[1]This application claims the benefit of priority based on the Republic of Korea Patent Application No. 10-2017-0119811 submission dated 18 September 2017, and all information disclosed in the documents of the Republic of Korea patent application are included as part of the specification.
[2]The present application relates to a manufacturing method of the battery pack.
BACKGROUND
[3]
The secondary battery is used as a power source for cellular phones, etc., as well as a small state-of-the-art electronic device fields such as PDA and notebook computer, the energy storage system (ESS), an electric vehicle (EV) or a hybrid vehicle (HEV).
[4]
If you need a large power such as a motor drive for an electric vehicle, there is generally a large capacity modular battery pack comprising a battery module is connected, including a plurality of high power battery cell used.
[5]
The battery cell may refer to a unit which can function as a secondary battery. Battery modules may be means which houses a plurality of battery cells electrically connected to the module case. The battery pack can be attached to the substrate to allow for detaching the plurality of battery modules, manufactured by electrically connecting the plurality of battery modules.
[6]
In order to secure the battery cell accommodated in the module case, the resin composition can be injected into a module case provided with a battery cell. The resin composition can be used to heat the adhesive resin composition in order to dissipate heat generated from the other hand, the battery cells fixed to the battery cell in a module case to the outside. If it is higher, the viscosity of the resin composition is overloaded to the injection device from the injection process of the adhesive composition occurs, the resin composition has a characteristic low viscosity is required.
[7]
However, prior to assembling the battery pack with the battery module is performed in the battery module on an end-of-line (end of line, EOL) quality inspection, for example, the engine hot-test of the battery module is the battery module lower toward the direction of gravity a it can be carried out in a mounted state. In the process, low-cost injection through an injection port provided in the lower portion of the battery module also has the resin composition having the properties can flow out through the injection port, in order to prevent this, the EOL quality testing the resin composition injected into the battery module to be fully cured before there are problems that have to wait for about 3 hours to 4 hours, until.
Detailed Description of the Invention
SUMMARY
[8]
The purpose of the present application is to provide a method of manufacturing the battery pack.
Problem solving means
[9]
If the measured temperature from among the physical properties as referred to in this specification that affect the results, the physical properties that are not specifically defined otherwise, the properties measured at room temperature. The term room temperature is a temperature of a natural or non-heated heat-sensing, usually from a temperature or around 23 ° C or about 25 ° C in the range of about 10 ° C to 30 ° C. In addition, the temperature of the unit is not otherwise specifically stated in this specification ℃.
[10]
If the measured pressure in physical properties referred to herein that affect the results, the physical properties that are not specifically defined otherwise, the properties measured at ambient pressure. The term ambient pressure should be a temperature that is not pressurized or reduced pressure natural refers to the extent of about 1 atmosphere typically a normal pressure.
[11]
In this application example of the present application is a method for producing the battery pack.
[12]
An exemplary battery pack manufacturing method includes the steps of injecting resin composition through an injection port formed on one side of the battery modules having battery cells; Forming a heat adhesive layer on a first surface of the battery module which the injection hole is formed; And a step of inspecting the quality of a battery module in a state where one side of the battery modules on the lower the heat radiation adhesive layer formed.
[13]
As one example, the step of injecting the resin composition through an injection port formed on one surface of the battery module has a top plate, bottom plate and side walls, the inner space is formed, and the module case is formed with the adhesive composition inlet in the lower plate; And the battery cell present in the interior space; can be injected into the adhesive composition through the injection hole of the lower plate in a state where the lower plate of the battery module including the placing to face the upper direction.
[14]
Battery cell may be housed in the module case. Battery cells may be present at least one in the module case, there may be a plurality of battery cells are housed in the module case. The number of battery cells are housed in the module case is not especially limited to be controlled depending on the purpose. A battery cell housed in the module case may be electrically connected to each other.
[15]
The module case has a space inside which the battery cell can be housed is formed, the module case may include a side wall and the lower plate forming at least the internal space. The module case may further include an upper plate for sealing the inner space. The side walls, bottom plate and top plate are either formed integrally with one another, or assembled discrete side walls, bottom plate and / or the upper plate, each may be formed with the module case. The shape and size of the module case is not particularly limited and may be suitably selected in accordance with the use object, etc., type and number of battery cells housed in the interior space.
[16]
The term the upper plate and the lower plate in the present specification is the term of relative concept used to distinguish the plate constituting the module case. The lower plate is a battery module is attached to the base of the battery pack may mean a plate, which is opposite to, the direction of gravity when assembled into a battery pack.
[17]
1 is a diagram illustrating an example module case 10. An exemplary module case 10 may be a box shape of the housing 10 including a bottom plate (10a) and four side walls (10b). Module case 10 may further include a top plate (10c) for sealing the inner space.
[18]
2 is a pattern diagram observing the module case 10 in Fig housed, the battery cell 20 1 from the top.
[19]
The bottom plate of the module case, the side walls and / or top plate can have a hole is formed. The hole can be a injection port for injecting a resin composition to form the material of the resin layer in the case of forming the resin layer by the injection process as described later. The form, number and position of the injection hole can be adjusted in consideration of the injection efficiency of a material for forming the resin layer. The injection port in an illustration may be formed on the lower plate.
[20]
In one example of the injection port it may be formed on the side wall, or the bottom plate of about 1/4 to about 3/8 or 3/4 point to 7/8 point or substantially central portion of the entire length of the top plate. By injecting the resin composition through an injection port formed at this point it can be injected so that the resin layer is formed having a large contact myeonjok. The 1/4, 3/4, 3/8 or 7/8 point is, for example, the total length (L) which a measurement based on a single end surface (E), such as the bottom plate as shown in Fig. 3 contrast is the ratio of the distance (a) to the forming position of the hole. Further, the terminal (E) with a length (L) and the distance (A) is formed in the above step can be the length (L) and the distance (A) an arbitrary terminal (E) for measuring from the same end (E) . In Figure 3 the inlet (50a) is in the form which is located in approximately the middle portion of the lower plate (10a).
[21]
The size and shape of the injection hole can be formed in consideration of the efficiency of injection of the resin material to be described later is not particularly limited. For example, the injection port may be polygonal or amorphous, such as circular, elliptical, triangular or rectangular. Not necessarily that the number and the spacing of the injection port is also greatly limited, a resin layer as described above can be adjusted to have a large contact area as the lower plate.
[22]
Terminal, such as the injection hole is a side wall, the lower plate or the upper plate which is formed can be formed with a sphere observed (e.g., reference 3 of 50b). These observations district, for example, when the injected material when injecting a resin material through the injection port may be to observe the side wall, or will be well injected from the lower plate or the end of the top plate. The observation ward position, shape, size and number are not limited to be formed to determine whether the material to be injected into the appropriate injection.
