Title of Invention:
Method for manufacturing electronic control device mounted in
vehicle and electronic control device mounted in vehicle
Technical Field
[0001]
The present invention relates to a method for manufacturing an electronic control device mounted in vehicle for controlling an internal combustion engine of a vehicle such as a motorcycle and an electronic control device mounted in vehicle, and in particular, an electronic circuit board on which an heating circuit component that generates heat when energized and an electronic circuit component are inserted through an opening of a housing mounted in a vehicle, and accommodated in a predetermined position of the electronic circuit board accommodating chamber in the housing.
Background Art
[0002]
An electronic control device of an internal combustion engine of a vehicle such as a motorcycle has a common structure in which a printed circuit board mounting an electronic circuit component, heating circuit component, and connectors are inserted in a cylindrical housing as disclosed in Fig. 1 of Patent Document
!•
On the printed circuit board, heating circuit component with large heat generation amount is present by repeating on/off operation in order to operate an internal combustion engine such as a power transistor. In order to prevent failure of the electronic circuit component on the printed circuit board, it is necessary to discharge the heat generated by the heating circuit component on the printed circuit board to the outside of the electronic control device.
[0003] An electronic control device for an internal combustion engine disclosed in Patent Document 1 will be described using the reference numerals in Patent Document 1 as follows. The connector (3) and the electronic component (2) that generates heat are mounted on the printed circuit board (1) by soldering, the unexpanded heat radiation material (4) is applied on the electronic component (2) that generates heat, and then after inserting the printed circuit board (1) with the electric component (2) mounted thereon from the opening surface of the housing (5), by heating the unexpanded heat radiation material (4), the foaming agent mixed in the unexpanded heat radiating material (4) is foamed, and by this

foaming, the heat radiation material (4) expands until it reaches the inner surface of the housing (5), a heat radiation path extending from the electronic component (2) to the inner surface of the housing (5) via the expanded heat radiation material (4) is formed.
In the method disclosed in Patent Document 1, although it is possible to form a heat radiation path from the electronic component (2) to the inner surface of the housing (5), a gas is contained in the heat radiation material by foaming the expandable heat radiation material, in addition, in this method, generally, a gas having poorer thermal conductivity is contained in the heat radiation material, so that high thermal conductivity cannot be obtained. Also, since the heat radiation material is interposed in the space between the electronic component (2) and the housing (5), there is a distance from the electronic component (2) to the housing (5), so a good heat radiation performance cannot be expected.
Therefore, according to the method disclosed in Patent Document 1, it is difficult to achieve the original purpose, that is to release the heat generated by the electronic component to the outside of the electronic control device with high efficiency.
Patent Document [0004]
[Patent Document 1] JP4479840B2 Disclosure of Invention
Technical Problem
[0005]
As described above, according to the method disclosed in Patent Document 1, it is difficult to release the heat generated by the electronic component to the outside of the electronic control device with high efficiency, which is the original purpose. There is also a method of improving the thermal conductivity by incorporating fine particles of a metal having high thermal conductivity, such as metal or ceramic, into the foaming heat radiation agent, but in this method, there is a cost increase problem of the heat radiation material, which is not realistic.
[0006]
The present invention was made in the light of the circumstances as described above, and it is an object of the present invention to provide a method for manufacturing an electronic control device mounted in vehicle for controlling an internal combustion engine of a vehicle and an electronic control device mounted in vehicle wherein an electronic circuit board on which an heating circuit component that generates heat when

