurrence of surface roughness. However, more complicated automobile outer panel product shapes are required. That is, there is a demand for a method capable of achieving both a plate thickness reduction rate of 10% or more for a metal plate during molding and suppression of surface roughness. [0008] 　As for the method for producing a molded product of Patent Document 2, a molded product in which the occurrence of surface roughness is suppressed can be obtained. However, a technique for suppressing the occurrence of surface roughness by a technique of an approach different from the method for manufacturing a molded product of Patent Document 2 is also desired. [0009] 　In view of the above circumstances, the subject of the present disclosure is that plane strain tensile deformation and biaxial tensile deformation occur in a metal plate having a bcc structure, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30%. A method for manufacturing a metal plate and a metal plate that can obtain a molded product in which the occurrence of surface roughness is suppressed even when the following molding process is performed, and a method for manufacturing a metal plate molded product using the metal plate. Is to provide. 　Further, another problem of one aspect of the present disclosure is that the surface of a molded metal plate having a bcc structure, having a ridgeline portion, and satisfying the conditions (BD) and conditions (BH) described later is roughened. It is to provide a molded product of a metal plate in which the occurrence of is suppressed. [0010] 　Another object of the present disclosure is that plane strain tensile deformation and biaxial tensile deformation occur in a metal plate having an fcc structure, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. Provided are a method for manufacturing a metal plate and a metal plate that can obtain a molded product in which the occurrence of surface roughness is suppressed even when the molding process is performed, and a method for manufacturing a molded product of a metal plate using the metal plate. It is to be. 　Further, another problem of one aspect of the present disclosure is that the surface of a molded metal plate having an fcc structure, having a ridgeline portion, and satisfying the conditions (FD) and conditions (FH) described later is roughened. It is to provide a molded product of a metal plate in which the occurrence of is suppressed. Means to solve problems [0011] 　The gist of this disclosure is as follows. [0012] <1> A 　metal plate having a bcc structure and satisfying the following conditions (a1) or (b1) on the surface. 　(A1) When the area division of crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.25 or more and 0.35 or less. Yes, and the average crystal grain size is less than 16 μm. 　(B1) When the area division of crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.15 or more and 0.30 or less. Yes, and the average crystal grain size is 16 μm or more. <2> A 　metal plate having a bcc structure and satisfying the following conditions (c1) on the surface. 　(C1) In the plane of the metal plate, the area fraction of the crystal grains showing a Taylor Factor value of 3.0 or more and 3.4 or less when assuming plane strain tensile deformation in the lateral direction is 0.18 or more. It is 0.40 or less. <3> The 　metal plate according to <1> or <2>, wherein the metal plate is a steel plate. <4> 　The metal plate according to <3>, wherein the steel plate is a ferritic steel plate having a ferrite fraction of 50% or more of a metal structure on the surface. <5> 　When the steel sheet is mass%, 　C: 0.0040% to 0.0100% 　Si: 0% to 1.0%, 　Mn: 0.90% to 2.00%, 　P: 0.050% to 0.200% 　S: 0% to 0.010%, 　Al: 0.00050% to 0.10%, 　N: 0% to 0.0040%, 　Ti: 0.0010% to 0.10%, 　Nb: 0.0010% to 0.10%, 　B: 0% to 0.003%, 　total of one or more of Cu and Sn: 0% to 0.10% 　Ni, Ca, Mg, The total of one or more of Y, As, Sb, Pb and REM: 0% to 0.10%, and the 　balance: Fe and impurities, and 　the value of F1 defined by the following formula (1) is 0.5. The metal plate according to <3> or <4>, which is a ferrite-based steel plate having a chemical composition of 1.0 or more. 　Formula (1): F1 = (C / 12 + N / 14 + S / 32) / (Ti / 48 + Nb / 93) <6> 　The chemical composition of the steel sheet is mass%, 　and the total of one or more types of Cu and Sn: 0. 002% to 0.10%, and 　the total of one or more of Ni, Ca, Mg, Y, As, Sb, Pb and REM: 0.005% to 0.10% 　containing one or more. The metal plate according to <5>. <7> A 　hot-rolled plate is cold-rolled with a rolling reduction of 70% or more to obtain a cold-rolled plate. 　<5> or <5> or 　that the cold rolled plate is annealed under the conditions that the annealing temperature is the recrystallization temperature + 25 ° C. or less, the temperature unevenness in the plate surface is within ± 10 ° C., and the annealing time is within 100 seconds. The method for manufacturing a metal plate according to <6>. <8> 　The metal plate according to any one of <1> to <6> undergoes planar strain tensile deformation and biaxial tensile deformation, and at least a part of the metal plate has a plate thickness reduction rate of 10. A method for producing a molded product of a metal plate, which is subjected to a molding process of% or more and 30% or less to produce a molded product. <9> 　A molded product of a metal plate having a bcc structure and a ridge line portion, 　which satisfies the following (BD) and (BH), and has the following (a2) or (b2) on the surface of the maximum plate thickness portion. A molded product of a metal plate that meets the conditions of. 　(BD) When the maximum plate thickness of the molded product is D1 and the minimum plate thickness of the molded product is D2, the condition of the formula: 10 ≦ (D1-D2) / D1 × 100 ≦ 30. 　(BH) When the maximum Vickers hardness of the molded product is H1 and the minimum Vickers hardness of the molded product is H2, the condition of the formula: 15 ≦ (H1-H2) / H1 × 100 ≦ 40. 　(A2) When the area fraction of the crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the molded product and 20 ° or more away from the {001} plane is 0.25 or more and 0.35 or less. Yes, and the average crystal grain size is less than 16 μm. 　(B2) When the area fraction of the crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the molded product and 20 ° or more away from the {001} plane is 0.15 or more and 0.30 or less. Yes, and the average crystal grain size is 16 μm or more. <10> 　A molded product of a metal plate having a bcc structure and a ridgeline portion, 　which satisfies the following (BD) and (BH), and satisfies the following (c2) on the surface of the maximum plate thickness portion. Molded metal plate. (BD) When the maximum plate thickness of the molded product is D1 and the minimum plate thickness of the molded product is D2, the condition of the formula: 10 ≦ (D1-D2) / D1 × 100 ≦ 30. (BH) When the maximum Vickers hardness of the molded product is H1 and the minimum Vickers hardness of the molded product is H2, the condition of the formula: 15 ≦ (H1-H2) / H1 × 100 ≦ 40. (C2) Taylor when the plane strain tensile deformation in the direction orthogonal to the extending direction of the ridge in the minimum radius of curvature of the concave surface of the ridge in the cross section perpendicular to the extending direction of the ridge is assumed. The area fraction of the crystal grains showing a factor value of 3.0 or more and 3.4 or less is 0.18 or more and 0.35 or less. <11> 　The molded product of the metal plate according to <9> or <10>, wherein the metal plate is a steel plate. <12> 　The molded product of the metal plate according to <11>, wherein the steel plate is a ferritic steel plate having a ferrite fraction of 50% or more of a metal structure on the surface. <13> The 　steel sheet is in mass%. 　C: 0.0040% to 0.0100% 　Si: 0% to 1.0%, 　Mn: 0.90% to 2.00%, 　P: 0.050% to 0.200% 　S: 0% to 0 .010%, 　Al: 0.00050% to 0.10%, 　N: 0% to 0.0040%, 　Ti: 0.0010% to 0.10%, 　Nb: 0.0010% to 0.10%, 　B: 0% to 0.003%, 　total of one or more types of Cu and Sn: 0% to 0.10% Total of one or more types of 　Ni, Ca, Mg, As, Sb, Pb and REM: 0% to 　<11> A ferrite-based steel sheet having a chemical composition of 0.10% and the 　balance: Fe and impurities, and having an F1 value defined by the following formula (1) of 0.5 or more and 1.0 or less. Or, the molded product of the metal plate according to <12>. 　Formula (1): F1 = (C / 12 + N / 14 + S / 32) / (Ti / 48 + Nb / 93) <14> 　The chemical composition of the steel sheet is mass%, 　and the total of one or more types of Cu and Sn: 0. 002% to 0.10%, and 　the total of one or more of Ni, Ca, Mg, As, Sb, Pb and REM: 0.005% to 0.10% 　The molded product of the metal plate according to <13>, which contains one or more of the above. <15> A 　metal plate having an fcc structure and satisfying the following conditions (a1) or (b1) on the surface. 　(A1) When the area fraction of the crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.25 or more and 0.35 or less. Yes, and the average crystal grain size is less than 16 μm. 　(B1) When the area division of crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.15 or more and 0.30 or less. Yes, and the average crystal grain size is 16 μm or more. <16> A 　metal plate having an fcc structure and satisfying the following conditions (c1) on the surface. (C1) In the plane of the metal plate, the area fraction of the crystal grains showing a Taylor Factor value of 3.0 or more and 3.4 or less when assuming plane strain tensile deformation in the lateral direction is 0.18 or more and 0. It is .40 or less. <17> The 　metal plate according to <15> or <16>, wherein the metal plate is an austenitic stainless steel plate. <18> The 　metal plate according to <15> or <16>, wherein the metal plate is an aluminum alloy plate. <19> 　Planar strain tensile deformation and biaxial tensile deformation occur in the metal plate according to any one of <15> to <18>, and at least a part of the metal plate has a plate thickness reduction rate of 5% or more 30. % Or less, a method for manufacturing a molded product of a metal plate, which manufactures a molded product. <20> 　A molded product of a metal plate having an fcc structure and a ridge line portion, 　which satisfies the following (FD) and (FH), and has the following (a2) or (b2) on the surface of the maximum plate thickness portion. A molded product of a metal plate that meets the conditions of. 　(FD) When the maximum plate thickness of the molded product is D1 and the minimum plate thickness of the molded product is D2, the condition of the formula: 5 ≦ (D1-D2) / D1 × 100 ≦ 30. 　(FH) When the maximum Vickers hardness of the molded product is H1 and the minimum Vickers hardness of the molded product is H2, the condition of the formula: 7 ≦ (H1-H2) / H1 × 100 ≦ 40. 　(A2) The area fraction of the crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the molded product and 20 ° or more away from the {001} plane is 0.25 or more and 0.35 or less. Moreover, the average crystal grain size is less than 16 μm. 　(B2) The area fraction of the crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the molded product and 20 ° or more away from the {001} plane is 0.15 or more and 0.30 or less. Moreover, the average crystal grain size is 16 μm or more. <21> 　A molded product of a metal plate having an fcc structure and a ridge line portion, 　which satisfies the following (FD) and (FH), and satisfies the following (c2) on the surface of the maximum plate thickness portion. Molded metal plate. 　(FD) When the maximum plate thickness of the molded product is D1 and the minimum plate thickness of the molded product is D2, the condition of the formula: 5 ≦ (D1-D2) / D1 × 100 ≦ 30. 　(FH) When the maximum Vickers hardness of the molded product is H1 and the minimum Vickers hardness of the molded product is H2, the condition of the formula: 7 ≦ (H1-H2) / H1 × 100 ≦ 40. 　(C2) Taylor when the plane strain tensile deformation in the direction orthogonal to the extending direction of the ridge in the minimum radius of curvature of the concave surface of the ridge in the cross section perpendicular to the extending direction of the ridge is assumed. The area fraction of the crystal grains showing a factor value of 3.0 or more and 3.4 or less is 0.18 or more and 0.35 or less. <22> 　The molded product of the metal plate according to <20> or <21>, wherein the metal plate is an austenitic stainless steel plate. <23> 　The molded product of the metal plate according to <20> or <21>, wherein the metal plate is an aluminum alloy plate. Effect of the invention [0013] 　According to the present disclosure, a metal plate having a bcc structure undergoes planar strain tensile deformation and biaxial tensile deformation, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. It is possible to provide a metal plate and a method for manufacturing a metal plate capable of obtaining a molded product in which the occurrence of surface roughness is suppressed, and a method for manufacturing a molded product of a metal plate using the metal plate. 　