[23]
The module case may be a heat-conductive casing. The term thermally conductive casing, in the entire case or a thermal conductivity above 10 W / mk, or at least means a case that contains a region having a thermal conductivity as described above. For example, at least one of the aforementioned side walls, bottom plate and the top plate may have the above-described thermal conductivity. In another example it may include the side wall, the bottom plate portion and at least one of the top plate having the thermal conductivity.
[24]
The structure of the battery module in accordance with one example of the application in contact with the bottom plate and the battery cell, and includes the number formed by the resin composition is injected into the battery module layers. At least the resin layer in such a structure may be a thermally conductive resin layer it can accordingly may include at least the bottom plate is either a heat-conductive, heat-conductive parts.
[25]
Thermal conductivity adult top plate, bottom plate or the side wall above; Or thermally conductive region; thermal conductivity of, in another example about 20 W / mk or more, 30 W / mk or more, 40 W / mk or more, 50 W / mk or more, 60 W / mk or more, 70 W / mk or more, 80 W / mk or more, 90 W / mk or more, 100 W / mk or more, 110 W / mk or more, 120 W / mk or more, 130 W / mk or more, 140 W / mk or more, 150 W / mk or more, 160 W / mk may be at least, 170 W / mk or more, 180 W / mk, at least 190 W / mk or about 195 W / mk. The thermal conductivity is higher the value, so that the glass in terms of heat dissipation characteristics of the module, and the upper limit thereof is not particularly limited. In one example, the thermal conductivity of about 1,000 W / mK or less, 900 W / mk or less, 800 W / mk or less, 700 W / mk or less, 600 W / mk or less, 500 W / mk or less, 400 W / mk or less, 300 W / mk or about 250 W / mK or less, but not be limited thereto. Type of material exhibiting thermal conductivity as described above is not particularly restricted, and for example, there are aluminum, gold, and metal materials such as sterling silver, tungsten, copper, nickel or platinum. The module case may be a whole or composed of a thermally conductive material as described above, at least a part region of the part made of the thermally conductive material. Accordingly, the module case may include a different thermal conductivity of the above-given ranges, or, or at least the portion having the above-mentioned thermal conductivity.
[26]
In the module case portion having a thermal conductivity within the above range may be a portion in contact with the insulating layer that may exist between the number of the above-described resin and / or resin layer and the module case. Further, the region having the heat conductivity may be a contact area with the cooling medium such as cooling water. With such a structure may be a structure capable of emitting to the outside heat generated from the battery cells effectively implemented.
[27]
The type of the battery cell accommodated in the module case is also not particularly limited, and can be applied to all of the various battery cells known in the art. The battery cells in one example can be of the pouch. Referring to FIG. 4, the pouch-shaped battery cell 100 may typically include an electrode assembly, electrolyte, and a pouch exterior.
[28]
Pouch electrode assembly 110 contained in hyeongsel 100, may be at least one positive and one negative electrode plate with a separator arranged between the forms. The electrode assembly 110 includes a single or a wound type winding with a positive electrode plate and a negative plate the separator, it can be divided into a plurality of positive electrode plates and a plurality of negative electrode plate is placed a separator between the laminated alternately stacked and the like.
[29]
The pouch exterior 120 is, for example, may be of a type having an external insulating layer, a metal layer and an inner adhesive layer. Such packaging material 120, protection of the electrode assembly 110 and the internal components such as the electrolyte. Metal layer of the electrode assembly 110 may include a metal thin film of aluminum or the like in view of heat dissipation and the like complementary to the electrochemical properties by protecting the internal elements, and an electrode assembly 110, such as an electrolytic solution. This metal thin film is to ensure electrical insulation of the electrode assembly 110 and an electrolyte, such as the element or cell 100 of the other elements in the external, it may be interposed between the insulating layer formed of an insulating material.
[30]
In one example of the case 120, the upper pouch 121 and may include a lower pouch 122, the upper pouch 121 and a lower pouch 122 is at least one of an inner space of the concave form (I) this can be formed. The inner space (I) of this pouch has an electrode assembly 110 can be housed. The outer peripheral surface of the upper pouch 121 and the pouch bottom 122 is provided with a sealing part (S), is such a sealing part (S) is adhered to each other at the electrode assembly 110 is accommodated in the internal space can be closed.
[31]
And each electrode plate of the electrode assembly 110 includes the electrode tabs, the one or more electrode tabs may be connected to the electrode lead. Electrode leads may function as an electrode terminal of the upper pouch 121 and the pouch bottom 122 sealing portion being disposed exposed to the outside of the packaging material (120) between (S), the secondary battery 100 of the.
[32]
In the form of a pouch-shaped cell it is an illustration, not a battery cell used in the present application be limited to the type as described above. In the present application has variety of hyeongsel pouch or other types of cells known to be applied both as a battery cell.
[33]
The resin composition to be injected in the battery pack production method of the present application may be a filler-containing resin composition to be described later. The term filler-containing resin composition used herein is a composition comprising a resin component and a filler. The resin composition may have a sufficient flowability in order to prevent the injection device overloading. It has a sufficient fluidity at the above it may mean a viscosity of a range of about 400 cP or less, or from about 100 cP to about 400 cP. The lower limit of the viscosity is not particularly limited if it has a sufficient low viscosity resin composition, in general, at least about 10Pas.
[34]
On the other hand, the viscosity of the resin composition may be as measured at a shear rate (shear rate) the range of from room temperature to from 0.01 to 10.0 / s using the rheological properties measuring instrument (ARES), and a viscosity measured at 2.5 / s point value.
[35]
The resin composition may be, for example, the adhesive composition. The adhesive composition may include at least one selected from known resin components that can typically be used as an adhesive. It can be given to the resin, acrylic resin, urethane resin, silicone resin and epoxy resin, and the like. Of the above resin component acrylic resins, urethane resins and silicone resins have a heat conductivity similar to each other, an epoxy resin, and is excellent in thermal conductivity as compared thereto, the olefin resin is known to have high thermal conductivity compared to the epoxy resin. Therefore, it is possible to select to have the excellent thermal conductivity of the resin is also necessary. However, it is difficult to generally the thermal conductivity of a desired resin component alone is secured, the method of heat-conductive resin composition is contained in a proper ratio an excellent filler component as described below can also be applied.
[36]
The resin composition may be a thermally conductive resin composition, a cured product of the heat-conductive resin composition (ex: a resin layer) is a thermal conductivity of about 1.5 W / mK or more, 2 W / mK or more, 2.5 W / mK or more, 3 W / mK may be at least, 3.5 W / mK or more, or about 4 W / mK. The thermal conductivity of about 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk or less, and is equal to or less than 10W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK. And the resin composition as a heat conductive resin composition in the case in which the resin composition is injected into the lower plate and the like may be the above-described thermal conductivity of 10 W / mK or more sites. At this time, portions of the module case indicative of the thermal conductivity may be a cooling medium, for example as cooling water in contact area. Thermal conductivity of the thermally conductive resin composition is, for example, a numerical value measured according to ASTM D5470 standard, or ISO 22007-2 standard.
