1. A method for controlling a laser-processing operation for surface modificationof a workpiece, the method comprising the steps of: placing and automatically adjusting (202), by a targeting device, the workpiece on a workbench of a laser processing system; determining (204), by a plurality of sensing units, at least one or more first parameters related to the workpiece to undergo laser-processing operation; learning (206), by a learning device, to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are based on at least one or more first parameters related to the workpiece to undergo laser-processing operation; and receiving (208), by a surface modification unit, the learned data from the learning device as an input for the laser-processing operation for performing surface modification of the workpiece.

2. The method as claimed in claim 1, wherein the laser-processing operation for surface modification of the workpiece comprise at least one of: marking, etching, and/or engraving on the surface of the workpiece.

3. The method as claimed in claim 1, wherein the one or more first parameters are associated with at least a material, a thickness, and/or a dimension of the workpiece.

4. The method as claimed in claim 1, wherein the one or more second parameters are associated with at least one of: laser source power, etching process speed, and pulse frequency requirement.

5. The method as claimed in claim 1, wherein the learning (206) to generate/adjust one or more one or more second parameters is adapted to control at least: - laser-processing operation according to a variation in Dry Film Thickness (DFT) over the surface of the workpiece; - under-removal causing blackness or over-removal causing yellowness on the surface of the workpiece due to the etching process; and - a symbol shift due to dislocation of the workpiece.

6. A laser processing system (2000) for controlling a laser-processing operation for surface modification of a workpiece, the system(2000) comprising: a targeting device (2002) place and automatically adjust the workpieceon a workbench of the laser processing system (2000); aplurality of sensing units(2004) to determine at least one or more first parameters related to the workpiece to undergo laser-processing operation; a learning device (2006) that learns to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are based on at least one or more first parameters related to the workpiece to undergo laser-processing operation; and asurface modification unit(2008) to receive the learned data from the learning deviceas an input for the laser-processing operation to perform surface modification of the workpiece.

7. The system (2000) as claimed in claim 6, wherein the surface modification unit (2008),comprising at least a control unit (2008a) and a memory (2008b),is adapted to perform the laser-processing operation for surface modification of the workpiece that comprises at least one of: marking, etching, and/or engraving on the surface of the workpiece.

8. The system (2000) as claimed in claim 6, wherein the plurality sensing units (2004),comprising at least a laser source, is adapted to determine the one or more first parameters are associated with at least a material, a thickness, and/or a dimension of the workpiece, wherein the sensing unit.

9. The system (2000) as claimed in claim 6, wherein the one or more second parameters are associated with at least one of: laser source power, etching process speed, and pulse frequency requirement.

10. The system (2000) as claimed in claim 6, wherein the learning device (2006) learn to generate/adjust one or more one or more second parameters is adapted to control at least: - laser-processing operation according to a variation in Dry Film Thickness (DFT) over the surface of workpiece; - under-removal causing blackness or over-removal causing yellowness on the surface of the workpiece due to the etching process; and - a symbol shift due to dislocation of workpiece.