energized and an electronic circuit component are inserted through an opening of a housing mounted in a vehicle, and accommodated in a predetermined position of the electronic circuit board accommodating chamber in the housing,
in which it is aimed to improve the heat radiation property of the heating circuit component on the electronic circuit board at low cost.
Solution to Problem [0007]
According to a first aspect of the present invention, the present invention relates to a method of manufacturing an electronic control device mounted in vehicle, wherein;
the electronic control device mounted in vehicle comprises an electronic circuit board on which electronic circuit component and a heating circuit component that generate heat when energized are mounted, and a housing mounted in vehicle having an opening into which this electronic circuit board is inserted at one end and having an electronic circuit board accommodating chamber therein for accommodating the electronic circuit board inserted through the opening at a predetermined position,
the housing owns a first wall part and a second wall part opposed to the first wall part via the electronic circuit board accommodating chamber,
the d electronic circuit board is positioned between the first wall part and the second wall part,
the electronic circuit board faces the first wall part via a first space in the electronic circuit board accommodating chamber,
the electronic circuit board faces the second wall part via a second space in the electronic circuit board accommodating chamber,
the first wall part integrally has a heat transfer protruding part protruding toward the inside of electronic circuit board accommodating chamber,
the heat transfer protruding part is disposed at a position facing the heating circuit component,
a surface of the heat transfer protruding part on the side of the heating circuit component and a surface of the heating circuit component on the side of the heat transfer protruding part are adhered by a heat conductive paste adhesive, and
heat generated by energization of the heating circuit component is conducted from the heating circuit component to the heat transfer protruding part via the thermally conductive paste adhesive in order to provide heat radiation from the housing,
and wherein; in the manufacturing method,
before the electronic circuit board is inserted into the electronic circuit board accommodating chamber from the opening,

the heat conductive paste adhesive is applied to the heating circuit component, and
the thickness of the thermally conductive paste adhesive applied to the heating circuit component in a state before the electronic circuit board is inserted into the electronic circuit board accommodating chamber is made larger than a first distance between a surface of the heating circuit component on the side of the heat transfer protruding part and a surface of the heat transfer protruding part on the side of the heating circuit component in a state in which the electronic circuit board is accommodated in the predetermined position of the electronic circuit board accommodating chamber.
[0008]
According to a second aspect of the present invention, the present invention relates to a method of manufacturing an electronic control device mounted in vehicle, wherein;
the electronic control device mounted in vehicle comprises an electronic circuit board on which electronic circuit component and a heating circuit component that generate heat when energized are mounted, and a housing mounted in vehicle having an opening into which this electronic circuit board is inserted at one end and having an electronic circuit board accommodating chamber therein for accommodating the electronic circuit board inserted through the opening at a predetermined position,
the housing owns a first wall part and a second wall part opposed to the first wall part via the electronic circuit board accommodating chamber,
the electronic circuit board is positioned between the first wall part and the second wall part,
the electronic circuit board faces the first wall part via a first space in the electronic circuit board accommodating chamber,
the d electronic circuit board faces the second wall part via a second space in the electronic circuit board accommodating chamber,
the second wall part integrally has a heat transfer protruding part protruding toward the inside of electronic circuit board accommodating chamber,
the heat transfer protruding part is disposed at a position facing the heating circuit component,
a surface of the heat transfer protruding part on the side of the heating circuit component and a surface of the heating circuit component on the side of the heat transfer protruding part are adhered by a heat conductive paste adhesive, and
heat generated by energization of the heating circuit component is conducted from the heating circuit component to the heat transfer protruding part via the thermally conductive paste

adhesive in order to provide heat radiation from the housing, and wherein; in the manufacturing method,
before the electronic circuit board is inserted into the electronic circuit board accommodating chamber from the opening, the heat conductive paste adhesive is applied to the heating circuit component, and
the thickness of the thermally conductive paste adhesive applied to the heating circuit component in a state before the electronic circuit board is inserted into the electronic circuit board accommodating chamber is made larger than a first distance between a surface of the heating circuit component on the side of the heat transfer protruding part and a surface of the heat transfer protruding part on the side of the heating circuit component in a state in which the electronic circuit board is accommodated in the predetermined position of the electronic circuit board accommodating chamber.
Advantageous Effects of Invention [0009]
According to the manufacturing method of the electronic control device mounted in vehicle of the first invention according to the present invention, in an electronic control device mounted in vehicle wherein an electronic circuit board on which a heating circuit component which generates heat when energized and an electronic circuit component are is inserted from the opening of the housing, the electronic control device is configured such that the housing integrally has a heat transfer protruding part protruding toward the inside of electronic circuit board accommodating chamber in the housing and heat generated by energization of the heating circuit component is conducted from the heating circuit component to the heat transfer protruding part via the thermally conductive paste adhesive in order to provide heat radiation from the housing, and the thickness of the thermally conductive paste adhesive applied to the heating circuit component in a state before the electronic circuit board is inserted into the electronic circuit board accommodating chamber is made larger than a first distance between a surface of the heating circuit component on the side of the heat transfer protruding part and a surface of the heat transfer protruding part on the side of the heating circuit component in a state in which the electronic circuit board is accommodated in the predetermined position of the electronic circuit board accommodating chamber, therefore it is possible to shorten the relative distance between the heat transfer protruding part with the housing and the heating circuit component and also to improve the adhesion between the thermally conductive paste adhesive and the heat transfer protruding part, therefore it is possible to improve the heat radiation property of the heating

