TECHNICAL FIELD

The present disclosure generally relates to a field of material science and metallurgy. The present disclosure particularly relates to a method of depositing a metal or an alloy on coated substrate. The disclosure also relates to soldering filler material on the metal or the alloy deposited coated substrate. The disclosure also relates to an apparatus for depositing the metal or the alloy on the coated substrate.

BACKGROUND OF THE DISCLOSURE
Flexible printed electronics represent an emerging technology with potentially broad impact on everyday life. Printed devices such as environmental, physical, and biological sensors, logic circuits, radio frequency transmitters, and display elements can enable a variety of applications in portable electronics, cybersecurity, biomedical diagnostics, and the internet of things. The development of inks based on electronic material is considered a way forward in the field of electronics and conductive nanomaterials have attracted significant interest in this regard. In particular, recent efforts have focused on the application of graphene inks or conductive polymer inks in flexible printed electronics, due to desirable combination of electrical and thermal conductivity, mechanical flexibility, chemical and thermal stability of the graphene or conductive polymer.

It is observed that graphene ink or conductive polymer ink based printed electronic circuits are easy to manufacture on a variety of insulating surfaces such as paper, fabric and polymers etc. However, it is noted that it is very difficult to establish an ohmic contact with the electronic and electrical components and wires with such graphene ink or conductive polymer ink based printed electronic circuits, as the graphene ink or the conductive polymer ink does not allow soldering on its surface. Alternatively, there has been an attempt to directly print the electronic components on the surface of the graphene ink or conductive polymer ink based printed electronic circuits. However, connecting the circuit wires for power supply and inductance will again poses the same problem of establishing an ohmic contact.

In the light of the foregoing limitations, the present disclosure describes a method of depositing metal or alloy on graphene ink or conductive polymer coated substrate that overcomes the mentioned limitations.

SUMMARY OF THE DISCLOSURE
The object of the present invention is to arrive at simple, low cost and effective method of depositing a metal or an alloy on coated substrate to obtain the metal or the alloy deposited coated substrate which exhibits efficient ohmic contact.

Accordingly, the present disclosure relates to a method of depositing a metal or an alloy on coated substrate, comprises: contacting the coated substrate with an electrolyte comprising an electrode; and passing electric current through the electrode, thereby depositing the metal or the alloy on the coated substrate.

The present disclosure further relates a method of soldering a filler material on the said metal or alloy deposited coated substrate, comprises: contacting the filler material with the metal or the alloy deposited coated substrate, followed by heating the filler material; fusing the filler material on the metal or the alloy deposited coated substrate, thereby soldering the filler material on the metal or the alloy deposited coated substrate.

The present disclosure further relates to an apparatus for depositing a metal or an alloy on coated substrate, comprises: a conduit (1) configured to house a power source (2); a nozzle (3) connected to the conduit, configured to store electrolyte (5); at least one electrode (4) is disposed within the conduit and connected to the power source (2), wherein the electrode (4) upon receiving the electric current causes deposition of the metal or the alloy on the substrate.

BRIEF DESCRIPTION OF THE ACCOMPANYING FIGURES
For the purpose that the disclosure may be easily perceived and put into practical effect, reference will now be made to exemplary embodiments as illustrated with reference to the accompanying figures. The figures together with detailed description below, are incorporated in and form part of the specification, and serve to further illustrate the embodiments and explain various principles and advantages, in accordance with the present disclosure where:

FIGURE 1 illustrates graphene ink patch on fabric, wherein the graphene ink patch has a dimension of about 2cm x 10cm.

FIGURE 2 illustrates experimental setup of depositing metal on the graphene ink coated fabric, where in a) illustrates placement of copper electrode at the bottom of the petri dish having electrolyte; and b) illustrates placement of the graphene ink coated fabric, allowing the fabric to float in the electrolyte on top of the copper electrode.

FIGURE 3 illustrates scanning electron microscope (SEM) image of bare fabric

FIGURE 4 illustrates scanning electron microscope (SEM) image of copper deposited on graphene ink surface.

FIGURE 5 illustrates scanning electron microscope (SEM) image of continuous copper that is deposited on the graphene ink coated fabric.

FIGURE 6 illustrates actual image of copper deposited graphene ink coated fabric.

FIGURE 7 illustrates soldering of copper on copper deposited graphene ink coated fabric.