[37]
As an example, after placing the resin layer formed of a resin composition between two copper bars (copper bar) according to the specifications of ASTM D 5470 one of the two copper bars are brought into contact with the heater, and one cooler (cooler) after contact with the heater and is to maintain a constant temperature, it is possible to create a thermal equilibrium state by controlling the capacity of the cooler (showing the temperature change of up to about 0.1 ℃ a 5-minute condition). Column to measure the temperature of each copper bar in equilibrium, and also the thermal conductivity according to the formula the thermal conductivity (K, unit: W / mK) can be evaluated for. Thermal conductivity pressure applied to the resin layer during the evaluation is about Kg 11/25 cm 2 can be adjusted so that the extent, can have a thickness of the resin layer during the measurement process to calculate the thermal conductivity relative to the final thickness to the changed circumstances.
[38]

[39]
K = (Q×dx)/(A×dT)
[40]
In the above formula, K is the thermal conductivity (W / mK), Q is an hour moved column by column (in W) is, dx is the resin layer thickness (unit: m) of a, A is the cross-sectional area of the resin layer (unit: m 2 ) and, dT is the temperature difference (in units of copper rod: a K).
[41]
Way that the thermal conductivity of the thermally conductive resin composition in the range as described above is not particularly limited. For example, the thermal conductivity of the thermally conductive resin composition can be adjusted using a filler having a thermal conductivity, which will be described later with the resin composition.
[42]
The resin composition is, for example, may be a urethane resin composition. The urethane resin composition contains the subject a composition containing at least a polyol, and the like; And a curing agent composition comprising at least an isocyanate compound, may be a two-component, including, it is possible to form a resin layer to cure it.
[43]
A urethane resin composition is, as the polyol contained in the subject composition at least for the securing of the physical properties, non-crystalline or is a resin composition containing low crystalline polyol is sufficiently applicable.
[44]
The term secret in the crystalline is, means the crystallization temperature (Tc) and melting temperature in DSC (Differential Scanning calorimetry) analysis described below (Tm) is not observed, and this time the DSC analysis of 10 ° C / min as to about -80 ° C can be carried out in the range of 60 ° C, for example, after the temperature was raised from 25 ° C to 60 ° C with the speed and back to the heat-sensing -80 ° C, again raising the temperature to 60 ° C It can be measured in this way. In addition, it has enough crystallinity in the lower than the melting point (Tm) of from about 20 ° C observed in the DSC analysis, no more than about 15 ° C, up to about 10 ° C, up to about 5 ° C, about 0 ° C means less, up to about -5 ° C, about -10 ° C or less, or about -20 ° C or less in the case. The lower limit of the melting point in the above is not particularly limited, for example, the melting point, may be on the order of about -80 ° C or higher, at least about -75 ° C or at least about -70 ° C.
[45]
Polyols as described above can be illustrated a polyol of the structure to be described later as a carboxylic acid polyols or polycaprolactone polyols or concrete.
[46]
The carboxylic acid polyol is a carboxylic acid and polyol (ex. A diol or triol, and so on) component lactone and the reaction can be formed by caprolactone polyol containing silver comprises a caprolactone and a polyol (ex. A diol or triol, and so on) by reacting the components can be formed. In this case, the carboxylic acid is a dicarboxylic can sanil.
[47]
At this time, it is possible to configure a polyol satisfying the above-mentioned physical properties by adjusting the type and ratio of the components.
[48]
In one example, the polyol may be a polyol represented by Formula 1 or 2 below.
[49]
Formula 1
[50]
[51]
[Formula 2]
[52]
[53]
In Formula 1 and X 2 is a carboxylic acid derived from said unit, Y is a unit derived from the polyol. Of the polyol derived units it is, for example, can be a triol unit or diol unit. In addition, n and m may be any of several days, for example, n is a natural number in the range of 2 to 10, m is a natural number in the range of 1 to 10.
[54]
The terms used herein, "a carboxylic acid derived units" may refer to a portion other than a carboxyl group in a carboxylic acid compound. Similarly, the terms used herein, "polyol derived units" may refer to a portion other than a hydroxyl group in the polyol compound structure.
[55]
That is, when a hydroxyl group and a carboxyl group of a carboxylic acid of the polyol reaction, water (H by a condensation reaction 2 the ester bond is formed while the desorption O) molecules. Thus, the carboxylic acid is a carboxylic acid-derived units in the case of forming an ester bond by the condensation reaction may refer to the portion that does not participate in the condensation reaction from a carboxylic acid structure. Further, the polyol derived units may refer to the portion which does not participate in the condensation reaction among the polyol structure.
[56]
In addition, Y in the formula (II) also represents a portion other than the ester bond after the polyol to form the ester linkage and caprolactone. That is, the polyol derived units of the formula 2, Y may represent a portion not involved in the ester bond in the polyol structure when the polyol and caprolactone forming an ester bond. Ester bonds is shown in formulas (1) and (2) respectively.
[57]
On the other hand, if the polyol derived units of the Y in the above in the units derived from the polyol containing three or more hydroxyl groups, such as all units of the tree, the Y portion of the structure of the above formula can be a branched structure is formed the implementation.
[58]
The type of carboxylic acid-derived units in X of Formula 1 is not particularly limited, in order to obtain the desired physical properties of acid units, isophthalic acid units, terephthalic acid unit, trimellitic acid unit, tetrahydrophthalic acid units, hexahydrophthalic acid unit , tetrachloro phthalic acid unit, oxalic acid unit, adipic acid unit, azelaic acid unit, sebacic acid unit, succinic acid unit, malic acid unit, Glidden tar acid unit, malonic acid unit, pimelic acid unit, suberic acid unit, 2, 2 dimethyl-succinic acid unit, 3, 3-dimethyl be a glutaric acid unit, 2,2-dimethyl glutaric acid units, maleic acid units, fumaric acid units of the floor, itaconic acid unit and any of the units selected from the group consisting of fatty acid units and, the resin glass transition temperature to a consideration of the aliphatic carboxylic acid-derived units, rather than the aromatic carboxylic acid-derived units is advantageous.
[59]
On the other hand, in order to secure the physical properties of the desired type of the polyol derived units of Y in formulas (1) and (2) is not particularly limited, ethylene glycol unit, propylene glycol unit, 1,2-butylene glycol units, 2,3-butylene glycol unit, 1,3-propanediol units, 1,3-butanediol unit, 1,4-butanediol unit, 1,6-hexanediol unit, neopentyl glycol unit, 1, 2-ethyl hexyl diol unit, 1,5 -pentanediol unit, 1,10-decanediol units, 13-cyclohexanedimethanol units, 1,4-cyclohexanedimethanol one selected from the group consisting of methanol unit, glycerin unit, and trimethylolpropane unit, or more than two can.
