View All Documents & Correspondence
Method For Fabricating A Semiconductor Device Package
Abstract: A method of fabricating a semiconductor device package is provided. The method includes providing a laminate comprising a dielectric film disposed on a first metal layer, said laminate having a dielectric film outer surface and a first metal layer outer surface; forming a plurality of vias extending through the laminate according to a predetermined pattern; attaching one or more semiconductor device to the dielectric film outer surface such that the semiconductor device contacts one or more vias after attachment; disposing an electrically conductive layer on the first metal layer outer surface and on an inner surface of the plurality of vias to form an interconnect layer comprising the first metal layer and the electrically conductive layer; and patterning the interconnect according to a predetermined circuit configuration to form a patterned interconnect layer, wherein a portion of the patterned interconnect layer extends through one or more vias to form an electrical contact with the semiconductor device. A semiconductor device package is also provided.
Notices, Deadlines & Correspondence
Patent Information
Applicants
GENERAL ELECTRIC COMPANY
Inventors
1. MCCONNELEE, PAUL ALAN
2. GOWDA, ARUN VIRUPAKSHA
Specification
NA
Documents
Orders
| Section | Controller | Decision Date |
|---|---|---|
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 3742-del-2011-Correspondence-others-(29-12-2011).pdf | 2011-12-29 |
| 2 | 3742-del-2011-Assignment-(29-12-2011).pdf | 2011-12-29 |
| 3 | 3742-del-2011-Correspondence-Others-(23-01-2012).pdf | 2012-01-23 |
| 4 | 3742-del-2011-Form-3-(24-05-2012).pdf | 2012-05-24 |
| 5 | 3742-del-2011-Correspondence Others-(24-05-2012).pdf | 2012-05-24 |
| 6 | 3742-del-2011-GPA.pdf | 2012-07-10 |
| 7 | 3742-del-2011-Form-5.pdf | 2012-07-10 |
| 8 | 3742-del-2011-Form-3.pdf | 2012-07-10 |
| 9 | 3742-del-2011-Form-2.pdf | 2012-07-10 |
| 10 | 3742-del-2011-Form-1.pdf | 2012-07-10 |
| 11 | 3742-del-2011-Drawings.pdf | 2012-07-10 |
| 12 | 3742-del-2011-Description (Complete).pdf | 2012-07-10 |
| 13 | 3742-del-2011-Correspondence-others.pdf | 2012-07-10 |
| 14 | 3742-del-2011-Claims.pdf | 2012-07-10 |
| 15 | 3742-del-2011-Assignment.pdf | 2012-07-10 |
| 16 | 3742-del-2011-Abstract.pdf | 2012-07-10 |
| 17 | GPOA_GEC.pdf | 2014-10-28 |
| 18 | 241303 Form 13.pdf | 2014-10-28 |
| 19 | 3742-DEL-2011-FER.pdf | 2018-10-09 |
| 20 | 3742-DEL-2011-RELEVANT DOCUMENTS [28-02-2019(online)].pdf | 2019-02-28 |
| 21 | 3742-DEL-2011-FORM 13 [28-02-2019(online)].pdf | 2019-02-28 |
| 22 | 3742-DEL-2011-FORM-26 [01-04-2019(online)].pdf | 2019-04-01 |
| 23 | 3742-DEL-2011-GPA-200319 -.pdf | 2019-04-02 |
| 24 | 3742-DEL-2011-Correspondence-200319.pdf | 2019-04-02 |
| 25 | 3742-DEL-2011-Power of Attorney-200319.pdf | 2019-04-03 |
| 26 | 3742-DEL-2011-Power of Attorney-020419.pdf | 2019-04-06 |
| 27 | 3742-DEL-2011-Correspondence-020419.pdf | 2019-04-06 |
| 28 | 3742-DEL-2011-FORM 4(ii) [09-04-2019(online)].pdf | 2019-04-09 |
| 29 | 3742-DEL-2011-PETITION UNDER RULE 137 [09-07-2019(online)].pdf | 2019-07-09 |
| 30 | 3742-DEL-2011-OTHERS [09-07-2019(online)].pdf | 2019-07-09 |
| 31 | 3742-DEL-2011-FORM 3 [09-07-2019(online)].pdf | 2019-07-09 |
| 32 | 3742-DEL-2011-FER_SER_REPLY [09-07-2019(online)].pdf | 2019-07-09 |
| 33 | 3742-DEL-2011-CLAIMS [09-07-2019(online)].pdf | 2019-07-09 |
| 34 | 3742-DEL-2011-ABSTRACT [09-07-2019(online)].pdf | 2019-07-09 |
| 35 | 3742-DEL-2011-US(14)-HearingNotice-(HearingDate-24-04-2023).pdf | 2023-03-21 |
| 36 | 3742-DEL-2011-Correspondence to notify the Controller [17-04-2023(online)].pdf | 2023-04-17 |
Search Strategy
| 1 | SS_26-04-2018.pdf |