circuit component on the circuit board at low cost.
Further, according to the manufacturing method of the electronic control device mounted in vehicle of the second invention, the thickness of the thermally conductive paste adhesive applied to the heating circuit component in a state before the electronic circuit board is inserted into the electronic circuit board accommodating chamber is made larger than a third distance between a surface of the heating circuit component on the side of the heat transfer protruding part and a surface of the heat transfer protruding part on the side of the heating circuit component in a state in which the electronic circuit board is accommodated in the predetermined position of the electronic circuit board accommodating chamber, therefore, similarly to the first invention, it is possible to shorten the relative distance between the heat transfer protruding part with the housing and the heating circuit component, in addition, the adhesion between the heat conductive paste adhesive and the heat transfer protruding part is improved, and it is possible to improve the heat radiation property of the heating circuit component on the electronic circuit board at low cost.
Brief Description of Drawings [0010]
[Fig. 1] Fig. 1 is a view showing a first embodiment of the present invention, and is a sectional view showing an example of an electronic control device mounted in vehicle.
[Fig. 2] Fig. 2 is a sectional view illustrating the first half of the assembly process of the electronic control device mounted in vehicle of Fig. 1, and illustrating a first embodiment of the present invention, and is an explanatory diagram of a manufacturing method of an electronic control device mounted in vehicle.
[Fig. 3] Fig. 3 is a sectional view illustrating the latter half of the assembly process of the electronic control device mounted in vehicle of Fig. 1, and illustrating a first embodiment of the present invention, and is an explanatory diagram of a manufacturing method of an electronic control device mounted in vehicle.
[Fig. 4] Fig. 4 is a sectional view showing a second embodiment of the present invention, and showing another example of the electronic control device mounted in vehicle.
[Fig. 5] Fig. 5 is a sectional view showing a third embodiment of the present invention, and showing another example of the electronic control device mounted in vehicle.
[Fig. 6] Fig. 6 is a sectional view showing a fourth embodiment of the present invention, and showing another example of the electronic control device mounted in vehicle.
[Fig. 7] Fig. 7 is a sectional view showing a fifth embodiment of the present invention, and showing another example of the

electronic control device mounted in vehicle.
[Fig. 8] Fig. 8 is a sectional view showing a sixth embodiment of the present invention, and showing another example of the electronic control device mounted in vehicle.
Description of Embodiments
[0011]
Embodiments of the present invention will be described below with reference to the figures. It is to be noted that the present invention is not limited to the description of the following embodiments, and each embodiment can be appropriately combined, modified, or omitted without departing from the gist of the present invention.
[0012]
In each of the figures of the following embodiments, in order to facilitate understanding, the scales of each part may be different from the actual scales, and illustration of configurations not related to the features of the present invention is omitted. In each figure of the following embodiments, the same reference numerals indicate the same or corresponding parts.
[0013] First embodiment
Hereinafter, a first embodiment will be described with reference to Figs. 1 to 3. Fig. 1 is a view showing a first embodiment of the present invention, and is a sectional view showing an example of an electronic control device mounted in vehicle, Fig. 2 is a sectional view illustrating the first half of the assembly process of the electronic control device mounted in vehicle of Fig. 1, and illustrating a first embodiment of the present invention, and is an explanatory diagram of a manufacturing method of an electronic control device mounted in vehicle, Fig. 3 is a sectional view illustrating the latter half of the assembly process of the electronic control device mounted in vehicle of Fig. 1, and illustrating a first embodiment of the present invention, and is an explanatory diagram of a manufacturing method of an electronic control device mounted in vehicle.
Figs. 1 to 3, as an example, is showing an electronic circuit board 1, an electronic circuit component 1EP, a tubular resin housing 2 having an opening on the side for electrically connecting to the wiring of a vehicle body with an electronic control device mounted in vehicle, a first wall part 21, a heat transfer protruding part 21P, a second wall part 22, a third wall part 23, a fourth wall part 24, a fifth wall part 25, an electronic circuit board accommodating chamber 2R1, a first space 2R11, a second space 2R12, a heating circuit component 3, a holding part

