This invention relates to a method of forming Subscriber Identity Module (SIM) cards, in particular SIM cards suitable for use with mobile telecommunication devices, such as mobile phones.
SIM cards are removable smart cards, which are available in two standard sizes, the first of which being of a standard credit card (i.e. 85.60mm x 53.98 mm x 0.76 mm), while its more popular version (called a "Plug-In SIM card") being of a dimension of 25 mm (length) X 15 mm (width) x 0.76 mm (thickness). SIM cards store securely the key identifying a mobile phone service subscriber. The SIM card allows users to change phones easily by removing the SIM card from a first mobile phone and inserting it into a second mobile phone, thereby eliminating the need for activation of the second mobile phone on the network.
In the context of this invention, the term "SIM card" also covers Universal Subscriber Identity Module (USIM) card and Removable User Identity Module (R-UIM) card.
Before such Plug-In SIM cards are installed m a mobile phone, each Plug-In SIM card is linked to a substrate card whose dimensions conform with the relevant international standards, e.g. as given in International Standard ISO/IEC 7816, the contents of which are incorporated herein by reference.
When the Plug-In SIM cards are required for use, they are broken off Irom the respective substrate card, whereupon the remaining substrate card will be discarded. As the dimensions and physical characteristics of SIM cards are meticulously specified in the relevant international standards, the machines for manufacturing and installing SIM cards is also highly standardized, and there is very little room for change. However, as can be seen from the above, discarding the substrate cards after detachment of the Plug-In SIM cards is a wastage of resources. It is thus an object of the present invention to provide a method of forming a plurality of Plug-In SIM cards in which the aforesaid shortcoming is mitigated, or at least to provide a useful alternative to the public.
According to the present invention, there is provided a method of forming Plug-In
2

Subscriber Identity Module (SIM) cards (126), including steps (a) providing a substrate card with dimensions conforming with the requirements of ISO 7816-1 and 7816-2 and with a plurality of stepped depressions on a major surface of said substrate card; (b) embedding a SIM integrated circuit (IC) module in each of said stepped depressions; (c) cutting out a plurality of Plug-In SIM cards from said substrate card; and (d) releasably engaging one of said plurality of Plug-In SIM cards obtained in said step (c) with a carrier card with dimensions conforming with the requirements of ISO 7816-1 and 7816-2 but with a thickness of at least 0.76mm.
Embodiments of the present invention will now be described, by way of examples only, with reference to the accompanying drawings, in which:
Fig. 1 is a top view of a card carrying eight Plug-In SIM cards according to a first embodiment of the present invention;
Fig. 2 is a top view of a card carrying seven Plug-In SIM cards according to a second embodiment of the present invention;
Fig. 3 is a top view of a card carrying six Plug-In SIM cards according to a third embodiment of the present invention;
Fig. 4 is a top view of a card carrying five Plug-In SIM cards according to a fourth embodiment of the present invention;
Fig. 5 is a top view of a card carrying four Plug-In SIM cards according to a fifth embodiment of the present invention;
Fig. 6 is a top view of a card carrying three Plug-In SIM cards according to a sixth embodiment of the present invention;
Fig. 7 is a perspective view of a substrate card for forming a card according to the present invention;
Fig. 8 is a top view of the substrate card of Fig. 7 formed with a number of stepped depressions;
Fig. 9 is a perspective view of the substrate card of Fig. 8;
Fig. 10 shows a SIM integrated circuit (IC) module to be embedded onto the substrate card of Fig. 8;
Fig. 11 is a perspective view of the substrate card of Fig. 8 embedded with eight SIM IC modules; Fig. 12 shows die-cutting out a Plug-In SIM card from the card of Fig. 11;
3