Further, according to another disclosure of the present invention, surface roughness may occur even in a molded metal plate having a bcc structure, having a ridgeline portion, and satisfying the conditions (BD) and conditions (BH) described later. It is possible to provide a molded product of a suppressed metal plate. [0014] 　Further, according to another present disclosure, plane strain tensile deformation and biaxial tensile deformation occur in a metal plate having an fcc structure, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. It is possible to provide a metal plate and a method for producing a metal capable of obtaining a molded product in which the occurrence of surface roughness is suppressed even when the above-mentioned molding process is performed, and a method for producing a molded product using the metal plate. 　Further, according to another present disclosure, surface roughness may occur even in a molded product of a metal plate having an fcc structure, having a ridgeline portion, and satisfying the conditions (FD) and conditions (FH) described later. It is possible to provide a molded product of a suppressed metal plate. A brief description of the drawing [0015] FIG. 1 is a schematic diagram for explaining the definition of “crystal grains having a crystal orientation separated by X ° or more from the {klm} plane”. [Fig. 2] Fig. 2 is a schematic view of a metal plate observed from above for explaining a location for measuring an area fraction of crystal grains and an average crystal grain size. FIG. 3 is a schematic diagram for explaining a method of measuring the average crystal grain size of crystal grains. FIG. 4A is a schematic view showing an example of overhang molding processing. FIG. 4B is a schematic view showing an example of a molded product obtained by the overhang molding process shown in FIG. 4A. FIG. 5A is a schematic view showing an example of draw-out molding processing. FIG. 5B is a schematic view showing an example of a molded product obtained by the draw-out molding process shown in FIG. 5A. FIG. 6 is a schematic diagram for explaining plane strain tensile deformation, biaxial tensile deformation, and uniaxial tensile deformation. FIG. 7 is a schematic perspective view showing an example of a molded metal plate according to the first and second embodiments. FIG. 8 is a partial schematic cross-sectional view showing an example of a ridgeline portion of a molded metal plate according to the first and second embodiments. Mode for carrying out the invention [0016] 　Hereinafter, embodiments that are an example of the present disclosure will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals and the description thereof will not be repeated. 　In addition, in this specification, "%" notation of the content of each element of a chemical composition means "mass%". 　Further, the numerical range represented by using "-" means a range including the numerical values ​​before and after "-" as the lower limit value and the upper limit value. 　In addition, the numerical range when "greater than" or "less than" is added to the numerical values ​​before and after "to" means a range in which these numerical values ​​are not included as the lower limit value or the upper limit value. 　Further, the term "process" is included in this term not only as an independent process but also as long as the intended purpose of the process is achieved even when it cannot be clearly distinguished from other processes. 　Further, the "extending direction of the ridgeline portion" means a direction in which the ridgeline portion extends at the target ridgeline portion when a design surface having the ridgeline portion is viewed in a plan view. For example, the "extending direction of the ridgeline portion" at the position where the apex of the ridgeline portion draws a straight line means the direction in which the straight line extends. On the other hand, the "extending direction of the ridgeline portion" of the portion where the apex of the ridgeline portion draws a curve means the direction in which the tangent line at the portion of the curve extends. 　Further, the “design surface” refers to a surface that is exposed to the outside and can be an object of aesthetics among the surfaces constituting the molded product of the metal plate. [0017] (Metal plate having a bcc structure) 　The metal plate according to the first embodiment is a metal plate satisfying the following conditions (a1), (b1) or (c1) on the surface. 　(A1) The area fraction of crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane (hereinafter, also referred to as “crystal grain A”) It is 0.25 or more and 0.35 or less, and the average crystal grain size is less than 16 μm. 　(B1) The area fraction of crystal grains (crystal grains A) having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.15 or more 0. It is .30 or less and the average crystal grain size is 16 μm or more. 　(C1) The value of Taylor Factor (hereinafter also referred to as “TF value”) in the plane of the metal plate assuming plane strain tensile deformation in the lateral direction is 3.0 or more and 3.4 or less. The area fraction of the indicated crystal grains (hereinafter, also referred to as “crystal grains C”) is 0.18 or more and 0.40 or less. [0018] 　The metal plate according to the first embodiment is subjected to molding processing in which plane strain tensile deformation and biaxial tensile deformation occur due to the above configuration, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. Even when it is applied, a molded product in which the occurrence of surface roughness is suppressed can be obtained. Then, the metal plate according to the first embodiment was found by the following findings. [0019] 　In recent years, the correspondence between the metallographic structure of metal plates and mechanical properties has been studied. The inventors made the following studies. 　First, the relationship between the crystal orientation of crystal grains and surface roughness in the multiaxial deformation field of plane strain tensile deformation was investigated. As a result, the inventors obtained the following findings. Compared to biaxial tensile deformation, surface strain and tensile deformation increase surface roughness more. In particular, in a metal plate having a specific texture such as an IF steel sheet, the increase in surface roughness due to planar strain tensile deformation is larger than that in biaxial tensile deformation. It is considered that the cause of this is that the difference in strength between crystal grains greatly differs depending on the deformation mode. That is, it is considered that the degree of deformation between the biaxial tensile deformation and the plane strain tensile deformation is significantly different between the crystal grains. [0020] 　Therefore, the inventors focused on crystal grains having crystal orientations other than the {001} plane and the {111} plane, in which the strength of the crystal grains did not change significantly between the biaxial tensile deformation and the planar strain tensile deformation. Then, the fraction of the crystal grains was increased, and the difference in surface roughness development between the isobiaxial tensile deformation and the plane strain tensile deformation was verified including the relationship with the average crystal grain size. 　As a result, the inventors obtained the following findings. By increasing the fraction of crystal grains having crystal orientations other than the {001} plane and the {111} plane, a metal plate is formed with a large processing amount (a processing amount that makes the plate thickness reduction rate of the metal plate 10% or more). Even so, the increase in surface roughness due to plane strain tensile deformation is suppressed. As a result, the degree of deformation of the crystal grains is reduced between the isobiaxial tensile deformation and the planar strain tensile deformation, and the difference in surface roughness development is reduced. [0021] 　Specifically, the inventors have obtained the following findings. 　When the average crystal grain size is 16 μm or less, the area fraction of the crystal grain A is 0.25 or more and 0.35 or less (that is, if the condition (a1) is satisfied), or the average crystal grain size is 16 μm or more. In the case of, if the area division of the crystal grains A is 0.15 or more and 0.30 or less (that is, if the condition (b1) is satisfied), even if the metal plate is formed with a large processing amount, the plane strain tensile deformation The increase in surface roughness is suppressed. As a result, the degree of deformation of the crystal grains is reduced between the isobiaxial tensile deformation and the planar strain tensile deformation, and the difference in surface roughness development is reduced. [0022] 　That is, if the condition (a1) or the condition (b1) is satisfied, plane strain tensile deformation and biaxial tensile deformation occur, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. Even when it is applied, the occurrence of surface roughness is suppressed. [0023] 　On the other hand, the inventors also conducted the following examination. 　First, the inventors paid attention to the value (TF value) of the Taylor Factor when the plane strain tensile deformation in the lateral direction of the metal plate was assumed. The TF value is an index indicating the magnitude of deformation resistance when an arbitrary deformation of the crystal is assumed. 　Then, the relationship between the TF value and the surface roughness was investigated. As a result, the inventors obtained the following findings. 　Of the TF values, if the fraction of the crystal grains C showing a TF value of 3.0 or more and 3.4 or less when assuming plane strain tensile deformation in the lateral direction of the metal plate is controlled, the metal plate can be processed with a large amount of processing. Even if the above is formed, the increase in surface roughness due to surface strain and tensile deformation is suppressed. As a result, the degree of deformation of the crystal grains is reduced between the isobiaxial tensile deformation and the planar strain tensile deformation, and the difference in surface roughness development is reduced. The reason for this is that the distribution of TF values ​​assuming biaxial tensile deformation is mainly distributed in 3.0 or more and 3.4 or less. By controlling the fraction of the crystal grains C, the distribution of the deformation resistance difference between the crystal grains becomes the same between the equibiaxial tensile deformation and the plane strain tensile deformation, and the difference due to the deformation mode of surface roughness development is reduced. Conceivable. [0024] 　That is, if the condition (c1) is satisfied, even when plane strain tensile deformation and biaxial tensile deformation occur and at least a part of the metal plate is subjected to a molding process in which the plate thickness reduction rate is 10% or more and 30% or less. The occurrence of surface roughness is suppressed. [0025] 　From the above findings, the metal plate according to the first embodiment is subjected to plane strain tensile deformation and biaxial tensile deformation, and at least a part of the metal plate is formed by forming a plate thickness reduction rate of 10% or more and 30% or less. It was found that the metal plate can be obtained as a molded product in which the occurrence of surface roughness is suppressed even when the above is applied. [0026] 　Hereinafter, the details of the metal plate according to the first embodiment will be described. [0027] 　The condition (a1) will be described. 　Under the condition (a1), the area fraction of the crystal grain A having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.25 or more and 0. It is 35 or less. However, from the viewpoint of suppressing surface roughness, it is preferably 0.25 or more and 0.30 or less. 　