The present invention relates to the field of laser marking /etching/ engraving. More specifically, the invention provides a method and system for real-time measurement of laser parameters for laser etching.
Background:
Nowadays, laser machines are highly equippedsuch that they cantransform the entire outlook of the object through markingand/or engravingand/or etching the surface of the object.However,many times it has been observed that during the etching process,variation in the Dry Film Thickness (DFT), which is the thickness of a covering/coating estimated over the substrate, leads to rejection of components, due to improper laser etching/marking process. The selection of incorrect static parameters eventually leads to either over removal or under removal ofan undesired layer from thesurface of the object.
For example, in industries, the objects are painted before the etching process. These industries use laser marking machine for removing the paint or DFT. Generally, the paint’s coating thickness varies(around 2-3 microns) at different sites on the surface of the object. This variation in thickness of the coating is majorly influenced by various factors such as temperature, humidity, dust, etc. Therefore, there is always a need to vary the laser parameters according to the coating thickness of the surface of the object.
Further, improper machining conditions selection of laser machines may result invarious types of damages to the surface such as under etching, over-etching, etc. The under etching of the surface results in under removal, i.e.,when the desired area is not etched properly and some amount of the paint is still deposit on the surface of the object. Such a problem occurs when the laser parameters such as laser source power, etching speed, and pulse frequency are not set according to paint coating. All the laser parameters like laser source power, etching speed, and pulse frequency are the main cause of the blacknessproblem, as also referred to in Figure 1a. In the laser machine process,the laser heats the material, causing oxidation under the surface and turning the material black. This problem due to low source power (less than required source power), high etching speed (more than required etching speed), and high pulse frequency (more than required pulse frequency) to etch the surface coating of the object. Due to this problem, around 4-5% of total production is rejected.
Similarly, the laser creates a large amount of heat during the engraving process, which essentially causes the material to vaporize. Engraving is a quick process, as the material is vaporized with each pulse and this creates a cavity in the surface that is noticeable to the eye and touch. To form deeper marks, as referred in Figure 1b, the engraving process is repeated with several loop counts.
Similarly, another problem of object’s yellowness due to the burning of the desired area is encountered as a result of an over-etching process. Laser etching is a subset of laser engraving, which occurs when the heat from the beam causes the surface of the material to melt. The laser beam uses a large amount of heat to melt the surface of the material as referred to in Figure 1c. The melted material expands and gives a raised mark. All the laser parameters like laser source power, etching speed, and pulse frequency are the main cause of the yellowness problem. This problem due to high source power (high than required source power), low etching speed (less than required etching speed), and low pulse frequency (less than required pulse frequency) to etch the surface coating of the object. Due to this problem, around 3-5% of total production is rejected.
Another problem of symbol shift is also caused due to improper laser processing during etching when the object is not placed at a perfect etching position. The same problem occurs in the laser marking and laser engraving process. Due to this problem, around 2-3% of total production is rejected. Such damages cause huge losses to the industry.
At least to address aforesaid constraints, there lies a need for obviating aforesaid drawbacks plaguing the state of the art of existing laser processing which can be optimized at least on the basis of properties of the object and/or static parameters.Further, there also lies a need for the laser parameters to change according to the coating thickness of the surface of the object. Hence, there is a need to develop a system and method for real-time measurement of information of the surface and accordingly change the laser parameter.
Summary:
This summary is provided to introduce a selection of concepts, in a simplified format, that are further described in the detailed description of the invention. This summary is neither intended to identify key or essential inventive concepts of the invention and nor is it intended for determining the scope of the invention.
The present disclosure relates to providinga method and system for improving the controlling of a laser-processing operation for surface modification of a workpiece.
In an aspect of the present invention, there is provided a method for controlling a laser-processing operation for surface modification of a workpiece, the method comprising the steps of placing and automatically adjusting, by a targeting device, the workpiece on a workbench of a laser processing system; determining, by a plurality of sensing units, at least one or more first parameters related to the workpiece to undergo laser-processing operation; learning, by a learning device, to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are based on at least one or more first parameters related to the workpiece to undergo laser-processing operation; and receiving, by a surface modification unit, the learned data from the learning device as an input for the laser-processing operation for performing surface modification of the workpiece.
In an aspect of the present invention, there is provided a laser processing system for controlling a laser-processing operation for surface modification of a workpiece, the system comprisinga targeting device place and automatically adjust the workpiece on a workbench of a laser processing system. The system further comprising a plurality of sensing units to determine at least one or more first parameters related to the workpiece to undergo the laser-processing operation. The system further comprising a learning device that learns to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are generated/adjusted based on at least one or more first parameters related to the workpiece to undergo the laser-processing operation. The system further comprising a surface modification unit to receive the learned data from the learning device as an input for the laser-processing operation to perform surface modification of the workpiece.
Brief Description of the Drawings:
The present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
Figure 1a, 1b, & 1c illustrate images ofsurface modification of a workpiece through laser-processing operation;