Fig. 13 shows placement of cut-out Plug-In SIM cards in pockets of a length of plastic bag;
Fig. 14 shows steps of personalization of a Plug-In SIM card by using a carrier card;
Fig. 15 is a perspective view of an alternative carrier card;
Fig. 16 is a perspective exploded view of the carrier card of Fig. 15;
Fig. 17A is a top view of an upper card layer of the carrier card of Fig 15;
Fig. 17B is a top view of a middle card layer of the carrier card of Fig 15;
Fig. 17C is a top view of a lower card layer of the carrier card of Fig 15; and
Fig. 18 is a perspective view of the carrier card of Fig. 15 releasably engaged with a Plug-In
SIM card.
Fig. 1 shows a plastic substrate card 100 carrying eight Plug-In SIM cards 102 in which all the contact surfaces of the Plug-In SIM cards 102 are on a same side of the substrate card 100. Dimensions of the substrate card 100 conform with the requirements of ISO/IEC 7816-1 and 7816-2, and in compliance with GSM 11.11.
The substrate card 100 is in the general shape of a rectangle with two opposite longer edges 104 and two opposite shorter edges 106. Each longer edge 104 is perpendicular to and adjacent the two shorter edges 106, and each shorter edge 106 is perpendicular to and adjacent the two longer edges 104. At a mid-point along one of the longer edges 104 is formed a V-shaped recess 108; and at a mid-point along one of the shorter edges 106 is also formed a V-shaped recess 110.
Fig. 2 shows a substrate card 200 carrying seven Plug-In SIM cards 202. Fig. 3 shows a substrate card 300 carrying six Plug-In SIM cards 302. Fig. 4 shows a substrate card 400 carrying five Plug-In SIM cards 402. Fig, 5 shows a substrate card 500 carrying four Plug-In SIM cards 502. Fig. 6 shows a substrate card 600 carrying three Plug-In SIM cards 602. The material, structure and dimensions of the substrate cards 200, 300, 400, 500, 600 are the same as those of the substrate card 100, the only difference being the number of Plug-In SIM cards 102, 202, 302, 402, 502, 602 carried by the respective substrate cards 100, 200, 300, 400, 500, 600,
A method of forming a plurality of Plug-In SIM cards according to this invention will be described below, in the exemplary context of a substrate card 100 carrying eight Plug-In SIM
4

cards 102. It should be readily understood that the same method can be used in the context of a substrate card carrying different numbers of Plug-In SIM cards.
A plastic substrate card 100 whose dimensions conforming to the requirements of ISO/IEC 7816-1 and 7816-2, and in compliance with GSM 11.11, as shown in Fig. 7, is provided. Eight generally square stepped depressions 120 are formed on one major surface 122 of the substrate card 100 by milling or injection molding. At a mid-point along one of the longer edges 104 is formed a V-shaped recess 108, and at a mid-point along one of the shorter edges 106 is also formed a V-shaped recess 110. These V-shaped recesses 108, 110 are provided for ensuring proper placement, alignment and orientation of the substrate card 100 in a card magazine (loader) (not shown) for subsequent processes and procedures.
Subsequent to the formation of the stepped depressions 120 on the substrate card 100, and as shown in Fig. 10, a SIM integrated circuit (IC) module 125 is embedded in each respective stepped depression 120, e.g. by hot-melt tape method. When each of the eight stepped depressions 120 on the substrate card 100 is embedded with a respective SIM IC module 125, a substrate card 100 carrying eight Plug-In SIM cards 102 is formed, as shown in Fig. 11.
A punching machine 128 then cuts out from the substrate card 100 a number of Plug-In SIM cards 126 conforming to the conventional dimensions and shape by die-cut punching, as shown in Fig. 12. For proper storage of the cut-out Plug-In SIM cards 126, a length of plastic bag 130 with a number of pockets 132 are provided, each for storing one of the cut-out Plug-In SIM cards 126.
For effecting personalization of the cut-out Plug-In SIM cards 126, and as showTi in Fig. 14, each Plug-ln SIM card 126 is inserted into a depression 134 on a major surface 145 of a carrier card 136. The dimensions of the carrier card 136 also conform to the requirements of ISO/IEC 7816-1 and 7816-2, but it may be thicker than 0.76mm, such as 1mm. The depression 134 of the carrier card 136 is sized and configured to receive a Plug-ln SIM card 126.
In addition, and similar to the substrate card 100 discussed above, the carrier card 136 is
5