41, a holding part 42, a recess part 5, an opening part 6, an opening 61, a guide 71, a guide 72, a thermally conductive paste adhesive 8, a jig 9, a heat caulking part 10, a first distance al, a second distance A2, a fifth distance A5, a sixth distance A6, and a thickness t of the thermally conductive paste adhesive 8.
[0014]
An electronic control device mounted in vehicle is an electronic control device mounted in vehicle that performs control of internal combustion engine of a vehicle such as a motorcycle, for example, ignition control, air-fuel ratio control, further, the electronic control device mounted in vehicle comprises an electronic circuit board 1 and a housing 2 in which the electronic circuit board 1 is housed.
As a mounting form of the electronic control device mounted in vehicle, various mounting forms according to the type of vehicle are adopted, for example, a fixed type in which the housing 2 is fixed to the vehicle body by fixing means such as screws or bands, a mounting type in which the housing 2 is placed on a predetermined place of the vehicle without being fixed, and a suspended type in which the electronic control device mounted in vehicle is suspended at a predetermined position of the vehicle body.
Further, the first embodiment and the second to sixth embodiments described later can be applied to vehicles with motorized bicycles, boats, snowmobiles, and other so-called vehicles with internal combustion engine, in addition to vehicles such as motorcycles.
[0015]
On the electronic circuit board 1, a heating circuit component 3 and a plurality of electronic circuit component 1EP are mounted. The electronic circuit board 1 is a wiring board, such as a printed-wiring board, printed-circuit board, etc., electrically connected by a plurality of electronic circuit component 1EP. On the electronic circuit board 1, an electronic circuit of the electronic control device mounted in vehicle is formed. Here, the heating circuit component 3 is a circuit component which consumes a large amount of power during the operation of the electronic control device mounted in vehicle and which generates a large amount of heat, for example, a power transistor such as a MOSFET, such that the possibility of exceeding the allowable temperature of the component is occurred unless heat radiation measures are taken. The electric circuit component 1EP, in the example of Figs. 1 to 3, are mounted on the surface of the electronic circuit board 1 on the side of the first wall part 21, however, it may be mounted on the surface of the electronic circuit board 1 on the side of the second wall part 22, and may also be mounted on both the surface of the

electronic circuit board 1 on the side of the first wall part 21 and the surface of the side of the second wall part 22.
[0016]
The housing 2 has the holding parts 41 and 42 which holds the electronic circuit board 1 and has the recess part 5. In addition, the housing 2 has the opening part 6 on the surface thereof on the side on which the electronic control device mounted in vehicle is electrically connected to the wiring of the vehicle body, and is configured such that the electronic circuit board 1 is inserted into the housing part 2 through the opening part 6 and is taken out an electrical connection part not shown in Figs. 1 to 3, such as a connector, of the electronic circuit board 1 to the outside of the housing 2 through the opening part 6.
Further, the housing 2 has two guides 71, 72 each of which has a guiding function to guide the electronic circuit board 1 from the opening part 6 to the opposite side to the opening part 6 when inserting the electronic circuit board 1 into the housing 2 and has a holding function to hold the electronic circuit board 1 in the predetermined position in the housing 2.
[0017]
The groove formed on the inner wall surface of the fourth wall part 24 and extending from the opening 61 to the holding parts 41 and 42 of the third wall part 23 is the guide 71. The groove formed on the inner wall surface of the fifth wall part 25 facing the fourth wall part 24 and extending from the opening 61 to the holding parts 41, 42 of the third wall part 23 is the guide 71. Both the groove-shaped guides 71, 72 are parallel to the first wall part 21 and the second wall part 22. Therefore, in Fig. 1 showing the state after assembly, the electronic circuit board 1 is parallel to the first wall part 21 and the second wall part 22. As illustrated in Fig. 1, in a state where the electronic circuit board 1 is held by the holding parts 41, 42, the electronic circuit board 1 is accommodated in the predetermined position of the electronic circuit board accommodating chamber 2R1.
[0018]
The recess part 5 of the housing 2 is provided at a position facing the heating circuit component 3 mounted on the electronic circuit board 1. By adopting a structure in which a thermally conductive paste adhesive having flexibility and high thermal conductivity is interposed between the recess part 5 and the heating circuit component 3, a heat radiation path which is a path for heat transfer from the heating circuit component 3 to the housing 2 via the thermally conductive paste adhesive 8 and is a path for heat transfer from the housing 2 to the exterior of the