Under the condition (a1), the average crystal grain size of the crystal grains A is less than 16 μm. However, from the viewpoint of increasing the manufacturing cost, it is set to 6 μm or more, for example. [0028] 　The condition (b1) will be described. 　Under the condition (b1), the surface integral of the crystal grain A having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.15 or more. It is 30 or less. However, from the viewpoint of suppressing surface roughness, 0.15 or more and 0.25 or less are preferable. 　Under the condition (b1), the average crystal grain size of the crystal grains A is 16 μm or more. However, the lower limit of the average crystal grain size of the crystal grains A is, for example, 25 μm or less from the viewpoint of suppressing surface roughness. [0029] 　Here, as shown in FIG. 1, a crystal grain having a crystal orientation separated from the {klm} plane by X ° or more is a sharp X ° on both sides of the {klm} plane with respect to the {klm} plane. It means a crystal grain having a crystal orientation in the range of an angle θ formed by two inclined crystal orientations Y1 and Y2. [0030] 　The average crystal grain size of the crystal grains A is measured by the following method. 　As shown in FIG. 2, in the width direction of the steel sheet (perpendicular to the rolling direction), a measurement area Er of 1 mm square is arbitrarily set at the center (the area of ​​50% of the center of the width) from 1/4 of the total width from the edge. Choose 3 places. A sample having this measurement region Er is collected from a metal plate. The observation surface of the sample (the surface having the measurement region Er) is polished by 0.1 mm. The observation surface of the sample is observed by SEM, and crystal grains A are selected by using the EBSD method. Two test lines are drawn on each selected grain A. By obtaining the arithmetic mean of the two test lines, the average crystal grain size of the crystal grains A is obtained. [0031] 　Specifically, it is as follows. As shown in FIG. 3, a first test line passing through the center of gravity of each crystal grain A is drawn so that all the crystal grains A have the same orientation. Further, a second test line passing through the center of gravity of each crystal grain A is drawn so as to be orthogonal to the first test line. The arithmetic mean of the lengths of the two first test lines and the second test line is defined as the crystal grain size of the crystal grain A. The arithmetic mean of the crystal grain sizes of all the crystal grains A in the three samples is defined as the average crystal grain size. 　In FIG. 3, Cry indicates crystal grains A, L1 indicates the first test line, and L2 indicates the second test line. [0032] 　The surface integral of the crystal grains A is measured by the following method. 　Similar to the measurement of the average crystal grain size of the crystal grains A, the observation surface of the sample of the metal plate is observed, and the crystal grains A are selected by using the EBSD method. The surface integral of the selected crystal grain A with respect to the observation field of view is calculated. Then, the average of the area fractions of the crystal grains A in the three samples is defined as the area fraction of the crystal grains A. [0033] 　Specifically, the surface integral of the crystal grains A is measured as follows. 　Using OIM analysis (manufactured by TSL), the area of ​​the target crystal particles A is extracted (tolerance is set to 20 °) from the observation field of view by the scanning electron microscope observed under the following measurement conditions. Divide the extracted area by the area of ​​the observation field to obtain the percentage. This value is taken as the surface integral of the crystal grain A. [0034] 　The details of the measurement conditions for obtaining the surface integral of the crystal grains A are as follows. -Measuring device: Scanning electron microscope (SEM-EBSD) with electron backscatter diffraction device "SEM model number JSM-6400 (manufactured by JEOL) EBSD detector uses model number" HIKARI "(manufactured by TSL)" -Step Interval: 2 μm ・ Measurement area: 8000 μm × 2400 μm area ・ Grain boundary: Angle difference of crystal orientation is 15 ° or more (Continuous region with angle difference of less than 15 ° is regarded as one crystal grain) [0035] 　The condition (c1) will be described. 　Under the condition (c1), the crystal grains showing a Taylor Factor value (TF value) of 3.0 or more and 3.4 or less in the plane of the metal plate assuming plane strain and tensile deformation in the lateral direction of the metal plate. The area division of C is 0.18 or more and 0.40 or less. However, from the viewpoint of suppressing surface roughness, 0.18 or more and 0.35 or less is preferable. [0036] 　Here, the TF value of the crystal grain C (the TF value when the plane strain tensile deformation in the lateral direction of the metal plate is assumed) is calculated by the following analysis. 　The observation surface of the sample (the surface having the measurement region Er) is polished by 0.1 mm. The observation surface of the sample is observed by SEM, and the crystal orientation distribution data of the observation surface is acquired by using the EBSD method. Measured by creating a Taylor Factor Map by setting a strain tensor representing the plane strain tensile deformation state for the acquired crystal orientation distribution data using the software OIM Analysis v 7.2.1 manufactured by TSL Solutions Co., Ltd. The TF value for each point is calculated, and the Taylor Factor distribution is visualized. [0037] 　The surface integral of the crystal grain C is measured as follows. 　Similar to the measurement of the TF value of the crystal grains C, the observation surface (the surface having the measurement region Er) of the sample is polished by 0.1 mm with respect to the sample of the metal plate. The observation surface of the sample is observed by SEM, and the crystal orientation distribution data of the observation surface is acquired by using the EBSD method. Using the software OIM Analysis v 7.2.1 manufactured by TSL Solutions Co., Ltd., a strain tensor representing the plane strain tensile deformation state is set for the acquired crystal orientation distribution data, and a histogram of the abundance ratio of the TF value is created. To do. From the created histogram, the ratio of the measurement points whose Taylor Factor value (TF value) satisfies 3.0 or more and 3.4 or less to the total measurement points is calculated as the area fraction of the crystal grain C. Then, the average of the area fractions of the crystal grains C in the three samples is defined as the area fraction of the crystal grains C. [0038] 　Here, when a plating layer or the like is formed on the surface of the molded product of the metal plate to be measured, the plating layer or the like is removed, and then the surface is polished to obtain the average crystal grain size of the crystal grains A and the average crystal grain size. The area division of the crystal grains A and the crystal grains C is measured. [0039] 　The types of metal plates will be described. 　The metal plate is a metal plate having a bcc structure (body-centered cubic lattice structure). Examples of the metal plate having a bcc structure include metal plates such as α-Fe, Li, Na, K, β-Ti, V, Cr, Ta, and W. Among these, steel sheets (ferritic steel sheets, bainite steel sheets having a bainite single-phase structure, martensite steel sheets having a martensite single-phase structure, etc.) are preferable because they are most easily available for producing molded products. .. Further, a ferritic steel sheet is more preferable because of ease of processing. The ferritic steel sheet includes a steel sheet in which martensite, bainite and the like are present (DP steel sheet) in addition to a steel sheet having a metal structure having a ferrite content of 100%. [0040] 　Here, the ferrite fraction of the metal structure of the ferritic steel sheet is preferably 50% or more, more preferably 80% or more. When the ferrite fraction of the metal structure is less than 80%, the influence of the hard phase becomes strong. If it is less than 50%, the hard phase becomes dominant, and the grain orientation of ferrite, which is vulnerable to the stress of planar strain tensile deformation and biaxial tensile deformation (crystal orientation within 15 ° from the {111} plane parallel to the surface of the metal plate). The influence of crystal grains other than the crystal grains having the above (particularly crystal grains having a crystal orientation within 15 ° from the {001} plane parallel to the surface of the metal plate) is reduced. Therefore, there is a tendency that unevenness is less likely to develop due to deformation of crystal grains during the molding process, and surface roughness itself of the molded product is less likely to occur. Therefore, when a ferritic steel sheet having a ferrite fraction in the above range is applied, the effect of suppressing surface roughness becomes remarkable. [0041] 　The ferrite fraction can be measured by the following method. After polishing the surface of the steel sheet (the surface having the measurement region Er), the ferrite structure is exposed by immersing it in a nital solution, and a microstructure photograph is taken with an optical microscope. Then, the area of ​​the ferrite structure is calculated with respect to the area of ​​the entire area of ​​the structure photograph. [0042] 　The metal plate may be a metal plate (plated steel plate or the like) having a plating layer on the surface. However, when the metal plate is a plated metal plate, the "surface of the metal plate" to be measured for the average crystal grain size of the crystal grains A and the area fractions of the crystal grains A and the crystal grains C is the plating. It is the surface of the metal plate excluding the layer. The plating layer is thin with respect to the thickness of the metal plate. Therefore, the surface texture of the plated metal plate during and after processing is affected by the crystal grain size and crystal orientation of the surface of the metal plate excluding the plating layer. [0043] 　The thickness of the metal plate is not particularly limited, but is preferably 3 mm or less from the viewpoint of moldability. [0044] (Chemical composition of 　metal plate ) Suitable steel plate as a metal plate is 　C: 0.0040% to 0.0100% 　Si: 0% to 1.0%, 　Mn: 0.90% to 2.00 in mass%. %, 　P: 0.050% to 0.200% 　S: 0% to 0.010%, 　Al: 0.00050% to 0.10%, 　N: 0% to 0.0040%, 　Ti: 0.0010 % To 0.10%, 　Nb: 0.0010% to 0.10%, 　B: 0% to 0.003%, 　total of one or more of Cu and Sn: 0% to 0.10% 　Ni, Ca, The total of one or more of Mg, As, Sb, Pb and REM: 0% to 0.10%, and the 　balance: Fe and impurities, and 　the value of F1 defined by the following formula (1) is 0.5. A ferrite-based steel sheet having a chemical composition of 1.0 or more is preferable. 　