Figure 2illustrates a flow diagram of a presented disclosure for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
Figure 3 illustrates a laser processing system for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
Figure 4 illustratesa use-case scenario of an application laser processing system for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
Figure 5 illustrate a use-case scenario of an application laser processing system for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure;
Figure 6a, 6b, & 6c illustrates different workpiece samples after surface modification through the method and system as depicted in the present subject matter, in accordance with an embodiment of the present subject matter.
Further, skilled artisans will appreciate that elements in the drawings are illustrated for simplicity and may not have been necessarily been drawn to scale. For example, the flow charts illustrate the method in terms of the most prominent steps involved to help to improve understanding of aspects of the present disclosure. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the drawings by conventional symbols, and the drawings may show only those specific details that are pertinent to understanding the embodiments of the present disclosure so as not to obscure the drawings with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein.
Detailed Description of Figures:
For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiment illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated system, and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates.
It will be understood by those skilled in the art that the foregoing general description and the following detailed description are explanatory of the present disclosure and are not intended to be restrictive thereof.
Reference throughout this specification to “an aspect”, “another aspect” or similar language means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, appearances of the phrase “in an embodiment”, “in another embodiment” and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment.
The terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such process or method. Similarly, one or more devices or sub-systems or elements or structures or components proceeded by "comprises... a" does not, without more constraints, preclude the existence of other devices or other sub-systems or other elements or other structures or other components or additional devices or additional sub-systems or additional elements or additional structures or additional components.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skilled in the art to which this disclosure belongs. The system, methods, and examples provided herein are illustrative only and not intended to be limiting.
In metal/non-metal industries, laser technology-based machines are widely used for cutting, engraving, and marking the metals and/or non-metal workpiece or objects. Generally, the problems related to an adjustment of laser parameters like power, speed and frequency, and principle working of laser marking machine in real-time are encountered. For example, in plastic industries, theworkpieces or objectsare painted through a laser etching process to protect the surface from environmental effects. However, during the etching process, various problems may arise, such as‘symbol shift’ in which position of marked/engraved symbol is not appropriate, or ‘blackness’ in which the paint or dry film thickness (DFT) is not cut completely due to inadequate power supply, or ‘yellowness’ due to the cutting of bare part at high power may occur.
The present disclosureaddresses the above-mentioned problems related to laser processing by providingat least a method and a system for gathering information in real-time for controlling a laser-processing operation for surface modification of a workpieceby using artificial intelligence.Through the present disclosure, various parameters that are required for surface modification of the workpiece through laser processing are gathered todetermine the various laser parameters such as speed, power, frequency requirement for workpiece of specific material and thickness/dimensions and accordingly determine the optimize the operation/functioning of the laser-processing system in accordance the determined parameters.
Figure 2 depicts a flow diagram of a presented disclosure for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
In an embodiment of the present disclosure, there is provided a method for controlling a laser-processing operation for surface modification of a workpiece. The laser-processing operation for surface modification of the workpiece comprises at least one of marking, etching, and/or engraving on the surface of the workpiece.
At step 202, the workpiece is placed and adjusted by a targeting device on a workbench of a laser processing system.The workbench is provided with a plurality of sensors, cameras, and adjustment mechanisms to identify and adjust at least an intended target point on the workpiece for the laser processing. When the workpiece is placed on the workbench for the laser-processing, the coordinates are mapped with respect to intended markings through the adjustment mechanism, and accordingly, the workpiece is adjusted on the workbench.
At step 204, at least one or more first parameters related to the workpiece to undergo laser-processing operation are determined by a plurality of sensing units. The one or more first parameters are associated with at least a material, a thickness, and/or a dimension of the workpiece.For example, DFT may comprise a solitary layer or different layers are estimated for restored coatings after the covering dries. Since the accuracy in the etching process is generally affected by variation in DFT of coating over the surface of the workpiece, therefore it is essentially required to estimate the DFT for laser-processing. Similarly, different parameters are used for different materialsof the workpiece such as metal or non-metal, ductility, etc., based on which at least the laser marking/ engraving/ etching process is required to be controlled. Similarly,information relating to hatch is required to attain marking, engraving, and etching on the workpiece. The hatchrelating to laser processing is adapted to be programmed using AI. A user may control the density, angle, and type of fill pattern according to the desired symbol.
At step 206, learning is performed, by a learning device, to generate and/or adjust at least one or more second parameters related to machining conditions for the laser-processing operation. The one or more second parameters are associated with at least one of: laser source power, etching process speed, and pulse frequency requirement. Further, the one or more second parameters are generated/ adjusted based on at least one or more first parameters related to the workpiece to undergo the laser-processing operation.For the laser marking, engraving, and etching process, several parameters are adapted to be determined for optimization of machining conditions required for the laser-processing. The determination of parameters related to laser-processing may be adequately done effectively through Artificial intelligence (AI).