in the general shape of a rectangle with two opposite longer edges 138 and two opposite shorter edges 139. Each longer edge 138 is perpendicular to and adjacent the two shorter edges 139, and each shorter edge 139 is perpendicular to and adjacent the two longer edges 138. At a mid-point along one of the longer edges 138 is formed a V-shaped recess 141; and at a mid-point along one of the shorter edges 139 is also formed a V-shaped recess 143. These V-shaped recesses 141, 143 are provided for ensuring proper placement, alignment and orientation of the carrier card 136 (and thus of the Plug-In SIM card 126 releasably engaged therewith) in the subsequent personalization process.
The Plug-In SIM card 126 releasably engaged with the carrier card 136 is then personalized by a card personalization machine. After this process, the personalized Plug-In SIM card 126 is then removed from the depression 134 of the carrier card 136.
An alternative carrier card for use in the method according to the present invention is shown in Fig. 15 and generally designated as 140. The dimensions of the carrier card 140 also conform to the requirements of ISO/IEC 7816-1 and 7816-2, but with a thickness over 0.76mni. As shown in Fig. 16, the carrier card 140 has an upper card layer 142, a middle card layer 144 and a lower card layer 146 fixedly secured with one another.
The upper card layer 142 has an aperture 148; the middle card layer 144 has an aperture 150; and the lower card layer 146 has an aperture 152. The shapes and dimensions of the apertures 148, 150, 152 differ from one another.
As shown more clearly in Figs. 17A to 17C:
(1) The aperture 148 of the upper card layer 142 is of a length a, e.g. of 23.1mm The aperture 148 has a wider end with a width b, e.g. of 15.6mm and a narrower end with a width c, e.g. of 12.6mm. The width c of the narrower end of the aperture 148 is significantly narrower than the width of 15mm of the Plug-In SIM card 126.
(2) The aperture 150 of the middle card layer 144 is of a length d, e.g. of 25.1mm, which is longer than the length a of the aperture 148 of the upper card layer 142, and is slightly longer than length of 25mm of the Plug-In SIM card 126. The aperture 150 has a wider end with a width e, e.g. of 15.4mm and a narrower end with a width/ e.g. of 15.1mm. Both the width e and the width/of the aperture 150 is slightly longer than the width of
6

15mm of the Plug-In SIM card 126. The middle layer 144 is of a thickness of 0.76mm. It can be seen that the aperture 150 of the middle card layer 144 is sized and configured to receive the whole of the Plug-In SIM card 126. (3) The aperture 152 of the lower card layer 146 is of a length g, e.g. of 9.5mm (which is significantly shorter than the length of 25mm of the Plug-In SIM card 126), and of a width h, e.g. of 13.6mm (which is significantly narrower than the width of 15mm of the Plug-In SIM card 126).
When the upper card layer 142, the middle card layer 144 and the lower card layer 146 are fixedly secured with one another such that the upper card layer 142 sits on the'middle card layer 144 and the middle card layer 144 sits on the lower card layer 146, the apertures 148, 150, 152 communicate with one another (as shown in Fig. 15), and the carrier card 140 so formed is of a thickness of over 0.76mm.
When the carrier card 140 so formed is to be releasably engaged with the Plug-In SIM card 126, the Plug-In SIM card 126 has to be slid on and relative to the upper card layer 142 of the carrier card 140, through the wider end of the aperture 148, into the aperture 150 of the middle card layer 144, and rests on the lower card layer 146. This is the only way in which the Plug-In SIM card 126 can be engaged with the carrier card 140.
When the Plug-In SIM card 126 is thus releasably engaged with the carrier card 140, as shown in Fig. 18:
(1) part of an upper major surface 160 of the Plug-In SIM card 126, including a contact surface 162 of the SIM IC module 125 of the Plug-In SIM card 126, is exposed to the outside environment via the aperture 148 of the upper card layer 142. This allows the Plug-In SIM card 126 to be personalized by a card personalization machine or otherwise processed;
(2) part of an opposite lower major surface (not shown) of the Plug-In SIM card 126 is exposed to the outside environment via the aperture 152 of the lower card layer 146, e.g. allowing the lower major surface of the Plug-In SIM card 126 to be marked with an identification number;
(3) the upper major surface 160 of the Plug-In SIM card 126 is in contact with part of a major surface of the upper card layer 142 facing the second card layer 144; and
7

(4) the lower major surface of the Plug-In SIM card 126 is in contact with part of a major surface of the lower card layer 146 facing the second card layer 144.
When the card personalization step or other processing step is completed, the Plug-In SIM card 126 may be removed from the carrier card 140 by sliding the Plug-In SIM card 126 out of the aperture 150 of the middle card layer 144 and the aperture 148 of the upper card layer 142. This is the only way in which the Plug-In SIM card 126 can be removed from the carrier card 140.
By way of the aforesaid arrangement, in particular the structure of the carrier card 140, the Plug-In SIM card 126 can be:
(1) easily engaged with the carrier card 140;
(2) securely carried by the carrier card 140 for undergoing the card personalization step and/or other processing step; and
(3) easily removed from the carrier card 140 after personalization and/or processing.
It should be understood that, although not showTi in any one of Figs. 15 to 18, at a mid-point along one of the longer edges 156 of the carrier card 140 is formed a V-shaped recess and along one of the shorter edges 158 of the carrier card 140 is also formed a V-shaped recesses. These V-shaped recesses are provided for ensuring proper placement, alignment and orientation of the carrier card 140 (and thus of the Plug-In SIM card 126 releasably engaged therewith) in the personalization process.
It should be understood that the above only illustrates examples whereby the present invention may be carried out, and that various modifications and/or alterations may be made thereto without departing from the spirit of the invention.
It should also be understood that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may be provided in combination in a single embodiment. Conversely, various features of the invention which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any appropriate sub-combinations.
8