Formula (1): F1 = (C / 12 + N / 14 + S / 32) / (Ti / 48 + Nb / 93) 　Here, in the formula, the element symbol indicates the content (mass%) of each element in steel. [0045] 　Hereinafter, the chemical composition of the ferritic steel sheet suitable as the metal plate will be described. About chemical composition "%" means mass%. [0046] 　C: 0.0040% to 0.0100% 　carbon (C) is known to reduce the ductility and deep drawing formability of steel sheets even in general IF steels. Therefore, the smaller the C content, the more preferable. However, C contributes to the development of grain A and grain C. Therefore, in order to achieve both of these, the C content is preferably 0.0040% to 0.0100%. [0047] 　Si: 0 to 1.0% 　silicon (Si) is an optional element. However, Si increases the strength while suppressing the decrease in ductility of the steel sheet by solid solution strengthening. Therefore, it may be contained as needed. The lower limit of the Si content is, for example, 0.005% or more. When the purpose is to increase the strength of the steel sheet, the lower limit of the Si content is, for example, 0.10% or more. On the other hand, if the Si content is too high, the surface properties of the steel sheet deteriorate. Therefore, the Si content is preferably 1.0% or less. The preferable upper limit of the Si content is 0.5% or less. When the strength of the steel sheet is not required, the more preferable upper limit of the Si content is 0.05% or less. [0048] 　Mn: 0.90% to 2.00% 　Manganese (Mn) increases the strength of the steel sheet by solid solution strengthening of Mn. Further, Mn fixes sulfur (S) as MnS. Therefore, the red-hot brittleness of steel due to FeS formation is suppressed. Furthermore, Mn lowers the transformation temperature from austenite to ferrite. This promotes the refinement of the crystal grains of the hot-rolled steel sheet. In addition, the larger the Mn content, the greater the surface integral of the crystal grains A and C. On the other hand, from the viewpoint of reducing the alloy cost, the upper limit of the Mn content is, for example, 2.0%. Therefore, the Mn content is preferably 0.90% to 2.00%. The Mn content is preferably 1.2% to 2.0%, more preferably 1.5% to 2.00%. [0049] 　P: 0.050% to 0.200% 　phosphorus (P) increases the strength while suppressing the decrease in the r value of the steel sheet by solid solution strengthening. On the other hand, P contributes to the development of crystal grains A and crystal grains C together with Mn. On the other hand, if the amount of P is too large, segregation is likely to occur and the surface quality after press molding deteriorates. From the viewpoint of ensuring the surface texture, the upper limit of the P content is, for example, 0.20%. Therefore, the P content is preferably 0.050% to 0.200%. The P content is more preferably over 0.100% to 0.200%. [0050] 　S: 0% to 0.010% 　sulfur (S) is an optional element. S lowers the formability and ductility of the steel sheet. Therefore, the smaller the S content, the better. Therefore, the S content is preferably 0% to 0.010%. From the viewpoint of reducing the refining cost, the lower limit of the S content is, for example, 0.00030%. The upper limit of the S content is preferably 0.006% or less, more preferably 0.005% or less. [0051] 　Al: 0.00050% to 0.10% 　Aluminum (Al) deoxidizes molten steel. On the other hand, if the Al content is too high, the ductility of the steel sheet will decrease. Therefore, the Al content is preferably 0.00050% to 0.10%. The preferable upper limit of the Al content is 0.080% or less, and the more preferable upper limit is 0.060% or less. The preferable lower limit of the Al content is 0.00500% or more. The Al content means the content of so-called acid-soluble Al (sol.Al). [0052] 　N: 0% to 0.0040% 　Nitrogen (N) is an optional element. N lowers the formability and ductility of the steel sheet. Therefore, the smaller the N content, the better. Therefore, the N content is preferably 0% to 0.0040%. From the viewpoint of reducing the refining cost, the lower limit of the N content is, for example, 0.00030% or more. [0053] 　Ti: 0.0010% to 0.10% 　titanium (Ti) combines with C, N and S to form carbides, nitrides and sulfides. If the Ti content is excessive with respect to the C content, N content and S content, the solid solution C and the solid solution N are reduced. The excess Ti that is not combined with C, N and S dissolves in the steel. If the solid solution Ti increases too much, the recrystallization temperature of the steel rises, so it is necessary to raise the annealing temperature. Further, if the amount of solid solution Ti increases too much, the steel material becomes hard and the workability deteriorates. Therefore, the moldability of the steel sheet is lowered. Therefore, in order to lower the recrystallization temperature of the steel, the upper limit of the Ti content is preferably 0.10% or less. The preferred upper limit of the Ti content is 0.08% or less, more preferably 0.06% or less. [0054] 　On the other hand, Ti improves moldability and ductility by forming a carbonitride as described above. In order to obtain this effect, the lower limit of the Ti content is preferably 0.0010% or more. The lower limit of the Ti content is preferably 0.005% or more, more preferably 0.01% or more. [0055] 　Nb: 0.0010% to 0.10% 　Niobium (Nb), like Ti, combines with C, N and S to form carbides, nitrides and sulfides. If the Nb content is excessive with respect to the C content, N content and S content, the solid solution C and the solid solution N are reduced. The excess Nb that is not combined with C, N and S dissolves in the steel. If the solid solution Nb increases too much, it is necessary to raise the annealing temperature. Therefore, in order to lower the recrystallization temperature of steel, the upper limit of the Nb content is preferably 0.10% or less. The preferred upper limit of the Nb content is 0.050% or less, more preferably 0.030% or less. [0056] 　On the other hand, Nb improves moldability and ductility by forming a carbonitride as described above. Further, Nb suppresses the recrystallization of austenite and refines the crystal grains of the hot-rolled plate. In order to obtain this effect, the lower limit of the Nb content is preferably 0.0010% or more. The preferable lower limit of the Nb content is 0.0012% or more, and more preferably 0.0014% or more. [0057] 　B: 0 to 0.0030% 　boron (B) is an optional element. Ultra-low carbon steel sheets with reduced solid solution N and solid solution C generally have low grain boundary strength. Therefore, when performing molding processing such as deep drawing molding and overhang molding in which plane strain deformation and biaxial tensile deformation occur, unevenness develops and the surface of the molded product is likely to be roughened. B improves the surface roughness resistance by increasing the grain boundary strength. Therefore, B may be contained if necessary. On the other hand, when the B content exceeds 0.0030%, the r value (Rankford value) decreases. Therefore, the preferable upper limit of the B content when B is contained is 0.0030% or less, and more preferably 0.0010% or less. 　The B content is preferably 0.0003% or more in order to surely obtain the effect of increasing the grain boundary strength. [0058] 　Total of one or more of Cu and Sn: 0% to 0.10% 　Cu and Sn are optional elements. Generally, when one or more of Cu and Sn are contained, the surface roughness tends to be remarkable by press molding. One reason for this is that Cu and Sn affect the texture of the steel sheet. However, even if Cu and Sn are contained, surface roughness can be suppressed by developing crystal grains A and crystal grains C. 　However, the total amount of one or more types of Cu and Sn is preferably 0.10% or less. On the other hand. Cu and Sn are elements that are difficult to separate when scrap or the like is used as a raw material. Therefore, from the viewpoint of reducing the refining cost, the total amount of one or more types of Cu and Sn is preferably 0.002% to 0.10%. [0059] 　Total of one or more of Ni, Ca, Mg, As, Sb, Pb and REM: 0% to 0.10% 　Ni, Ca, Mg, As, Sb, Pb and REM are optional elements. Generally, when one or more of Ni, Ca, Mg, As, Sb, Pb and REM are contained, the surface roughness tends to be remarkable by press molding. One reason for this is that Ni, Ca, Mg, As, Sb, Pb and REM affect the texture of the steel sheet. 　However, even if Ni, Ca, Mg, As, Sb, Pb and REM are contained, surface roughness can be suppressed by developing crystal grains A and crystal grains C. 　However, the total amount of one or more of Ni, Ca, Mg, As, Sb, Pb and REM is preferably 0.10% or less. On the other hand. Ni, Ca, Mg, As, Sb, Pb and REM are elements that are difficult to separate when scrap or the like is used as a raw material. Therefore, from the viewpoint of reducing the refining cost, the total amount of one or more of Ni, Ca, Mg, As, Sb, Pb and RE is preferably 0.005% to 0.10%. [0060] 　In addition, "REM" is a general term for a total of 17 elements of Sc, Y, and lanthanoid, and the content of REM refers to the total content of one or more elements of REM. Further, REM is generally contained in misch metal. Therefore, for example, REM may be contained in the form of misch metal so that the content of REM is within the above range. [0061] 　The balance The 　balance consists of Fe and impurities. Here, impurities are those that are mixed in from ore, scrap, or the manufacturing environment as raw materials when steel materials are industrially manufactured, and are allowed as long as they do not adversely affect the steel sheet. means. [0062] 　Equation (1) will be described. 　F1 defined by the formula (1) is 0.5 or more and 1.0 or less. [0063] 　F1 is a parameter formula showing the relationship between C, N and S, which lowers moldability, and Ti and Nb. The lower F1 is, the more Ti and Nb are contained. In this case, since Ti and Nb and C and N easily form a carbonitride, the solid solution C and the solid solution N can be reduced. Therefore, the moldability is improved. However, if F1 is too low, specifically, if F1 is 0.5 or less, Ti and Nb are contained in a large excess. In this case, the solid solution Ti and the solid solution Nb increase. If the solid solution Ti and the solid solution Nb increase too much, the recrystallization temperature of the steel rises. Therefore, it is necessary to raise the annealing temperature. When the annealing temperature is high, the crystal orientation of ferrite, which is vulnerable to the stress of plane strain tensile deformation and biaxial tensile deformation (crystal grains other than those having a crystal orientation within 15 ° from the {111} plane parallel to the surface of the metal plate). (In particular, crystal grains having a crystal orientation within 15 ° from the {001} plane parallel to the surface of the metal plate) are easy to grow. In this case, unevenness due to deformation of the crystal grains develops during the molding process, and the surface of the molded product is likely to be roughened. Therefore, the lower limit of F1 is preferably 0.5 or more. [0064] 　On the other hand, if F1 is too high, the solid solution C and the solid solution N increase. In this case, the formability of the steel sheet is lowered due to age hardening. In addition, the recrystallization temperature of steel rises. Therefore, it is necessary to raise the annealing temperature. Crystal grains other than those having a crystal orientation within 15 ° from the {111} plane parallel to the surface of the metal plate, which is vulnerable to the stress of planar strain tensile deformation and biaxial tensile deformation when the annealing temperature is high. (In particular, crystal grains having a crystal orientation within 15 ° from the {001} plane parallel to the surface of the metal plate) are easy to grow. In this case, unevenness due to deformation of the crystal grains develops during the molding process, and the surface of the molded product is likely to be roughened. Therefore, F1 is preferably 1.0 or less. [0065] 　The preferable lower limit of F1 is 0.6 or more. The preferable upper limit of the F1 value is 0.9 or less. [0066] (Method for manufacturing a metal plate having a bcc structure] 　An example of a method for manufacturing a ferrite-based steel sheet suitable as a metal plate will be described below. [0067] 　In a suitable method for producing a ferritic steel sheet, in order to obtain the above-mentioned structure of the ferritic steel sheet, it is preferable to control cold rolling and annealing conditions in addition to the above chemical composition. 　Specifically, a suitable method for producing a ferrite-based steel sheet is a step of cold-rolling a hot-rolled sheet with a rolling reduction of 70% or more to obtain a cold-rolled sheet, and an annealing temperature of recrystallization temperature. The cold-rolled sheet is annealed under the conditions of + 25 ° C. or less, temperature unevenness in the plate surface within ± 10 ° C., and annealing time within 100 seconds. [0068] 　Hereinafter, details of a method for producing a suitable ferritic steel sheet will be described. [0069] -Heating step-In the 　heating step, the slab having the above chemical composition is heated. The heating is preferably set appropriately so that the finish temperature in the finish rolling in the hot rolling step (the surface temperature of the hot-rolled steel sheet after the final stand) is in the range of Ar3 + 30 to 50 ° C. When the heating temperature is 1000 ° C. or higher, the finishing temperature tends to be Ar3 + 30 to 50 ° C. Therefore, the lower limit of the heating temperature is preferably 1000 ° C. When the heating temperature exceeds 1280 ° C., a large amount of scale is generated and the yield is lowered. Therefore, the upper limit of the heating temperature is preferably 1280 ° C. When the heating temperature is within the above range, the lower the heating temperature, the better the ductility and formability of the steel sheet. Therefore, the more preferable upper limit of the heating temperature is 1200 ° C. [0070] -Hot rolling process-The 　hot rolling process includes rough rolling and finish rolling. In rough rolling, a slab is rolled to a certain thickness to produce a hot-rolled steel sheet. The scale generated on the surface may be removed during rough rolling. [0071] 　The temperature during hot rolling is maintained so that the steel is in the austenite range. Strain is accumulated in the austenite grains by hot rolling. Cooling after hot rolling transforms the structure of the steel from austenite to ferrite. Since the temperature is in the austenite region during hot rolling, the release of strain accumulated in the austenite crystal grains is suppressed. The austenite crystal grains with accumulated strain are transformed into ferrite at once by using the accumulated strain as a driving force when the temperature reaches a predetermined temperature range by cooling after hot rolling. As a result, the crystal grains can be efficiently refined. When the finishing temperature after hot rolling is Ar3 + 30 ° C. or higher, the transformation from austenite to ferrite during rolling can be suppressed. Therefore, the lower limit of the finishing temperature is Ar3 + 30 ° C. 　