The determination of processing parameters through AI enhance the results on the basis ofthe specificity of material and other related properties of the workpiece. In fact, in many cases, different combinations are ideal for specific materials. There are various parameters related to machining conditions thatare essentially required for laser-processing such as scanning speed, laser power, frequency of the laser, loop count, and hatch, etc.The speed may range from 10 mm/sec to 7000 mm/sec, depending upon the one or more first parameters. Similarly, the percentage of power is adapted to adjust according to the given range. Similarly, the loop count which is the number of times the workpiecemay be processed or operated is required to be adjusted using the combination of the settingssuch as speed, power, and frequency. The entire loop is adapted to be processed onthe same laser parameters. The loop count is depending on the thickness of the material which is engraved.
Through AI, an appropriate data set related to machining conditions associated with at least one laser-processing may be received. The dataset is generated/ adjusted based at least on the one or more first parameters determined through a plurality of sensing units and related databases. The learning (206) employs one of: supervised/unsupervised machine learning or reinforcement learning algorithm for analyzing the dataset related to machining conditions for laser-processing.The learning (206) for generating/adjustingthe one or more second parameters is adapted to control at least:
- laser-processing operation according to a variation in Dry Film Thickness (DFT) over the surface of the workpiece;
- under-removal causing blackness or over-removal causing yellowness on the surface of the workpiece due to the etching process; and
- a symbol shift due to dislocation of the workpiece.
At step, 208, receiving (208), by a surface modification unit, the learned data from the learning device as an input for the laser-processing operation for performing surface modification of the workpiece. The parameters related to the laser marking process may be attained through AI. The first and the second parameters related to the machining condition are fed to the laserprocessing system. The adequate and accurate marking is attained using a dataset obtained through AI which allows the moving of a low-powered beam slowly across the material using a method called discoloration. The AI-based laser marking-process creates high-contrast marks without disrupting the workpiece.
Similarly, the laser engraving process is employed usingAI through which the laser beam is controlled to physically remove the surface of the object to expose a cavity that reveals an image at eye level and givingan unblemished outlook to the workpiece. The laser is adjusted through datasets obtained from AI to generate a sufficient amount of heat during the engraving process, which essentially causes the material to vaporize. Since engraving is a quick process, as the material of the workpiece gets vaporized with each pulse, therefore it is always desirable to adequately select the appropriate datasets which can be done automatically through AI. This AI-based engraving process creates a cavity of the desired dimension at the desired location on the surface of the workpiece. Even, the number of loop counts may also be determined through AI.
Similarly, laser etching can be controlled through AI, through which the heating of the workpiece through the laser beam may be controlled, eventually, causing the surface of the workpiece to melt. The AI-controlled laser beam may generate an adequate amount of heat to melt the surface of the workpiece due to which the specific location on the surface of the workpiecemay expand and cause a raised mark.
Figure 3 illustrates a laser processing system2000 for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
In an embodiment of the present disclosure, there is provided at least a laser processing system (2000) for controlling a laser-processing operation for surface modification of a workpiece. The system (2000) comprising:a targeting device (2002) to place and automatically adjust the workpiece on a workbench of the laser processing system (2000). The system (2000) further comprisinga plurality of sensing units (2004) to determine at least one or more first parameters related to the workpiece to undergo the laser-processing operation. The sensing units 2004 may further comprise the sensing unit 1-n,2004a-2004n, that are mounted to capture various parameters relating to the workpiece and current machining conditions of the laser-processing system (2000). The plurality sensing units (2004), may further comprise at least a laser source, adapted to determine the one or more first parameters are associated with at least a material, a thickness and/or a dimension of the workpiece, wherein the sensing unit.
The system (2000)further comprising a learning device (2006) that learns to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are based on at least one or more first parameters related to the workpiece to undergo the laser-processing operation. The one or more second parameters are associated with at least one of: laser source power, etching process speed, and pulse frequency requirement. The learning device (2006) is further adapted to learn and generate/adjust one or more one or more second parameters is adapted to control at least:laser-processing operation according to a variation in Dry Film Thickness (DFT) over the surface of the workpiece, under-removal causing blackness or over-removal causing yellowness on the surface of the workpiece due to the etching process, anda symbol shift due to dislocation of the workpiece.
The system (2000) further comprising at least a surface modification unit (2008) to receive the learned data from the learning device as an input for the laser-processing operation to perform surface modification of the workpiece. The surface modification unit (2008), comprising at least a control unit (2008a) and a memory (2008b), is adapted to perform the laser-processing operation for surface modification of the workpiece that comprises at least one of: marking, etching, and/or engraving on the surface of the workpiece. The control unit 2008ais operatively coupled with the memory 2008b comprising a database.
Figure 4 depicts a use-case scenario of an application laser processing system400 for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