FIGURE 8 illustrates copper wire soldered on copper deposited graphene ink coated fabric.

FIGURE 9 illustrates the apparatus for deposition of metal on graphene ink coated fabric.

DETAILED DESCRIPTION
The present disclosure relates to a method of depositing metal or an alloy on coated substrate.

In an embodiment, the present disclosure relates to a method of depositing a metal on coated substrate.

In another embodiment, the present disclosure relates to a method of depositing an alloy on coated substrate.

In an embodiment of the present disclosure, the method of depositing a metal or an alloy on coated substrate comprises-
contacting the coated substrate with an electrolyte comprising an electrode; and
passing electric current through the electrode, thereby depositing the metal or the alloy on the coated substrate

In an embodiment of the present disclosure, the method of depositing a metal on coated substrate comprises-
contacting the coated substrate with an electrolyte comprising an electrode; and
passing electric current through the electrode, thereby depositing the metal on the coated substrate.

In an embodiment of the present disclosure, the method of depositing an alloy on coated substrate comprises-
contacting the coated substrate with an electrolyte comprising an electrode; and
passing electric current through the electrode, thereby depositing the alloy on the coated substrate

In an embodiment of the present disclosure, the method of depositing the metal or the alloy on the coated substrate further comprises washing the metal or the alloy deposited coated substrate with a solvent such as water and subjecting the washed metal or alloy deposited coated substrate for drying for a duration ranging from about 10 minutes to 30 minutes.

In an embodiment of the present disclosure, the method of depositing the metal on the coated substrate further comprises washing the metal deposited coated substrate with a solvent such as water and subjecting the washed metal deposited coated substrate for drying for a duration ranging from about 10 minutes to 30 minutes.

In an embodiment of the present disclosure, the method of depositing the alloy on the coated substrate further comprises washing the alloy deposited coated substrate with a solvent such as water and subjecting the washed alloy deposited coated substrate for drying for a duration ranging from about 10 minutes to 30 minutes.

In an embodiment of the present disclosure, the drying is carried for a duration of about 10minutes, about 12minutes, about 14minutes, about 16minutes, about 18minutes, about 20minutes, about 22minutes, about 24minutes, about 26minutes, about 28minutes or about 30minutes.

In an embodiment of the present disclosure, during the method of depositing the metal on coated substrate electric current ranging from about 100mA to 250mA is passed through the electrode for a duration ranging from about 5 minutes to 15minutes.

In another embodiment of the present disclosure, during the method of depositing the metal on coated substrate electric current of about 100mA, about 110mA, about 120mA, about 130mA, about 140mA, about 150mA, about 160mA, about 170mA, about 180mA, about 190mA, about 200mA, about 210mA, about 220mA, about 230mA, about 240mA or about 250mA is passed through the electrode for a duration of about 5minutes, about 6minutes, about 7minutes, about 8minutes, about 9minutes, about 10minutes, about 11minutes, about 12minutes, about 13minutes, about 14minutes or about 15minutes.

In an embodiment of the present disclosure, during the method of depositing the alloy on coated substrate electric current ranging from about 100mA to 250mA is passed through the electrode for a duration ranging from about 5 minutes to 15minutes.

In another embodiment of the present disclosure, during the method of depositing the alloy on coated substrate electric current of about 100mA, about 110mA, about 120mA, about 130mA, about 140mA, about 150mA, about 160mA, about 170mA, about 180mA, about 190mA, about 200mA, about 210mA, about 220mA, about 230mA, about 240mA or about 250mA is passed through the electrode for a duration of about 5minutes, about 6minutes, about 7minutes, about 8minutes, about 9minutes, about 10minutes, about 11minutes, about 12minutes, about 13minutes, about 14minutes or about 15minutes.

In an embodiment of the present disclosure, the metal is deposited on the coated substrate due to the potential difference ranging from about 5V to 9V, applied between the coated substrate and the electrode.

In another embodiment of the present disclosure, the metal is deposited on the coated substrate due to the potential difference of about 5V, about 5.5V, about 6V, about 6.5V about 7V, about 7.5V, about 8V, about 8.5V or about 9V, applied between the coated substrate and the electrode.

In an embodiment of the present disclosure, the alloy is deposited on the coated substrate due to the potential difference ranging from about 5V to 9V, applied between the coated substrate and the electrode.