[60]
On the other hand, in Formula 1 n is a natural number, the range can be selected in consideration of the physical properties desired. It may be, for example, 2 to 10 or 2 to 5.
[61]
Further, in the above formula 2 m is a natural number, the range may be selected in consideration of the physical properties of interest may be, for example, 1 to 10 or 1 to 5.
[62]
If in the formulas (1) and (2) n and m beyond the foregoing range, it is possible to intensify the expression of sex determination of the polyol.
[63]
The molecular weight of the polyol as described above and the desired low viscosity can also be adjusted in consideration of the characteristics or durability or adhesion, for example, range from about 300 to about 2000 tomorrow. The molecular weight as referred to in the specification may be, for example, a weight average molecular weight measured using GPC (Gel Permeation Chromatograph), unless otherwise specified particularly, unlike in the present specification, the polymer molecular weight means a weight average molecular weight. If outside of the range, not the poor reliability of the resin or may cause problems associated with volatile components.
[64]
On the other hand, the kind of the polyisocyanate contained in the curing agent composition is not particularly limited, it may be advantageous that the cycloaliphatic series to ensure the desired physical properties.
[65]
That is, the polyisocyanate is tolylene diisocyanate, diphenylmethane diisocyanate, phenylene diisocyanate, polyethylene, polyphenylene polyisocyanate, xylene diisocyanate, tetramethyl xylene diisocyanate, tri binary diisocyanate, naphthalene diisocyanate and triphenylmethane aromatic polyisocyanate compounds such as methane triisocyanate; Hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, aliphatic diisocyanates such as propylene or tetramethylene diisocyanate diisocyanate; Trans-cyclohexane-1,4-diisocyanate, isobutyl boron-diisocyanate, bis (isocyanatomethyl) cyclohexane diisocyanates or di-cycloalkyl alicyclic polyisocyanate, such as cyclohexyl methane diisocyanate; Or at least any one of the carbodiimide-modified polyisocyanates and isocyanurate-modified polyisocyanate; And the like can be used. Also, a mixture of two or more of the above listed compounds may be used.
[66]
The content of the polyol with a polyisocyanate in the resin composition is properly controlled to not particularly limited and can be their urethane reaction.
[67]
In order to include other ingredients such as fillers, flame retardants, which will be described later with the resin composition, when the curing is by blending the additive of interest in the subject compositions and / or the curing agent composition of the resin composition.
[68]
The resin composition may include a filler in consideration of the physical properties such as the above-described heat-conductive. The thermal conductivity of the above-mentioned range through the use of appropriate fillers, if necessary, also it is possible to secure the like. In one example of the filler contained in the resin composition may be a thermally conductive filler. The term thermally conductive filler in the present application, the thermal conductivity is meant from about 1 W / mK or more, about 5 W / mK or more, about 10 W / mK or more, or about 15 W / mK or more materials. The thermal conductivity of the thermally conductive filler may be up to about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK. The type of thermally conductive filler that can be used is not particularly limited and may be applied to a ceramic filler in consideration of the insulating property and the like. For example, a ceramic particle such as alumina, AlN (aluminum nitride), BN (boron nitride), silicon nitride (silicon nitride), SiC, or BeO may be used. Also, if the insulating characteristic of the resin composition can be formed by the resin layer can be secured, it is possible to consider the application of carbon fillers such as graphite (graphite). Form or content of the filler contained in the resin composition is not particularly limited, and considering also sedimentation potential, it is an object thermal conductivity naejineun heat resistance in the viscosity of the resin composition, the resin composition, the insulating property, the filling effect or dispersibility including selection It can be. In general, the larger the size of the filler increases the viscosity of the resin composition, the higher the possibility of the filler is precipitated in the resin composition. In addition, the smaller size tends to have higher heat resistance. Therefore, if considering the point such as the need to have a filler of the appropriate kind to be selected it may also be used two or more kinds of fillers. Further, in consideration of the amount to be filled it is to use a spherical filler of glass, but may also be used in consideration of the form or the form of a network of conductive fillers, such as needle-shaped or plate-shaped. The resin composition in one example may comprise a thermally conductive filler in a range of the average particle diameter is 0.001 to 80 ㎛ ㎛. The average particle size of the filler is at least about 0.01 ㎛ or more, 0.1 or more, or more 0.5㎛, more than 1 ㎛, over 2㎛, over 3㎛, 4㎛ over, or approximately over 5㎛ 6㎛ In other instances. The average particle size of the filler is less than or equal to about 75㎛ In another example, 70㎛ hereinafter 65㎛ hereinafter 60㎛ hereinafter 55㎛ hereinafter 50㎛ hereinafter 45㎛ hereinafter 40㎛ hereinafter 35㎛ hereinafter 30㎛ or less, 25㎛ hereinafter 20㎛ hereinafter 15㎛ or less, and is less than or about 10㎛ 5㎛ less.
[69]
Ratio of the filler is, the above-described characteristics contained in the thermally conductive resin composition adult, for example, the thermal conductivity may be selected so that the like can be secured. For example the filler is, the resin component 100 parts by weight of the preparation of the resin composition may be included within the range of from about 50 to about 2,000 parts by weight. By weight of said filler portion to about 100 parts by weight In another example parts or more and 150 parts by weight or more and 200 parts by weight or more and 250 parts by weight or more and 300 parts by weight or more and 350 parts by weight or more and 400 parts by weight or more and 500 parts by weight or more, 550 It may be greater than or equal to parts by weight or more and 600 parts by weight or more or about 650 parts by weight.
[70]
The battery pack production method of the present application, and forming a heat adhesive layer on a first surface of the battery module, the injection hole is formed. The surface may represent a bottom plate, a top plate or a side wall is formed in the injection port. It may form a heat adhesive layer on the bottom plate of the battery module as an example. It should form a heat adhesive layer on the bottom plate of the battery module may indicate that the battery module is attached to the base of the battery pack is formed on the side designed to be facing when the assembled battery pack, the direction of gravity plate.
[71]
Therefore, when the resin composition is injection port of the implanted battery modules to form a heat adhesive layer on a formed lower plate, it is possible to prevent the coming out of the resin composition flowing through the inlet during the assembly process of the battery pack is a resin composition injected into the battery module cured without having to wait for about three hours to four hours until it is possible to perform the inspection step to be described later.