In an implementation of the present disclosure, there is provided the laser processing system 400 through which the laser parameters are adjusted according to the workpiece’s Dry Film Thickness (DFT). The system comprises aplurality of sensor units, one of which is a laser light source 408which is configured to generate the light which may be reflected in a specific direction by adjusting a mirror 412 coupled to it.The laser light reflected from the mirror 412 is allowed to reflect back and fall on the surface of the workpiece 424place over the workbench of the system 400 for one or more first parameters such as thickness measurement.
The sensor units coupled with the system 400 further comprises one or more detectors.The detector may further comprise a plurality of infrared detectors adapted 410 to detect the light coming from the sample workpiece 424 and a camera such asIR/vision cameras, to detect the placement position and forthe real-time measurement of Dry Film Thickness (DFT) of the workpiece 424.For example, the IR/vision cameras mounted in the vicinity of the workpiece 424, are adapted to capture the image of a workpiece for correct positioning of the laser as per the CAD drawing.
The system 400 further comprises alearning device 406,coupled with a surface modification unit,is adapted to receive the signal from the infrared detectors 410 and through adaptive learning and collecting information from the database, it is configured to accurately determine the required second parameters for theoperation of the system 400 for marking /engraving/ etching, etc.
The learning device 406 is adapted to take a real-time decision for adjusting one or more laser engraving parametersbased upon DFT and machine learning to prevent under removal and over removal. Real-time decision making through machine learning is employed to adjust one or more parameters in case of variation in DFT. As a non-limiting factor, the real-time decision making through machine learningapplication may also be implemented for similar other real-time decision-making problems. The real-time decision making and parameter optimization may also be adapted for the applications involving variation in DFT. Such requirements employ intelligent adjustments of one or more second parameters for the laser marking/etching machine so that under- removal /over-removal of the workpiece 422 can be avoided. Further, deep learning may also be employed, which may intelligently learn from the experiments and provide optimization of parameters in real-time. Through real-time decision making, the speed may be controlled by the laser scan head beam transmission system coupled with the laser-processing system.
Figure 5depicts a use-case scenario of an application of laser processing system 500 for controlling a laser-processing operation for surface modification of a workpiece, in accordance with an embodiment of the present disclosure.
In an implementation, the laser processing system 500 is depicted. The system comprises a server machine 502, which is operatively coupled with central processing unit 504 which is adapted to automatically control the laser processing system 500. The central processing unit 504 is further communicatively coupled with at least an Artificial Intelligence (AI) server 506 and a control unit 508. The control unit 508 herein and after depicts the Surface Modification Unit 2008 as referred to in Figure 3.
The laser processing system 500 is further comprised of at least an optical sensor 510 and a laser head 512. When a workpiece 514 is placed on a workbench 508, the position sensors and detectors coupled in the vicinity of the workbench 516 are adapted to adjust and correctly position the workpiece 514 by automatically adjusting the workbench 516. The workpiece 514 is allowed to suitably adjust within a frame 518. When the workpiece 514 is detected by laser heads 512, at least one or more first parameters are detected based on the material of the workpiece 514. The type of material is inputted at least to the control unit 508 which may further gather at least all relevant information first parameters related to the workpiece 514. All gathered information by the control unit 508 is provided to the AI server 506. The AI server employs at least a supervised/unsupervised learning algorithm. The learning process by the AI server is configured to detect at least one or more second parameters related to the workpiece 514. Such as based on the material and dimension of the workpiece 514, the appropriate machining conditions can be determined either through a related database or through supervised/unsupervised learning. Data set obtained from supervised/unsupervised learning is provided to the control unit 508 through a feedback mechanism. Datasets provide all related information regarding machining conditions to the control unit 508 required for the surface modification of the workpiece 514, such as laser power, speed, and frequency requirements for the laser marking/ engraving/ etching. The learning algorithm is also adapted to determine the quality of surface modification after the laser-processing is accomplished. Accordingly, the feedback is provided to the control unit 508 to manage the loop count for further processing steps required in laser processing.Based on the feedback the output is reflected through output means 520, which may comprise a light or sound indicator or their combination thereof.
Experimental Results:
Figure 6a, 6b, & 6cdepict different workpiece samples after surface modification through the method and system as depicted in the present subject matter, in accordance with an embodiment of the present subject matter.
Awhite plastic sheet without paint is selected as a workpiece. The thickness is determined through the laser processing system as discussed in the aforesaid embodiments. The thickness is determined as 755 micrometer.
Observations of laser marking process with different parameters:The observations takes from 1 to 5,as referred in Figure 6a, on a white plastic sheet without paint are discussed below:
In observation 1, the parameters of a laser marking system are to be set as per material requirements (normal parameters for plastic object marking). Parameters on which the text (JUST THINK) is marked are given below in Table no. 1.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 800mm/s
2. Power 8watt
3. Frequency 70khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 1: Observation parameter table
In observation 2, the text (JUST THINK) is marked on low power, high speed, and high frequency. Parameters on which the text (JUST THINK) is marked are given below in table no. 2.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 1000mm/s
2. Power 6watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table No. 2 Observation parameter table
In observation 3, the text (JUST THINK) is marked on low power, high speed, and high frequency. Parameters on which the text (JUST THINK) is marked are given below in table no. 3.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 950mm/s
2. Power 6.5watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 3 Observation parameter table