housing 2, therefore the heat generation of the heating circuit component 3 can be suppressed.
[0019]
Fig. 2 is a sectional view of the first embodiment before assembly. In the present electronic control device mounted in vehicle, the electronic circuit board 1 is inserted in the direction of the arrow along the guides 71, 72 from the opening 61 of the opening part 6 of the cylindrical housing 2, and the electronic circuit board 1 is inserted into the housing 2, and is housed in the predetermined position. Until the electronic circuit board 1 is inserted into a predetermined position in the housing 2, the recess part 5 shown in Fig. 1 which is a completed view of the electronic control device mounted in vehicle is not formed. Before inserting the electronic circuit board 1 into a predetermined position in the housing 2, the heat conductive paste adhesive 8 is applied to the heating circuit component 3 on the electronic circuit board 1. At this time, the thermally conductive paste adhesive 8 is applied to the package surface of the heating circuit component 3, which is the surface facing to the first wall part 21 of the housing 2.
[0020]
After housing the electronic circuit board 1 in the predetermined position in the housing 2, the heat caulking part 10 of the housing 2 facing the heating circuit component 3 is deformed. The direction of deformation is deformed in a direction in which the housing 2 and the thermally conductive paste adhesive 8 applied to the heating circuit component 3 are in contact with each other to form the recess part 5 shown in Fig. 1. The formation depth of the recess part 5 is noted as dl. It may be sufficient to contact uniformly the heat conductive paste adhesive 8 and the heat transfer protruding part 21P of the housing 2.
[0021]
The method for forming the recess part 5 is not limited, but as an example, a manufacturing method using resin deformation by heat will be described. Fig. 3 is a diagram illustrating the formation of a recess by heat caulking.
[0022]
First, the housing 2 is molded from a thermoplastic resin such as PBT, PPS, or PA66. However, the heat resistant temperature of the housing 2 is required to be about 150°C or more. Such the housing 2 is prevented from being deformed or destroyed by the heat generated when the electronic control device mounted in vehicle is operated. Since the heat from the heating circuit component 3 is

radiated to the housing 2, if the heat resistant temperature is low, the housing 2 is not prevented from being deformed or destroyed by the heat generated when the electronic control device mounted in vehicle is operated. The electronic circuit board 1 is housed inside a housing 2 formed of a thermoplastic resin. At this time, as described above, after applying the thermally conductive paste adhesive 8 on the heating circuit component 3, the electronic circuit board 1 is accommodated in the housing 2. After accommodation, by using the jig 9, the heat caulking part 10 is pushed inward in the housing 2, i.e. in the direction of the arrow in Fig. 3, from the outside of the housing 2 to the electronic circuit board accommodating chamber 2R1. At this time, the jig 9 is pushed in a heated state. Then, the housing 2 is softened by heat, deformed by the force at the time of pushing the jig 9 to form the recess part 5, and the heat transfer protruding part 21P is formed. The depth dl of the recess part 5 is adjusted by the distance by which the jig 9 is pushed. Regarding the depth dl of the recess part 5, assuming that the first distance between the heat transfer protruding part 21P and the heating circuit component 3 is "al" and the thickness t of the heat conductive paste adhesive 8 is "t", the formation depth dl is so adjusted as to satisfy a conditional expression "CKaKt". If the formation depth dl is too large, pressing from the jig 9 may be applied to the heating circuit component 3 during processing of the recess part 5, which may cause damage to the heating circuit component 3.
[0023]
When executing the heat caulking, the heat caulking part 10 may be formed thicker than the thickness of the housing 2. When the resin is softened by heat and processed, if the thickness of the heat caulking part 10 is thin, it is feared that the heat caulking part 10 may be broken. Therefore, by forming the heat caulking part 10 thicker as described above, it is possible to prevent damage such as break during processing. A waterproof function is indispensable for an electronic control device mounted in vehicle. Therefore, breakage of the housing 2 is a fatal defect.
[0024]
When the thermally conductive paste adhesive 8 to be used is a thermosetting resin, the electronic control device mounted in vehicle, after forming the recess part 5 and making contact with the thermally conductive paste adhesive 8, is subjected to heat treatment to obtain thermal conductive paste adhesive 8 being harden.
[0025] According to the first embodiment described above, the