[72]
As one example, the thermal conductivity of the heat radiation adhesive layer may be about 2 W / mK or more, 2.5 W / mK or more, 3 W / mK or more, 3.5 W / mK or more, or about 4 W / mK. The thermal conductivity of about 50 W / mK or less, 45 W / mk or less, 40 W / mk or less, 35 W / mk or less, 30 W / mk or less, 25 W / mk or less, 20 W / mk or less, 15 W / mk or less, and is equal to or less than 10W / mK or less, 5 W / mK or less, 4.5 W / mK or less, or about 4.0 W / mK. The thermal conductivity of the heat radiation adhesive is, for example, a numerical value measured according to ASTM D5470 standard, or ISO 22007-2 standard.
[73]
As an example, after placing the heat radiation adhesive between the two copper plate (copper plate) according to the specifications of ASTM D 5470 one of the two copper plates is brought into contact with the heater, and the other is the later in contact with the cooler (cooler) you can make (the state showing a temperature variation of no more than about 0.1 ℃ for 5 minutes) and the heater so as to maintain a constant temperature, thermal equilibrium by adjusting the capacity of the cooler. Column to measure the temperature of each copper plate in equilibrium, and also the thermal conductivity according to the formula the thermal conductivity (K, unit: W / mK) can be evaluated for. Thermal conductivity pressure applied to heat the adhesive layer during the evaluation is about Kg 11/25 cm 2 can be adjusted so that the degree, it is possible to calculate the thermal conductivity in the case where the thickness of the heat radiation adhesive layer in the measurement process is changed based on the final thickness.
[74]

[75]
K = (Q×dx)/(A×dT)
[76]
In the above formula, K is the thermal conductivity (W / mK), Q is per unit time moving the column: and (in W), dx is the thickness of the heat bonding layer (unit: m), and, A is the cross-sectional area of the heat radiation adhesive (unit: m 2 ) and, dT is the temperature difference (in units of the copper plate: a K).
[77]
Way that the thermal conductivity of the heat radiation adhesive layer within the range as described above is not particularly limited. For example, the thermal conductivity of the heat radiation adhesive can be adjusted by using the filler having a thermal conductivity as a filler contained in the heat radiation adhesive.
[78]
Forming a heat radiation adhesive layer which the injection port is formed, it can be on one side the inlet of the battery module is formed as an example a step of attaching a heat radiation adhesive sheet comprising a release film, and heat radiation adhesive. On the other hand, the inlet side of the battery module is formed may be a surface of the lower plate is formed in the injection port. That is to heat the adhesive layer can be formed comprising the step of attaching a heat radiation adhesive sheet comprising a release film, and heat the adhesive layer on the bottom plate of the battery module to the inlet is formed.
[79]
The heat radiation adhesive sheet may include at least one of the release film and the heat bonding layer. As an example, heat-radiating adhesive sheet may be a release film / heat radiation adhesive layer / release may be a film laminated to the net structure, the heat radiation adhesive layer / release film laminated in the order of the structure.
[80]
Two heat radiation adhesive sheet including the release film has a heat adhesive layer is peeled off the release film was peeled off the release film 1 can be attached to the bottom plate of the battery module. The heat-radiating sheet comprising a single release film has a heat adhesive layer without peeling of the release film can be attached to the bottom plate of the battery module.
[81]
On the other hand, and the battery module can be a release film present on the heat adhesive layer of the heat in the step of assembling the battery pack adhesive sheet removed, it protects the heat radiation adhesive layer comprises a heat adhesive sheet until the battery module is assembled to the battery pack, the role that can be done.
[82]
An adhesive layer on the heat radiation adhesive sheet can be formed by the heat conducting adhesive composition. A method of forming a heat adhesive layer on a heat-radiating adhesive sheet can be formed by a known method without particular limitation. By applying a heat conducting adhesive composition on the base film as an example, and cured to form a heat radiation adhesive. By impregnation, and curing the heat conducting adhesive composition on a base film in another example it is possible to form the heat radiation adhesive.
[83]
Heat conducting adhesive composition for forming the adhesive layer on the heat radiation adhesive sheet may include at least one selected from known resin components that can be used generally. The resin as there may be mentioned acrylic resins, urethane resins, silicone resins and epoxy resins and the like. Of the above resin component acrylic resins, urethane resins and silicone resins have a heat conductivity similar to each other, an epoxy resin, and is excellent in thermal conductivity as compared thereto, the olefin resin is known to have high thermal conductivity compared to the epoxy resin. Therefore, it is possible to select to have the excellent thermal conductivity of the resin is also necessary. However, it is difficult to generally the thermal conductivity of the heat adhesive resin component alone is desired to obtain, by including a heat conducting adhesive composition of the components of the filler to be described later at an appropriate ratio can be applied.
[84]
As an example, a heat conducting adhesive composition for forming the adhesive layer on the heat radiation adhesive sheet may be, for example, urethane heat conducting adhesive composition. The urethane heat conducting adhesive composition may comprise at least a polyol and a polyisocyanate. Polyols as described above can be illustrated a carboxylic acid polyols or caprolactone polyol.
[85]
The carboxylic acid polyol is a carboxylic acid and polyol (ex. A diol or triol, and so on) component lactone and the reaction can be formed by caprolactone polyol containing silver comprises a caprolactone and a polyol (ex. A diol or triol, and so on) by reacting the components can be formed. In this case, the carboxylic acid is a dicarboxylic can sanil.
[86]
Type of polyisocyanate included in the polyurethane heat conducting adhesive composition may be advantageous in not particularly limited, the alicyclic series to ensure the desired physical properties.
[87]
That is, the polyisocyanate is tolylene diisocyanate, diphenylmethane diisocyanate, phenylene diisocyanate, polyethylene, polyphenylene polyisocyanate, xylene diisocyanate, tetramethyl xylene diisocyanate, tri binary diisocyanate, naphthalene diisocyanate and triphenylmethane aromatic polyisocyanate compounds such as methane triisocyanate; Hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, aliphatic diisocyanates such as propylene or tetramethylene diisocyanate diisocyanate; Trans-cyclohexane-1,4-diisocyanate, isobutyl boron-diisocyanate, bis (isocyanatomethyl) cyclohexane diisocyanates or di-cycloalkyl alicyclic polyisocyanate, such as cyclohexyl methane diisocyanate; Or at least any one of the carbodiimide-modified polyisocyanates and isocyanurate-modified polyisocyanate; And the like can be used. Also, a mixture of two or more of the above listed compounds may be used.
[88]
On the other hand, heat-radiating adhesive composition for forming the adhesive layer on the heat radiation adhesive sheet may include a filler in consideration of the physical properties such as thermal conductivity is also described above. In one example of the filler contained in the heat-radiating adhesive composition may be a thermally conductive filler.