In observation 4, the text (JUST THINK) is marked on low power, high speed, and high frequency. Due to loop count 2, the effect of parameters is double on workpiece. Parameters on which the text (JUST THINK) is marked are given below in table no. 4.
S. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 950mm/s
2. Power 6.5watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 2
6 Hatch Hatched
Table no. 4 Observation parameter table

In observation 5, the text (JUST THINK) is marked on low power, high speed, and high frequency. Parameters on which the text (JUST THINK) is marked are given below in table no. 5.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 1100mm/s
2. Power 6watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 5 Observation parameter table
In observation 6, the text (JUST THINK) is marked on high power, low speed, and high frequency. Parameters on which the text (JUST THINK) is marked are given below in table no. 6.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 700mm/s
2. Power 10watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 6 Observation parameter table
Observations Laser engraving process with different parameters:Observations of laser marking process with different parameters:The observations takes from 6 to 9,as referred in Figure 6b, on a white plastic sheet without paint are discussed below:
In observation 7, the text (JUST THINK) is engraved on high power, low speed, and high frequency. Parameters on which the text (JUST THINK) is engraved are given below in table no. 7.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 600mm/s
2. Power 10watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 2
6 Hatch Hatched
Table no. 7 Observation parameter table
In observation 8, the text (JUST THINK) is engraved on high power, low speed, and high frequency. Parameters on which the text (JUST THINK) is engraved are given below in table no. 8.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 200mm/s
2. Power 8watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 8 Observation parameter table
In observation 9, the text (JUST THINK) is engraved on high power, high speed, and low frequency. Parameters on which the text (JUST THINK) is engraved are given below in table no. 9.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 700mm/s
2. Power 8watt
3. Frequency 10khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 9 Observation parameter table
Observations of the laser etching process on different parameter:
A white plastic sheet with paint is selected as a workpiece. The thickness is determined through the laser processing system as discussed in the aforesaid embodiments. The thickness is determined as 755 micrometers. Further, the paint coating or dry film thickness on the workpiece is determined as within the range of 22 to 25 microns.
The observations take from 10 to 15,as referred in Figure 6c, on a white plastic sheet without paint are discussed below:
In observation 10, the text (JUST THINK) is etched on low power, high speed, and high frequency. Parameters on which the text (JUST THINK) is etched are given below in table no. 10.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 800mm/s
2. Power 6watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 10 Observation parameter table
In observation 11, the text (JUST THINK) is etched on low power, high speed, and high frequency. Parameters on which the text (JUST THINK) is etched are given below in table no. 11.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 900mm/s
2. Power 7watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 11 Observation parameter table
In observation 12, the text (JUST THINK) is etched on high power, low speed, and high frequency. Parameters on which text (JUST THINK) is etched are given below in table no. 12.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 700mm/s
2. Power 8watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 12 Observation parameter table
In observation 13, the text (JUST THINK) is etched on perfect parameters according to DFT. Parameters on which the text (JUST THINK) is etched are given below in table no. 13.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 900mm/s
2. Power 8watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 13 Observation parameter table
In observation 14, the text (JUST THINK) is etched on high power, high speed, and high frequency. Parameters on which the text (JUST THINK) is etched are given below in table no. 14.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 800mm/s
2. Power 9watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 1
6 Hatch Hatched
Table no. 14 Observation parameter table
In observation 15, the text (JUST THINK) is etched with high power, high speed, and high frequency. There is loop count 2 gives a double effect of laser parameters on the workpiece. Parameters on which the text (JUST THINK) is etched are given below in table no. 15.
Sr. No. Name of Laser parameters Values of Laser parameters
1. Scanning speed 800mm/s
2. Power 8watt
3. Frequency 80khz
4. Focal length 290mm
5. Loop count 2
6 Hatch Hatched
Table no. 15 Observation parameter table
In view of the aforesaid, there are provided various advantageous features relating to the present disclosure:
• It provides anoptimizedmethod for controlling under-removal/ over-removal of surface coating material caused due to uneven surface.
• It provides anoptimized method for controlling the inaccurate laser position during material removal.
While specific language has been used to describe the present subject matter, any limitations arising on account thereto, are not intended. As would be apparent to a person in the art, various working modifications may be made to the method in order to implement the inventive concept as taught herein. The drawings and the foregoing description give examples of embodiments. Those skilled in the art will appreciate that one or more of the described elements may well be combined into a single functional element. Alternatively, certain elements may be split into multiple functional elements. Elements from one embodiment may be added to another embodiment.