thermal resistance from the heating circuit component 3 to its surroundings can be lowered. The heat generated from the heating circuit component 3 can be radiated to the outside more efficiently, and the temperature rise around the heating circuit component 3 itself and its surroundings can be kept low.
[0026]
According to the first embodiment, it is possible to increase the heat radiation performance of the heating circuit component 3 without filling the entire interior of the housing 2 with resin. Therefore, the cost of the electronic control device mounted in vehicle can be reduced by the material cost of the resin, and also the mass of the electronic control device mounted in vehicle can be reduced.
[0027]
Furthermore, according to the first embodiment, it is possible to contact the inner surface of the housing 2 with the thermally conductive paste adhesive 8 without foaming the heat dissipating member in contrast to the formation of the heat radiation path by the foam member in the conventional examples. Since the foam heat radiation member contains air in the heat radiation member and the air has poor thermal conductivity, as a result, the heat radiation from the heating circuit component 3 to the housing 2 becomes low. On the other hand, according to the first embodiment, it is not necessary to foam the thermally conductive paste adhesive 8, and it is possible to transfer heat from the heating circuit component 3 to the housing 2 at the shortest distance. In addition, the thermally conductive paste adhesive 8 does not contain air, it is possible to reduce the factor of deteriorating the thermal conductivity as compared with the conventional examples, and as a result, as compared with the conventional example, the thermal conductivity is improved.
[0028]
As described above, the first embodiment is a manufacturing method of an electronic control device mounted in vehicle, wherein;
the electronic control device mounted in vehicle comprises an electronic circuit board 1 on which electronic circuit component 1EP and a heating circuit component 3 that generate heat when energized are mounted, and a housing 2 mounted in vehicle having an opening 61 into which this electronic circuit board 1 is inserted at one end and having an electronic circuit board accommodating chamber 2R1 therein for accommodating the electronic circuit board 1 inserted through the opening 61 at a predetermined position,
the housing 2 owns a first wall part 21 and a second wall part 22 opposed to the first wall part 21 via the electronic

circuit board accommodating chamber 2R1,
the electronic circuit board 1 is positioned between the first wall part 21 and the second wall part 22,
the electronic circuit board 1 faces the first wall part 21 via a first space 2R11 in the electronic circuit board accommodating chamber 2R1,
the electronic circuit board 1 faces the second wall part 22 via a second space 2R12 in the electronic circuit board accommodating chamber 2R1,
the first wall part 21 integrally has a heat transfer protruding part 21P protruding toward the inside of electronic circuit board accommodating chamber 2R1,
the heat transfer protruding part 21P is disposed at a position facing the heating circuit component 3,
a surface of the heat transfer protruding part 21P on the side of the heating circuit component 3 and a surface of the heating circuit component 3 on the side of the heat transfer protruding part 21P are adhered by a heat conductive paste adhesive 8, and
heat generated by energization of the heating circuit component 3 is conducted from the heating circuit component 3 to the heat transfer protruding part 21P via the thermally conductive paste adhesive 8 in order to provide heat radiation from the housing 2,
and wherein; in the manufacturing method,
before the electronic circuit board 1 is inserted into the electronic circuit board accommodating chamber 2R1 from the opening 61, the heat conductive paste adhesive 8 is applied to the heating circuit component 3, and
the thickness of the thermally conductive paste adhesive 8 applied to the heating circuit component 3 in a state before the electronic circuit board 1 is inserted into the electronic circuit board accommodating chamber 2R1 is made larger than a first distance between a surface of the heating circuit component 3 on the side of the heat transfer protruding part 21P and a surface of the heat transfer protruding part 21P on the side of the heating circuit component 3 in a state in which the electronic circuit board 1 is accommodated in the predetermined position of the electronic circuit board accommodating chamber 21R.
[0029]
As described above, in the first embodiment, the housing 2 is a resin housing, and the heat transfer protruding part 21P is fixed to the outside of the housing 2 by the heated jig 9, and presses the housing 2 from the housing 2. The thickness of the part of the housing 2 pressed by the jig 9 is formed thicker than the thickness of the part not pressed by the jig 9. As for the