[89]
The thermal conductivity of the thermally conductive filler may be up to about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK. The type of thermally conductive filler that can be used is not particularly limited and may be applied to a ceramic filler in consideration of the insulating property and the like. For example, a ceramic particle such as alumina, AlN (aluminum nitride), BN (boron nitride), silicon nitride (silicon nitride), SiC, or BeO may be used. Also, if the insulating properties of the heat adhesive layer formed by the heat conducting adhesive composition can be secured, it is possible to consider the application of carbon fillers such as graphite (graphite). Form or content of the filler contained in the heat conducting adhesive composition is not particularly limited and may be selected in view of the sedimentation potential, such as the thermal conductivity of the object in the heat radiation adhesive composition viscosity, heat-radiating adhesive composition. In general, the larger the size of the filler increases the viscosity of the heat conducting adhesive composition, the higher the possibility of the filler is precipitated in the heat conducting adhesive composition. In addition, the smaller size tends to have higher heat resistance. Therefore, if considering the point such as the need to have a filler of the appropriate kind to be selected it may also be used two or more kinds of fillers. Further, in consideration of the amount to be filled it is to use a spherical filler of glass, but may also be used in consideration of the form or the form of a network of conductive fillers, such as needle-shaped or plate-shaped. The heat radiation adhesive composition in one example may comprise a thermally conductive filler in the average particle diameter of from 0.001 to 80 ㎛ ㎛. The average particle size of the filler is at least about 0.01 ㎛ In another example, at least 0.1, 0. 5㎛, at least 1 ㎛, over 2㎛, over 3㎛, 4㎛ over, or approximately over 5㎛ 6㎛ may be equal to or greater than. The average particle size of the filler is less than or equal to about 75㎛ In another example, 70㎛ hereinafter 65㎛ hereinafter 60㎛ hereinafter 55㎛ hereinafter 50㎛ hereinafter 45㎛ hereinafter 40㎛ hereinafter 35㎛ hereinafter 30㎛ or less, 25㎛ hereinafter 20㎛ hereinafter 15㎛ or less, and is less than or about 10㎛ 5㎛ less.
[90]
Ratio of the filler is, the above-described characteristics contained in the thermally conductive heat radiating adult adhesive composition, for example, the thermal conductivity may be selected so that the like can be secured. For instance the filler may be included within the scope of the adhesive component, 100 parts by weight compared to about 50 to about 2,000 parts by weight of a heat conducting adhesive composition. The adhesive component, for example, may refer to a polyol and a polyisocyanate. By weight of said filler portion to about 100 parts by weight In another example parts or more and 150 parts by weight or more and 200 parts by weight or more and 250 parts by weight or more and 300 parts by weight or more and 350 parts by weight or more and 400 parts by weight or more and 500 parts by weight or more, 550 It may be greater than or equal to parts by weight or more and 600 parts by weight or more or about 650 parts by weight.
[91]
The release film while radiating the adhesive layer can be easily peeled off from the battery pack manufacturing step to be described later after may be easily peeled from the heat-radiating adhesive layer when attached to the bottom plate of the battery module, attached to the heat radiation adhesive layer to the battery pack manufacturing step If you are not able to protect the material is not particularly limited. In one example, as the release film may be selected from polyester (POET) surface treatment on one or both sides of the film. By using the heat-radiating adhesive sheet is a release film formed, even if the battery module is mounted such that the heat adhesive layer of the heat adhesive sheet is the bottom plate of the battery module opposite to the direction of gravity in the quality check process to be described later is attached to the lower plate of the battery module, a quality check the above-described heat bonding layer in the process can be prevented from being damaged by contact with the bottom.
[92]
Forming a heat radiation adhesive layer which the injection port is formed, and a heat conducting adhesive composition Other examples may include the step of applying to said surface the injection port of the battery module is formed. On the other hand, the inlet side of the battery module is formed may be a surface of the lower plate is formed in the injection port. In other words, it is possible to form the heat bonding layer comprising the step of applying a heat conducting adhesive composition on the bottom plate of the battery module to the inlet is formed. On the other hand, a method for applying a heat conducting adhesive composition on the bottom plate is not particularly limited, and may be applied to the lower plate by a known method.
[93]
Heat conducting adhesive composition for forming the heat-radiating adhesive layer so long as it can satisfy a thixotropy such that the above-mentioned thermal conductivity or below its kind is not particularly limited. In one example, the heat adhesive composition satisfying the above properties may be a polyurethane adhesive composition for heat dissipation.
[94]
The urethane adhesive composition is heat topic composition containing at least a polyol, and the like; And a curing agent composition comprising at least an isocyanate compound, may be a two-component, including, by curing it is possible to form the heat radiation adhesive.
[95]
The heat conducting adhesive composition can include a filler in consideration of the physical properties such as thermal conductivity is also described above. The thermal conductivity of the above-mentioned range through the use of appropriate fillers, if necessary, also it is possible to secure the like. In one example of the filler contained in the heat-radiating adhesive composition may be a thermally conductive filler.
[96]
The thermal conductivity of the thermally conductive filler may be up to about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK. The type of thermally conductive filler that can be used is not particularly limited and may be applied to a ceramic filler in consideration of the insulating property and the like. For example, a ceramic particle such as alumina, AlN (aluminum nitride), BN (boron nitride), silicon nitride (silicon nitride), SiC, or BeO may be used. Also, if the insulating properties of the heat adhesive layer formed by the heat conducting adhesive composition can be secured, it is possible to consider the application of carbon fillers such as graphite (graphite). Form or content of the filler contained in the heat conducting adhesive composition is not particularly limited and may be selected in view of the sedimentation potential, such as the thermal conductivity of the object in the heat radiation adhesive composition viscosity, heat-radiating adhesive composition. In general, the larger the size of the filler increases the viscosity of the heat conducting adhesive composition, the higher the possibility of the filler is precipitated in the heat conducting adhesive composition. In addition, the smaller size tends to have higher heat resistance. Therefore, if considering the point such as the need to have a filler of the appropriate kind to be selected it may also be used two or more kinds of fillers. Further, in consideration of the amount to be filled it is to use a spherical filler of glass, but may also be used in consideration of the form or the form of a network of conductive fillers, such as needle-shaped or plate-shaped. The heat radiation adhesive composition in one example may comprise a thermally conductive filler in the average particle diameter of from 0.001 to 80 ㎛ ㎛. The average particle size of the filler is at least about 0.01 ㎛ In another example, at least 0.1, 0. 5㎛, at least 1 ㎛, over 2㎛, over 3㎛, 4㎛ over, or approximately over 5㎛ 6㎛ may be equal to or greater than. The average particle size of the filler is less than or equal to about 75㎛ In another example, 70㎛ hereinafter 65㎛ hereinafter 60㎛ hereinafter 55㎛ hereinafter 50㎛ hereinafter 45㎛ hereinafter 40㎛ hereinafter 35㎛ hereinafter 30㎛ or less, 25㎛ hereinafter 20㎛ hereinafter 15㎛ or less, and is less than or about 10㎛ 5㎛ less.