On the other hand, when the finishing temperature is Ar3 + 100 ° C. or higher, the strain accumulated in the austenite crystal grains is easily released by hot rolling. Therefore, it is difficult to efficiently refine the crystal grains. Therefore, the upper limit of the finishing temperature is preferably Ar3 + 100 ° C. When the finishing temperature is Ar3 + 50 ° C. or lower, strain can be stably accumulated in the austenite crystal grains, and the crystal grains can be made finer. Therefore, the preferred upper limit of the finishing temperature is Ar3 + 50 ° C. [0072] 　In finish rolling, a hot-rolled steel sheet having a certain thickness due to rough rolling is further rolled. In finish rolling, continuous rolling with a plurality of passes is performed using a plurality of stands arranged in a row. The larger the reduction rate in one pass, the more strain is accumulated for the austenite grains. In particular, the reduction rate in the final two passes (the final stand and the stand in the previous stage thereof) shall be 50% or more in total of the plate thickness reduction rates. In this case, the crystal grains of the hot-rolled steel sheet can be miniaturized. [0073] -Cooling process- 　After hot rolling, the hot-rolled steel sheet is cooled. Cooling conditions can be set as appropriate. Preferably, the maximum cooling rate until the cooling is stopped is 100 ° C./s or more. In this case, the release of strain accumulated in the austenite crystal grains by hot rolling is suppressed, and the crystal grains can be easily refined. The faster the cooling rate, the better. The time from the completion of rolling to cooling to 680 ° C. is preferably 0.2 to 6.0 seconds. When the time from the completion of rolling to 680 ° C. is 6.0 seconds or less, the crystal grains after hot rolling can be easily refined. When the time from the completion of rolling to 680 ° C. is 2.0 seconds or less, the crystal grains after hot rolling can be further refined. [0074] -Winling step-The 　winding step is preferably performed at 400 to 690 ° C. When the winding temperature is 400 ° C. or higher, the precipitation of the carbonitride is insufficient and the solid solution C and the solid solution N can be suppressed from remaining. In this case, the formability of the cold-rolled steel sheet is improved. When the winding temperature is 690 ° C. or lower, it is possible to suppress coarsening of crystal grains during slow cooling after winding. In this case, the formability of the cold-rolled steel sheet is improved. [0075] [Cold Rolling Process] A 　cold-rolled steel sheet is manufactured by performing cold rolling on the hot-rolled steel sheet after the winding process. The reduction rate in the cold rolling process is preferably high. By increasing the reduction rate, it becomes easy to increase the r value of the material having a strong correlation with the drawability in the annealing step. Therefore, the rolling reduction of cold rolling is preferably 70% or more. Due to the rolling equipment of the annealed steel sheet, the practical upper limit of the rolling reduction in the cold rolling process is 95%. [0076] -Annealing process- 　Annealing process is performed on the cold-rolled steel sheet after the cold rolling process. The annealing method may be either continuous annealing or box annealing. 　The annealing may be carried out under the conditions that the annealing temperature is the recrystallization temperature + 25 ° C. or less, the temperature unevenness in the plate surface is within ± 10 ° C., and the annealing time is 100 seconds or less. By performing annealing under these conditions, crystal grains A and crystal grains C are likely to develop. [0077] 　The recrystallization temperature is calculated as follows. The material is held at a temperature of 600 ° C. to 900 ° C. for 60 seconds, and then a sample having a cross section (L cross section) parallel to the rolling direction is obtained by cutting. Next, the cut surface of the sample is polished and nital-corroded, and the material structure of the cross section is observed. It is analyzed whether or not the elongated rolled structure remains, and the minimum temperature at which the rolled structure does not remain is defined as the recrystallization temperature. 　The temperature unevenness in the plate surface is measured as follows. Thermocouples are attached to the material at a total of three points, the central portion in the rolling width direction and both ends thereof, and the temperature is measured after holding at a temperature of 600 ° C. to 900 ° C. for 60 seconds. The average temperature of the three points is taken, and the difference between the maximum temperature and the minimum temperature is measured as temperature unevenness. 　　The annealing time indicates the time from reaching the desired annealing temperature to cooling. [0078] 　It is desirable that the annealing temperature distribution of the ferritic steel sheet is more uniform than the annealing temperature distribution of the prior art. It is necessary to lower the annealing temperature in order to suppress the coarsening of crystal grains and obtain a crystal structure suitable for suppressing surface roughness after press molding. However, it is necessary to set the lowest temperature among the objects to be heated to be equal to or higher than the recrystallization temperature. That is, in order to set the annealing temperature low, it is necessary to reduce the temperature unevenness in the plate surface. As a heating device for that purpose, it is desirable to use near infrared rays as a heat source from the viewpoint of responsiveness of feedback control according to the temperature of the steel sheet, and a heating device capable of controlling the output of the heat source in the width direction of the material at each position is more preferable. desirable. As described above, in order to increase the surface integral ratio of the crystal grains A and the crystal grains C, it is preferable to increase the C content, the P content, and the Mn content as compared with the prior art. [0079] 　Through the above steps, a ferritic steel sheet suitable as a metal plate can be manufactured. [0080] (Method for manufacturing a molded product of a metal plate having a bcc structure) 　The method for manufacturing a molded product of a metal plate according to the first embodiment is different from the metal plate according to the first embodiment in planar strain tensile deformation This is a method of manufacturing a molded product by performing a molding process in which biaxial tensile deformation occurs and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. [0081] 　This molding process includes deep drawing, overhanging, drawing overhanging, and bending. Specifically, as the molding process, for example, a method of overhanging the metal plate 10 as shown in FIG. 4A can be mentioned. In this molding process, the edge of the metal plate 10 is sandwiched between the die 11 and the holder 12 on which the draw beads 12A are arranged. As a result, the draw bead 12A is made to bite into the surface of the edge of the metal plate 10 to fix the metal plate 10. Then, in this state, the punch 13 having a flat top surface is pressed against the metal plate 10, and the metal plate 10 is overhanged and molded. Here, an example of a molded product obtained by the overhang molding process shown in FIG. 4A is shown in FIG. 4B. 　In the overhang molding process shown in FIG. 4A, for example, the metal plate 10 (the portion serving as the side wall of the molded product) located on the side surface side of the punch 13 undergoes plane strain deformation. On the other hand, the metal plate 10 (top surface of the molded product) located on the top surface of the punch 13 undergoes isobiaxial deformation or unequal biaxial tensile deformation that is relatively close to equibiaxial deformation. [0082] 　Further, as the molding process, for example, a method of drawing and overhanging the metal plate 10 as shown in FIG. 5A can be mentioned. In this molding process, the edge of the metal plate 10 is sandwiched between the die 11 and the holder 12 on which the draw beads 12A are arranged. As a result, the draw bead 12A is made to bite into the surface of the edge of the metal plate 10 to fix the metal plate 10. Then, in this state, the punch 13 whose top surface protrudes in a substantially V shape is pressed against the metal plate 10, and the metal plate 10 is drawn out and formed. Here, an example of a molded product obtained by the draw-out molding process shown in FIG. 5A is shown in FIG. 5B. 　In the draw-out molding process shown in FIG. 5A, for example, the metal plate 10 (the portion that becomes the side surface of the molded product) located on the side surface side of the punch 13 undergoes plane strain deformation. On the other hand, the metal plate 10 (top surface of the molded product) located on the top surface of the punch 13 undergoes unequal biaxial tensile deformation, which is relatively close to plane strain deformation. Further, the metal plate 10 (the ridgeline portion of the molded product) located at the top of the punch 13 undergoes planar strain tensile deformation. [0083] 　Here, as shown in FIG. 6, the plane strain tensile deformation is a deformation that extends in the ε1 direction and does not cause deformation in the ε2 direction. The biaxial tensile deformation is a deformation in which the deformation occurs in the ε1 direction and also in the ε2 direction. Specifically, the planar strain tensile deformation is a deformation in which the strain ratio β (= ε2 / ε1) becomes β = 0 when the strains in the biaxial direction are the maximum principal strain ε1 and the minimum principal strain ε2, respectively. The biaxial tensile deformation is a deformation in which the strain ratio β (= ε2 / ε1) is 0 <β ≦ 1. The deformation in which the strain ratio β (= ε2 / ε1) is 0 <β <1 is the unequal biaxial deformation, and the deformation in which the strain ratio β (= ε2 / ε1) is β = 1 is the equibiaxial deformation. Is. Incidentally, the uniaxial tensile deformation is a deformation that extends in the ε1 direction and contracts in the ε2 direction, and the strain ratio β (= ε2 / ε1) is −0.5 ≦ β <0. [0084] 　However, the range of the strain ratio β is a theoretical value. For example, it is calculated from the maximum principal strain and the minimum principal strain measured from the shape change before and after forming the steel plate (before and after the deformation of the steel plate) in the scribed circle transferred to the surface of the steel plate. The range of the strain ratio β of each deformation is as follows. ・ Uniaxial tensile deformation: -0.5 <β ≤ -0.1 ・ Plane strain tensile deformation: -0.1 <β ≤ 0.1 ・ Unequal biaxial deformation: 0.1 <β ≤ 0.8 ・ etc. Biaxial deformation: 0.8 <β ≤ 1.0 [0085] 　On the other hand, in the molding process, at least a part of the metal plate is processed at a processing amount such that the plate thickness reduction rate is 10% or more and 30% or less. If the processing amount is less than 10%, the unevenness tends to be less likely to develop during the molding process. Therefore, even if