thickness of the housing 2 in the part of the heat transfer protruding part 21P, the thickness after being pressed by the jig 9 is thinner than the thickness before being pressed by the jig 9, depending on other conditions such as the pressing amount of the jig 9 (the depth of the recess part 5), there are cases where the thickness before pressing and the thickness after pressing hardly change.
[0030]
As described above, in the first embodiment, a fifth distance A5 between the surface of the first wall part 21 on the side of the electronic circuit board 1 and the surface of the electronic circuit board 1 on the side of the first wall part 21 on the side of the opening 61 of the heating circuit component 3 is the same as the sixth distance A6 between the surface of the first wall part 21 on the side of the electronic circuit board 1 and the surface on the side of the first wall part 21 of the electronic circuit board 1 on the side opposite to the opening 61 of the heating circuit component 3.
[0031]
Further, in the first embodiment, the heat transfer protruding part 21P may be molded together with the molding of the housing 2 at the time of molding the housing 2.
Further, in a state where the electronic circuit board 1 is accommodated in the predetermined position of the electronic circuit board accommodating chamber 2R1, the thermally conductive paste adhesive 8 may be thermally cured by heating.
In addition, the housing 2 may be a housing made of resin, the heating circuit component 3 may be a heating circuit component molded with a resin, and the heat conductive paste adhesive 8 may be a resin-based heat conductive.
In addition, the thermally conductive paste adhesive 8 may be a thermally conductive adhesive having elasticity.
In addition, the thermally conductive paste adhesive 8 may be a thermosetting resin-based thermally conductive adhesive.
[0032] Second Embodiment
Hereinafter, Embodiment 2 will be described with reference to Fig. 4 which is sectional view showing another example of the electronic control device mounted in vehicle. In the second embodiment, only the points different from the first embodiment will be described, and description of matters identical or equivalent to those in the first embodiment will be omitted.
The difference from the first embodiment is that the recess part 5 is formed not on a surface All (the surface on the side of

the first wall part 21 side where the heating circuit component 3 is mounted), but on a surface B12 of the electronic circuit board 1.
[0033]
On the surface B12, i.e. the surface on the side of the second wall part 22 on the side where the heating circuit component 3 is not mounted, of the electronic circuit board 1, a metal surface generally named heat radiation pad is formed. Specifically, a metal terminal of the heating circuit component 3 is joined to a planar wiring (not shown) on the surface All by soldering. Further, a heat radiation pad is formed on the surface B12, and the planar wiring of the surface All and the heat radiation pad of the surface B12 are electrically and thermally connected by a via provided in the electronic circuit board 1. The planar wiring is made of copper foil and via is made by plating copper on an inner surface of the through hole of the board and since the thermal conductivity is high, the heat from the heating circuit part 3 is radiated from the surface All to the surface B12.
[0034]
The heat conductive paste adhesive 8 is applied on the heat radiation pad on the surface B12 and the electronic circuit board 1 is housed in the housing 2 in the same manner as in the first embodiment and then the recess part 5 and the heat transfer protruding part 22P are formed. The heat transfer protruding part 22P and the heat conductive paste adhesive 8 are brought into contact with each other and the generated heat transferred from the heating circuit component 3 to the surface B12 is transferred through the heat conductive paste adhesive 8 and the heat transfer protruding part 22P, and radiates heat to the housing 2.
[0035]
In the configuration of the first embodiment, when forming the recess part 5, in the case of processing by heat caulking, the heating circuit component may be exposed to high temperature. However, according to the second embodiment, it is possible to assemble the heating circuit component 3 without exposing the heating circuit component 3 to a high temperature as compared with the first embodiment.
[0036]
As described above, in the manufacturing method of the electronic control device mounted in vehicle of the second embodiment, wherein;
the electronic control device mounted in vehicle comprises an electronic circuit board 1 on which electronic circuit component and a heating circuit component 3 that generate heat when energized