[97]
Ratio of the filler is, the above-described characteristics contained in the thermally conductive heat radiating adult adhesive composition, for example, the thermal conductivity may be selected so that the like can be secured. For instance the filler may be included within the scope of the adhesive component, 100 parts by weight compared to about 50 to about 2,000 parts by weight of a heat conducting adhesive composition. On the other hand, the adhesive component may refer to a polyol and a polyisocyanate. By weight of said filler portion to about 100 parts by weight In another example parts or more and 150 parts by weight or more and 200 parts by weight or more and 250 parts by weight or more and 300 parts by weight or more and 350 parts by weight or more and 400 parts by weight or more and 500 parts by weight or more, 550 It may be greater than or equal to parts by weight or more and 600 parts by weight or more or about 650 parts by weight.
[98]
As one example, the heat radiation adhesive composition can be an excellent composition is thixotropic. The thixotropy is stationary in the present specification it means the property that has fluidity if the fluidity, but the vibration. Method of measuring the thixotropy is not particularly limited, and can be measured by the rheological properties device known in the art. For example, the rheological properties as a device may be used a Brookfield Viscometer DV-in Ⅱ + Pro. By using this excellent thixotropic adhesive composition, to suppress the air bubbles generated in the heat dissipation layer formed by the heat conducting adhesive composition can form an excellent heat radiation performance is the adhesive layer. In one example, the heat radiation adhesive composition can tomorrow thixotropic index range (T) is from 1 to 8 according to the general formula (1).
[99]
[Formula 1]
[100]
T = V 0.5　/ V 5
[101]
Wherein in Formula 1, V 0.5 is the viscosity of the heat conducting adhesive composition as measured by a Brookfield viscometer at a rotation speed and CPA-52Z spindle of a temperature of 25 ℃, 0.5 rpm, V 5 is the temperature of 25 ℃, of 5 rpm at a rotation speed and CPA-52Z shows a spindle viscosity of the heat conducting adhesive composition as measured by a Brookfield viscometer.
[102]
In one example, the lower limit of the thixotropic index of the heat conducting adhesive composition can be about 1.5 or higher, or about 2 or more. The upper limit of the thixotropic index of the heat radiation adhesive composition, for example about 6, or less, or about 4 or less.
[103]
As a way to have a thixotropic index which is the heat radiation adhesive composition described above includes, for example, to give a thixotropic addition to the heat conducting adhesive composition. The thixotropy imparting agent, calcium carbonate (CaCO 3 may be mentioned as an example), alumina, talc or fumed silica.
[104]
Applying an adhesive composition to the heat radiation lower plate of the battery module is the ratio of the heat radiation adhesive composition application area can be carried out such that 70% to 99% of the area of ​​the battery modules on the lower plate. By controlling as the ratio of the area of ​​the heat conducting adhesive composition is applied to the above, after assembly of the battery pack to the battery module can be to facilitate the separation of the battery module, to prevent that the heat conducting adhesive is applied in the inspection step, which will be described later contamination can. The lower limit of the area ratio, for example, at least about 75%, at least 80% or about 85%. The upper limit of the area ratio can be, for example, up to about 95% or less, or about 90%.
[105]
Forming a heat radiation adhesive layer is formed in the injection port may further include a step of curing the adhesive composition after applying the heat. Curing of the heat conducting adhesive composition is not curing methods include thermal curing, photocuring, the curing temperature is not particularly limited, and can be cured by a known method.
[106]
The curing step and the curing rate of the heat conducting adhesive composition is applied to the lower plate of the call over the battery module is facilitated, and thus it can proceed with the quality check of the battery module to an earlier time, it can be improved and the productivity of the battery pack.
[107]
The battery pack production method of the present application can be in a state where one surface of the battery module located at the lower heat dissipation layer formed comprises a step of inspecting the quality of the battery module.
[108]
As an example check the quality of the battery module comprises: may be a step of performing an inspection process in a state that a lower plate of a battery module toward the lower direction. It is called a state in the present specification to the lower plate toward the bottom direction may indicate a state in the battery module through the lower plate of the battery module opposite to a direction of gravity.
[109]
On the other hand, quality inspection of the battery module may be, for example, hot-test engine. The quality check of the battery module, such as may be performed on an end-of-line (end of line, EOL) prior to assembling the battery pack with the battery module.
[110]
The battery module is an electric vehicle (EV) or a hybrid vehicle (HEV) as it is applied in a state while the lower plate of the battery module toward the lower direction when it is applied or the like, the quality check of the battery module also faces the lower plate is a lower direction of the battery modules is to be carried out in a state mounted.
[111]
The battery module as described above as an example one side, for instance if the heat radiation adhesive is applied to a portion on the bottom plate, the method comprising inspecting the quality of the battery module of the present application is the heat radiation adhesive composition applied to one side battery module the may further comprise a step of mounting a support member to support the battery module, the heat dissipating part that is the adhesive composition is not applied during the one surface.
[112]
If heat conducting adhesive is to be applied to some areas of the inlet side of the battery module is formed as described above, the shape of the heat radiation adhesive is applied area is not particularly limited, for example, rectangular, circular, or the like, stripe-shaped.
[113]
On the other hand, the material and shape of the support members is not particularly limited as long as it can support the battery module in the inspection step, it may be selected in consideration of the contact area between the durability and the battery module.
[114]
When forming the heat adhesive layer on the bottom plate of the battery module by coating a heat conducting adhesive composition, the heat radiation adhesive composition the ratio of the applied area as described above, about 70% to about 99 for the area on the battery module to the bottom plate, as described above It is such that the%, and a portion of the lower plate may be exposed, without the heat conducting adhesive composition being applied. Therefore, when placing the bottom plate of the battery module on the support member toward the lower direction, the applied heat the adhesive composition can not be in contact with the support member. Therefore, it is possible to prevent that the heat conducting adhesive is applied to the damaged surface of the one battery module.
[115]
The battery pack production method of the present application may include an assembling step of attaching the bottom plate of the battery module to a heat sink. The battery pack may include a plurality of battery modules according to the application, the battery module may be electrically connected to each other.
[116]
The heat sink may be in one can mean a means to promote the release of heat generated from the battery module, for example comprising a channel flowing a cooling medium pipe. The cooling medium is not particularly limited as long as it can absorb the heat generated by the battery modules can be used, for example, water.
[117]
By attaching the bottom plate of the battery modules in the assembly step for the heat sink, and the heat generated from the battery cells can be transferred to the heat dissipation layer formed in the battery module to the lower plate by a thermally conductive adhesive composition layer formed on the bottom plate side of a battery module, the heat can be transferred from the heat sink heat dissipation layer formed on the lower plate of the battery module.