the metal plate does not satisfy the above conditions (a1), (b1) or (c1), the surface roughness of the molded product itself is unlikely to occur. On the other hand, when the plate thickness reduction rate exceeds 30%, the tendency of the metal plate (molded product) to break due to the molding process increases. Therefore, the processing amount of the molding process is within the above range. [0086] 　The molding process is performed at a processing amount such that at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. However, the molding process may be performed with a processing amount such that the entire metal plate excluding the edge portion (the portion sandwiched between the die and the holder) has a plate thickness reduction rate of 10% or more and 30% or less. Although it depends on the shape of the molded product to be molded, in particular, in the molding process, the part of the metal plate located on the top surface of the punch (the part where the metal plate is biaxially tensilely deformed) has a plate thickness reduction rate of 10% or more and 30% or less. It is preferable to carry out with the processing amount that becomes. The portion of the metal plate located on the top surface of the punch is often the portion most exposed to the line of sight when the molded product is applied as an exterior member. Therefore, when the portion of the metal plate is molded with a large processing amount of 10% or more and 30% or less in thickness reduction rate, if the development of unevenness is suppressed, the effect of suppressing surface roughness becomes remarkable. [0087] 　The plate thickness reduction rate is calculated when the plate thickness of the metal plate before the molding process is Ti and the plate thickness of the metal plate (molded product) after the molding process is Ta. The formula: plate thickness reduction rate = (Ti-). It is indicated by Ta) / Ti. [0088] (Molded product of a metal plate having a bcc structure) 　The molded product of the metal plate according to the first embodiment is a molded product of a metal plate having a bcc structure and having a ridgeline portion, and is described in (BD) below. It is a molded product of a metal plate that satisfies (BH) and satisfies the following conditions (a2), (b2) or (c2) on the surface of the maximum plate thickness portion. [0089] 　(BD) When the maximum plate thickness of the molded product is D1 and the minimum plate thickness of the molded product is D2, the condition of the formula: 10 ≦ (D1-D2) / D1 × 100 ≦ 30. 　(BH) When the maximum Vickers hardness of the molded product is H1 and the minimum Vickers hardness of the molded product is H2, the condition of the formula: 15 ≦ (H1-H2) / H1 × 100 ≦ 40. [0090] 　(A2) The area fraction of crystal grains (crystal grains A) having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.25 or more. It is 0.35 or less and the average crystal grain size is less than 16 μm. 　(B2) The area fraction of crystal grains (crystal grains A) having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.15 or more. It is 0.30 or less and the average crystal grain size is 16 μm or more. (C2) Taylor when the plane strain tensile deformation in the direction orthogonal to the extending direction of the ridge line portion at the minimum radius of curvature of the concave side surface of the ridge line portion in the cross section perpendicular to the extending direction of the ridge line portion is assumed. The area fraction of the crystal grains (crystal grains C) having a Factor value of 3.0 or more and 3.4 or less is 0.18 or more and 0.35 or less. [0091] -An example of a molded metal plate according to the first embodiment- 　Here, FIG. 7 shows an example of a molded metal plate according to the first embodiment. 　As shown in FIG. 7, the molded product 10 of the metal plate according to the first embodiment has, for example, a ridge line portion 12 on a bulging portion 13 which is a part or all of the design surface 11. Specifically, for example, the molded product 10 of the metal plate has a top plate portion 14 having a ridge line portion 12, a vertical wall portion 16 adjacent to the periphery of the top plate portion 14, and a vertical wall portion 16 adjacent to the periphery. It is a molded product of a metal plate on the substantially hat side having a flange 18. That is, the bulging portion 13 is composed of a top plate portion 14 and a vertical wall portion 16. The flange 18 may be partially or completely removed. [0092] 　The shape of the molded product 10 of the metal plate is not limited to the above configuration as long as the plate surface has the ridge line portion 12, and various shapes (dome shape, etc.) according to the purpose can be adopted. [0093] 　The ridge line portion 12 is provided linearly on the top plate portion 14 in a plan view of the molded product 10 of the metal plate. Further, the ridge line portion 12 is provided in a streamlined shape curved in a convex shape in a side view of the molded product 10 of the metal plate viewed from the direction orthogonal to the ridge line portion 12. [0094] 　Here, the ridge line portion 12 is arranged at a position separated by 10 mm or more from, for example, the edge of the molded product 10 of the metal plate (for example, the edge of the flange 18A on the orthogonal direction of the ridge line portion 12). That is, the ridge line portion 12 is provided inside, for example, the shoulder portion 14A (or the vertical wall portion 16A) along the extending direction of the ridge line portion 12 which is the boundary between the top plate portion 14 and the vertical wall portion 16. There is. The ridge line portion 12 may pass through the shoulder portion 14B (or the vertical wall portion 16B) intersecting the extending direction of the ridge line portion 12 and extend to the flange 18B on the extending direction of the ridge line portion 12. [0095] 　The ridge line portion 12 is not limited to the above aspect, and may be linear or streamlined in a plan view. Further, in the side view, the ridge line portion 12 may be linear or streamlined. [0096] -Each condition-In 　the molded product of the metal plate according to the first embodiment, at least the condition (BD) (condition of formula: 10 ≦ (D1-D2) / D1 × 100 ≦ 30) is satisfied. It can be considered that the molded product is molded by a molding process in which a part of the plate thickness reduction rate is 10% or more and 30% or less. 　That is, the maximum plate thickness D1 of the molded product can be regarded as the plate thickness of the metal plate before the molding process, and the minimum plate thickness D2 of the molded product is the metal plate (molding) at the portion where the plate thickness reduction rate is the largest after the molding process. It can be regarded as the plate thickness of the product). [0097] 　The condition (BH) (formula: 15 ≦ (H1-H2) / H1 × 100 ≦ 40) can also be satisfied by molding so that at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. It can be considered that the molded product is molded. This is due to the fact that work hardening (that is, Vickers hardness) increases as the processing amount (thickness reduction) of the molding process increases. 　That is, the portion having the maximum Vickers hardness H1 of the molded product can be regarded as the Vickers hardness of the metal plate (molded product) of the portion having the largest reduction rate of the plate thickness after the molding process, and the minimum Vickers hardness H2 of the molded product. Can be regarded as the Vickers hardness of the metal plate before molding. [0098] 　The Vickers hardness is measured according to the Vickers hardness (HV) measuring method described in the JIS standard (JIS Z 2244 (2009)). The measurement condition is test force = 294.2N (= 30kgf). [0099] 　Satisfying the condition (a2) indicates that the metal plate according to the first embodiment satisfying the condition (a2) is a molded product. 　Satisfying the condition (b2) indicates that is a molded product obtained by molding a metal plate according to the first embodiment satisfying the condition (b1). 　Here, under the conditions (a2) and (b2), the area fraction and the average crystal grain size of the crystal grains A are measured at a portion where the maximum plate thickness D1 or the minimum Vickers hardness H2 of the molded product is obtained. 　Then, the condition (a2) and the condition (b2) are replaced with the condition (a1) and the condition (b1) described in the metal plate according to the first embodiment and the metal plate before the molding process. It has the same meaning except that the area fraction and the average crystal grain size of the crystal grains A of the molded product are the conditions. [0100] 　Satisfying the condition (c2) indicates that the metal plate according to the first embodiment satisfying the condition (c1) is a molded product. The reason for this is as follows. 　When a metal plate is subjected to biaxial tensile deformation or plane strain deformation, an ND {111} or ND {001} texture develops. As a result, the area fraction of the crystal grains C in the molded product decreases, so that the upper limit of the desired area fraction of the crystal grains C under the condition (c2) and the condition (c1) fluctuates. Therefore, satisfying the condition (c2) indicates that the metal plate according to the first embodiment satisfying the condition (c1) is a molded product. 　In addition, ND indicates the rolling surface normal direction. [0101] 　Here, in the condition (c2), the value of the Taylor Factor shall be the "plane strain tensile deformation in the lateral direction" in the condition (c1), except that the plane strain tensile deformation in the direction orthogonal to the extending direction of the ridgeline portion is assumed. It is measured according to the measurement method of "Value of Taylor-Factor when assumed". [0102] 　Further, the minimum radius of curvature of the concave surface of the ridge of the cross section orthogonal to the extending direction of the ridge (see FIG. 8: R1 in the figure indicates the radius of curvature) is measured as follows. First, the three-dimensional shape on the concave surface of the ridgeline portion is measured by a three-dimensional shape measuring device. Next, a computer CAD software (for example, 3DCAD Solidworks, etc.) is used to continuously acquire the orthogonal cross-section of the ridgeline along the parallel direction of the ridgeline, and the radius of curvature of the concave surface of the ridgeline is the smallest. The portion having a radius is defined as the minimum radius of curvature. [0103] 　The metal plate molded product according to the first embodiment is subjected to a molding process that causes planar strain tensile deformation and biaxial tensile deformation. [0104] 　The method for confirming that the molded product is subjected to a molding process that causes plane strain tensile deformation and biaxial tensile deformation is as follows. [0105] 　The three-dimensional shape of the molded product is measured, a shape model divided into finite elements for numerical analysis is created based on the measurement data, and the process from the plate material to the three-dimensional shape is derived by inverse analysis by a computer. Then, the ratio of the maximum principal strain to the minimum principal strain (β) in each of the shape models is calculated. By this calculation, it can be confirmed that the molding process that causes the plane strain tensile deformation and the biaxial tensile deformation is performed. 　For example, the three-dimensional shape of a molded product is measured by a three-dimensional measuring machine such as Comet L3D (Tokyo Trading Techno System Co., Ltd.). Based on the obtained measurement data, the mesh shape data of the molded product is obtained. Next, using the obtained mesh shape data, numerical analysis of the one-step method (work hardening calculation tool "HYCRASH (JSOL Co., Ltd.)", etc.) is performed to make a flat plate once based on the shape of the molded product. expand. From the shape information such as the elongation and bending state of the molded product at that time, the plate thickness change and residual strain of the molded product are calculated. By this calculation, it can be confirmed that the molding process that causes the plane strain tensile deformation and the biaxial tensile deformation is performed. [0106] 　As described above, the molded product of the metal plate according to the first embodiment can be the molded product of the metal plate according to the first embodiment by satisfying each of the above conditions. It can be regarded as a molded product formed by the manufacturing method of. 　