CLAIMS:I Claim:

1. A method for controlling a laser-processing operation for surface modificationof a workpiece, the method comprising the steps of:
placing and automatically adjusting (202), by a targeting device, the workpiece on a workbench of a laser processing system;
determining (204), by a plurality of sensing units, at least one or more first parameters related to the workpiece to undergo laser-processing operation;
learning (206), by a learning device, to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are based on at least one or more first parameters related to the workpiece to undergo laser-processing operation; and
receiving (208), by a surface modification unit, the learned data from the learning device as an input for the laser-processing operation for performing surface modification of the workpiece.
2. The method as claimed in claim 1, wherein the laser-processing operation for surface modification of the workpiece comprise at least one of: marking, etching, and/or engraving on the surface of the workpiece.

3. The method as claimed in claim 1, wherein the one or more first parameters are associated with at least a material, a thickness, and/or a dimension of the workpiece.

4. The method as claimed in claim 1, wherein the one or more second parameters are associated with at least one of: laser source power, etching process speed, and pulse frequency requirement.

5. The method as claimed in claim 1, wherein the learning (206) to generate/adjust one or more one or more second parameters is adapted to control at least:
- laser-processing operation according to a variation in Dry Film Thickness (DFT) over the surface of the workpiece;
- under-removal causing blackness or over-removal causing yellowness on the surface of the workpiece due to the etching process; and
- a symbol shift due to dislocation of the workpiece.

6. A laser processing system (2000) for controlling a laser-processing operation for surface modification of a workpiece, the system(2000) comprising:
a targeting device (2002) place and automatically adjust the workpieceon a workbench of the laser processing system (2000);
aplurality of sensing units(2004) to determine at least one or more first parameters related to the workpiece to undergo laser-processing operation;
a learning device (2006) that learns to generate and/or adjust at least one or more second parameters related to machining condition for the laser-processing operation, wherein the one or more second parameters are based on at least one or more first parameters related to the workpiece to undergo laser-processing operation; and
asurface modification unit(2008) to receive the learned data from the learning deviceas an input for the laser-processing operation to perform surface modification of the workpiece.

7. The system (2000) as claimed in claim 6, wherein the surface modification unit (2008),comprising at least a control unit (2008a) and a memory (2008b),is adapted to perform the laser-processing operation for surface modification of the workpiece that comprises at least one of: marking, etching, and/or engraving on the surface of the workpiece.

8. The system (2000) as claimed in claim 6, wherein the plurality sensing units (2004),comprising at least a laser source, is adapted to determine the one or more first parameters are associated with at least a material, a thickness, and/or a dimension of the workpiece, wherein the sensing unit.

9. The system (2000) as claimed in claim 6, wherein the one or more second parameters are associated with at least one of: laser source power, etching process speed, and pulse frequency requirement.

10. The system (2000) as claimed in claim 6, wherein the learning device (2006) learn to generate/adjust one or more one or more second parameters is adapted to control at least:
- laser-processing operation according to a variation in Dry Film Thickness (DFT) over the surface of workpiece;
- under-removal causing blackness or over-removal causing yellowness on the surface of the workpiece due to the etching process; and
- a symbol shift due to dislocation of workpiece.