[118]
7 is a schematic view of an exemplary battery pack produced by the battery pack production method of the present application. Referring to Figure 7, the battery pack 700 includes a heat sink 730, the battery module 710, the heat radiation adhesive layer 720 to the lower plate on said heat sink is formed may be attached.
Effects of the Invention
[119]
In this application there is a battery pack manufacturing method capable of efficiently manufacturing the battery pack to be provided.
Brief Description of the Drawings
[120]
1 is a diagram illustrating an example module case of this application.
[121]
2 is a view showing a form of the battery cell is accommodated in a module case of FIG.
[122]
3 is a view of an exemplary bottom plate and the inlet observed sphere formed.
[123]
4 is a view showing an exemplary battery pouch of the present application.
[124]
Figure 5 is a schematic view of the structure of the battery pack of the present invention.
[125]
Figure 6 is a flow diagram illustrating the battery pack production method comprising the step of forming the heat-radiating adhesive injection hole is formed by the heat radiation adhesive sheet of the present invention.
[126]
Figure 7 is a flow diagram illustrating the battery pack production method comprising the step of forming the heat-radiating adhesive injection hole is formed by the heat conducting adhesive composition of the present invention.
Mode for the Invention
[127]
Reference to the following accompanying drawings and embodiments will be described in detail a method for producing the battery pack but is not in the range of the battery pack manufacturing method is limited by the following examples.
[128]
[129]
Experimental Example 1. Measurement of thixotropy index
[130]
Thixotropic index of the heat conducting adhesive used in Preparation Example 2 was measured according to the general formula (1).
[131]
[Formula 1]
[132]
T = V 0.5　/ V 5
[133]
Wherein in Formula 1, V 0.5 is the viscosity of the adhesive composition as measured by a Brookfield viscometer at a rotation speed and CPA-52Z spindle of a temperature of 25 ℃, 0.5 rpm, V 5 is the temperature, rotation of 5 rpm for 25 ℃ in speed and CPA-52Z shows a spindle viscosity of the adhesive composition as measured by a Brookfield viscometer.
[134]
[135]
Preparation Example 1. The battery pack using the heat radiation adhesive sheet production method
[136]
The battery pack were prepared according to the procedure shown in Fig. A two-component resin composition of the ceramic filler is filled with a urethane series via the injection port on the bottom plate and the inlet observed sphere formed as shown in FIG. 3, the battery module was injected, including the module housing of FIG. The heat adhesive layer of the heat adhesive sheet comprising a release film 530 and the thermal conductivity is 2.0 W / mK in heat radiation adhesive layer 520 to the lower plate the inlet of the battery modules formed in this order for 20 minutes after the resin composition is injection attached to the injection port was sealed. And then to the lower plate of the battery module toward the bottom it was carried out a quality check of the battery module. After the paper is only 20 minutes, injecting the resin composition into the battery module though subjected to quality inspection after placing the battery module to the bottom plate of a battery module toward the lower direction, and come out of the resin composition injected into the battery module, to flow through the inlet It did.
[137]
[138]
Preparation Example 2. The battery pack using a heat conducting adhesive method
[139]
The battery pack were prepared according to the procedure shown in Fig. A two-component resin composition of the ceramic filler is filled with a urethane series via the injection port on the bottom plate and the inlet observed sphere formed as shown in FIG. 3, the battery module was injected, including the module housing of FIG. And for 20 minutes after the resin composition is injected into a thixotropic index to the lower plate the inlet of the battery modules formed 3, the thermal conductivity of 3 W / mK of the injection port by applying a two-pack type heat-radiating adhesive composition (620) of the urethane series and it sealed. The application of a heat conducting adhesive composition 620 was performed, except that comes into contact with the mounting process, the support pins in the battery module of the battery module, which will be described later. The area of ​​applying a heat conducting adhesive composition was about 85% of the total area of ​​the heat radiation adhesive composition applied to the battery module lower plate. After mounting the battery module over four pins to the lower plate toward the bottom direction it was carried out a quality check of the battery module. After the paper is only 20 minutes, injecting the resin composition into the battery module though subjected to quality inspection after placing the battery module to the bottom plate of a battery module toward the lower direction, and come out of the resin composition injected into the battery module, to flow through the inlet It did.

Claims

[Claim 1]Injecting resin composition through an injection port formed on one side of the plurality of battery modules having battery cells; Forming a heat adhesive layer on a first surface of the battery module which the injection hole is formed; And the battery pack production method comprising the step of inspecting the quality of a battery module in a state where one side of the battery modules on the lower the heat radiation adhesive layer formed.
[Claim 2]
The method of claim 1, wherein the heat radiation adhesive layer is a battery pack manufacturing method than the thermal conductivity of 2 W / mK.
[Claim 3]
2. The method of claim 1, wherein the injection port is formed to be heat-radiating adhesive layer on the surface of the battery module is formed of the battery includes the step of attaching a heat radiation adhesive sheet comprising a release film, and heat the adhesive layer on one surface of the battery module to which the inlet is formed Pack method.
[Claim 4]
The method of claim 1, further comprising: forming a heat adhesive layer on a first surface of the battery module, the injection port is formed in the battery pack production method comprising the step of coating the one side of the battery module, wherein the inlet is formed to heat the adhesive composition.
[Claim 5]
The method of claim 4, further comprising: forming a heat adhesive layer on a first surface of the battery module, the injection port is formed is to a formed battery thixotropic index (T) is 1 to 8, wherein the inlet of the range heat conducting adhesive composition according to general formula 1 method of manufacturing a battery pack including the step of coating the one side of the module: [formula 1] T = V 0.5　/ V 5 wherein in formula 1, V 0.5 at a temperature of 25 ℃, 0.5 rpm rotation speed and CPA-52Z of and the viscosity of the heat conducting adhesive composition measured at spindle Brookfield viscometer, V 5 indicates the viscosity of the heat conducting adhesive composition measured as a temperature, a Brookfield viscometer at a rotation speed and CPA-52Z spindle of 5 rpm for 25 ℃.
[Claim 6]
4 wherein, 70% to 99% of the battery pack manufacturing method for the heat conducting adhesive composition is a ratio of the applied area to the area of ​​one surface of the battery module is formed in the injection port.
[Claim 7]
The method of claim 4, further comprising: forming a heat adhesive layer on a first surface of the battery module, the injection port is formed in the battery pack manufacturing method further comprises a step of curing the adhesive composition after applying the heat.
[Claim 8]
The method of claim 4, wherein the step of inspecting the quality of a battery module comprises the steps of: mounting the support member to the heat conducting adhesive composition is applied to the battery module to a surface to support the battery module part that is not a heat conducting adhesive composition is applied from the side The battery pack manufacturing method.