Therefore, the molded metal plate according to the first embodiment has a bcc structure, has a ridgeline portion, and has a surface even if it is a molded metal plate that satisfies the conditions (BD) and the condition (BH). It is a molded product of a metal plate in which the occurrence of roughness is suppressed. [0107] (Metal Plate Having Fcc Structure) 　The metal plate according to the second embodiment is a metal plate having an fcc structure and satisfying the following conditions (a1), (b1), or (c1) on the surface. 　(A1) The area fraction of the crystal grains (crystal grains A) having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.25 or more. It is 0.35 or less and the average crystal grain size is less than 16 μm. 　(B1) The area division of crystal grains (crystal grains A) having a crystal orientation 20 ° or more parallel to the surface of the metal plate and 20 ° or more away from the {001} plane is 0.15 or more. It is 0.30 or less and the average crystal grain size is 16 μm or more. (C1) In the plane of the metal plate, the area fraction of the crystal grains (crystal grains C) showing a Taylor Factor value of 3.0 or more and 3.4 or less when assuming plane strain tensile deformation in the lateral direction is It is 0.18 or more and 0.40 or less. [0108] 　The metal plate according to the second embodiment is subjected to molding processing in which plane strain tensile deformation and biaxial tensile deformation occur due to the above configuration, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. Even when it is applied, a molded product in which the occurrence of surface roughness is suppressed can be obtained. Then, the metal plate according to the second embodiment was found by the following findings. [0109] 　The inventors focused on the slip system (slip surface and slip direction) of the crystal structure of the metal plate having a bcc structure and the metal plate having an fcc structure. In other words, the inventors focused on the following. The slip surface of the crystal structure of the metal plate having the bcc structure and the slip direction of the crystal structure of the metal plate having the fcc structure are in a parallel relationship. The slip direction of the crystal structure of the metal plate having the bcc structure and the slip surface of the crystal structure of the metal plate having the fcc structure are in a parallel relationship. Then, it was estimated that the metal plate having the fcc structure has the same strength distribution for each crystal orientation in the biaxial tensile deformation as the metal plate having the bcc structure. (See Table 1 below). [0110] [table 1] [0111] 　The inventors focusing on the slip system of both crystal structures have found that the crystal orientation and molding of crystal grains in a biaxial deformation field (equal biaxial deformation field and unequal biaxial tensile deformation field) in a metal plate having an fcc structure. R.BECKER, "Effects of strain localization on surface roughening during sheet forming", Acta Mater. Vol. 46.No. 4.pp. 1385-1401, 1998). 　Specifically, the slip system of the crystal orientation of the cross section of the metal plate having the bcc structure was changed to the slip system of the metal plate having the fcc structure, and the area fraction of the crystal grains A on the surface of the metal plate was changed. .. The effect of surface roughness of the metal plate due to plastic strain at that time was investigated by numerical analysis. [0112] 　As a result, the inventors obtained the following findings. Similar to the metal plate having the bcc structure, the metal plate having the fcc structure also has a large processing amount (metal plate) by increasing the fraction of the crystal grains having the crystal orientation other than the {001} plane and the {111} plane. Even if a metal plate is formed with a processing amount of 10% or more, the increase in surface roughness due to planar strain tensile deformation is suppressed, and the equibiaxial tensile deformation and planar strain tensile deformation crystallize. The degree of deformation of the grains is reduced, and the difference in surface roughness development is reduced. [0113] 　That is, like the metal plate having the bcc structure, the metal plate having the fcc structure also undergoes plane strain tensile deformation and biaxial tensile deformation if the condition (a1) or the condition (b1) is satisfied, and at least the metal plate. The occurrence of surface roughness is suppressed even when a part of the sheet is subjected to a molding process in which the plate thickness reduction rate is 10% or more and 30% or less. [0114] 　On the other hand, the inventors also conducted the following examination. 　First, the inventors paid attention to the value (TF value) of the Taylor Factor when the plane strain tensile deformation in the lateral direction of the metal plate was assumed for the metal plate having the fcc structure. [0115] 　As a result, the inventors obtained the following findings. 　Similar to the metal plate having the bcc structure, the metal plate having the fcc structure also has an increased surface roughness due to plane strain tensile deformation even if the metal plate is formed with a large processing amount by controlling the fraction of the crystal grains C. Is suppressed. As a result, the degree of deformation of the crystal grains is reduced between the isobiaxial tensile deformation and the planar strain tensile deformation, and the difference in surface roughness development is reduced. 　It is considered that the reason why the difference in the development of surface roughness is small even in the metal plate having the fcc structure is the same as in the case of the metal plate having the bcc structure described above. [0116] 　That is, if the condition (c1) is satisfied, the metal plate having the fcc structure also undergoes plane strain tensile deformation and biaxial tensile deformation, and at least a part of the metal plate has a plate thickness reduction rate of 10% or more and 30% or less. Even when molding is performed, the occurrence of surface roughness is suppressed. [0117] 　From the above findings, the metal plate according to the second embodiment is subjected to plane strain tensile deformation and biaxial tensile deformation, and at least a part of the metal plate is formed by forming a plate thickness reduction rate of 10% or more and 30% or less. It was found that the metal plate can be obtained as a molded product in which the occurrence of surface roughness is suppressed even when the above is applied. [0118] 　Hereinafter, the details of the metal plate according to the second embodiment will be described. [0119] 　In the metal plate according to the second embodiment, the condition (a1), the condition (b1) and the condition (c1) are the condition (a1), the condition (b1) and the condition described in the metal plate according to the first embodiment. It is synonymous with (c1). [0120] 　In the metal plate according to the second embodiment, the metal plate is a metal plate having a fcc structure (face-centered cubic lattice structure). Examples of the metal plate having an fcc structure include metal plates such as γ-Fe (austenitic stainless steel), Al, Cu, Au, Pt, and Pb. 　Among these, the metal plate is preferably an austenitic stainless steel plate or an aluminum alloy plate. [0121] 　The thickness of the metal plate is not particularly limited, but is preferably 3 mm or less from the viewpoint of moldability. [0122] 　The metal plate according to the second embodiment is the same as the metal plate according to the first embodiment except that it has an fcc structure (face-centered cubic lattice structure). [0123] (Method for manufacturing a molded product of a metal plate having an fcc structure) 　The method for manufacturing a molded product of a metal plate according to the second embodiment is different from the metal plate according to the second embodiment in planar strain tensile deformation and This is a method of manufacturing a molded product by performing a molding process in which biaxial tensile deformation occurs and at least a part of the metal plate has a plate thickness reduction rate of 5% or more and 30% or less. 　The method for manufacturing a molded metal plate according to the second embodiment is the manufacture of a molded metal plate according to the first embodiment, except that the metal plate according to the second embodiment is applied as the metal plate. Similar to the method. Therefore, the duplicate description will be omitted. [0124] 　However, in the method for manufacturing a molded metal plate according to the second embodiment, the lower limit of the plate thickness reduction rate is set to 5% or more. The reason for this is that, unlike the metal plate having the bcc structure, the metal plate having the fcc structure tends to have a surface roughness from a plate thickness reduction rate of 5%. Then, in the method for producing a molded metal plate according to the second embodiment, a molded metal plate with suppressed surface roughness can be obtained even if the plate thickness reduction rate is 5%. [0125] (Molded product of a metal plate having an 　fcc structure ) A molded product of a metal plate having an fcc structure and having a ridge line portion, 　which satisfies the following (FD) and (FH), and on the surface of the maximum plate thickness portion. A molded product of a metal plate satisfying the following conditions (a2), (b2) or (c2). 　(FD) When the maximum plate thickness of the molded product is D1 and the minimum plate thickness of the molded product is D2, the condition of the formula: 5 ≦ (D1-D2) / D1 × 100 ≦ 30. 　(FH) When the maximum Vickers hardness of the molded product is H1 and the minimum Vickers hardness of the molded product is H2, the condition of the formula: 7 ≦ (H1-H2) / H1 × 100 ≦ 40. 　(A2) The area fraction of crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the molded product and 20 ° or more away from the {001} plane is 0.25 or more and 0.35 or less. Moreover, the average crystal grain size is less than 16 μm. 　(B2) The area fraction of the crystal grains having a crystal orientation 20 ° or more from the {111} plane parallel to the surface of the molded product and 20 ° or more away from the {001} plane is 0.15 or more and 0.30 or less. Moreover, the average crystal grain size is 16 μm or more. 　(C2) Taylor Factor when the plane strain tensile deformation in the direction orthogonal to the extending direction of the ridge portion at the minimum radius of curvature of the concave surface of the ridge portion of the cross section orthogonal to the extending direction of the ridge portion is assumed. The area fraction of the crystal grains showing a value of 3.0 or more and 3.4 or less is 0.18 or more and 0.35 or less. [0126] 　The molded metal plate according to the second embodiment has an fcc structure and is the same as the molded metal plate according to the first embodiment except that the condition (FD) and the condition (FH) are satisfied. .. Therefore, the duplicate description will be omitted. [0127] 　However, in the molded metal plate according to the second embodiment, the condition (FD) is the same as the condition (BD) except that the lower limit of (D1-D2) / D1 × 100 is 5 or more. The condition (FH) is the same as the condition (BH) except that the lower limit of (H1-H2) / H1 × 100 is 7 or more. The reason for this is that the molded product of the metal plate having the fcc structure is different from the molded product of the metal plate having the bcc structure from (D1-D2) / D1 × 100 = 5, and (H1-H2) / H1 ×. Surface roughness tends to occur from 100 = 7. Then, in the molded metal plate according to the second embodiment, the surface roughness is suppressed even when D1-D2) / D1 × 100 = 5 and (H1-H2) / H1 × 100 = 7. It is a molded product of a metal plate. Example [0128] (Manufacturing of steel plate) 　Each steel piece having the chemical composition shown in Table 2 was processed under the conditions shown in Tables 3 to 4. Specifically, first, a heating step, a hot rolling step, a winding step, a cold rolling step, and an annealing step were carried out on each steel piece. The hot rolling step was carried out under the conditions shown in Table 3 using an experimental rolling mill. Next, the hot-rolled steel sheet cooled to the winding temperature was charged into an electric furnace maintained at a temperature corresponding to the winding temperature. After holding it as it was for 30 minutes, it was cooled under the conditions shown in Tables 3 to 4, and the winding process was simulated. Further, the cold rolling step was carried out under the conditions shown in Table 3. Then, the obtained cold-rolled steel sheet was annealed under the conditions shown in Tables 3 to 4. 　