are mounted, and a housing 2 mounted in vehicle having an opening 61 into which this electronic circuit board 1 is inserted at one end and having an electronic circuit board accommodating chamber 2R1 therein for accommodating the electronic circuit board 1 inserted through the opening at a predetermined position,
the housing 2 owns a first wall part 21 and a second wall part 22 opposed to the first wall part 21 via aforesaid electronic circuit board accommodating chamber 2R1,
the electronic circuit board 1 is positioned between the first wall part 21 and the second wall part 22,
the electronic circuit board 1 faces the first wall part 21 via a first space 2R11 in the electronic circuit board accommodating chamber 2R1,
the electronic circuit board 1 faces the second wall part 22 via a second space 2R12 in the electronic circuit board accommodating chamber 2R1,
the second wall part 22 integrally has a heat transfer protruding part protruding 22P toward the inside of electronic circuit board accommodating chamber 2R1,
the heat transfer protruding part 22P is disposed at a position facing the heating circuit component 3,
a surface of the heat transfer protruding part 22P on the side of the heating circuit component 3 and a surface of the heating circuit component 3 on the side of the heat transfer protruding part 22P are adhered by a heat conductive paste adhesive 8, and
heat generated by energization of the heating circuit component 3 is conducted from the heating circuit component 3 to the heat transfer protruding part 22P via the thermally conductive paste adhesive 8 in order to provide heat radiation from the housing 2,
and wherein; in the manufacturing method,
before the electronic circuit board 1 is inserted into the electronic circuit board accommodating chamber 2R1 from the opening 61, the heat conductive paste adhesive 8 is applied to the heating circuit component 3, and
the thickness of the thermally conductive paste adhesive 8 applied to the heating circuit component 3 in a state before the electronic circuit board 1 is inserted into the electronic circuit board accommodating chamber 2R1 is made larger than a third distance between a surface of the heating circuit component 3 on the side of the heat transfer protruding part 22P and a surface of the heat transfer protruding part 22P on the side of the heating circuit component 3 in a state in which the electronic circuit board 1 is accommodated in the predetermined position of the electronic circuit board accommodating chamber 2R1.

[0037] Third embodiment
Hereinafter, the third embodiment will be described with reference to Fig. 5 which is a sectional view showing another example of the electronic control device mounted in vehicle. In the third embodiment, only the points different from those in the first and second embodiments are described, and a description of the same or equivalent matters as in the first and second embodiments is omitted.
As illustrated in Fig. 5, the heating circuit component 3 may be mounted on a heat circuit component mounting substrate 13.
[0038]
The heat circuit component mounting substrate 13 will be described. In the first embodiment, the heating circuit component 3 is mounted on one electronic circuit board 1 by soldering. On the other hand, in the third embodiment, apart from the electronic circuit board 1, the heating circuit component 3 is mounted on the heat circuit component mounting substrate 13 by soldering. Furthermore, the heat circuit component mounting substrate 13 is mounted on the electronic circuit board 1 by soldering, and is electrically and mechanically connected to the electronic circuit board 1. As a result, the heat circuit component mounting substrate 13 is attached to the electronic circuit board 1 as a part of the electronic circuit board 1.
[0039]
A recess part 5 and a heat transfer protruding part 21P are formed in the housing 2 with respect to the heating circuit component 3 mounted on the heat circuit component mounting substrate 13 which is a part of the electronic circuit board 1 and the heat transfer protruding part 21P of the housing 2 and the heating circuit component 3 are brought into contact via the thermally conductive paste adhesive 8.
[0040]
According to the third embodiment, by mounting the heat circuit component mounting substrate 13 on the electronic circuit board 1, the distance (corresponding to A2 shown in Fig. 3) between the housing 2 and the heating circuit component 3 can be reduced, and it is possible to make it smaller as compared with the first embodiment. The depth d2 of the recess part 5 can be formed with d2A6 is satisfied at the time of forming the housing 2 by injection molding in the above-described first embodiment. However, the relationship between the height h of the heating circuit component 3 and the coating thickness t (see Fig. 3) of the thermally conductive paste adhesive 8 is set as ht. On the contrary, when A5B7.
The part corresponding to a seventh distance B7 of the housing 2 corresponds to the recess part 5 when viewed from the outside of the housing 2 with respect to the part corresponding to a fourth distance B4, and corresponds to the heat transfer protruding part 22P as viewed from the electronic circuit board accommodation chamber 2R1 side.
[0054]
In the sixth embodiment, the housing 2 is configured with the shape shown in Fig. 6, and the electronic control device mounted in vehicle is assembled in the same manner as in the fifth embodiment. In the sixth embodiment, the thickness t of the thermally conductive paste adhesive 8 applied to the heating circuit component 3 in a state before the electronic circuit board 1 is inserted into the electronic circuit board accommodating chamber 2R1 (See Fig. 2), the aforementioned fourth distance B4, and the seventh distance B7 is such that 0t, the housing 2 is manufactured. Conversely, when B4