We Claim:
1. A method of forming Plug-In Subscriber Identity Module (SIM) cards (126), including
steps:
(a) providing a substrate card (100, 200, 300, 400, 500, 600) with dimensions conforming with the requirements of ISO 7816-1 and 7816-2 and with a plurality of stepped depressions (120) on a major surface (122) of said substrate card;
(b) embedding a SIM integrated circuit (IC) module (125) in each of said stepped depressions;
(c) cutting out a plurality of Plug-In SIM cards (126) from said substrate card; and
(d) releasably engaging one of said plurality of Plug-In SIM cards obtained in said step (c) with a carrier card (136) with dimensions conforming with the requirements of ISO 7816-1 and 7816-2 but with a thickness of at least 0.76mm.

2. A method according to Claim 1 further characterized in that said substrate card has two opposite longer edges (104) and two opposite shorter edges (106).
3. A method according to Claim 2 further characterized in including steps of forming a first recess (108) at substantially a mid-point of one of said longer edges of said substrate card and forming a second recess (HO) at substantially a mid-point of one of said shorter edges of said substrate card.
4. A method according to any of the preceding claims further characterized in that said plurality of stepped recesses are formed on said major surface of said substrate card by milling or injection molding.
5. A method according to any of the preceding claims further characterized in that said step
(b) is carried out by hot-mcU tape method.
6. A method according to any of the preceding claims further characterized in that said step
(c) is carried out by die-cut punching.
9

7. A method according to any of the preceding claims further characterized in including steps of providing a bag (130) with a plurality of pockets (132) and storing at least one of said plurality of Plug-In SIM cards obtained in said step (c) in one of said pockets.
8. A method according to any of the preceding claims further characterized in that said carrier card has two opposite longer edges (138) and two opposite shorter edges (139), and that a third recess (141) is provided at substantially a mid-point of one of said longer edges and a fourth recess (143) is provided at substantially a mid-point of one of said shorter edges.
9. A method according to any of the preceding claims further characterized in including a step of personalizing said Plug-In SIM card engaged with said carrier card by a card personalization machine.
10. A method according to Claim 9 further characterized in including a step of removing said Plug-In SIM card from said carrier card.
11. A method according to any of the preceding claims further characterized in that said carrier card comprises a plurality of card layers (142, 144, 146) fixedly secured to one another.
12. A method according to Claim 11 further characterized in that said carrier card comprises at least a first card layer (142), a second card layer (144) and a third card layer (146) fixedly secured to one another.
13. A method according to Claim 12 fiirther characterized in that said first card layer includes a first aperture (148), said second card layer includes a second aperture (150) and said third card layer includes a third aperture (152).
14. A method accordmg to Claim 13 further characterized in that the dimensions and shape of said first aperture, the dimensions and shape of said second aperture and the dimensions and shape of said third aperture differ from one another.
10

15. A method according to Claim 13 or 14 further characterized in that said first, second and third apertures communicate with one another.
16. A method according to any one of Claims 13 to 15 further characterized in that, when said Plug-In SIM card is releasably engaged with said carrier card, at least part of a first major surface (160) of said Plug-In SIM card is exposed via said first aperture of first card layer and at least part of a second opposite major surface of said Plug-In SIM card is exposed via said third aperture of said third card layer.
17. A method according to any one of Claims 12 to 16 further characterized in that, when said Plug-In SIM card is releasably engaged with said carrier card, at least part of a first major surface of said Plug-In SIM card is in contact with a major surface of said first card layer and at least part of a second opposite major surface of said Plug-In SIM card is in contact with a major surface of said third card layer.
18. A method according to any one of Claims 13 to 17 further characterized in that said second aperture of said second card layer is sized and configured to receive the whole of said Plug-In SIM card.
19. A method according to any of the preceding claims further characterized in that said Plug-In SIM card is releasably engageable with and removable from said carrier card slidingly only.
20. A method according to any of the preceding claims further characterized in that said carrier card is of a thickness of over 0.76mm.