In another embodiment of the present disclosure, the alloy is deposited on the coated substrate due to the potential difference of about 5V, about 5.5V, about 6V, about 6.5V about 7V, about 7.5V, about 8V, about 8.5V or about 9V, applied between the coated substrate and the electrode.

In an embodiment of the present disclosure, the metal is selected from a group comprising copper, nickel, zinc and silver.

In an embodiment of the present disclosure, the alloy is selected from a group comprising copper, silver, zinc, and nickel.

In an embodiment of the present disclosure, the electrolyte is selected from a group comprising copper sulphate, zinc sulphate, nickel chloride and silver chloride.

In an embodiment of the present disclosure, the electrolyte is having a concentration ranging from about 1.0 M to 2.5 M.

In another embodiment of the present disclosure, the electrolyte is having a concentration of about 1.0M, about 1.2M, about 1.4M, about 1.6M, about 1.8M, about 2.0M, about 2.1M, about 2.2M,a bout 2.3M, about 2.4M or about 2.5M.

In an embodiment of the present disclosure, the electrode is a metal or an alloy, equivalent to the metal or the alloy that is deposited on the coated substrate.

In an embodiment of the present disclosure, the electrode is a metal selected from a group comprising copper, nickel, zinc and silver.

In an embodiment of the present disclosure, the electrode is an alloy selected from a group comprising copper, silver, zinc and nickel.

In an embodiment of the present disclosure, the coating in the coated substrate is selected from a group comprising graphene ink and conductive polymer.

In an embodiment of the present disclosure, the conductive polymer is selected from a group comprising polymethylmetacryalte (PMMA), poly acrylonitrile (PAN), polyimides, polyaniline, polyacetylene, polypyrrole, polythiophene, poly (3-hexylthiophene), polynaphthalene, polyp(p-phenylene sulfide) and a poly(p-phenylene vinylene), or any combination thereof.

In an embodiment of the present disclosure, the substrate in the coated substrate is selected from a group comprising fabric, paper, silicon, glass, gallium nitride, plastic, polyethylene terephthalate, polyester sulfone and polyethylene naphthalate or any combination thereof.

In an embodiment of the present disclosure, effective adhesion of the metal or the alloy on the coated substrate during the deposition of the metal or the alloy on the coated substrate is caused by presence of nano size pores on the surface of the coated substrate.

In an embodiment of the present disclosure, the metal or the alloy that is deposited on the coated substrate is having a thickness ranging from about 10µm to 100µm.
In an embodiment of the present disclosure, the metal that is deposited on the coated substrate is having a thickness of about 10µm, about 15µm, about 20µm, about 25µm, about 30µm, about 35µm, about 40µm, about 45µm, about 50µm, about 55µm, about 60µm, about 65µm, about 70µm, about 75µm, about 80µm, about 85µm, about 90µm, about 95µm or about 100µm.

In an embodiment of the present disclosure, the alloy that is deposited on the coated substrate is having a thickness of about 10µm, about 15µm, about 20µm, about 25µm, about 30µm, about 35µm, about 40µm, about 45µm, about 50µm, about 55µm, about 60µm, about 65µm, about 70µm, about 75µm, about 80µm, about 85µm, about 90µm, about 95µm or about 100µm.

In an exemplary embodiment of the present disclosure, the method of depositing the metal on graphene ink coated substrate comprises-
contacting the graphene ink coated substrate with the electrolyte comprising the electrode; and
passing electric current through the electrode, thereby depositing the metal on the graphene ink coated substrate.

In another exemplary embodiment of the present disclosure, the method of depositing the metal on the conductive polymer coated substrate comprises-
contacting the conductive polymer coated substrate with the electrolyte comprising the electrode; and
passing electric current through the electrode, thereby depositing the metal on the conductive polymer coated substrate.

In another exemplary embodiment of the present disclosure, the method of depositing the alloy on the graphene ink coated substrate comprises-
contacting the graphene ink coated substrate with the electrolyte comprising the electrode; and
passing electric current through the electrode, thereby depositing the alloy on the graphene ink coated substrate.

In another exemplary embodiment of the present disclosure, the method of depositing the alloy on the conductive polymer coated substrate comprises-
contacting the conductive polymer coated substrate with the electrolyte comprising the electrode; and
passing electric current through the electrode, thereby depositing the alloy on the conductive polymer coated substrate.