Through the above steps, the desired steel sheet was obtained. The ferrite fraction of the obtained steel sheet was 100% in each case. [0129] [Molding of molded product] 　Next, the obtained steel plate (steel plate having a bcc structure) was then subjected to drawing molding to obtain a molded product shown in FIG. 7. The dimensions of the molded product are W = 400 mm, L = 400 mm, H11 = 95 mm, H12 = 100 mm, H2 = 25 mm, and the minimum radius of curvature θ of the concave surface of the ridgeline in the cross section perpendicular to the extending direction of the ridgeline. (Fig.) = 1/1600 mm. 　In this molding, the plate thickness reduction rate of the steel plate serving as the evaluation portion of the molded product (the minimum radius of curvature of the concave surface of the ridge portion in the cross section in the direction orthogonal to the extending direction of the ridge portion) is shown in Table 5. The processing amount was reduced. [0130] 　Here, in the molding of the molded product, the scribed circle is transferred to the surface of the steel plate corresponding to the evaluation part of the molded product, and the shape change of the scribed circle before and after molding (before and after deformation) is measured. The maximum principal strain and the minimum principal strain were measured. From these values, the deformation ratio β in the evaluation section of the molded product was calculated. [0131] [Evaluation method] The 　following measurement tests and visual evaluations were carried out on each of the obtained steel sheets and each molded product. The results are shown in Tables 3-5. 　An example of molding conditions in which the plate thickness reduction rate is less than 10% is described as a reference example because the amount of strain is small and surface unevenness does not occur. [0132] [Measurement test of crystal grain area fraction and average crystal grain size] The area fraction and average crystal grain size of 　the following crystal grains were measured according to the method described above. 　-Crystal grain A (crystal grain having a crystal orientation 20 ° or more parallel to the surface of the metal plate and 20 ° or more away from the {001} plane) 　-Crystal grain C1 (in the plane of the metal plate ) Area fraction of Taylor Factor value of 3.0 or more and 3.4 or less when assuming planar strain and tensile deformation in the lateral direction 　・ Crystal grain C2 (cross section in the direction perpendicular to the extending direction of the ridgeline ) Crystals showing a Taylor Factor value of 3.0 or more and 3.4 or less when assuming plane strain tensile deformation in the direction perpendicular to the extending direction of the ridgeline at the minimum radius of curvature of the concave surface of the ridgeline. Area division of grains) In the 　table, each area division is expressed in% (that is, a value multiplied by 100). [0133] [Measurement test of plate thickness] A 　plate thickness measurement test was performed on the molded product. Specifically, a computer-based molding simulation of the molded product was carried out to identify the portion where the plate thickness was the maximum and the minimum. After that, the plate thickness of the molded product was measured using a plate thickness gauge at each of the parts where the plate thickness was the maximum and the minimum. As a result, the maximum plate thickness D1 and the minimum plate thickness D2 were obtained. However, the maximum plate thickness D1 was obtained as the maximum plate thickness of the molded product (the entire molded product), and the minimum plate thickness D2 was obtained as the minimum plate thickness of the evaluation part of the molded product. [0134] [Vickers hardness measurement test] A 　Vickers hardness measurement test was performed on the molded product. Specifically, a computer-based molding simulation of the molded product was carried out to identify the sites where the equivalent plastic strain was maximum and minimum. Then, the Vickers hardness of the molded product was measured according to the JIS standard (JIS Z 2244 (2009)) at each of the parts where the plate thickness was the maximum and the minimum. As a result, the maximum Vickers hardness H1 and the minimum Vickers hardness H2 were obtained. However, the maximum Vickers hardness H1 was the maximum Vickers hardness of the molded product (the entire molded product), and the minimum Vickers hardness H2 was the minimum Vickers hardness of the evaluation unit of the molded product. [0135] [Visual evaluation] 　Originally, electrodeposition coating is performed after chemical conversion treatment, but as a simple evaluation method, the surface of the molded product is uniformly coated with lacquer spray, then visually observed, and surface roughness occurs according to the following criteria. We investigated the degree and sharpness of the evaluation surface. 　Furthermore, as another parameter indicating the superiority or inferiority of the surface texture, the value of the arithmetic mean swell Ra was measured with a laser microscope manufactured by Keyence Corporation. The measurement conditions were an evaluation length of 2.0 mm and a cutoff wavelength of λc of 0.8 mm. Then, the profile on the short wavelength side of the cutoff wavelength λc was evaluated. 　The evaluation criteria are as follows. A: A pattern is not visually confirmed on the surface of the evaluation part of the top plate of the molded product, the surface is glossy, and the sharpness is excellent (Ra ≤ 0.75 μm). It is more desirable as an automobile outer panel part, and can also be used as an automobile outer panel part. B: A pattern is not visually confirmed on the surface of the evaluation part of the top plate of the molded product, and the surface is glossy (0.75 μm [Molding simulation of molded product] 　Using the cross section of the metal plate having the bcc structure used in Reference Example A, the crystal grains in the cross section of the metal plate having the fcc structure were modeled. Then, the grain size of the crystal grains in the cross section of the metal plate having the fcc structure was changed, and the average area division of the crystal grains A and the crystal grains B was changed to model a virtual material having the characteristics shown in Table 6. .. 　Next, a molding simulation corresponding to molding of the molded product shown in FIG. 7 (molding of the same molded product as in Example A) was performed on the modeled virtual material by drawing and extending. That is, with respect to the modeled virtual material, the "plate thickness" corresponding to the amount of plastic strain of the virtual material that is the evaluation part of the molded product (outside the bending of the minimum radius of curvature of the ridge line in the cross section orthogonal to the extending direction of the ridge line). A molding simulation was carried out to give a "decrease rate". 　Specifically, first, in order to impart a displacement of "equivalent plastic strain" shown in Table 6 to the virtual material, a press forming simulation of the model shape (hereinafter referred to as a press forming simulation) was carried out by a finite element analysis method. 　As a result, the "maximum plate thickness D1 (corresponding to the maximum plate thickness D1 of the molded product)", "minimum plate thickness D2 (corresponding to the minimum plate thickness D2 of the molded product)", and the maximum in the virtual material after the press molding simulation are performed. The Vickers hardness H1 (corresponding to the maximum Vickers hardness H1 of the molded product) and the "minimum Vickers hardness H2 (corresponding to the minimum Vickers hardness H2 of the molded product)" were calculated. 　Then, as a molding simulation of the virtual material corresponding to this press molding simulation, a displacement of "equivalent plastic strain" shown in Table 6 is applied to the left, right, front, and depth directions of the cross section of the virtual material, and biaxial tensile deformation is applied. A molding simulation (hereinafter referred to as a molding simulation) was carried out by a crystal-plastic finite element analysis method. [0142] 　Here, the "maximum plate thickness D1 (corresponding to the maximum plate thickness D1 of the molded product)" and the "minimum plate thickness D2 (corresponding to the minimum plate thickness D2 of the molded product)" in the virtual material after the press molding simulation are performed are It was as follows. 　The maximum plate thickness D1 is the plate thickness at the place where the plate thickness is maximum in the plate surface of the press-molded product. 　The minimum plate thickness D2 is the plate thickness at the place where the plate thickness is the minimum in the plate surface of the press-molded product. [0143] 　Further, "maximum Vickers hardness H1 (corresponding to the maximum Vickers hardness H1 of the molded product)" and "minimum Vickers hardness H2 (corresponding to the minimum Vickers hardness H2 of the molded product)" in the virtual material after the press molding simulation is performed. Was as follows. 　For the maximum Vickers hardness H1, the Vickers hardness before molding was calculated from the average yield strength YP 1 (MPa) of the virtual material by the following formula. 　-Formula: Maximum Vickers hardness H1 = YP 1 (MPa) / 3 　Minimum Vickers hardness H2 is the following formula from the average yield strength YP 2 (MPa) of the virtual material after molding (after work hardening). Calculated by 　-Formula: Maximum Vickers hardness H2 = YP 2 (MPa) / 3 [0144] 　However, the Vickers hardness before molding was calculated as the average yield strength YP 1 (MPa) of the virtual material based on the yield strength of the 6000 series aluminum alloy plate and its crystal orientation dependence as the virtual material. 　Further, the average yield strength YP 2 (MPa) of the virtual material is the Vickers hardness after molding (after work hardening), and the plate surface of the press-molded product is measured by the press-molding simulation in which the mechanical properties of the 6000 series aluminum alloy plate are input. It was calculated using the equivalent stress value at the place where the plate thickness is the minimum. [0145] 　Then, the following evaluation was carried out for the virtual material after the molding simulation was carried out. The results are shown in Table 6. 　The example of the molding simulation condition in which the plate thickness reduction rate is less than 10% is described as a reference example because the amount of strain is small and surface unevenness does not occur. [0146] (Height of unevenness) The height 　of unevenness on the surface of the virtual material after the molding simulation was performed was calculated by the following method. The surface profile of the virtual material after the molding simulation was performed was used as the cross-sectional curve of the virtual material, and was calculated from the maximum and minimum values ​​of the cross-sectional curve. [0147] (Arithmetic Mean Height Pa of Cross-Section Curve) With 　respect to the surface texture of the virtual material after the molding simulation was performed, the arithmetic mean height Pa of the cross-section curve was calculated after obtaining the cross-sectional curve of the virtual material. Then, it was evaluated according to the following evaluation criteria. 　The arithmetic mean height Pa of the cross-sectional curve is the arithmetic mean height specified in JIS B0601 (2001). The measurement conditions are as follows. ・ Evaluation length: 1 mm ・ Standard length: 1 mm [0148] 　The evaluation criteria for the surface texture of the virtual material are as follows. A: Pa ≤ 0.75 μm (more desirable as an automobile outer panel part and can also be used as an outer panel part of a luxury car.) B: 0.75 μm