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Method Of Inhibiting Corrosion Of Copper Plated Or Metallized Surfaces And Circuitry During Semiconductor Manufacturing Processes
Abstract: A treatment bath for use in the. manufacture of copper plated or metallized semiconductor davices and a method of inhibiting corrosion of copper plated or matalized surfaces and circuitry in the semiconductor devices immersed in an aqoeous fluid in a treatment bath comprising adding to the aqueous fluid an effective corrosion inhibiting amount of one or more aromatic triazole corrosion inhibitors; XXXmetrically monitoring the concentration of aromatic triazole corrosion inhibitors in the aqueous fluid; and adding additional aromatic triazole corrosion inhibitor to the aqueous fluid to maintain an effective corrosion inhibiting conceniration of thc aromatic triazole corrosion inhibitor in the aqueous fluid
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