In an embodiment of the present disclosure, the method of depositing the metal or the alloy on a coated substrate is simple, low cost and an efficient method for depositing the metal or the alloy on the coated substrate, which enables easy soldering of filler material on the metal or the alloy deposited on the coated substrate. As a result, significant ohmic contact is developed on graphene ink or conductive polymer coated substrate.

In an embodiment of the present disclosure, the method of depositing the metal or the alloy on the coated substrate causes deposition of the metal or the alloy only on the area coated with graphene ink or the conductive polymer.

In an embodiment of the present disclosure, the method of depositing the metal or the alloy on the coated substrate enables localized deposition of the metal or the alloy on the graphene ink coated substrate or on the conductive polymer coated substrate.

The present disclosure further relates to an apparatus for depositing the metal or the alloy on the coated substrate described above.

In an embodiment of the present disclosure, an apparatus for depositing the metal or the alloy on the coated substrate, comprises:
a conduit (1) configured to house a power source (2);
a nozzle (3) connected to the conduit, configured to store electrolyte (5);
at least one electrode (4) is disposed within the conduit and connected to the power source (2), wherein the electrode (4) upon receiving the electric current causes deposition of the metal or the alloy on the coated substrate.

In an embodiment of the present disclosure, in the apparatus, the electrode is selected from a group comprising metal and alloy; wherein the metal is selected from a group comprising copper, silver, zinc, and nickel; and wherein the alloy is selected from a group comprising copper, silver, zinc, and nickel.

In an embodiment of the present disclosure, the electrolyte in the apparatus is selected from a group comprising copper sulphate, zinc sulphate, nickel chloride and silver chloride; and wherein the concentration of the electrolyte is ranging from about 1.0M to 2.5M.

In an embodiment of the present disclosure, the apparatus causes localized deposition of the metal or the alloy on the coated substrate.

The present disclosure further relates to soldering a filler material on the metal or the alloy deposited coated substrate described above.

In an embodiment of the present disclosure, the method of soldering a filler material on the metal or the alloy deposited coated substrate comprises-
contacting the filler material with the metal or the alloy deposited coated substrate, followed by heating the filler material;
fusing the filler material on the metal or the alloy deposited coated substrate, thereby soldering the filler material on the metal or the alloy deposited coated substrate.

In an embodiment of the present disclosure, the method of soldering a filler material on the metal deposited graphene ink coated substrate comprises-
contacting the filler material with the metal deposited graphene ink coated substrate followed by heating the filler material;
fusing the filler material on the metal deposited graphene ink coated substrate, thereby soldering the filler material on the metal deposited graphene ink coated substrate.

In an embodiment of the present disclosure, the method for soldering a filler material on the alloy deposited graphene ink coated substrate comprises-
contacting the filler material with the alloy deposited on the graphene ink coated substrate, followed by heating the filler material; and
fusing the filler material on the alloy deposited graphene ink coated substrate, thereby soldering the filler material on the alloy deposited graphene ink coated substrate.

In an embodiment of the present disclosure, the method for soldering a filler material on the metal deposited conductive polymer coated substrate comprises-
contacting the filler material with the metal deposited on the conductive polymer coated substrate, followed by heating the filler material; and
fusing the filler material on the metal deposited conductive polymer coated substrate, thereby soldering the filler material on the metal deposited conductive polymer coated substrate.

In an embodiment of the present disclosure, the method for soldering a filler material on the alloy deposited conductive polymer coated substrate comprises-
contacting the filler material with the alloy deposited on the conductive polymer coated substrate, followed by heating the filler material; and
fusing the filler material on the alloy deposited conductive polymer coated substrate, thereby soldering the filler material on the alloy deposited conductive polymer coated substrate.

In an embodiment of the present disclosure, the filler material is selected from a group comprising metal and alloy, wherein the metal is selected from a group comprising copper, silver, zinc, and nickel; and wherein the alloy is selected from a group comprising copper, silver, zinc, and nickel .

In an embodiment of the present disclosure, the method of soldering the filler material on the metal or the alloy establishes significant ohmic contact between the filler material and the metal or the alloy deposited on the coated substrate.

Additional embodiments and features of the present disclosure will be apparent to one of ordinary skill in art based upon the description provided. The embodiments provide various features and advantageous details thereof in the description. Description of well-known/conventional methods and techniques are omitted so as to not unnecessarily obscure the embodiments. The examples provided herein are intended merely to facilitate an understanding of ways in which the embodiments provided may be practiced and to further enable those of skilled in the art to practice the embodiments provided. Accordingly, the following examples should not be construed as limiting the scope of the embodiments.

EXAMPLES

EXAMPLE 1: Preparation of graphene ink printed fabric (graphene ink coated substrate)
About 30 to 50 µm graphene ink is printed on fabric and allowed to dry in an oven at a temperature of about 80°C for a duration of about 1 hour to obtain graphene ink printed fabric.
The above followed procedure to obtain graphene ink printed fabric can be followed to obtain graphene ink printed paper, silicon, glass, gallium nitride, plastic, polyethylene terephthalate, polyester sulfone or polyethylene naphthalate, respectively. However, the concentration of the graphene ink, the temperature and duration of drying may be varied depending on the substrate on which the graphene ink is printed.

EXAMPLE 2: Preparation of conductive polymer printed fabric (conductive polymer coated substrate)
About 30 to 50 µm conductive polymer solution is printed on fabric and allowed to dry in an oven at a temperature of about 80°C for a duration of about 1 hour.
The above followed procedure to obtain conductive polymer printed fabric can be followed to obtain conductive polymer printed paper, silicon, glass, gallium nitride, plastic, polyethylene terephthalate, polyester sulfone or polyethylene naphthalate, respectively. However, the concentration of the conductive polymer, the temperature and duration of drying may be varied depending on the substrate on which the conductive polymer is printed.

EXAMPLE 3: Depositing copper on graphene ink printed fabric (graphene ink coated substrate)
A solution ranging from about 1.0M to 2.5M copper sulphate (electrolyte) was prepared in a petri dish. A copper electrode was placed at the bottom of the petri dish and a portion of graphene ink printed fabric was floated on top of the electrolyte. A potential difference of about 5V was applied across the electrode and graphene ink printed fabric for a duration of about 10minutes, by passing a current ranging from about 100mA to 250mA. The copper was deposited on the graphene ink coated area. The copper deposited graphene ink printed fabric was removed, cleaned with running water and left for drying for a duration of about 1 hour minutes.

Adhesion of copper to the graphene ink coat is caused by the presence of nano size pores present on the surface of the graphene ink printed fabric. A sufficiently thick layer of about 30µm of copper was deposited which gave a metallic finish.

EXAMPLE 4: Depositing zinc on graphene ink printed fabric (graphene ink coated substrate)
A solution ranging from about ¬¬¬¬1.0 M to 2.5 M zinc sulphate (electrolyte) was prepared in a petri dish. A zinc electrode was placed at the bottom of the petri dish and a portion of graphene ink printed fabric was floated on top of the electrolyte. A potential difference of about 5.0V was applied across the electrode and graphene ink printed fabric for a duration of about 5 to15 minutes, by passing a current ranging from about 100mA to 250mA. The zinc was deposited on the graphene ink coated area. The zinc deposited graphene ink printed fabric was removed, cleaned with running water and left for drying for a duration of about 10 minutes.

Adhesion of zinc to the graphene ink coat is caused by the presence of nano size pores present on the surface of the graphene ink printed fabric. A sufficiently thick layer of about 10 to 30 µm of zinc was deposited which gave a metallic finish.

EXAMPLE 5: Depositing nickel on graphene ink printed fabric (graphene ink coated substrate)
A solution ranging from about ¬¬¬¬1.0 M to 2.5 M nickel chloride (electrolyte) was prepared in a petri dish. A nickel electrode was placed at the bottom of the petri dish and a portion of graphene ink printed fabric was floated on top of the electrolyte. A potential difference of about 5.0 V was applied across the electrode and graphene ink printed fabric for a duration of about 5 to 15 minutes, by passing a current ranging from about 100mA to 250mA. The nickel was deposited on the graphene ink coated area. The nickel deposited graphene ink printed fabric was removed, cleaned with running water and left for drying for a duration of about 30 minutes.

Adhesion of nickel to the graphene ink coat is caused by the presence of nano size pores present on the surface of the graphene ink printed fabric. A sufficiently thick layer of about 10 to 30 µm of nickel was deposited which gave a metallic finish.

EXAMPLE 6: Depositing silver on graphene ink printed fabric (graphene ink coated substrate)
A solution ranging from about ¬¬¬¬1.0 M to 2.5 M silver chloride (electrolyte) was prepared in a petri dish. A silver electrode was placed at the bottom of the petri dish and a portion of graphene ink printed fabric was floated on top of the electrolyte. A potential difference of about 5.0 V was applied across the electrode and graphene ink printed fabric for a duration of about 5 to 15 minutes, by passing a current ranging from about 100mA to 250mA. The silver was deposited on the graphene ink coated area. The silver deposited graphene ink printed fabric was removed, cleaned with running water and left for drying for a duration of about 30 minutes.

Adhesion of silver to the graphene ink coat is caused by the presence of nano size pores present on the surface of the graphene ink printed fabric. A sufficiently thick layer of about 10 to 30 µm of silver was deposited which gave a metallic finish.

EXAMPLE 7: Soldering on metal deposited graphene ink printed fabric (graphene ink coated substrate)
Normal solder iron was used to solder common Pb and Sn alloy based solder at temperature ranging from about 200°C to 300°C.

Claims:

1.A method of depositing a metal or an alloy on coated substrate, comprising:
contacting the coated substrate with an electrolyte comprising an electrode; and
passing electric current through the electrode, thereby depositing the metal or the alloy on the coated substrate.

2. The method as claimed in claim 1, wherein the electric current is ranging from 100 mA to 250 mA is passed through the electrode for a duration ranging from about 5 minutes to 15 minutes.

3. The method as claimed in claim 1, wherein the coated substrate is selected from a group comprising graphene ink coated substrate and conductive polymer coated substrate.

4. The method as claimed in claim 3, wherein the substrate is selected from a group comprising fabric, paper and polymer, or any combination thereof.

5. The method as claimed in claim 3, wherein the conductive polymer is selected from a group comprising polymethylmetacryalte (PMMA), poly acrylonitrile (PAN), polyimides, polyaniline, polyacetylene, polypyrrole, polythiophene, poly (3-hexylthiophene), polynaphthalene, polyp(p-phenylene sulfide) and a poly(p-phenylene vinylene), or any combination thereof.

6. The method as claimed in claim 1, wherein the metal or the alloy is deposited on the coated substrate due to potential difference applied between the coated substrate and the electrode, wherein the potential difference is ranging from about 5 V to 9 V.

7. The method as claimed in claim 1, wherein the metal is selected from a group comprising copper, nickel and silver; and the alloy is selected from a group comprising copper, silver, zincs and nickel.

8. The method as claimed in claim 1, wherein the electrolyte is selected from a group comprising copper sulphate, zinc sulphate, nickel chloride and silver chloride; and wherein the electrolyte is at a concentration ranging from about 1.0 M to 2.5 M.

9. The method as claimed in claim 1, further comprises localized deposition of the metal or the alloy on the coated substrate at a predetermined region.
10. The method as claimed in claim 1, further comprises washing the metal or the alloy deposited coated substrate, with a solvent, followed by drying for a duration ranging from about 10 minutes to 30 minutes.

11. The method as claimed in claim 1, wherein thickness of the metal or the alloy deposited on the coated substrate is ranging from about 10µm to 100 µm.

12. A method for soldering a filler material on the metal or the alloy deposited coated substrate obtained by the claim 1, comprises:
contacting the filler material with the metal or the alloy deposited coated substrate, followed by heating the filler material;
fusing the filler material on the metal or the alloy deposited coated substrate, thereby soldering the filler material on the metal or the alloy deposited coated substrate.

13. The method as claimed in claim 12, establishes ohmic contact between the filler material and the metal or the alloy deposited coated substrate.

14. The method as claimed in claim 12, wherein the filler material is selected from a group comprising metal and alloy; wherein the metal is selected from a group comprising, copper, silver, zinc and nickel; and the alloy is selected from a group comprising copper, silver, zinc and nickel.

15. An apparatus for depositing a metal or an alloy on coated substrate, comprising:
a conduit (1) configured to house a power source (2);
a nozzle (3) connected to the conduit, configured to store electrolyte (5);
at least one electrode (4) is disposed within the conduit and connected to the power source (2), wherein the electrode (4) upon receiving the electric current causes deposition of the metal or the alloy on the substrate.